Electrolytic Coating (process, Composition And Method Of Preparing Composition) Patents (Class 205/80)
  • Patent number: 11846031
    Abstract: An electrode, which includes at least one tetragonally crystallized compound containing at least one element selected from the group of Cu and Ag, the crystal lattice of the compound being of the space group I41/amd type. An electrolysis cell includes the electrode.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: December 19, 2023
    Inventors: Nemanja Martic, Christian Reller, Günter Schmid, Bernhard Schmid, David Reinisch
  • Patent number: 11598018
    Abstract: A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: March 7, 2023
    Assignee: SunPower Corporation
    Inventors: Hung-Ming Wang, Paul W. Loscutoff, Raphael M. Manalo, Arnold V. Castillo, Mohamad Ridzwan Mustafa, Mark A. Kleshock, Neil G. Bergstrom
  • Patent number: 11066755
    Abstract: A substrate holder holds a polygonal substrate Wf. A plating bath accommodates the anode holder and the substrate holder. The anode and the substrate are immersed in a plating solution in the plating bath. A control device controls a current flowing between the anode and the substrate. The substrate holder has power feed members placed along respective sides of the polygonal substrate, and there are a plurality of groups of the sides, each group including at least one side, at least one side being different between the groups. The control device can control, on a group-by-group basis, a current to be supplied to the power feed members.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: July 20, 2021
    Inventors: Naoki Shimomura, Mizuki Nagai
  • Patent number: 11008664
    Abstract: Methods and systems for producing a three-dimensional structure using electrochemical additive manufacturing are described herein. The methods can comprise injecting a growth control solution into an electrolyte comprising a metal salt to form a growth control region and applying an electric potential to a working electrode to thereby form a layer of metal at a location defined by the growth control region. The injecting and applying steps of the methods can be repeated for form the three-dimensional structure on a layer-by-layer basis.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 18, 2021
    Inventor: Qiang Huang
  • Patent number: 10947636
    Abstract: Electroplating and painting systems, methods and power converters are disclosed to provide regulated individual DC output signals to anode structures distributed in a plating solution in a tank to promote formation of plating material on a workpiece using a PWM inverter to generate a first AC signal, a sinewave filter to provide a filtered AC signal, a multiphase isolation transformer to provide a plurality of isolated AC signals, a multi-pulse diode bridge rectifier to provide a DC rectifier output signal, an output filter to provide a filtered DC rectifier output signal, and a blocking diode to provide the filtered DC rectifier output signal to the corresponding tank anode structure.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: March 16, 2021
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Nickolay N. Guskov, Gary L. Skibinski, Zhijun Liu, William Jonn Sarver
  • Patent number: 10914020
    Abstract: To prevent turbulence on a surface of a plating solution as much as possible and suppress spattering and splashing of the plating solution even when the plating solution is stirred. Provided is a wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid. The wave absorbing member includes a thin plate shaped body portion configured to move on a liquid surface when moving in the horizontal direction and a front end portion designed to be tapered toward an end from the body portion.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: February 9, 2021
    Inventors: Shao Hua Chang, Jumpei Fujikata
  • Patent number: 10537130
    Abstract: A method of forming a material structure from structural units contained within a liquid solution in a spray head is described. The liquid solution includes a solvent and a solute, the solute comprising a plurality of the structural units, the structural units including monomer units, oligomer units, or combinations thereof. The method comprises forming droplets of the liquid solution including the structural units, and spraying the droplets on a substrate, thereby substantially increasing the reactivity of the structural units within the droplets relative to the structural units within the liquid solution in the spray head. The increase in reactivity can result from the droplets containing an excess of a particular ion, the ion excess resulting from a voltage applied to conductive walls of the device which dispenses the droplets. The material structure is then formed on the substrate from the more highly reactive structural units within the droplets.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: January 21, 2020
    Assignee: Apeel Technology, Inc.
    Inventor: James T. Rogers
  • Patent number: 10426577
    Abstract: An implant system and a method of forming the implant system including an implant to be implanted into living bone. The implant includes titanium. The implant includes a first surface geometry on a first portion of a surface of the implant and a second surface geometry on a second portion of the surface of the implant. The first surface geometry includes at least a submicron topography including tube-like structures and the second surface geometry includes a first micro-scale topography, a second micro-scale topography superimposed on the first topography, and a submicron topography superimposed on the first and second micro-scale topographies, the submicron topography including the tube-like structures.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: October 1, 2019
    Assignee: Biomet 3I, LLC
    Inventors: Daniel Mandanici, Zachary B. Suttin, Keng-Min Lin, Olga S. Sanchez
  • Patent number: 10407793
    Abstract: A substrate holder for vertical galvanic metal deposition on a substrate, comprising a first substrate holder part and a second substrate holder part, wherein both said parts comprise an inner metal comprising part and an outer non-metallic part in which the substrate holder further comprises a hanging element in each substrate holder part, a first sealing element in each substrate holder part, a second sealing element between the inner metal comprising part and the outer non-metallic part of the substrate holder, a fastening system for detachably fastening both substrate holder parts to each other, a first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and a second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: September 10, 2019
    Assignee: Atotech Deutschland GmbH
    Inventors: Arnulf Fendel, Ralph Rauenbusch, Tobias Bussenius
  • Patent number: 9959979
    Abstract: An improved capacitor is provided wherein the improved capacitor has improved ESR. The capacitor has a fluted anode and an anode wire extending from the fluted anode. A dielectric is on the fluted anode. A conformal cathode is on the dielectric and a plated metal layer is on the carbon layer.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: May 1, 2018
    Assignee: KEMET Electronics Corporation
    Inventors: Randolph S. Hahn, Jeffrey Poltorak, Brandon Summey, Antony P. Chacko, John T. Kinard, Philip M. Lessner
  • Patent number: 9863051
    Abstract: Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: January 9, 2018
    Assignees: International Business Machines Corporation, Ancosys GmbH
    Inventors: Charles L. Arvin, Jürg Stahl
  • Patent number: 9840651
    Abstract: A flowable, (e.g., screen printable, stencil printable and/or dispensable) thermally conductive paste is disclosed and provide low temperature curing or firing. The pastes are useful in forming thermally conductive pathways for electronic type applications, such as, providing thermal conduction between a semiconductor chip and its associate semiconductor chip packaging (e.g. power electronic applications), which can be useful in power converters, electrical power steering modules, car head lights (LEDs), solar cells, printed circuit boards (PCBs), plasma display panels (PDPs), and the like. The pastes have a combination of conductive flakes and particles in a minimal amount of carrier fluid and carrier resin to provide advantageous deposition and heat melding properties.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: December 12, 2017
    Inventors: Dave Hui, John McKean Oleksyn, Jason Kenneth Parsons, Gareth Michael Fuge
  • Patent number: 9834852
    Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: December 5, 2017
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas Ponnuswamy, Hilton Diaz Camilo, Robert Rash, David W. Porter
  • Patent number: 9782442
    Abstract: Methods for preparing capsules, such as micro- and/or nanocapsules from all-aqueous emulsions are described herein. The method includes mixing, combining, or contacting a first electrically charged phase containing a first solute with at least an optionally charged second phase containing a second solute. The solutes are incompatible with each other. The electrostatic forces between the two solutions induce the formation of droplets of a dispersed phase in a continuous phase. The droplets are then solidified to form the capsules.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: October 10, 2017
    Assignee: Versitech Limited
    Inventors: Ho Cheung Shum, Yang Song
  • Patent number: 9744542
    Abstract: A method of forming a material structure from structural units contained within a liquid solution in a spray head is described. The liquid solution includes a solvent and a solute, the solute comprising a plurality of the structural units, the structural units including monomer units, oligomer units, or combinations thereof. The method comprises forming droplets of the liquid solution including the structural units, and spraying the droplets on a substrate, thereby substantially increasing the reactivity of the structural units within the droplets relative to the structural units within the liquid solution in the spray head. The increase in reactivity can result from the droplets containing an excess of a particular ion, the ion excess resulting from a voltage applied to conductive walls of the device which dispenses the droplets. The material structure is then formed on the substrate from the more highly reactive structural units within the droplets.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: August 29, 2017
    Assignee: aPEEL Technology, Inc.
    Inventor: James T. Rogers
  • Patent number: 9162216
    Abstract: The oxide catalyst for the direct NO decomposition to N2 and 02 is deposited on the austenitic acid-proof steel substrate and contains the phase with aFe203 structure and the phase with spinel structure and the lattice parameters close to the lattice parameters of NiFe204. Those phases form the micro-crystallites that additionally contain Cr and Mn and eventually Si. The catalyst according to the invention is manufactured by the at least twice heating of the austenitc acid-proof steel substrate in the atmosphere containing oxygen, up to the temperature from the 600-850° C. range, with the rate of 2-6° C./min, followed by the annealing at that temperature for 2-6 hours.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: October 20, 2015
    Inventors: Mieczyslawa Najbar, Jaroslaw Dutkiewicz, Aleksandra Weselucha, Józef Camra, Stanislaw Janiga, Iga Nazarczuk, Mateusz Kozicki, Pawel Kornelak, Wieslaw Lasocha, Alicja Lasocha
  • Publication number: 20150147593
    Abstract: An electrode for use in bio-electrochemical systems is described, including: a substantially planar electrode material; a frame comprising a non-conductive substance; and one or more first conductive substances linked or secured to the frame. Bio-electrochemical systems, racks for inserting the electrode, and methods of using the racks are also described.
    Type: Application
    Filed: November 24, 2014
    Publication date: May 28, 2015
    Inventors: Matthew SILVER, Justin BUCK, Casey CHARTIER, Mark BAROSKY, James Ryan HAWKINS, Zhen HUANG, Quynh Anh Le TRAN, Tzipora WAGNER
  • Publication number: 20150132539
    Abstract: A coated device comprising a body, a coating on at least a portion of a surface of the body, wherein the coating comprises, a terminal layer, and at least one underlayer positioned between the terminal layer and the body, the underlayer comprising a hardness of greater than 61 HRc, wherein prior to the addition of the terminal layer, at least one of the body and the underlayer is polished to a surface roughness of less than or equal to 1.0 micrometer Ra.
    Type: Application
    Filed: August 28, 2014
    Publication date: May 14, 2015
    Inventors: Jeffrey R. Bailey, Srinivasan Rajagopalan, Mehmet Deniz Ertas, Adnan Ozekcin, Bo Zhao
  • Publication number: 20150122658
    Abstract: Certain embodiments disclosed herein pertain to methods and apparatus for electrodepositing material on a substrate. More particularly, a novel membrane for separating the anode from the cathode/substrate, and a method of using such a membrane are presented. The membrane includes at least an ion exchange layer and a charge separation layer. The disclosed embodiments are beneficial for maintaining relatively constant concentrations of species in the electrolyte over time, especially during idle (i.e., non-electroplating) times.
    Type: Application
    Filed: April 18, 2014
    Publication date: May 7, 2015
    Applicant: Lam Research Corporation
    Inventors: Doyeon Kim, Shantinath Ghongadi, Yuichi Takada, Ludan Huang, Tariq Majid
  • Publication number: 20150108001
    Abstract: Disclosed is a liquid processing jig for performing a predetermined processing on a workpiece using a processing liquid. The liquid processing jig includes: a liquid processing unit formed on a surface of the liquid processing jig and configured to perform a predetermined processing on the workpiece by the processing liquid; a liquid supplying unit configured to supply the processing liquid to the liquid processing unit; a liquid supplying channel configured to connect the liquid supplying unit and the liquid processing unit and supply the processing liquid from the liquid supplying unit to the liquid processing unit; and a liquid discharging channel configured to discharge the processing liquid from the liquid processing unit. The liquid supplying unit, the liquid supplying channel, the liquid processing unit, and the liquid discharging channel are provided to cause the processing liquid to flow by a capillary phenomenon.
    Type: Application
    Filed: October 21, 2014
    Publication date: April 23, 2015
    Inventors: Kazuo SAKAMOTO, Haruo IWATSU
  • Patent number: 8999475
    Abstract: A component of a substrate processing apparatus that performs plasma processing on a substrate includes a base mainly formed of an aluminum alloy containing silicon. A film is formed on the surface of the base by an anodic oxidation process which includes connecting the component to an anode of a power supply and immersing the component in a solution mainly formed of an organic acid. The film is impregnated with ethyl silicate.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: April 7, 2015
    Assignee: Tokyo Electron Limited
    Inventor: Koji Mitsuhashi
  • Patent number: 8968839
    Abstract: There is provided a method for producing a surface-treated metallic material, by use of which a metallic material having a stable and excellent sliding characteristic can be produced with a low environmental load without covering the metallic material surface with an oxide film. The method for producing a surface-treated metallic material includes immersing an anode and a cathode in an electrolyte solution, placing a metallic material used as a material to be treated above the surface of the electrolyte solution, and applying a voltage between the anode and the cathode to treat the metallic material surface, the voltage being equal to or higher than a voltage for causing a complete plasma state.
    Type: Grant
    Filed: November 24, 2011
    Date of Patent: March 3, 2015
    Assignee: JFE Steel Corporation
    Inventors: Masayasu Nagoshi, Kaoru Sato, Seiichi Watanabe, Souki Yoshida
  • Publication number: 20150027613
    Abstract: EC film stacks and different layers within the EC film stacks are disclosed. Methods of manufacturing these layers are also disclosed. In one embodiment, an EC layer comprises nanostructured EC layer. These layers may be manufactured by various methods, including, including, but not limited to glancing, angle deposition, oblique angle deposition, electrophoresis, electrolyte deposition, and atomic layer deposition. The nanostructured EC layers have a high specific surface area, improved response times, and higher color efficiency.
    Type: Application
    Filed: July 25, 2014
    Publication date: January 29, 2015
    Inventors: Anita TRAJKOVSKA-BROACH, Ying Sun, William Kokonaski, Pie Paolo Monticone, Niklaus Schneeberger
  • Patent number: 8895425
    Abstract: A method of forming a channel layer of an electric device according to an embodiment is provided. First, a conductive substrate including an insulating layer on the substrate is provided. The conductive substrate and a metal to be plated are used as respective electrodes to carry out electroplating within an electrolyte solution. In this case, electrons provided by a tunneling current passing through the insulating layer from the conductive substrate are bonded with ions of the metal within the electrolyte solution to form a metal channel layer on the insulating layer.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: November 25, 2014
    Assignee: SNU R&DB Foundation
    Inventors: Young June Park, Seok Ha Lee, Jun Ho Chun, Yeonkyu Choi
  • Publication number: 20140295093
    Abstract: A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.
    Type: Application
    Filed: March 24, 2014
    Publication date: October 2, 2014
    Inventor: Tomonori HIRAO
  • Publication number: 20140284216
    Abstract: According to the invention an electrochemical deposition or polishing clamber including: a support for a substrate, the support having an in-use position; a housing having an interior surface and a fluid outlet pathway for removing an electrolyte from the chamber, wherein the fluid outlet pathway includes one or more slots which extend into the housing from at least one slotted opening formed in the interior surface; a seal for sealing the housing to a peripheral portion of a surface of a substrate position on the support in its in-use position; and a tilting mechanism for tilting the chamber in order to assist in removing electrolyte from the housing through the fluid outlet pathway.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 25, 2014
    Inventor: John MACNEIL
  • Publication number: 20140262797
    Abstract: The present disclosure relates to an electro-chemical plating (ECP) process which utilizes a dummy electrode as a cathode to perform plating for sustained idle times to mitigate additive dissociation. The dummy electrode also allows for localized plating function to improve product gapfill, and decrease wafer non-uniformity. A wide range of electroplating recipes may be applied with this strategy, comprising current plating up to approximately 200 Amps, localized plating with a resolution of approximately 1 mm, and reverse plating to remove material from the dummy electrode accumulated during the dummy plating process and replenish ionic material within the electroplating solution.
    Type: Application
    Filed: April 9, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Yi Chang, Liang-Yueh Ou Yang, Chen-Yuan Kao, Hung-Wen Su
  • Publication number: 20140262800
    Abstract: Presented herein is a method of processing a device, comprising providing an electroplating bath having a leveler, the leveler having a total nitrogen-to-total carbon (TN/TOC) ratio of about 15% or less, bringing a substrate into contact with the electroplating bath, the substrate having a recess formed therein and electroplating the substrate to create a feature substantially free of voids in the substrate recess. Electroplating the substrate is performed for a time period about as long as an electrical response peak of the leveler, and optionally for at least 30 seconds. The leveler may optionally have at least one ingredient free of nitrogen and having a leveling functionality. One ingredient may be a benzene ring free of nitrogen. The leveler TN/TOC ratio is between about 3% and about 15%.
    Type: Application
    Filed: March 27, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yuan Kao, Hung-Wen Su, Minghsing Tsai
  • Patent number: 8826528
    Abstract: Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: September 9, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Steven D. Theiss, Michael A. Haase
  • Patent number: 8828151
    Abstract: Disclosed is an easily handleable composition for metal surface treatment which enables to achieve foundation surface concealment, coating adhesion and corrosion resistance equal to or higher than those obtained by the conventional metal surface treatment compositions. This composition for metal surface treatment places no burden on the environment. Also disclosed are a method for treating the surface of a metal material wherein such a composition for metal surface treatment is used, and a metal material treated by such a metal surface treatment method. Specifically disclosed is a metal surface treatment composition used for a treatment of a metal surface, which composition contains a zirconium compound and/or titanium compound substantially not containing fluorine, and an inorganic acid and/or a salt thereof. This metal surface treatment composition has a pH of not less than 1.5 but not more than 6.5.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: September 9, 2014
    Assignee: Chemetall GmbH
    Inventors: Toshio Inbe, Thomas Kolberg
  • Patent number: 8828245
    Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: September 9, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Chung Chen, Yi-Ling Lo, Hung-Kun Lee, Tzu-Ping Cheng
  • Publication number: 20140190835
    Abstract: A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 10, 2014
    Applicant: YUKEN INDUSTRY CO., LTD.
    Inventors: Norikazu KOJIMA, Yoshiharu KIKUCHI
  • Publication number: 20140112112
    Abstract: The invention relates to a method of manufacturing an element comprising the following steps: a) forming a body made of oxide based ceramic; b) exposing at least one portion of the external surface of the body to a reduction reaction, to remove oxygen atoms to a predetermined depth in order to make the at least one portion electrically conductive; c) depositing a metallic material starting from the at least one electrically conductive portion; d) machining the body and/or the metallic material in order to provide the element with an aesthetic finish. The invention concerns the field of timepieces.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 24, 2014
    Applicant: The Swatch Group Research and Development Ltd.
    Inventors: Guido PLANKERT, Pierry Vuille
  • Patent number: 8679317
    Abstract: A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: March 25, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura
  • Patent number: 8668817
    Abstract: The invention relates to a system and a method of plating metal alloys, as well as to the structures thus obtained. The system for plating metal alloys comprises an electrolytic cell containing an electrolytic solution (3) in which an anode (4,4a,4b), a cathode (5), and a plurality of metal components to be plated onto the cathode are immersed, the anode (4,4a,4b) and the cathode (5) being electrically connected to means (6) adapted to apply a potential difference between said anode (4,4a,4b) and said cathode (5). The invention is characterized in that the means (6) adapted to apply a potential difference between said cathode (5) and said anode (4,4a,4b) impose a potential difference value that changes over time according to a predefined law.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: March 11, 2014
    Assignee: Creat New Technology S.R.L.
    Inventor: Lorenzo Battisti
  • Patent number: 8601691
    Abstract: Methods of fabricating coated components using multiple types of fillers are provided. One method comprises forming one or more grooves in an outer surface of a substrate. Each groove has a base and extends at least partially along the outer surface of the substrate. The method further includes disposing a sacrificial filler within the groove(s), disposing a permanent filler over the sacrificial filler, disposing a coating over at least a portion of the substrate and over the permanent filler, and removing the first sacrificial filler from the groove(s), to define one or more channels for cooling the component. A component with a permanent filler is also provided.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: December 10, 2013
    Assignee: General Electric Company
    Inventors: Raul Basilio Rebak, Renee Bushey Rohling, Scott Andrew Weaver, Ronald Scott Bunker, Don Mark Lipkin, John Brian McDermott, Lawrence Bernard Kool, Ann Melinda Ritter
  • Patent number: 8594417
    Abstract: Systems and methods for inspecting anodes, and smelting management based thereon are provided. In one embodiment, a system includes an imaging device configured to obtain images of at least one anode assembly, an image processor configured to producing imaging data based on the images, and a data analyzer configured to produce anode characteristic data based on the imaging data. In one embodiment, a method includes the steps of obtaining at least one image of at least a portion of an anode assembly, producing imaging data based on the at least one image, and deriving anode characteristic data based, at least in part, on the imaging data.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: November 26, 2013
    Assignee: ALCOA Inc.
    Inventors: Jean-Pierre Gagné, Gilles Dufour
  • Publication number: 20130299354
    Abstract: An electrochemical processor may include a head having a rotor configured to hold a workpiece, with the head moveable to position the rotor in a vessel. Inner and outer anodes are in inner and outer anolyte chambers within the vessel. An upper cup in the vessel, has a curved upper surface and inner and outer catholyte chambers. A current thief is located adjacent to the curved upper surface. Annular slots in the curved upper curved surface connect into passageways, such as tubes, leading into the outer catholyte chamber. Membranes may separate the inner and outer anolyte chambers from the inner and outer catholyte chambers, respectively.
    Type: Application
    Filed: July 16, 2013
    Publication date: November 14, 2013
    Inventors: Gregory J. Wilson, Paul R. McHugh
  • Patent number: 8562808
    Abstract: The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium consisting of (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: October 22, 2013
    Assignee: E I du Pont de Nemours and Company
    Inventors: John C. Crumpton, Jay Robert Dorfman
  • Patent number: 8562847
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: October 22, 2013
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Publication number: 20130256144
    Abstract: Described are devices and methods for forming one or more nanomembranes including electroactive nanomembranes within a nanowell or nanotube, or combinations thereof, in a support material. Nanopores/nanochannels can be formed by the electroactive nanomembrane within corresponding nanowells. The electroactive nanomembrane is capable of controllably altering a dimension, a composition, and/or a variety of properties in response to electrical stimuli. Various embodiments also include devices/systems and methods for using the nanomembrane-containing devices for molecular separation, purification, sensing, etc.
    Type: Application
    Filed: April 2, 2012
    Publication date: October 3, 2013
    Applicant: LUX BIO GROUP, INC.
    Inventor: Gordon HOLT
  • Patent number: 8512542
    Abstract: A method for the electrochemical coating of a substrate uses brush plating. This is to take place with an electrolyte in that particles are dispersed, which are embedded into the developing layer. It is proposed to add the particles to the carrier for the electrolyte by way of a separate conduit system. The electrolyte is added by way of a conduit system. In this way it is achieved that an agglomeration of the particles in the electrolyte can be prevented because only a short time passes between when the particles are fed and the layer is formed. A device for electrochemical coating has two conduit systems provided for this purpose.
    Type: Grant
    Filed: April 1, 2009
    Date of Patent: August 20, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Frank Heinrichsdorff, Jens Dahl Jensen, Hans-Richard Kretschmer, Daniel Reznik, Arno Steckenborn
  • Publication number: 20130199936
    Abstract: Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.
    Type: Application
    Filed: June 13, 2012
    Publication date: August 8, 2013
    Inventors: Jiguang Zhang, Wu Xu, Gordon L. Graff, Xilin Chen, Fei Ding, Yuyan Shao
  • Publication number: 20130195580
    Abstract: A fastening mechanism includes a basic body made from a base metal, onto which at least one corrosion-resistant layer is applied. A further layer is applied at least partially onto the at least one corrosion-resistant layer. The further layer has a lower coefficient of friction than the at least one corrosion-resistant layer.
    Type: Application
    Filed: January 12, 2011
    Publication date: August 1, 2013
    Applicant: Robert Bosch GmbH
    Inventors: Harald Kast, Juergen Reiner
  • Patent number: 8496799
    Abstract: Systems and methods for in-situ annealing of metal layers as they are being plated on a substrate by action of a chemical solution are provided. The in-situ annealing, in conjunction with controlled slow growth rates, allows control of the structure of the plated metal layers. The systems and methods are used for maskless plating of the substrates.
    Type: Grant
    Filed: September 10, 2008
    Date of Patent: July 30, 2013
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Robert J. Von Gutfeld, Alan C. West
  • Publication number: 20130183581
    Abstract: An improved substrate is disclosed for an electrode of an electrochemical cell. The improved substrate includes a core material surrounded by a coating. The coating is amorphous such that the coating includes substantially no grain boundaries. The core material may be one of lead, fiber glass, and titanium. The coating may be one of lead, lead-dioxide, titanium nitride, and titanium dioxide. Further, an intermediate adhesion promoter surrounds the core material to enhance adhesion between the coating and the core material.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Applicant: Energy Power Systems LLC
    Inventors: Subhash Dhar, Fabio Albano, Srinivasan Venkatesan, William Koetting, Lin Higley
  • Publication number: 20130122195
    Abstract: A superhydrophobic surface includes a plurality of microfeatures disposed on a substrate and a gas generator disposed within the microfeatures, the gas generator configured to generate a gas within the microfeatures. Gas is generated within the microfeatures when at least a portion of the microfeatures is in a wetted state to restore the microfeatures to a dewetted state. Gas generation is self-regulating in that gas generation automatically starts when a wetted condition exists and stops when sufficient gas has been generated to recover a dewetted state that restores superhydrophobicity.
    Type: Application
    Filed: July 22, 2011
    Publication date: May 16, 2013
    Inventors: Chang-Jin Kim, Choongyeop Lee
  • Publication number: 20130087462
    Abstract: The invention relates to a spacer textile (1) including a top textile (2), a bottom textile (3) and a spacer layer (5), wherein the top textile (2) and the bottom textile (3) are connected together by the spacer layer (5). The top textile (2), the bottom textile (3) and the spacer layer (5) are monofilament fibers from inert fluorocarbons. The invention relates additionally to the use of the spacer textile (1) according to the invention as at least in part sheathing of an electrode (13, 14) in an electroplating bath (11), as a lining of operating, bearing and/or transport surfaces (31), or as filter or support material in chemically aggressive media.
    Type: Application
    Filed: September 5, 2012
    Publication date: April 11, 2013
    Inventors: Hendrik Rabe, Richard Zimmermann, Martin Olesch, Joerg Zschetzsche, Katerina Machova
  • Publication number: 20130075265
    Abstract: Methods for electrochemically processing microfeature wafers using at least one counter electrode in a vessel, a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode.
    Type: Application
    Filed: November 20, 2012
    Publication date: March 28, 2013
    Inventor: Applied Materials Inc.
  • Patent number: 8377513
    Abstract: The invention relates to a method for coating a cooling element (1) mainly made of copper, provided with water cooling pipes (2) and used particularly in connection with metallurgic furnaces or the like, wherein the cooling element includes a fire surface (3) that is in contact with molten metal, suspension or process gas; side surfaces (6) and an outer surface (7), so that at least part of the fire surface (3) is coated by a corrosion resistant coating (5).
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: February 19, 2013
    Assignee: Outotec Oyj
    Inventors: Risto Saarinen, Yrjö Leppänen