Abstract: A filter includes a membrane having a plurality of nanochannels formed therein. Functionalized nanoparticles are deposited through self assembly onto surfaces defining the nanochannels so as to decrease the final diameter of the membrane. Methods for making and using the filter are also provided.

Abstract: An electrochemical treating device having low scale potential is disclosed. The device has a variety of configurations directed to the layering of the anionic exchange and cationic exchange. The treatment device can also comprise unevenly sized ion exchange resin beads and/or have at least one compartment that provides a dominating resistance that results in a uniform current distribution throughout the apparatus.

Abstract: The invention includes novel anion exchange membranes formed by in situ polymerization of at least one monomer, polymer or copolymer on a woven support membrane and their methods of formation. The woven support membrane is preferably a woven PVC membrane. The invention also includes novel cation exchange membranes with or without woven support membranes and their methods of formation. The invention encompasses a process for using the membranes in electrodialysis of ionic solutions and in particular industrial effluents or brackish water or seawater. The electrodialysis process need not include a step to remove excess ions prior to electrodialysis and produces less waste by-product and/or by-products which can be recycled.

Abstract: The invention includes novel anion exchange membranes formed by in situ polymerization of at least one monomer, polymer or copolymer on a woven support membrane and their methods of formation. The woven support membrane is preferably a woven PVC membrane. The invention also includes novel cation exchange membranes with or without woven support membranes and their methods of formation. The invention encompasses a process for using the membranes in electrodialysis of ionic solutions and in particular industrial effluents or brackish water or seawater. The electrodialysis process need not include a step to remove excess ions prior to electrodialysis and produces less waste by-product and/or by-products which can be recycled.

Abstract: The present invention provides a cation exchange membrane which has excellent durability, a high limiting current density, a low direct current membrane resistance and excellent selectivity to monovalent cations. In the present invention, a cation exchange membrane excellent in selective permeability to monovalent cations is produced by bringing high molecular cations into contact with a surface of a cation exchange membrane in the presence of anions of an oxyacid or anions of an organic sulfonic acid.

Abstract: The present invention is directed to an electrophoresis apparatus comprising: an inner electrode positioned in an inner electrolyte zone; a substantially non-planar outer electrode positioned in an outer electrolyte zone, wherein the electrodes are positioned so as to be adapted to generate a radial electric field in an electric field area therebetween upon application of an electric potential between the inner and outer electrodes; first and second substantially non-planar membranes disposed in the electric field area and forming a first interstitial volume; means adapted to communicate fluids to the inner electrolyte zone, the outer electrolyte zone, and the first interstitial volume; means adapted to provide a sample constituent to the first interstitial volume; and means adapted to apply an electric potential across at least the electric field area wherein upon application of the electric potential at least one component in the sample constituent is caused to move through at least one membrane to an adjac

Abstract: An assembly consisting of at least one seal layer and a solid polymer ion exchange layer wherein the seal layer covers essentially only the region of the ion exchange layer which is to be sealed. The seal layer is made of porous polytetrafluoroethylene film having one surface coated and partially impregnated with a solid polymer ion exchange material. The seal layer provides support and masking functions for the solid polymer ion exchange layer during intermediate manufacturing steps, and reinforcement and effective sealing when assembled in an electrochemical apparatus.

Abstract: A method for forming filtration members using an electric potential to control the migration of electrically charged particles and hence to control the formation of a membrane layer on a substrate. In one embodiment, electrophoresis and electrodialysis processes are used to control the migration of sol particles and the deposition of the sol particles to provide a desired pore size associated with the membrane layer. In another embodiment, the substrate pores are impregnated with a reagent and, subsequently, electrophoresis and "reverse" electrophoresis processes are utilized to control the diffusion of ions in connection with the formation of the membrane layer.

Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.

Abstract: The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.

Abstract: A process in which disubstituted ethane sulfonic compounds are employed as electroplating auxiliaries in electroplating. The compounds for use in combination with the claimed process have the general formula: ##STR1## wherein, A represents a pyridinium radical ##STR2## in which R.sub.1 and R.sub.2 denote hydrogen or an alkyl radical having 1 to 3 carbon atoms, or R.sub.1 and R.sub.2, together with the pyridinium radical, form a condensed six-membered aromatic ring; or,A represents a mercapto radical of the formula --S--R.sub.4, in which R.sub.4 denotes hydrogen or the group: ##STR3## and R.sub.3 is an alkyl group having 1 to 4 carbon atoms. Also included within the scope of the present invention are alkali or ammonium salts of the compounds of the foregoing structural formula.

Abstract: The process for depositing an adherent silver film, especially on a nonconducting substrate, involves depositing the silver film from the gas phase. A plasma discharge in a gas containing volatile silver organic compounds is used. The silver compounds advantageously contain silver atoms which are bonded to an sp.sup.2 -hybridized carbon atom and are halogen-containing, particularly fluorine-containing compounds. The compounds CF.sub.3 --CAg.dbd.CF--CF.sub.3, CF.sub.3 --CAg.dbd.CF.sub.2 and pentafluorophenyl silver may be used. The silver film so formed may be strengthened electrochemically or by chemical reduction. The silver film products are useful as electrically conducting, decorative or reflective layers.

Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.

Abstract: An acid copper plating bath and process for using with electropositive metals such as aluminum and tungsten is described, wherein the bath contains sulfuric acid, copper sulfate, in solution with urea as a levelling agent, a cationic surfactant as a wetting agent and an ester of a sulfonic acid, Beta-phenylethyltosylate as a brightening agent.

Abstract: The surface of copper foil or a copper clad laminate for an internal layer is subjected to electrolysis in an aqueous solution containing diethylenetriamine pentacetic acid and copper ion by using the copper foil or a copper clad laminate for the internal layer as the cathode.

Abstract: The aqueous acidic bath for electrochemical deposition of a shiny and tear-free copper coating, especially for reinforcement of conductive pathways of a printed circuit with outstanding breaking elongation, contains at least one copper salt, at least one inorganic acid and at least one alkoxylated lactam as an amide-group-containing compound. The aqueous acidic bath also includes, as necessary, a compound having a chloride ion, a sulfur-containing organic compound with a solubilizing group and another organic compound selected from a group including polyglycols defined in more detail hereinbelow in Table III.

Abstract: A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methylpiperidine, and diethylaminoethanol.

Abstract: An additive plating bath and process are described for use in printed circuit manufacturing for applying copper to thick film patterns, said bath includes a low concentration of sulfuric acid, copper sulfate, urea, glycerin and a surface active agent in an aqueous solution.

Abstract: A method of preparing a compound useful as a brightener in aqueous copper electroplating solutions comprising reacting a compound of the following formula: ##STR1## with a compound of the formula:HS--R.sub.2 --Z.sub.nwherein:R.sub.1 and R.sub.2 are each an alkylene containing from 2 to 8 carbon atoms, an arylene, an alkylarylene, an arylalkylene or a heterocyclic group containing at least one nitrogen atom in its ring structure:x, y and z each is a hydrogen or a water-solubilizing group; andn is an integer of from 1 to 4; with the proviso that:when R.sub.1 is a heterocyclic group, x, y and z are hydrogen and R.sub.2 is an alkylene containing from 2 to 8 carbon atoms, an arylene, an alkylarylene or an arylalkylene;when R.sub.2 is a heterocyclic group, x, y and z are hydrogen and R.sub.1 is an alkylene containing from 2 to 8 carbon atoms, an arylene, an alkylarylene or an arylalkylene;when x or y is a water-solubilizing group, R.sub.

Abstract: A process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation. At least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independently from the current to the soluble copper anode in order to reduce the level of bath impurities and maintain the quality of the deposit.

Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.

Abstract: A process for electrochemical reduction of CO.sub.2 to CH.sub.4 and C.sub.2 H.sub.4 providing both high current densities and high Faradaic efficiencies. The process is carried out in an electrochemical cell wherein copper is electrodeposited in situ on the cathode surface making freshly deposited copper available for the electrochemical reduction. Faradaic efficiencies of about 75 to about 98 percent for production of CH.sub.4 and C.sub.2 H.sub.4 are obtained.

Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.Also disclosed is a device for measuring throwing power of a plating solution. The device comprises two anodes and a cathode suspended in a chamber adapted to contain a plating solution. The cathode is suspended between said anodes and comprises two flat electrode portions in electrical contact with each other, in parallel relationship to each other and spaced apart from each other to define a space containing plating solution.

Abstract: A process for producing catalysts, in which an active component or a compound to be converted into an active component is obtained or deposited on a carrier material, using deposition-precipitation. According to the invention, the formula of a carrier material, which may or may not be catalytically active, and/or the precipition of the active component or a compound to be converted into such active component on a carrier material is effected by means of an electrochemical reaction.

Abstract: A heat-transfer material includes a tubular body made of a metal. The body includes on an inner surface thereof a porous electroplated layer having re-entrant cavities. A heat transfer material is produced by: preparing a body of a metal serving as a cathode and forming a hydrophobic film on a surface of the body; subsequently keeping the surface of the body and an anode in contact with a plating aqueous solution; and subsequently applying a direct electrical potential between the anode and the cathode to cause plating current to flow through the plating solution to lay deposits of plating metal on the surface of the body and laying a number of particulate bubbles on the hydrophobic film on the surface of the body so that the bubbles are enveloped by the metal deposits to form on the surface of the body a porous plated layer having re-entrant cavities.

Abstract: A heat-transfer material is produced by: preparing a body of metal serving as a cathode; subsequently keeping a surface of the body and an anode in contact with a plating aqueous solution; and applying a direct electrical potential between the anode and the cathode to cause a plating current to flow through the plating solution to produce slime from the anode and to lay deposits of plating metal on the surface of the body and moving the slime to the surface of the body to lay deposits of the slime on the surface of the body, so that the deposits of plating metal and the deposits of the slime jointly form on the surface of the body a porous layer which has minuscule projections of electrodeposits densely formed on one surface of the layer directed away from the body.

Abstract: Novel Polyalkylenglycol naphthyl-3-sulfopropyl diethers and salts thereof of the formula ##STR1## (R.sub.1 -R.sub.3 =H, C.sub.p H.sub.2p--1 ; p=l--4, A=(PO).sub.m --(EO).sub.n --, (EO).sub.n --(PO).sub.m,--(EO).sub.n EO=ethylenoxide residue, PO=propylenoxide residue, m=0-15, n-1-40, A=H, alkali metal, earth alkali metal, NR.sub.5 R.sub.6 R.sub.7 R.sub.8 wherein R.sub.5 -R.sub.8 =H, C.sub.1 -C.sub.4 --alkyl, aryl, aralkyl) are prepared by reacting the corresponding polyalkylene glycol naphthyl either with propane-1.3-sultone. The compounds are surfactants in particular in electroplating baths for precipitation Zn, Sn, Cu, Ag, Ni and alloys thereof.

Abstract: A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methyl-piperidine, and tris (4-bromophenyl) amine, N-methylmorpholine.

Abstract: Self supporting members of copper containing phosphorus, for example bulk copper anodes or plates, for use as consumable anodes for copper electrodeposition or for melting for alloy production are manufactured by electrodeposition from an electrolyte containing copper ions and a suspension of phosphorus bearing particles having a phosphorus concentration of up to about 5 grams per liter.

Abstract: A method of electropolating a layer of copper on gravure rolls is provided with the so-plated layer being especially adapted to receive electronic engraving. The method comprises the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 g/l of copper sulfate as pentahydrate, from about 35 to about 90 g/l of sulfuric acid, from about 0.01 to about 1.0 g/l of a polyether surfactant having a molecular weight of from about 400 to about 10,000, from about 1 to about 100 mg/l of a sulfonated, sulfurized benzene brightener compound, and about 0.5 to about 5 mg/l of a grain refining compound having the nucleus ##STR1## in a heterocyclic ring structure, and a molecular weight between about 100 and about 180.

Abstract: Methods for depositing metals on or removing metals from substrates are provided which involve the use of electrolytic cells comprising an anode and cathode, sulfuric acid, and a chalcogen-containing compound soluble in said bath and having the empirical formula ##STR1## wherein X is a chalcogen, each of R.sub.1 and R.sub.2 is selected from hydrogen, NR.sub.3 R.sub.4 and NR.sub.5, at least one of R.sub.1 and R.sub.2 is other than hydrogen, each of R.sub.3 and R.sub.4 is hydrogen or a monovalent organic radical, and R.sub.5 is a divalent organic radical, in which the molar ratio of the chalcogen compound to sulfuric acid is about 1 or more, and the molar ratio of water to the combination of acid and chalcogen compound is about 20 or less.

Abstract: An electrolytic bath, suitable for depositing a metal on or removing a metal from a substrate is provided which comprises an anode and cathode, an acid having a pK.sub.a of about 6 or less, and a chalcogen-containing compound soluble in said bath and having the empirical formula ##STR1## wherein X is a chalcogen, each of R.sub.1 and R.sub.2 is selected from hydrogen, NR.sub.3 R.sub.4 and NR.sub.5, at least one of R.sub.1 and R.sub.2 is other than hydrogen, each of R.sub.3 and R.sub.4 is hydrogen or a monovalent organic radical, and R.sub.5 is a divalent organic radical, in which the molar ratio of the chalcogen compound to the acid is about 1 or more, and the molar ratio of water to the combination of acid and chalcogen compound is about 10 or less.

Abstract: A method is provided for electrodepositing a layer of copper on a plastic substrate which method comprises: positioning the plastic substrate on a supporting member, with the supporting member being in contact at a plurality of spaced apart points with the substrate for the passage of electrical current therebetween; electrolessly depositing a thin layer of metal selected from the group consisting of copper, nickel, cobalt and mixtures thereof on a surface of the plastic substrate; positioning the supported substrate in an electroplating bath including from about 10.0 to about 45.0 g/l of copper ions, at least one acid selected from the group consisting of sulfuric acid, fluoroboric acid and sulfamic acid, with the acid being present in an amount sufficient to cause the electroplating bath to have a conductivity ranging from about 0.40 to about 0.

Abstract: A method is provided for depositing on a substrate a layer of fine-grained copper especially adapted for the making of masters for optical information storage discs, comprising the steps of placing a substrate in an electroplating bath comprising from about 180 to about 220 grams/liter of copper sulfate, from about 40 to about 80 grams/liter of sulfuric acid, from about 30 to about 60 ppm of chloride ion, from about 1.0 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 1.0 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound, and from about 3.5 to about 30 milligrams/liter of 1-lower alkyl-2-mercapto imidazole; and passing electric current through the bath to deposit copper on the substrate. Also disclosed is a method of using high performance liquid chromatography techniques to quantitatively measure 1-lower alkyl-2-mercapto imidazole concentration and to control the same.

Abstract: A method for the preparation of an alkali metal dialkylaminothioxomethyl-thioalkanesulfonate composition comprising reacting a monoamine with carbon disulfide to form a dithiocarbamic acid monoamine salt, reacting the salt with an alkyl sultone to form an amino thioxo methyl thioalkane sulfonate monoamine salt, and sulfonate salt with an alkali metal base to form an alkali metal salt of the amino thioxo methyl thioalkane sulfonate composition.

Abstract: A metal is deposited onto a substrate from an electroless plating solution by providing a first body which comprises the substrate in a plating solution, providing a second body in the plating solution wherein the second body includes a metal which has an electrolytic potential in the plating solution which is different from that of the metal to be plated, and electrically connecting the first body with the second body with an electrically conductive circuit.

Abstract: In a method for an automatic control of the galvanic deposition of copper coatings in acid copper bath by measuring a maximal current density and a continual dosing of gloss additives to the bath, the maximal current density is measured by cyclically measuring an actual voltage in the bath and compensating for eventual deviations of the actual voltage from the nominal value by an automatic dosing of the additives by means of dosing devices.