Abstract: An electropolishing system including an anode, a cathode, a rolling block and a motion controller. The anode is configured to removably retain a metal device to be electropolished, and may be formed as a bar made from a solid cylindrical piece of metal or other configurations, such as wires with hooks. The anode transfers the electricity to the metal device while grooming the surface of the metal device as it contacts the rolling block. The cathode may be configured as a mesh and completes the electrical circuit. The rolling block is formed from a relatively smooth, solid material and positioned so as to allow the metal device to roll against the surface of the block. The motion controller is configured to provide vertical and horizontal movement of the anode and metal device, using force transducers to control the compression of the metal device against the rolling block.

Abstract: A bandoleer of article carriers includes a carrier band, and a plurality of carrier racks connected with a bottom edge of the carrier band each by means of a connecting plate and arranged at regular intervals. Each carrier rack shows a substantially inverted-V shape and has a pair of elastic arms extending downward from two ends of a bottom edge of the connecting plate and gradually inclined away from each other. Two distal ends of the elastic arms protrude oppositely to each other to form a pair of hook portions. Upper portions of two opposite side edges of the connecting plate oppositely protrude sideward to form two blocking portions. Lower portions of the two opposite side edges of the connecting plate oppositely protrude sideward and then are bent towards two opposite directions perpendicular to the plane of the connecting plate to form two lying-L shaped resisting portions.

Abstract: An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

Abstract: A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.

Abstract: A tending module for a series of electrolysis cells designed for the manufacture of aluminum by igneous electrolysis, each cell including a series of anodes provided with a metal rod designed to fix and electrically connect the anodes to a metal anode frame. The tending module includes a frame to be fixed to a mobile component, and at least one anode handling unit connected to the frame. The module also includes, integral with the anode handling unit, an activator that can exert at least one force or impulse on the anode rod, with a force such that, although the stem is firmly maintained in contact against the anode frame, the contact surfaces are moved in relation to each other by an amount sufficient for electrical contact to be improved. Advantageously, the activator is a jack or an impulse generator integral with the anode clamp.

Abstract: The invention relates to an intermediate component for protecting hangers associated with electrostatic coating processes. The component is an electrically conductive, pliable, tubular member, and inexpensive relative to the hanger which it serves to protect. The component lessens the cost associated with traditional hanger cleaning and preserves hanger life and integrity. The tubular member may have a longitudinal slit for installing the member over a cross bar of a hanger.

Abstract: An apparatus for positioning, handling and conveying structural parts for a surface finishing of the parts comprises frames arranged successively in a conveying direction, hooks carried by the frames for hanging the structural parts, and devices for maintaining successive ones of the frames in the conveying direction so close to each other that the structural parts hanging on the hooks are locked in position by the successive frames.

Abstract: An electrochemical deposition method and apparatus that encapsulates a substrate's edge to prevent deposition thereon is generally provided. In one embodiment, the apparatus includes a contact ring, one or more electrical contact pads disposed on the contact ring and a thrust plate axially movable relative to the contact ring. A first seal is disposed inward of the contact pad and seals with the contact ring. A second seal is coupled to the thrust plate. The first and second seals are adapted to sandwich the substrate therebetween when the contact ring and the thrust plate are moved towards each other. In another embodiment, a third seal provides a seal between the thrust plate and contact ring, and, with the first and second seals, defines an exclusion zone encapsulating the substrate's edge. One or more electrical contact pads are protected from the electrolyte by being disposed within the exclusion zone.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: A cathode frame for receiving and retaining a cathode plate for electrowinning and/or electrorefining processes is constructed as an integrally-formed frame body having a base member and side members which provide a continuous channel therethrough for retaining the peripheral edge of a cathode plate, and is further structured with a cross frame extending between the side members for receiving a cathode plate therethrough. The cross frame is sized and positioned to extend proud of the frame body thereby providing contact surfaces for striking when recovering the cathode plate from the frame. In an alternative embodiment of the invention, the cross frame is integrally formed with the side members and base member and the cathode frame is configured to retain a filter media thereagainst.