Electrode Support Or Work Holder Patents (Class 204/297.01)
  • Patent number: 10294578
    Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: May 21, 2019
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Yoichi Nakagawa, Yoshitaka Mukaiyama, Yoshio Minami
  • Patent number: 9306222
    Abstract: A method of joining a substrate for a bipolar electrode of a bipolar battery to a frame for supporting the bipolar electrode for use in the bipolar battery includes the implanting of a thermoplastic material in the substrate. The substrate and the frame are then vibration welded together at a frequency in the range of 50 Hz to 1 kHz to melt the thermoplastic material. The melted thermoplastic material forms a continuous or substantially continuous loop around the substrate to join the substrate and the frame together. A bipolar battery comprising a substrate and a frame joined together by the method, and a substrate for a bipolar electrode for use in the method are also described.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: April 5, 2016
    Assignee: Atraverda Limited
    Inventors: Adam Jones, Adam Morgan, Gavin Davies
  • Patent number: 9028657
    Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: May 12, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Jingbin Feng, R. Marshall Stowell, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot
  • Patent number: 9017531
    Abstract: The invention relates to a tool for galvanically coating sliding bearings comprising at least one cover, to which a thief is attached.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: April 28, 2015
    Assignee: Federal-Mogul Wiesbaden GmbH
    Inventors: Hans-Ulrich Huhn, Axel Rothe
  • Patent number: 8986521
    Abstract: Disclosed is a segmented contact bar for use boarding an electrolytic cell. The segmented contact bar has contact pieces made of electrically conductive material and being in spaced apart relation along the capping board, each of the contact pieces defining a segment for supporting and electrically connecting an anode and a cathode in the electrolytic cell. The segmented contact bar also has connection members including an insulating material and provided in between pairs of adjacent segments for providing insulating interconnection of the segments. There is also an electrolytic refining apparatus including adjacent electrolytic cells; a capping board positioned on the adjacent electrolytic cells; anodes and cathodes extending in spaced apart alternate positions into the each of the adjacent electrolytic cells along the capping boards; and a segmented contact bar.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: March 24, 2015
    Assignee: Pultrusion Technique Inc.
    Inventor: Robert P. Dufresne
  • Publication number: 20150068890
    Abstract: A plating jig and a plating device used for plating treatment of a substrate. The plating jig includes a mechanism rotatably driving a substrate holder, and detachably mounted on a plating bath integrally with a support portion. The plating jig includes the support portion which is formed in an engageable manner with a side wall of the plating bath, and the substrate holder which is vertically rotatably mounted on the support portion. The plating jig further includes a rotary mechanism for the substrate holder. The plating device utilizes the plating jig.
    Type: Application
    Filed: April 20, 2012
    Publication date: March 12, 2015
    Applicant: JCU CORPORATION
    Inventors: Junichiro Yoshioka, Takashi Murayama
  • Patent number: 8961755
    Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: February 24, 2015
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Yoshitaka Mukaiyama
  • Patent number: 8936705
    Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: January 20, 2015
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Kuniaki Horie, Yugang Guo, Satoshi Morikami
  • Patent number: 8932443
    Abstract: A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield. The wafer carrier may include an electrically conductive wafer plating jig base having a plurality of concentric overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size, a plurality of concentric magnetic attractors, at least one positioned within each of the plurality of overlapping cavities, and a cover plate comprising an open center surrounded by a support, the cover plate comprising an attractive material positioned within the support adjacent to the open center and aligned with at least one of the magnetic attractors when the cover plate is positioned over the wafer plating jig base.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: January 13, 2015
    Assignee: DECA Technologies Inc.
    Inventor: Rico Sto. Domingo
  • Patent number: 8926820
    Abstract: An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: January 6, 2015
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Raschid J. Bezama, Glen N. Biggs, Hariklia Deligianni, Tracy A. Tong
  • Publication number: 20140367268
    Abstract: A jig for manufacturing a capacitor element is provided in which an immersion position of an anode body in a processing liquid can be controlled accurately, and a heat treatment can be performed without difficulty when heat treatment is required in the middle of manufacturing the capacitor element.
    Type: Application
    Filed: September 5, 2012
    Publication date: December 18, 2014
    Applicant: c/o SHOWA DENKO K.K.
    Inventors: Kazumi Naito, Masahiro Suzuki, Katsutoshi Tamura
  • Patent number: 8911599
    Abstract: A machining system is provided and includes a machining tool comprising a spindle, one or more electrodes configured to perform the electromachining, and one or more tool holding elements configure to conductively hold the respective one or more electrodes and be assembled onto the spindle of the machining tool. The machining system further comprises one or more adapters and one or more power sources configured to electrically connect to the respective one or more adapters and the workpiece. The one or more adapters are configured to conductively contact the respective one or more tool holding elements. Further, the machining system comprises one or more machining solution sources provided to pass one or more machining solutions between the workpiece and the respective one or more electrodes. A tool adapter assembly is also presented.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: December 16, 2014
    Assignee: General Electric Company
    Inventors: Hongtao Li, Bin Wei, Xiaobin Chen, Steven Robert Hayashi, Renwei Yuan, Yuanfeng Luo
  • Publication number: 20140346035
    Abstract: One embodiment provides an electroplating apparatus, which includes a tank filled with an electrolyte solution, a number of anodes situated around edges of the tank, a cathode situated above the tank, and a plurality of wafer-holding jigs attached to the cathode. A respective wafer-holding jig includes a common connector electrically coupled to the cathode and a pair of wafer-mounting frames electrically coupled to the common connector. Each wafer-mounting frame includes a plurality of openings, and a respective opening provides a mounting space for a to-be-plated solar cell, thereby facilitating simultaneous plating of front and back surfaces of the plurality of the solar cells.
    Type: Application
    Filed: May 23, 2014
    Publication date: November 27, 2014
    Inventors: Jianming Fu, Wen Zhong Kong
  • Patent number: 8882974
    Abstract: A support mechanism used in an electro plasma polishing process includes a support beam, a first electrically conducting assembly, and a second electrically conducting assembly. The first electrically conducting assembly and the second electrically conducting assembly are mounted on the support beam. The first electrically conducting assembly is electrically insulated from the second electrically conducting assembly.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: November 11, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Tian-Feng Huang, Bo Li, Wen-Li Wang, Hao-Chung Lee
  • Patent number: 8864965
    Abstract: A substrate holder includes a fixed holding member and a movable holding member for detachably holding a substrate by gripping a peripheral portion of the substrate therebetween, and an inner seal member and an outer seal member which are fixed to the movable holding member. When the substrate is held by the movable holding member and the fixed holding member, the inner and outer seal members seal the connection between the movable holding member and a peripheral portion of the substrate and the connection between the movable holding member and the fixed holding member, respectively. The movable holding member includes a seal holder, and the inner seal member and the outer seal member are fixed between the seal holder and a fixing ring secured to the seal holder.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: October 21, 2014
    Assignee: Ebara Corporation
    Inventors: Jumpei Fujikata, Yuji Araki, Masaaki Kimura
  • Publication number: 20140291159
    Abstract: A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.
    Type: Application
    Filed: October 18, 2012
    Publication date: October 2, 2014
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Kentaro Arai, Hiroshi Miyazawa
  • Patent number: 8834689
    Abstract: A device, apparatus, and method for abrasive electrochemical finishing of an arc flange leaf pack are presented. The device includes: a concave support block having holes to receive securing members; removable first and second end blocks configured to seat at opposite ends of the concave support block; removable first and second face plates attached to opposite sides of the concave support block via the securing members; and a region of space between the removable first and second face plates, the removable first and second end blocks, and the concave support block.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: September 16, 2014
    Assignee: General Electric Company
    Inventors: Yuefeng Luo, William Edward Adis, Hrishikesh Vishvas Deo
  • Publication number: 20140251798
    Abstract: A substrate plating jig including a first plate-shaped holding member and a second holding member including a ring-shaped seal packing, including an internal circumferential part, an external circumferential part, and an opening formed at the center of the ring-shaped seal packing. Leading edges of the internal circumferential part and external circumferential part of the ring-shaped seal packing come in close contact with a substrate surface-to-be plated and the first holding member, respectively. The edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing. The substrate surface-to-be-plated is exposed in the opening.
    Type: Application
    Filed: October 19, 2011
    Publication date: September 11, 2014
    Applicant: JCU CORPORATION
    Inventors: Junichiro Yoshioka, Takashi Murayama
  • Patent number: 8828197
    Abstract: A jig for connecting a part to a body for an on-line painting process may include a plastic adaptor and a metal hanger. The plastic adaptor may be configured to be connected to a part to be painted, and the metal hanger may be removably connectable to the plastic adaptor. The metal hanger may be configured to be connected to a body to be painted.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: September 9, 2014
    Assignee: Honda Motor Co., Ltd.
    Inventors: James P. Ryan, Todd A. Fitz
  • Patent number: 8795482
    Abstract: Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: August 5, 2014
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Marshall R. Stowell, John S. Drewery, Richard S. Hill, Timothy M. Archer, Avishai Kepten
  • Patent number: 8784621
    Abstract: A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: July 22, 2014
    Assignee: DECA Technologies Inc.
    Inventor: Rico Sto. Domingo
  • Publication number: 20140197035
    Abstract: A device suitable for the electrochemical processing of an object is at least provided with a chamber that is to accommodate an electrolyte, a support for the object that is to be processed in the chamber, at least one set of electrodes located in the chamber such that during operation at least one electrode is located opposite each portion of a surface of said object that is to be processed. The device also includes a controller configured to provide an electric current between the object that is to be processed and the electrodes.
    Type: Application
    Filed: January 17, 2013
    Publication date: July 17, 2014
    Applicant: ELSYCA N.V.
    Inventor: Bart Juul Wilhelmina Van Den Bossche
  • Publication number: 20140190835
    Abstract: A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 10, 2014
    Applicant: YUKEN INDUSTRY CO., LTD.
    Inventors: Norikazu KOJIMA, Yoshiharu KIKUCHI
  • Patent number: 8771482
    Abstract: An electrolytic oxide reduction system according to a non-limiting embodiment of the present invention may include a plurality of anode assemblies and an anode shroud for each of the anode assemblies. The anode shroud may be used to dilute, cool, and/or remove off-gas from the electrolytic oxide reduction system. The anode shroud may include a body portion having a tapered upper section that includes an apex. The body portion may have an inner wall that defines an off-gas collection cavity. A chimney structure may extend from the apex of the upper section and be connected to the off-gas collection cavity of the body portion. The chimney structure may include an inner tube within an outer tube. Accordingly, a sweep gas/cooling gas may be supplied down the annular space between the inner and outer tubes, while the off-gas may be removed through an exit path defined by the inner tube.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: July 8, 2014
    Assignee: GE-Hitachi Nuclear Energy Americas LLC
    Inventors: James L. Bailey, Laurel A. Barnes, Stanley G. Wiedmeyer, Mark A. Williamson, James L. Willit
  • Publication number: 20140183057
    Abstract: The present invention related to a contact bar or contact bar segment, a contact bar and insulating capping board assembly and a method for operating an electrolytic cell including electrodes for refining metal. Embodiments of the contact bar include support sections with multiple support surfaces for lying against the insulating capping board, thereby distributing weight of the electrodes hanging on the contact bar; and contact sections for receiving the electrodes while providing good electrical contact and precise positioning thereof. While following the steps of the method for operating the electrolytic cell, lifetime of the contact bar and insulating capping board may be increased.
    Type: Application
    Filed: March 29, 2012
    Publication date: July 3, 2014
    Applicant: Pultrusion Technique Inc.
    Inventor: Robert P. Dufresne
  • Patent number: 8753490
    Abstract: The present invention relates to an electrolyzer for producing sodium hypochlorite by electrolyzing brine such as salt water or seawater and the like, and more specifically to a horizontal non-membrane type electrolyzer of a new structure which can maintain a constant interval among electrode plates without using a welding means or an adhering means on the inside of a housing by including a separator for dividing an inner space of a hollow type housing into a plurality of electrode chambers; the electrode plates which are arranged in parallel to each other in the constant interval within a rectangular space part of the separator; and a fixing bar for fixing the separator to an inner wall of the housing.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: June 17, 2014
    Assignee: Unitech Co., Ltd
    Inventors: Ki-Ha Shin, Il-Kyung Seo, Yoon-Seok Shin
  • Publication number: 20140131196
    Abstract: A contact bar and related techniques allow enhanced electrolytic refining of metals, e.g. avoiding or reducing electrical short circuits. The contact bar is adapted to rest on an insulating capping board for contacting symmetrical electrodes to provide locations for electrical contact therewith. The contact bar includes a central portion laying on the capping board and branch portions extending laterally outward from the central portion, such that the branch portions fit in between seats of the capping board. The contact bar may include a retention member enabling to reduce lateral movement of the electrodes, and may include a plurality of apertures to engage corresponding holding arms of the capping board. There may be a plurality of adjacent similar contact bar segments.
    Type: Application
    Filed: July 12, 2012
    Publication date: May 15, 2014
    Applicant: PULTRUSION TECHNIQUE INC.
    Inventor: Robert Dufresne
  • Publication number: 20140102906
    Abstract: This invention relates generally to an apparatus and method for electroplating selected portions of a connector part, such as a pin or a socket. The selective plating apparatus of the present invention is capable of continuously depositing plating solution on precisely the right contact surface of the connector part irrespective of its shape and center of gravity. According to the preferred embodiment of the present invention, the selective plating apparatus is capable of plating either side of the connector part, such as a pin or a socket, allowing plating of different type of metals on each side of the machined or stamped parts. The parts are handled automatically with minimum physical stress resulting in more consistent and reliable plating deposits.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 17, 2014
    Applicant: Galvanotech A/K/A G&S Design and Manufacturing, Inc.
    Inventors: Gennady Volkov, David Olshanetskiy
  • Publication number: 20140076720
    Abstract: An electropolishing system that includes electropolishing fixtures. The electropolishing fixtures include pendulum assemblies configured to establish electrical contact between a device being electropolished and an anode and to reposition the device during the electropolishing process.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: ABBOTT CARDIOVASCULAR SYSTEMS, INC.
    Inventors: Anthony S. Andreacchi, Randolf von Oepen, William E. Webler, Rodney Charles Ow
  • Publication number: 20140042021
    Abstract: The cathode collector bar end portion extending through a window in a sidewall of an electrolytic cell for refining aluminum is snugly received in a central opening of a seal assembly. Such seal assembly maintains a hermetic seal preventing ingress of air through the sidewall window while permitting longitudinal (horizontal) movement of the collector bar and also movement in a vertical plane (side to side, or up and down, or diagonally) which can be caused by changing heat conditions inside the cell.
    Type: Application
    Filed: March 15, 2013
    Publication date: February 13, 2014
    Inventor: Tony G. Carroll
  • Patent number: 8647481
    Abstract: Pot tending machine for a series of electrolysis cells designed for the production of aluminum by igneous electrolysis including: a) an overhead traveling crane which can be relocated above said electrolysis cells, b) a tool carriage onto which is fixed a service module comprising tools; c) a tapping winch, interdependent of said overhead traveling crane, designed to grasp and position near cell a tapping assembly including a ladle, a tapping tube and a vacuum device; d) a freestanding device able to generate compressed air; characterized in that said compressed air generating device of includes a first compressor, able to provide a flow of compressed air at least equal to the minimum air flow necessary for operations other than tapping, and at least one second compressor mounted in such a way that, when operating simultaneously with said first compressor, the unit provides a flow of compressed air at least equal to the minimum output of air necessary during tapping.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: February 11, 2014
    Assignee: E.C.L.
    Inventors: Arnaud Wattel, Stéphane David
  • Publication number: 20130323910
    Abstract: A single-crystal substrate is placed on a supporting table while maintaining crystalline orientation of the single-crystal substrate. The single-crystal substrate has contacting regions on a periphery of an upper surface of the single-crystal substrate. Linear contacting surfaces of contacting pins are placed in contact with the contacting regions of the single-crystal substrate placed on the supporting table. Longitudinal directions on the contacting surfaces of all the contacting pins are not parallel to intersecting lines of the upper surface of the single-crystal substrate and cleaved surfaces of the single-crystal substrate.
    Type: Application
    Filed: February 7, 2013
    Publication date: December 5, 2013
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuhiro Maeda, Koichiro Nishizawa
  • Patent number: 8568575
    Abstract: An adjustable insertion assembly for an electrochemical sensor includes an electrode holder to receive the sensor, having a distal aperture to permit process fluid to contact the sensor. A receptacle slidably receives the holder, for a sliding range of motion extending from fully inserted to fully retracted positions. An open distal end portion of the receptacle extends through a wall of a process fluid vessel, so that the aperture is open to the process fluid when fully inserted, and closed when fully retracted. A leverage member is releasably movable relative to the receptacle, and moves with a captured extension. An abutment of the receptacle engages the extension so that movement of the leverage member in opposite directions alternately clamps and releases the electrode holder relative to the receptacle to substantially prevent and permit movement at substantially any point within the range of movement.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: October 29, 2013
    Assignee: Invensys Systems, Inc.
    Inventor: Stephen B. Talutis
  • Patent number: 8551313
    Abstract: An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: October 8, 2013
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, Eduard Cartier, Hariklia Deligianni, Rajarao Jammy, Vamsi K. Paruchuri
  • Patent number: 8551306
    Abstract: A permanent cathode that is to be used as electrode in the electro-refining and/or recovery of metals, such as copper, zinc, cobalt or nickel. The permanent cathode comprises a planar mother plate that is made of metal and comprises two sides. The mother plate comprises an edge, which at least partly surrounds the metal plate. The edge comprises a groove portion that is provided with a groove. The groove portion comprises at least one bridging section for joining together, over the groove portion of the edge of the metal plate at the at least one bridging section, the cathode metal halves, such as cathode copper halves, cathode zinc halves, cathode cobalt halves or cathode nickel halves, which are formed on the sides of the mother plate in the electro-refining of the metals.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: October 8, 2013
    Assignee: Outotec Oyj
    Inventors: Lauri Palmu, Henri Virtanen, Tuomo Kivistö, Ismo Virtanen
  • Publication number: 20130236736
    Abstract: An electroplating jig for processing electroplating at a certain location, an electroplating method incorporating with the electroplating jig, and an electro product free of a plating proof layer produced by the electroplating method are provided. The electroplating jig includes a base and a flexible electric conductive pad. An accommodation slot and an opening are respectively installed on two opposite surfaces of the base in which an electro can be disposed in the accommodation slot and the accommodation slot is larger than the opening and communicated with the opening, the opening exposes a first metal pattern of the electro therefrom. The flexible electric conductive pad is blanketed on a second metal pattern formed on another surface of the electro to electrically connect the first metal pattern and the second metal pattern.
    Type: Application
    Filed: September 5, 2012
    Publication date: September 12, 2013
    Inventors: Tzuh-Suan WANG, Ming-Chi Chiu, Yu-te Su, Ming-Chang Ku
  • Patent number: 8529736
    Abstract: According to various embodiment, a system includes an electrolytic cutting tool. The electrolytic cutting tool includes a first cathode configured to be positioned at a first gap away from a first side of a workpiece, a second cathode configured to be positioned at a second gap away from a second side of the workpiece. The first and second cathodes are positioned opposite from one another. The electrolytic cutting tool also includes a first electrolyte passage configured to flow a first electrolyte through the first gap between the first cathode and the workpiece, a second electrolyte passage configured to flow a second electrolyte through the second gap between the second cathode and the workpiece, and a power supply configured to flow current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first side and the second side.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: September 10, 2013
    Assignee: General Electric Company
    Inventors: Yuefeng Luo, William Edward Adis
  • Patent number: 8486239
    Abstract: Methods systems and devices for impeding an anode from being corroded or dissolved are provided. In one example, an electrolysis system includes an anode, the anode disposed on a support including a housing, the housing having an inverted cup on an end, the anode on an interior wall of the inverted cup such that electrical contact with an electrolysis solution is made along a concave portion of the inverted cup. Such an example may further include a cathode, the cathode disposed within a collection pipe such that gas produced at the cathode is retained within a channel of the collection pipe.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: July 16, 2013
    Inventor: Michael Anderson
  • Patent number: 8398831
    Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: March 19, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Shantinath Ghongadi, Robert Rash, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan, Bryan Buckalew, Brian Evans
  • Publication number: 20130048503
    Abstract: A method for repairing a blade forming a cathode and having a surface to be coated defining a critical area, utilizing an anode, an electrolyte bath including insoluble particles, and a mounting on which the blade is mounted in a working position relative to a reference wall. The mounting is placed in the bath, and the particles and the metal of the anode are co-deposited to form the coating on the surface to be coated. The anode is typically placed facing the critical area and the mounting includes a mechanism for monitoring current lines to obtain a coating with a relatively constant, predetermined thickness for the critical area, that gradually falls to a value of substantially zero along edges of the coating.
    Type: Application
    Filed: December 28, 2010
    Publication date: February 28, 2013
    Applicants: SNECMA, PRAXAIR SURFACE TECHNOLOGIES INC.
    Inventors: Justine Menuey, Frederic Braillard, John Foster, Stephen Owens, Alan Taylor, Martin Chatterney
  • Publication number: 20130042454
    Abstract: Disclosed herein are lipseal assemblies for use in electroplating clamshells which may include an elastomeric lipseal for excluding plating solution from a peripheral region of a semiconductor substrate and one or more electrical contact elements. The contact elements may be structurally integrated with the elastomeric lipseal. The lipseal assemblies may include one or more flexible contact elements at least a portion of which may be conformally positioned on an upper surface of the elastomeric lipseal, and may be configured to flex and form a conformal contact surface that interfaces with the substrate. Some elastomeric lipseals disclosed herein may support, align, and seal a substrate in a clamshell, and may include a flexible elastomeric upper portion located above a flexible elastomeric support edge, the upper portion having a top surface and an inner side surface, the later configured to move inward and align the substrate upon compression of the top surface.
    Type: Application
    Filed: August 13, 2012
    Publication date: February 21, 2013
    Inventors: Jingbin Feng, Marshall Stowell, Frederick D. Wilmot
  • Patent number: 8377268
    Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: February 19, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Robert Rash, Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins, Seshasayee Varadarajan, Bryan Buckalew
  • Publication number: 20130032474
    Abstract: Disclosed is a segmented contact bar for use boarding an electrolytic cell. The segmented contact bar has contact pieces made of electrically conductive material and being in spaced apart relation along the capping board, each of the contact pieces defining a segment for supporting and electrically connecting an anode and a cathode in the electrolytic cell. The segmented contact bar also has connection members including an insulating material and provided in between pairs of adjacent segments for providing insulating interconnection of the segments. There is also an electrolytic refining apparatus including adjacent electrolytic cells; a capping board positioned on the adjacent electrolytic cells; anodes and cathodes extending in spaced apart alternate positions into the each of the adjacent electrolytic cells along the capping boards; and a segmented contact bar.
    Type: Application
    Filed: February 6, 2012
    Publication date: February 7, 2013
    Applicant: PULTRUSION TECHNIQUE INC.
    Inventor: Robert P. Dufresne
  • Publication number: 20120325677
    Abstract: An electrochemistry method to produce a reaction gas of a lesser molar mass than that of an initial constituent of gas or vapor, according to which the gas or vapor of the initial constituent is made to flow, and the reaction gas is recovered in the path in which the initial constituent is made to flow. At least one vortex is created in a zone upstream from the reaction gas recovery zone, wherein the vortex can separate the produced reaction gas from the initial constituent still present to subject the initial constituent to an electrochemical process in the upstream zone. In a high-temperature water electrolysis application according to the method, by the vortex, the produced hydrogen is separated from the surplus steam to subject the surplus stream to an electrolytic process within the electrolyser itself.
    Type: Application
    Filed: March 11, 2011
    Publication date: December 27, 2012
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: Patrick Le Gallo
  • Patent number: 8329009
    Abstract: Multi-well plates having contoured well designs allow multi-stage high throughput parallel assaying of ion channels or ion transporters. A well of a multi-well plate has a bottom region that is sized and shaped to simultaneous accommodate a sensing electrode and a pipette for delivering, e.g., test compounds, wash fluid, and optionally ligands. Such multi-well plates may be coupled with an instrument having a pipette head and an electrode plate. Such arrangement facilitates fluidic contact between cells and fluids provided via a pipette. It also facilitates washing of wells with buffers or other wash solutions to allow serial exposure of test cells to various reagents or other stimuli. Generally, the design allows control and test experiments to be performed on the same cell (or cells) in a single well.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: December 11, 2012
    Assignee: Molecular Devices, LLC
    Inventors: Yuri Vladimirovich Osipchuk, James Richard Wasson, Edward D. Verdonk
  • Patent number: 8317987
    Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: November 27, 2012
    Assignee: SunPower Corporation
    Inventors: Emmanuel Chua Abas, Chen-An Chen, Diana Xiaobing Ma, Kalyana Bhargava Ganti
  • Patent number: 8313622
    Abstract: An electrochemical anode is formed using friction stir welded (FSW) joints. A FSW joint may be formed between the bus bar and anode sheet or the lead encapsulation and anode sheet. The FSW joints may also comprise fillet and butt joints. FSW joints may also be utilized to seal the ends of the electrochemical anodes to prevent corrosion.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: November 20, 2012
    Assignee: RSR Technologies, Inc.
    Inventors: Timothy W. Ellis, Matthew Burr, Elton Jones
  • Publication number: 20120285820
    Abstract: A machining system is provided and includes a machining tool comprising a spindle, one or more electrodes configured to perform the electromachining, and one or more tool holding elements configure to conductively hold the respective one or more electrodes and be assembled onto the spindle of the machining tool. The machining system further comprises one or more adapters and one or more power sources configured to electrically connect to the respective one or more adapters and the workpiece. The one or more adapters are configured to conductively contact the respective one or more tool holding elements. Further, the machining system comprises one or more machining solution sources provided to pass one or more machining solutions between the workpiece and the respective one or more electrodes. A tool adapter assembly is also presented.
    Type: Application
    Filed: January 20, 2011
    Publication date: November 15, 2012
    Inventors: Hongtao Li, Bin Wei, Xiaobin Chen, Steven Robert Hayashi, Renwei Yuan, Yuanfeng Luo
  • Patent number: 8308920
    Abstract: In various embodiments, the present invention provides an electrolytic cell contact bar having a first pole and a pair of second poles. The second poles are opposite in charge to the first pole and each of the pair of second poles are adjacent to and parallel to the first pole. In various embodiments, the contact bar may include an electrode holder capable of holding at least one electrode.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: November 13, 2012
    Assignee: Freeport-McMoran Corporation
    Inventors: Bret Ashford, William A Ebert, Fernando D Mollo Vega, Samuel Rasmussen, Timothy G Robinson, Scot P Sandoval
  • Patent number: 8308914
    Abstract: An electrolytic ozone cell anode spring fastening board structure includes a solid polymer electrolyte membrane (1), an anode electrocatalyst layer (2), a diffusion layer (3), frame body and support parts (5). A diffusion layer counterpiece (4) has one side attached to the diffusion layer (3), the other side of the diffusion layer counterpiece (4) equipped with a centered elevated step, which contacts the center of the convex side of a spherical spring board (6). In addition, the solid polymer electrolyte membrane (1), frame body and support parts (5), diffusion layer (3), diffusion layer counterpiece (4) and spring board (6) are held together by mechanical fastening means. It prevents a decrease in ozone generation rate in electrolytic ozone cell that can occur from the metal board deformation and thinning of the anode electrocatalyst layer.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: November 13, 2012
    Inventor: Mingyung Hsu