Abstract: There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.

Abstract: An electrochemical deposition system for depositing metal onto a workpiece, comprises a deposition chamber adapted to receive plating solution, a workpiece holder for holding a workpiece in a first plane, a shield holder for holding a shield in a second plane substantially parallel to the first plane, an agitation plate having a profiled surface to agitate plating solution, wherein the workpiece holder, shield holder and agitation plate are all adapted for insertion into and removal from the deposition chamber, and further comprising an actuator operable to change a relative distance between the workpiece holder and shield holder, in a direction normal to the first and second planes, while they are located within the deposition chamber.

Abstract: A method capable of removing a liquid from a seal of a substrate holder so as to prevent contact between the liquid and an electrical contact of the substrate holder is provided. The method includes: immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate; applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate; pulling up the plated substrate from the plating solution; separating the seal from the plated substrate; and forming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder.

Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.

Abstract: Disclosed are electroplating cups for holding, sealing, and providing electrical power to wafers during electroplating, where the electroplating cup can include a cup bottom, an elastomeric lipseal, and an electrical contact element. The cup bottom can include a radially inwardly protruding surface with a plurality of through-holes. The elastomeric lipseal can directly adhere to the radially inwardly protruding surface of the cup bottom, fill the plurality of through-holes, and encircle an inner edge of the cup bottom. In some implementations, this can mitigate the effects of wafer sticking. In some implementations, the cup bottom may be treated to promote adhesion between the elastomeric lipseal and the radially inwardly protruding surface of the cup bottom.

Abstract: A frame fixing jig for mounting on a chuck table has a chuck portion for holding a workpiece in an annular frame, and a body portion for supporting the chuck portion. A frame support member (FSM) supports the annular frame, and a ring presses the frame against the FSM. The FSM has a through hole. The ring has an annular base portion and an engaging portion. The engaging portion can be inserted through the through hole, thereby engaging the FSM. The engaging portion includes a rotating shaft extending through the annular base portion, a knob fixed to the upper end of the shaft, and a plate fixed to the lower end. The surface around the lower end of the through hole or the upper surface of the plate is formed with an inclined surface for lowering the rotating shaft by rotating the plate inserted through the through hole.

Abstract: An apparatus for electroplating a semiconductor wafer includes an insert member configured to circumscribe a processing region. The insert member has a top surface. A portion of the top surface of the insert member has an upward slope that slopes upward from a peripheral area of the top surface of the insert member toward the processing region. The apparatus also includes a seal member having an annular-disk shape. The seal member is positioned on the top surface of the insert member. The seal member is flexible such that an outer radial portion of the seal member conforms to the upward slope of the top surface of the insert member and such that an inner radial portion of the seal member projects inward toward the processing region.

Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.

Abstract: A method of joining a substrate for a bipolar electrode of a bipolar battery to a frame for supporting the bipolar electrode for use in the bipolar battery includes the implanting of a thermoplastic material in the substrate. The substrate and the frame are then vibration welded together at a frequency in the range of 50 Hz to 1 kHz to melt the thermoplastic material. The melted thermoplastic material forms a continuous or substantially continuous loop around the substrate to join the substrate and the frame together. A bipolar battery comprising a substrate and a frame joined together by the method, and a substrate for a bipolar electrode for use in the method are also described.

Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

Abstract: The invention relates to a tool for galvanically coating sliding bearings comprising at least one cover, to which a thief is attached.

Abstract: Disclosed is a segmented contact bar for use boarding an electrolytic cell. The segmented contact bar has contact pieces made of electrically conductive material and being in spaced apart relation along the capping board, each of the contact pieces defining a segment for supporting and electrically connecting an anode and a cathode in the electrolytic cell. The segmented contact bar also has connection members including an insulating material and provided in between pairs of adjacent segments for providing insulating interconnection of the segments. There is also an electrolytic refining apparatus including adjacent electrolytic cells; a capping board positioned on the adjacent electrolytic cells; anodes and cathodes extending in spaced apart alternate positions into the each of the adjacent electrolytic cells along the capping boards; and a segmented contact bar.

Abstract: A plating jig and a plating device used for plating treatment of a substrate. The plating jig includes a mechanism rotatably driving a substrate holder, and detachably mounted on a plating bath integrally with a support portion. The plating jig includes the support portion which is formed in an engageable manner with a side wall of the plating bath, and the substrate holder which is vertically rotatably mounted on the support portion. The plating jig further includes a rotary mechanism for the substrate holder. The plating device utilizes the plating jig.

Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield. The wafer carrier may include an electrically conductive wafer plating jig base having a plurality of concentric overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size, a plurality of concentric magnetic attractors, at least one positioned within each of the plurality of overlapping cavities, and a cover plate comprising an open center surrounded by a support, the cover plate comprising an attractive material positioned within the support adjacent to the open center and aligned with at least one of the magnetic attractors when the cover plate is positioned over the wafer plating jig base.

Abstract: An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

Abstract: A jig for manufacturing a capacitor element is provided in which an immersion position of an anode body in a processing liquid can be controlled accurately, and a heat treatment can be performed without difficulty when heat treatment is required in the middle of manufacturing the capacitor element.

Abstract: A machining system is provided and includes a machining tool comprising a spindle, one or more electrodes configured to perform the electromachining, and one or more tool holding elements configure to conductively hold the respective one or more electrodes and be assembled onto the spindle of the machining tool. The machining system further comprises one or more adapters and one or more power sources configured to electrically connect to the respective one or more adapters and the workpiece. The one or more adapters are configured to conductively contact the respective one or more tool holding elements. Further, the machining system comprises one or more machining solution sources provided to pass one or more machining solutions between the workpiece and the respective one or more electrodes. A tool adapter assembly is also presented.

Abstract: One embodiment provides an electroplating apparatus, which includes a tank filled with an electrolyte solution, a number of anodes situated around edges of the tank, a cathode situated above the tank, and a plurality of wafer-holding jigs attached to the cathode. A respective wafer-holding jig includes a common connector electrically coupled to the cathode and a pair of wafer-mounting frames electrically coupled to the common connector. Each wafer-mounting frame includes a plurality of openings, and a respective opening provides a mounting space for a to-be-plated solar cell, thereby facilitating simultaneous plating of front and back surfaces of the plurality of the solar cells.

Abstract: A support mechanism used in an electro plasma polishing process includes a support beam, a first electrically conducting assembly, and a second electrically conducting assembly. The first electrically conducting assembly and the second electrically conducting assembly are mounted on the support beam. The first electrically conducting assembly is electrically insulated from the second electrically conducting assembly.

Abstract: A substrate holder includes a fixed holding member and a movable holding member for detachably holding a substrate by gripping a peripheral portion of the substrate therebetween, and an inner seal member and an outer seal member which are fixed to the movable holding member. When the substrate is held by the movable holding member and the fixed holding member, the inner and outer seal members seal the connection between the movable holding member and a peripheral portion of the substrate and the connection between the movable holding member and the fixed holding member, respectively. The movable holding member includes a seal holder, and the inner seal member and the outer seal member are fixed between the seal holder and a fixing ring secured to the seal holder.

Abstract: A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.

Abstract: A device, apparatus, and method for abrasive electrochemical finishing of an arc flange leaf pack are presented. The device includes: a concave support block having holes to receive securing members; removable first and second end blocks configured to seat at opposite ends of the concave support block; removable first and second face plates attached to opposite sides of the concave support block via the securing members; and a region of space between the removable first and second face plates, the removable first and second end blocks, and the concave support block.

Abstract: A substrate plating jig including a first plate-shaped holding member and a second holding member including a ring-shaped seal packing, including an internal circumferential part, an external circumferential part, and an opening formed at the center of the ring-shaped seal packing. Leading edges of the internal circumferential part and external circumferential part of the ring-shaped seal packing come in close contact with a substrate surface-to-be plated and the first holding member, respectively. The edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing. The substrate surface-to-be-plated is exposed in the opening.

Abstract: A jig for connecting a part to a body for an on-line painting process may include a plastic adaptor and a metal hanger. The plastic adaptor may be configured to be connected to a part to be painted, and the metal hanger may be removably connectable to the plastic adaptor. The metal hanger may be configured to be connected to a body to be painted.

Abstract: Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.

Abstract: A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield.

Abstract: A device suitable for the electrochemical processing of an object is at least provided with a chamber that is to accommodate an electrolyte, a support for the object that is to be processed in the chamber, at least one set of electrodes located in the chamber such that during operation at least one electrode is located opposite each portion of a surface of said object that is to be processed. The device also includes a controller configured to provide an electric current between the object that is to be processed and the electrodes.

Abstract: A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism.

Abstract: An electrolytic oxide reduction system according to a non-limiting embodiment of the present invention may include a plurality of anode assemblies and an anode shroud for each of the anode assemblies. The anode shroud may be used to dilute, cool, and/or remove off-gas from the electrolytic oxide reduction system. The anode shroud may include a body portion having a tapered upper section that includes an apex. The body portion may have an inner wall that defines an off-gas collection cavity. A chimney structure may extend from the apex of the upper section and be connected to the off-gas collection cavity of the body portion. The chimney structure may include an inner tube within an outer tube. Accordingly, a sweep gas/cooling gas may be supplied down the annular space between the inner and outer tubes, while the off-gas may be removed through an exit path defined by the inner tube.

Abstract: The present invention related to a contact bar or contact bar segment, a contact bar and insulating capping board assembly and a method for operating an electrolytic cell including electrodes for refining metal. Embodiments of the contact bar include support sections with multiple support surfaces for lying against the insulating capping board, thereby distributing weight of the electrodes hanging on the contact bar; and contact sections for receiving the electrodes while providing good electrical contact and precise positioning thereof. While following the steps of the method for operating the electrolytic cell, lifetime of the contact bar and insulating capping board may be increased.

Abstract: The present invention relates to an electrolyzer for producing sodium hypochlorite by electrolyzing brine such as salt water or seawater and the like, and more specifically to a horizontal non-membrane type electrolyzer of a new structure which can maintain a constant interval among electrode plates without using a welding means or an adhering means on the inside of a housing by including a separator for dividing an inner space of a hollow type housing into a plurality of electrode chambers; the electrode plates which are arranged in parallel to each other in the constant interval within a rectangular space part of the separator; and a fixing bar for fixing the separator to an inner wall of the housing.

Abstract: A contact bar and related techniques allow enhanced electrolytic refining of metals, e.g. avoiding or reducing electrical short circuits. The contact bar is adapted to rest on an insulating capping board for contacting symmetrical electrodes to provide locations for electrical contact therewith. The contact bar includes a central portion laying on the capping board and branch portions extending laterally outward from the central portion, such that the branch portions fit in between seats of the capping board. The contact bar may include a retention member enabling to reduce lateral movement of the electrodes, and may include a plurality of apertures to engage corresponding holding arms of the capping board. There may be a plurality of adjacent similar contact bar segments.

Abstract: This invention relates generally to an apparatus and method for electroplating selected portions of a connector part, such as a pin or a socket. The selective plating apparatus of the present invention is capable of continuously depositing plating solution on precisely the right contact surface of the connector part irrespective of its shape and center of gravity. According to the preferred embodiment of the present invention, the selective plating apparatus is capable of plating either side of the connector part, such as a pin or a socket, allowing plating of different type of metals on each side of the machined or stamped parts. The parts are handled automatically with minimum physical stress resulting in more consistent and reliable plating deposits.

Abstract: An electropolishing system that includes electropolishing fixtures. The electropolishing fixtures include pendulum assemblies configured to establish electrical contact between a device being electropolished and an anode and to reposition the device during the electropolishing process.

Abstract: The cathode collector bar end portion extending through a window in a sidewall of an electrolytic cell for refining aluminum is snugly received in a central opening of a seal assembly. Such seal assembly maintains a hermetic seal preventing ingress of air through the sidewall window while permitting longitudinal (horizontal) movement of the collector bar and also movement in a vertical plane (side to side, or up and down, or diagonally) which can be caused by changing heat conditions inside the cell.

Abstract: Pot tending machine for a series of electrolysis cells designed for the production of aluminum by igneous electrolysis including: a) an overhead traveling crane which can be relocated above said electrolysis cells, b) a tool carriage onto which is fixed a service module comprising tools; c) a tapping winch, interdependent of said overhead traveling crane, designed to grasp and position near cell a tapping assembly including a ladle, a tapping tube and a vacuum device; d) a freestanding device able to generate compressed air; characterized in that said compressed air generating device of includes a first compressor, able to provide a flow of compressed air at least equal to the minimum air flow necessary for operations other than tapping, and at least one second compressor mounted in such a way that, when operating simultaneously with said first compressor, the unit provides a flow of compressed air at least equal to the minimum output of air necessary during tapping.

Abstract: A single-crystal substrate is placed on a supporting table while maintaining crystalline orientation of the single-crystal substrate. The single-crystal substrate has contacting regions on a periphery of an upper surface of the single-crystal substrate. Linear contacting surfaces of contacting pins are placed in contact with the contacting regions of the single-crystal substrate placed on the supporting table. Longitudinal directions on the contacting surfaces of all the contacting pins are not parallel to intersecting lines of the upper surface of the single-crystal substrate and cleaved surfaces of the single-crystal substrate.

Abstract: An adjustable insertion assembly for an electrochemical sensor includes an electrode holder to receive the sensor, having a distal aperture to permit process fluid to contact the sensor. A receptacle slidably receives the holder, for a sliding range of motion extending from fully inserted to fully retracted positions. An open distal end portion of the receptacle extends through a wall of a process fluid vessel, so that the aperture is open to the process fluid when fully inserted, and closed when fully retracted. A leverage member is releasably movable relative to the receptacle, and moves with a captured extension. An abutment of the receptacle engages the extension so that movement of the leverage member in opposite directions alternately clamps and releases the electrode holder relative to the receptacle to substantially prevent and permit movement at substantially any point within the range of movement.

Abstract: An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.

Abstract: A permanent cathode that is to be used as electrode in the electro-refining and/or recovery of metals, such as copper, zinc, cobalt or nickel. The permanent cathode comprises a planar mother plate that is made of metal and comprises two sides. The mother plate comprises an edge, which at least partly surrounds the metal plate. The edge comprises a groove portion that is provided with a groove. The groove portion comprises at least one bridging section for joining together, over the groove portion of the edge of the metal plate at the at least one bridging section, the cathode metal halves, such as cathode copper halves, cathode zinc halves, cathode cobalt halves or cathode nickel halves, which are formed on the sides of the mother plate in the electro-refining of the metals.

Abstract: An electroplating jig for processing electroplating at a certain location, an electroplating method incorporating with the electroplating jig, and an electro product free of a plating proof layer produced by the electroplating method are provided. The electroplating jig includes a base and a flexible electric conductive pad. An accommodation slot and an opening are respectively installed on two opposite surfaces of the base in which an electro can be disposed in the accommodation slot and the accommodation slot is larger than the opening and communicated with the opening, the opening exposes a first metal pattern of the electro therefrom. The flexible electric conductive pad is blanketed on a second metal pattern formed on another surface of the electro to electrically connect the first metal pattern and the second metal pattern.

Abstract: According to various embodiment, a system includes an electrolytic cutting tool. The electrolytic cutting tool includes a first cathode configured to be positioned at a first gap away from a first side of a workpiece, a second cathode configured to be positioned at a second gap away from a second side of the workpiece. The first and second cathodes are positioned opposite from one another. The electrolytic cutting tool also includes a first electrolyte passage configured to flow a first electrolyte through the first gap between the first cathode and the workpiece, a second electrolyte passage configured to flow a second electrolyte through the second gap between the second cathode and the workpiece, and a power supply configured to flow current through the first gap and the second gap to cause electrolytic dissolution through the workpiece from both the first side and the second side.

Abstract: Methods systems and devices for impeding an anode from being corroded or dissolved are provided. In one example, an electrolysis system includes an anode, the anode disposed on a support including a housing, the housing having an inverted cup on an end, the anode on an interior wall of the inverted cup such that electrical contact with an electrolysis solution is made along a concave portion of the inverted cup. Such an example may further include a cathode, the cathode disposed within a collection pipe such that gas produced at the cathode is retained within a channel of the collection pipe.

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract: A method for repairing a blade forming a cathode and having a surface to be coated defining a critical area, utilizing an anode, an electrolyte bath including insoluble particles, and a mounting on which the blade is mounted in a working position relative to a reference wall. The mounting is placed in the bath, and the particles and the metal of the anode are co-deposited to form the coating on the surface to be coated. The anode is typically placed facing the critical area and the mounting includes a mechanism for monitoring current lines to obtain a coating with a relatively constant, predetermined thickness for the critical area, that gradually falls to a value of substantially zero along edges of the coating.

Abstract: Disclosed herein are lipseal assemblies for use in electroplating clamshells which may include an elastomeric lipseal for excluding plating solution from a peripheral region of a semiconductor substrate and one or more electrical contact elements. The contact elements may be structurally integrated with the elastomeric lipseal. The lipseal assemblies may include one or more flexible contact elements at least a portion of which may be conformally positioned on an upper surface of the elastomeric lipseal, and may be configured to flex and form a conformal contact surface that interfaces with the substrate. Some elastomeric lipseals disclosed herein may support, align, and seal a substrate in a clamshell, and may include a flexible elastomeric upper portion located above a flexible elastomeric support edge, the upper portion having a top surface and an inner side surface, the later configured to move inward and align the substrate upon compression of the top surface.

Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

Abstract: Disclosed is a segmented contact bar for use boarding an electrolytic cell. The segmented contact bar has contact pieces made of electrically conductive material and being in spaced apart relation along the capping board, each of the contact pieces defining a segment for supporting and electrically connecting an anode and a cathode in the electrolytic cell. The segmented contact bar also has connection members including an insulating material and provided in between pairs of adjacent segments for providing insulating interconnection of the segments. There is also an electrolytic refining apparatus including adjacent electrolytic cells; a capping board positioned on the adjacent electrolytic cells; anodes and cathodes extending in spaced apart alternate positions into the each of the adjacent electrolytic cells along the capping boards; and a segmented contact bar.