Abstract: An aluminum member comprises a base material made of aluminum or art aluminum alloy, and an anodized coating provided on a surface of the base material and having a thickness of 100 ?m or less. The anodized coating comprises a barrier layer formed on the surface of the base material and having a thickness of 10 to 150 nm, and a porous layer formed on the barrier layer and having a thickness of 6 ?m or more. The porous layer comprises a first pore extending in a thickness direction of the porous layer from a boundary between the porous layer and the barrier layer, and a second pore connected to the first pore and extending so as to branch radially in the thickness direction of the porous layer toward a surface of the porous layer.

Abstract: A method of producing metallic medical supplies includes supplying a metallic material as a base material; treating the base material by carrying out any one of electrochemical treatment, chemical treatment, thermal and/or mechanical treatment or a combination of two or more of these treatments to form a film having micro pores and/or micro unevennesses having a density of 5? 104/mm2 on a surface of the base material; and carrying out iodine-impregnation treatment to impregnate the film with iodine or iodine compounds.

Abstract: The present disclosure provides semiconductor packages and methods for fabricating PoP semiconductor packages.

Abstract: A method for the antimicrobial provision of implant surfaces with silver, in which the method comprises an anodizing of the implant surface with an electrolyte, in which the electrolyte has a silver-yielding substance. Alternatively, the method comprises a silver implantation or a silver PVD deposition.

Abstract: A foraminous microstructure or film that has photonic or plasmonic properties is made by forming a structure or film composed of at least two constituent materials so that the compositional ratio of the constituent materials varies in a depth direction of the structure, and then removing one of the materials from the structure.

Abstract: One embodiment of the invention includes an assembly of metal oxide comprising valve metal oxide nanotubes.

Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.

Abstract: Electrodeposition methods for use with printed circuit boards and other articles are provided.

Abstract: The present disclosure relates to an electro-chemical plating (ECP) process that provides for an isotropic deposition, and a related apparatus. In some embodiments, the disclosed ECP process is performed by providing a substrate into an electroplating solution comprising a plurality of ions of a material to be deposited. A periodic patterned signal, which alternates between a first value and a different second value, is applied to the substrate. When the periodic patterned signal is at the first value, ions from the electroplating solution affix to the substrate. When the periodic patterned signal is at the second value, ions from the electroplating solution do not affix to the substrate. By using the periodic patterned signal to perform electro-chemical plating, the deposition rate of the plating process is reduced, resulting in an isotropic deposition over the substrate that mitigates gap fill problems (e.g., void formation).

Abstract: An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.

Abstract: A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern.

Abstract: Embodiments of the present disclosure provide for methods for manufacturing a metallized or metallizable felt by percolation of at least one felt element by electrodeposition.

Abstract: This is a process to generate alternating current without an external source for cell-houses in electrowinning or electrorefining of copper or other products in which the electric source consists of a conventional rectifier-transformer group that supplies continuous electrical current to the cell-house, which is connected in parallel to a device characterized by having the capacity to extract an electrical current from the cell-house for a period of time and then return it in another period of time, whether periodically or semiperiodically and without changing the average value of the electrical current, supplied to the cell-house by the rectifier-transformer. This results in a electrical current in the cell-house that is the superimposition of a continuous and alternating current. This process is designed to overcome the barrier of electric potential produced by the presence of the pure continuous electric field in cell-houses through the electric agitation of an ion-rich electrolyte.

Abstract: The invention relates to a method for producing a selectively absorbing coating on a solar absorber component comprising the steps of: Providing a substrate having a metallic surface, Determining the inner surface of the metallic surface, Determining the charge quantity per unit area required for producing the absorbing coating according to the inner surface, Electrolytically producing the absorbing coating by direct-current anodising the metallic surface of the substrate, forming a porous oxide layer, and then alternating-current pigmenting the pores of the oxide layer; until the charge quantity per unit area determined for the respective step from the inner surface is reached, wherein the ratio between the charge quantity per unit area for the direct-current anodising and the charge quantity per unit area for the alternating-current pigmenting is 0.65 to 0.8. In addition, the invention relates to a solar absorber component produced according to this method.

Abstract: Provided is a method for preparing an epoxy substrate having a nanopattern, including: (a) forming a titanium oxide film by anodizing a titanium substrate; (b) obtaining a titanium substrate having a concave shape formed on the surface by removing the titanium oxide film from the titanium substrate on which the titanium oxide film has been formed; (c) coating an epoxy resin onto the titanium substrate on which the concave shape has been formed; and (d) obtaining an epoxy substrate having a nanopattern of convex surfaces by removing the titanium substrate.

Abstract: A method of coating a carbon article with a metal by reductively electropolymerizing the metal via cyclic voltammetry on the carbon article, thereby forming a metal coating on the carbon article and the polymerized metal-coated carbon article made by the method. A polymerized metal-coated carbon article having a carbon article and a metal coating disposed on an exterior surface of the carbon article, the coating being present in an amount less than about 0.1 mg/cm2. A method of using a fuel cell by forming a fuel cell with a polymerized metal-coated carbon article as a working electrode and reducing oxygen, thereby providing power to a vehicle. A fuel cell including a polymerized metal-coated carbon article as a working electrode.

Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.

Abstract: A microsieve includes a patterned forest of vertically grown and aligned carbon nanotubes with a patterned matrix of vertically aligned pores. A conformal coating of substantially uniform thickness coats the nanotubes defining coated nanotubes. An interstitial material infiltrates the carbon nanotube forest and substantially fills interstices between individual coated nanotubes. The interstitial material can be a metal material infiltrated by electroplating.

Abstract: A fuel cell, having a first electrode, a second electrode, and a membrane element, in which the membrane element is disposed between the first electrode and the second electrode. At least one of the electrodes has a flow field plate and at least one flow conduit, through which a reactant can be conducted, extends in at least one outer surface of the flow field plate. The flow field plate has at least one microreaction chamber, and the microreaction chamber is disposed in the outer surface and on the flow conduit. A catalyst is disposed on at least a part of the microreaction chamber in such a way that the catalyst has contact simultaneously with the membrane element and the inflowing reactant.

Abstract: Example embodiments provide micro-heaters including a heating section, a plurality of connecting sections, and a plurality of support structures. The heating section is on the substrate, separated from the substrate and extended in a longitudinal direction. The plurality of connecting sections are arranged at a distance from each other in the longitudinal direction of the heating section, and extended from two sides of the heating section in a perpendicular direction with respect to the longitudinal direction of the heating section. The plurality of support structures are formed between the substrate and the plurality of connecting sections, so as to support the heating section and the plurality of connecting sections from underneath the plurality of connecting sections.

Abstract: A porous metal body containing continuous pores and having a low oxygen content is provided by decomposing a porous resin body that contains continuous pores and has a layer of a metal thereon by heating the porous resin body at a temperature equal to or less than the melting point of the metal while the porous resin body is immersed in a first molten salt and a negative potential is applied to the metal layer; and a method for producing the porous metal body is provided.

Abstract: There is described an open cell porous structure the cells of which are optionally filled with an elastomeric or thermosetting plastic comprising a nanocrystalline metallic or nanocrystalline metal matrix composite coating wherein the nanocrystals have a crystallite size of from about 5 nm to about 150 nm. A process for preparing the coated open cell porous structures is also disclosed.

Abstract: The present invention relates to a carbon black sheet with a thin layer of metal nanoparticles by pulse electroplating, which allows metal nanoparticles such as platinum, etc. to be uniformly dispersed on a carbon black layer and is very thin, enhancing the efficiency of a metal catalyst such as platinum, etc., minimizing the amount of the metal used to reduce the manufacturing costs significantly, and realizing a continuous process, and a polymer membrane electrode assembly (MEA) for a fuel cell by using the same.

Abstract: Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.

Abstract: The invention relates to a method for preparing metal nanoparticle-modified boron-doped diamond the method comprising generating a strong oxidising agent by acid treating a front surface of the boron-doped diamond prior to deposition of the metal nanoparticles onto the front surface of the boron-doped diamond. The metal nanoparticle-modified boron-doped diamond resulting from the acid wash has a front surface which is oxygen terminated. The metal nanoparticle-modified boron-doped diamond may be used in electrodes as an oxygen sensor, the electrode may be made by preparing a boron-doped diamond column; insulating the column so that only a front surface of the column is exposed; polishing the front surface of the column; acid-treating the front surface of the column; and depositing metal nanoparticles onto the front surface of the column.

Abstract: An initial pulse current cycle is supplied to at least one through-hole via. The pulse current cycle includes a forward pulse current. The magnitude of the forward pulse current is lower than the magnitude of the reverse pulse current. A corresponding forward and reverse current density is generated across the via causing conductive material to be deposited within the via, thereby reducing the effective aspect ratio of the via. At least one subsequent pulse current cycle is supplied. The magnitudes of the forward and reverse pulse currents of the subsequent pulse current cycle are determined in relation to the reduced effective aspect ratio. A subsequent corresponding forward and reverse current density is generated across the through-hole via causing conductive material to be deposited within the via, thereby further reducing the effective aspect ratio of the via.

Abstract: A method of producing a ultrahydrophobic substrate provided on its surface with metallic nanoparticles comprising the steps of furnishing a ultrahydrophobic substrate, applying a precursor layer on said substrate with deposition of metallic nanoparticles from the precursor layer on the substrate. The precursor layer is preferably free of electronic conductive particles and the particles are preferably deposited electrochemically from the precursor layer.

Abstract: Electrochemical plating (ECP) apparatuses with auxiliary cathodes to create uniform electric flux density. An ECP apparatus for electrochemical deposition includes an electrochemical cell with an electrolyte bath for electrochemically depositing a metal on a substrate. A main cathode and an anode are disposed in the electrolyte bath to provide a main electrical field. A substrate holder assembly holds a semiconductor wafer connecting the cathode. An auxiliary cathode is disposed outside the electrochemical cell to provide an auxiliary electrical field such that a flux line density at the center region of the substrate holder assembly substantially equals that at the circumference of the substrate holder assembly.

Abstract: A method and apparatus of anodizing a component, preferably aluminum, is disclosed. The component is placed in an electrolyte solution. A number of pulses are applied to the solution and component. Each pulse is formed by a pattern including having three magnitudes. The third magnitude is less, preferably substantially less, than the first and second magnitudes, and all three magnitudes are of the same polarity. The pulse pattern may include alternations between the first and second magnitudes, and following the alternations, the third magnitude. Other patterns may be provided. The solution is in a reaction chamber, along with at least a portion of the component. The fluid enters the reaction chamber from a transport chamber through a plurality of inlets directed toward the component, preferably at an angle of between 60 and 70 degrees. The inlet is preferably the cathode, and the component is the anode, whereby current flows between the cathode and the anode in another embodiment.

Abstract: A substrate includes an iron-nickel alloy core or a cobalt-nickel ferrous alloy core, a chromium conversion coating on at least a portion of the core, and an insulating coating on the chromium conversion coating. A method of making a substrate includes: providing an iron-nickel alloy core or a cobalt-nickel ferrous alloy core, applying a chromium conversion coating on at least a portion of the core, and applying an insulating coating on the chromium conversion coating.

Abstract: Apparatus and method for electrolytic coating of a mould, the internal surfaces of which demarcate a mould cavity, with a coating material for the purpose of achieving or re-achieving intended mould cavity dimensions. The mould, as the cathode, and an anode positioned in the mould cavity and an electrolyte containing the coating material are used. The electrolyte serving as the carrier of the coating material flows through the mould cavity in a controlled manner. During the electrolytic coating, only the internal surfaces of the mould cavity come into contact with the electrolyte and the external surfaces of the s mould therefore do not have to be covered. The mechanical properties can be kept largely uniform over the entire region. The coating can be achieved more rapidly than with the conventional processes.

Abstract: A method of coating a carbon article with a metal by cyclic voltammetrically electrodepositing the metal on the carbon article, thereby forming a metal coating on the carbon article and the metal-coated carbon article made by the method. A metal-coated carbon article having a carbon article and a metal coating disposed on an exterior surface of the carbon article, the coating being present in an amount less than about 0.1 mg/cm2.

Abstract: The present invention discloses a far infrared radiator used in various types of heating equipment. This far infrared radiator is comprised of a base material 1 composed of aluminum or aluminum alloy, and an electrolytic colored film 2 formed on this base material 1. Fine irregularities are formed in the surface of the electrolytic colored film, and nickel or cobalt is heterogeneously deposited from the bottoms to the openings in micropores of this film 2. Electrolytic colored film 2 is obtained by performing electrolysis treatment in a nickel bath or cobalt bath using an alumite film 3, formed on the surface of base material 1 having fine irregularities, as the cathode.

Abstract: A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.

Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.

Abstract: A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyte. If the cloud point is greater than the electrodeposition temperature, an anion is also present in an amount sufficient to lower the cloud point of the polymer suppressor to a temperature approximately no greater than the electrodeposition temperature.

Abstract: A method and apparatus of anodizing a component, preferably aluminum, is disclosed. The component is placed in an electrolyte solution. A number of pulses are applied to the solution and component. Each pulse is formed by a pattern including having three magnitudes. The third magnitude is less, preferably substantially less, than the first and second magnitudes, and all three magnitudes are of the same polarity. The pulse pattern may include alternations between the first and second magnitudes, and following the alternations, the third magnitude. Other patterns may be provided. The solution is in a reaction chamber, along with at least a portion of the component. The fluid enters the reaction chamber from a transport chamber through a plurality of inlets directed toward the component, preferably at an angle of between 60 and 70 degrees. The inlet is preferably the cathode, and the component is the anode, whereby current flows between the cathode and the anode in another embodiment.

Abstract: A method and associated apparatus includes depositing metal on a plating surface of an object immersed in an electrolyte solution prior to bulk deposition on the plating surface. In one aspect, the method further includes applying a voltage between an anode and the plating surface to enhance the concentration of metal ions in the electrolyte solution that is contained in a feature on the plating surface prior to the bulk deposition on the plating surface.

Abstract: A smooth layer of a metal is electroplated onto a microrough electrically conducting substrate by immersing the substrate and a counterelectrode in an electroplating bath of the metal to be electroplated and passing a modulated reversing electric current between the electrodes. The current contains pulses that are cathodic with respect to said substrate and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle less than about 50% and said anodic pulses have a duty cycle greater than about 50%, the charge transfer ratio of the cathodic pulses to the anodic pulses is greater than one, and the frequency of said pulses ranges from about 10 Hertz to about 12000 Hertz. The plating bath is substantially devoid of levelers and may be devoid of brighteners.

Abstract: The interior of cavities and through-holes in electrically conductive substrates having high-aspect ratios of 8:1 or greater can be electroplated with a uniform layer of metal on their interior surfaces by using a pulse reverse voltage waveform having a pulse train of long cathodic pulses followed by short anodic pulses even in the absence of conventional additives such as levelers and brighteners.

Abstract: This invention employs a novel approach to the copper metallization of a workpiece, such as a semiconductor workpiece. In accordance with the invention, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

Abstract: A method for producing a catalytic converter includes depositing a layer of catalytically active metallic material by electrochemical deposition on a planar substrate by immersing the substrate in an electrolyte that contains the catalytically active metallic material. A high overvoltage at which a large number of seeds of the metallic material are formed on the substrate is set for a predetermined first time period between the substrate and the opposing electrode. The overvoltage is reduced for a predetermined second time period to a value at which the seeds which are deposited in the first time period grow on the substrate.

Abstract: A method of forming an electrically conductive structure on a substrate. An electrically conductive electrode layer is formed on the substrate, and an electrically conductive conduction layer is formed over the electrode layer. The conduction layer is formed by placing the substrate in a plating solution. A first current is applied to the substrate at a first bias and a first density for a first duration. A second current is applied to the substrate at a second bias and a second density for a second duration. The first current and the second current are cyclically applied at a frequency of between about thirty hertz and about one hundred and thirty hertz.

Abstract: A method and apparatus of anodizing a component, preferably aluminum, is disclosed. The component is placed in an electrolyte solution. A number of pulses are applied to-the solution and component. Each pulse is formed by a pattern including having three magnitudes. The third magnitude is less, preferably substantially less, than the first and second magnitudes, and all three magnitudes are of the same polarity. The pulse pattern may include alternations between the first and second magnitudes, and following the alternations, the third magnitude. Other patterns may be provided. The solution is in a reaction chamber, along with at least a portion of the component. The fluid enters the reaction chamber from a transport chamber through a plurality of inlets directed toward the component, preferably at an angle of between 60 and 70 degrees. The inlet is preferably the cathode, and the component is the anode, whereby current flows between the cathode and the anode in another embodiment.

Abstract: A process for via filling is provided, wherein after flash plating, a PPR current is applied for a cycle of 1 to 50 msec positive electrolysis time and 0.2 to 5 msec reverse electrolysis time until an F/R ratio representing the ratio of positive electrolysis current density to reverse electrolysis current density is at least 1/0.2 and less than 1/1.

Abstract: Within both a method for forming a patterned photoresist layer and a method for forming an electroplated patterned conductor layer while employing the patterned photoresist layer as a patterned photoresist plating mask layer there is first provided a substrate. There is then formed over the substrate a blanket photoresist layer formed of a negative photoresist material. There is then photoexposed the blanket photoresist layer to form a photoexposed blanket photoresist layer while employing a photoexposure apparatus which employs an annular edge ring exclusion apparatus positioned over an annular edge ring of the blanket photoresist layer and the substrate. Finally, there is then developed the photoexposed blanket photoresist layer to form a patterned photoresist layer having an annular edge ring excluded over the annular edge ring of the substrate.

Abstract: In the NiFe electroplating method of the present invention, the atomic percent (at. %) composition of Ni and Fe in NiFe electroplated material is controlled by selection of the duty cycle of the electroplating current during the electroplating process. Generally, for a particular electroplating bath, where the electroplating current duty cycle is greatest the NiFe electroplated material has a higher Fe at. %, and where the electroplating current duty cycle is reduced, a lower Fe at. %. Therefore, electroplated NiFe components from a single electroplating bath can have differing NiFe concentrations where the electroplating current duty cycle is altered. Additionally, NiFe components can be electroplated with a graduated or changing Ni and Fe concentration by altering the electroplating current duty cycle during the electroplating process.

Abstract: Microscopic mechanical elements suitable for manufacture of microelectromechanical systems (MEMS) are directly prepared by forming a low-relief base of microscopic dimensions on a substrate surface by any conventional means, and electrodepositing a metal preferentially on the upper surface of the base to produce a vertically-extending 3-dimensional structure. In a first step, the patterned substrate and a counterelectrode are contacted with an electrolyte and an electric current is passed between the substrate and counterelectrode, with the substrate being predominantly cathodic with respect the counterelectrode.

Abstract: A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic solutions containing oxidising agents, then treated in trivalent bismuth compound solution and additionally treated in sulphide solution.

Abstract: A process and apparatus for conducting an electrically independent current through an anodized web to electro-deposit a coloring agent on the web. A preferred process includes the step of providing a continuous web of anodized aluminum; transferring with a charging plate a coloring current to the web with a charging plate in a first treatment cell over an area of the web sufficient to allow the current to pass through an anodic layer of the aluminum and flow through the web; and electro-depositing coloring agents on the web with the coloring current in a second treatment cell. Optionally, the web may be serially passed through additional treatment cells to apply a variety of different coloring currents to the web whereby the web may be colored with multiple coloring agents and consequently exhibit multiple colors and/or refractive properties.