Abstract: A method for treating a surface of a metallic structure, the metallic structure being made of a first metallic material, the method including the steps of: (a) releasing metallic ions from the surface of the metallic structure; and (b) depositing a nano-structured metallic layer onto the surface of the metallic structure from the released metallic ions, wherein the nano-structured metallic layer includes uniform nanoparticles.

Abstract: The present disclosure addresses limitations with methods, systems and processes for integrating multiple advanced technologies into a single automated manufacturing and repair cell. The methods, systems and processes of the present disclosure leverage unique software and hardware to configure a manufacturing cell that is capable of conducting process development and planning, dimensional analysis, pre-machining, surface preparation, cold spray (supersonic particle deposition), dust collection, helium recovery, and post machining in a single integrated manufacturing and repair cell.

Abstract: This disclosure includes coatings for increasing the physical and/or chemical properties of articles, for example, tubular metal articles such as those found in the oil and gas industry, as well as processes for making such coatings and articles comprising such coatings.

Abstract: The invention is relates to a method for manufacturing a capacitor. The method has the following steps: a) providing an electrode body made of an electrode material, wherein a dielectric at least partially covers a surface of the electrode material, to obtain an anode body; b) introducing a dispersion, which contains particles of an electrically conductive polymer with a particle size (d50) of 70 nm and less and a dispersing agent, into at least a part of the anode body; c) at least partial removing the dispersing agent, to obtain a capacitor body; and d) introducing, into the capacitor body, a polyalkylene glycol or a polyalkylene glycol derivative or a combination of at least two thereof as an impregnating agent.

Abstract: A copper mold or copper mold plate and also a process for reconditioning such worn molds or mold plates, which are used for the continuous casting of metals or metal alloys is provided. An electrolytically applied copper coating is provided on the inner wall of the mold or on that side of the mold plate which faces toward the casting strand.

Abstract: A plated component and a plating process are disclosed. The plating process includes applying a material to a region of a component, the material being selected from the group consisting of nickel, cobalt, chromium, iron, aluminum, or a combination thereof. The region includes a single crystal microstructure, includes a directionally solidified microstructure, is substantially devoid of equiaxed microstructure, or a combination thereof. The applying includes electroplating, electroless plating, or the electroplating and the electroless plating. The plated component includes an electroplated region, an intermediate layer on the electroplated region, and an overlay coating on the intermediate layer.

Abstract: A method of repairing damaged airfoils. The method comprises the steps of stripping thermal barrier coatings from the airfoil. After the coatings are removed, cracks are removed from the airfoil. Cracks that appear in the bond coat area over the airfoil fillet portion are removed by locally grit blasting the fillet portion of the airfoil. This operation also results in locally removing the bond coating from the fillet portion. Cracks and other damage sustained by the airfoil tip are removed and replaced by welding superalloy material. The airfoil then may be cleaned by thermal etching. The airfoil is then placed in a plating tool permitting preferential plating of airfoil areas from which plating has been removed. After plating, the airfoil is then heat treated to diffuse the platinum coating with the superalloy substrate materials. The diffusion heat treated airfoil is aluminided by any aluminiding process, forming a PtAl coating.

Abstract: A method for electrochemically activating a doped diamond electrode by bringing the electrode into contact with an aqueous solution containing an electrolyte and applying at least one electrical pulse to the electrode. This method may be used to restore the electrochemical reactivity of a doped diamond-based electrode, the activation of the electrode in some cases possibly being done in the same aqueous solution containing an electrolyte in which the electrode lost its electrochemical reactivity.

Abstract: An exposed surface on a steel component is prepared for an application of a nickel high speed solution. The nickel high speed solution is applied to the exposed surface to create an intermediate surface on the component. The intermediate surface is prepared for an application of a nickel sulfamate solution. The nickel sulfamate solution is applied to the intermediate surface to create a duplex brush plating.

Abstract: An electrochemical sensor system and membrane and method thereof for increased accuracy and effective life of electrochemical and enzyme sensors.

Abstract: A method for repairing an aluminum part having a worn portion is provided. In one embodiment, the method includes the steps of: (i) producing a first substantially non-porous coating over the worn portion utilizing a cold spray process wherein a powder mixture is propelled against the worn portion of the aluminum part, and (ii) anodizing the aluminum part to grow an aluminum oxide layer overlaying the first substantially non-porous coating. The powder mixture includes aluminum and an alloy media.

Abstract: An exposed surface on a steel component is prepared for an application of a nickel high speed solution. The nickel high speed solution is applied to the exposed surface to create an intermediate surface on the component. The intermediate surface is prepared for an application of a nickel sulfamate solution. The nickel sulfamate solution is applied to the intermediate surface to create a duplex brush plating.

Abstract: A copper mold or copper mold plate and also a process for reconditioning such worn molds or mold plates, which are used for the continuous casting of metals or metal alloys is provided. An electrolytically applied copper coating is provided on the inner wall of the mold or on that side of the mold plate which faces toward the casting strand.

Abstract: Apparatus for dissociating water into hydrogen and oxygen, comprising a tank and the quantity of water contained in said tank is dissolved. A quantity of a conductivity promoting material suspended or dissolved in said water to form an electrically conductive fluid and a plurality of plates suspended in said electrically conductive fluid and a reactive agent selected from the group consisting of derivatives of vegetable materials, derivatives of highly resinous vegetable materials, derivatives of vegetable materials taken from pinyon pine, derivatives of vegetable materials taken from dragon blood tree, water soluble derivatives of partially oxidized vegetable materials, water soluble derivatives of partially oxidized highly resinous vegetable materials, water soluble derivatives of partially oxidized vegetable materials taken from pinyon pine, and water soluble derivatives of partially oxidized vegetable materials taken from dragon blood tree.

Abstract: A method of and system for repairing the sheaves (24) in an elevator system has these steps. The ropes (22) associated with the sheave are removed, the sheave is cleaned, and a coating (24) is deposited on the cleaned surface. The coating is adapted to reduce the wear coefficient of the surface of the coated sheave by about 80% to 90% with respect to the sheave without a coating. The thickness of the coated sheave is adjusted to produce a specified sheave diameter.

Abstract: Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.

Abstract: A method for repairing an aluminum part having a worn portion is provided. In one embodiment, the method includes the steps of: (i) producing a first substantially non-porous coating over the worn portion utilizing a cold spray process wherein a powder mixture is propelled against the worn portion of the aluminum part, and (ii) anodizing the aluminum part to grow an aluminum oxide layer overlaying the first substantially non-porous coating. The powder mixture includes aluminum and an alloy media.

Abstract: A process for repairing components includes the steps of providing a component having an affected area on a surface of a component to be repaired; depositing a repair material over the affected area on the surface of the component so that the repair material plastically deforms without melting and bonds to the affected area upon impact with the affected area and thereby covers the affected area; providing a sulfuric acid based anodizing solution; anodizing a deposited repair material on the surface of said component in the sulfuric acid based anodizing solution; consuming only a portion of the deposited repair material to form a hard anodized coating layer upon the deposited repair material to form a hard anodized coated component; providing a corrosion resistant sealant solution; and contacting a hard anodized coated component with the corrosion resistant sealant solution to form a corrosion resistant sealant coating on the hard anodized coated component.

Abstract: Generating pulsed discharge between an end surface of an electrode 37 and an end face portion of a metallic plate 11, to attrite the electrode 37, to form in the end surface of the electrode 37 a recess 41 conforming to a shape of the end face portion of the metallic plate 11, having the electrode 37 making a relative movement in a direction perpendicular to a lateral side of the metallic plate 11, generating pulsed discharge between an internal side face of the recess 41 of the electrode 37 and a lateral face 11bl (11cl) or 11br (11cr) of the end face portion of the metallic plate 11, to form an auxiliary coat 43 or 45 on the lateral face 11bl (11cl) or 11br (11cr) of the end face portion of the metallic plate 11, and generating pulsed discharge between a bottom face of the recess 41 of the electrode 37 and a top face 11bu (11cu) of the end face portion of the metallic plate 11, to form a cladding layer 47 on the end face portion of the metallic plate 11.

Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.

Abstract: Methods for repairing gas turbine engine components are provided. In this regard, a representative method includes: applying a surface treatment to the component such that locations at an exterior surface of the component exhibiting inter-granular attack are protected from erosion during a cleaning process; and cleaning the component using hydrogen fluoride ion cleaning to clean the component.

Abstract: The invention relates to methods and compositions for the surface reconstruction of gold and other metal surfaces. Specifically, an applied potential and a certain solution composition, is used to reconstruct the metal surface atoms into a specific atomic lattice arrangement (symmetry). Also disclosed is a kit for the surface reconstruction of metal electrodes.

Abstract: Disclosed are a method and a device for filling material separations on the surface. In methods known in prior art, which are used for filling material separations, the substrate is often influenced in a negative manner by high processing temperatures and dissimilar additives. The inventive method overcomes said disadvantage, taking place at low temperatures and allowing the material separation to be completely filled without using dissimilar substances.

Abstract: A method of plating contacts in situ within an electrical connector, the connector having a plurality of contacts circumscribed by a skirt of a connector body. The method comprises. grounding the contacts and then applying a plate coating onto the contacts within the connector body.

Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

Abstract: A method of locally repairing parts coated with a thermal barrier including a ceramic outer layer and a metal underlayer of alumina-forming alloy for protecting the substrate against oxidation and for bonding with the ceramic outer layer, includes: defining the zone for repair with a mechanical mask adapted to the shape of the part and the zone for repair; scouring the zone for repair so as to remove the ceramic, the alumina layer, and the damaged portions of the underlayer; supplying materials for repairing the underlayer to the repair zone by subjecting the partially-scoured part to metal deposition by use of an electrical current; and subjecting the part to a heat treatment in order to enable the added metals to diffuse into the remaining underlayer in the repair zone for repair and to enable a surface film of alumina to form. After the underlayer has been reconstituted, the zone for repair is again defined by a mechanical mask and a new ceramic layer is deposited thereon.

Abstract: An electrochemical process for selectively stripping at least one coating from the surface of a substrate is disclosed. The substrate (often a turbine engine component) is immersed in a composition through which electrical current flows. The composition includes a halide salt, such as sodium chloride, ammonium chloride, and potassium chloride. In preferred embodiments, the electrical current is direct current (DC). The process is especially useful for selectively removing portions of diffusion aluminide coatings. For example, the additive layer can efficiently be removed, without substantially affecting the underlying diffusion layer or substrate. Related stripping compositions and apparatuses are also described.

Abstract: A method for touching up and/or repairing minor surface damage in a large-format pressing plate or an endless strip 3 made of steel sheet, with a textured surface 4, for surface embossing of wood materials or laminate panels, has the damaged surface subjected to microgalvanic treatment. In order to simply repair the damage locations and to allow a longer tool life of the pressing sheets, it is provided, that an electrolyte solution that contains metal ions and iron is used, which is coordinated with the base material of the pressing plate or the endless strip 3. This yields the particular advantage that no color deviations are formed as compared with the damaged locations and that a conventional chromium-plating process can be used. Thus the damaged locations 2 are not washed out and thereby become visible again, during subsequent touch-up chromium-plating, because of the electrolyte used.

Abstract: A method of manufacturing an electrolytic cell in which an intermediate sintered form is produced that comprises a porous anode layer and an electrolyte layer having a prespecified shape of the electrolytic cell. The electrolyte layer has defects extending through the electrolyte layer. A substance by way of a pressure, a solvent, particle suspended in a solvent or particles introduced by way of thermal spray are introduced into defects within the electrolyte layer. Thereafter, a green cathode layer is applied to the electrolyte layer while the substance is in place, within the defects. The intermediate sintered form with the applied green cathode layer is then fired to produce the electrolytic cell.

Abstract: The invention provides for a back-end metallisation process in which a recess is filled with copper and which includes the step of forming a plating base on the surfaces of the recess for the subsequent galvanic deposition of the said copper, and wherein subsequent to the formation of the plating base, but prior to the galvanic deposition of the copper, a modifying agent is introduced to the recess and which serves to absorb in the surface regions not covered by the plating base and to thereby modify the surface to promote copper growth thereon so as to effectively repair the initial plating base before the copper plating fill commences.

Abstract: Disclosed methods reduce the discontinuities that between individual layers of a structure that is formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regions defined in data descriptive of the structure or they may exist as a result of building limitations, e.g., those that result in non-parallel orientation between a building axis and sidewall surfaces of layers. Methods for reducing discontinuities may be applied to all regions or only to selected regions of the structure. Methods may be tailored to improve the accuracy between an original design of the structure and the structure as fabricated or they may simply be used to smooth the discontinuities between layers. Methods may include deposition operations that selectively favor filling of the discontinuities and/or etching operations that selectively favor removal of material from protrusions that define discontinuities.

Abstract: A process for in situ electroforming a structural reinforcing layer of selected metallic material for repairing an external surface area of a degraded section of metallic workpieces, especially of tubes and tube sections, is described. Preferably, the metal layer coatings are made of fine-grained metals, metal alloys or metal matrix composites. The plating system can be used on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. A suitable apparatus is assembled on or near the degraded site and is sealed in place to form the plating cell. Also described is a process for plating “patches” onto degraded areas by selective plating including brush plating.

Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.

Abstract: The present invention relates to methods for repairing defects on a semiconductor substrate. This is accomplished by selectively depositing the conductive material in defective portions in the cavities while removing residual portions from the field regions of the substrate. Another method according to the present invention includes forming a uniform conductive material overburden on a top surface of the substrate. The present invention also discloses a method for depositing a second conductive material on the first conductive material of the substrate.

Abstract: The invention relates to a method for touching up and/or repairing minor surface damage in a large-format pressing plate or an endless strip 3 made of steel sheet, with a textured surface 4, for surface embossing of wood materials or laminate panels, whereby the damaged surface is subjected to microgalvanic treatment, In order to simply repair the damage locations and to allow a longer tool life of the pressing sheets, it is provided, according to the invention, that an electrolyte solution that contains metal ions and iron is used, which is coordinated with the base material of the pressing plate or the endless strip 3. This yields the particular advantage that no color deviations are formed as compared with the damaged locations and that a conventional chrome-plating process can be used, whereby the damaged locations 2 are not washed out and thereby become visible again, during subsequent touch-up chrome-plating, because of the electrolyte used.

Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent confirm copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Abstract: A process for treating an impregnated electrolytic capacitor anode whereby the anode body is immersed in a liquid electrolytic solution and a voltage is applied to the anode body, whereby a current flows through and repairs flaw sites in the anode body. The liquid electrolytic solution includes an organic solvent comprising at least one of polyethylene glycol, polyethylene glycol monomethyl ether, and polyethylene glycol dimethyl ether. Alternatively, the electrolytic solution includes an organic solvent and an alkali metal phosphate salt. Preferably, the electrolytic solution contains both an alkali metal phosphate salt and an organic solvent comprising at least one of polyethylene glycol, polyethylene glycol monomethyl ether, and polyethylene glycol dimethyl ether.

Abstract: A method and a device are described for the repair and/or touch-up of small surface flaws in large press plates or endless bands of sheet metal, especially steel sheet, having a structured metal coating and a hard-chrome plating for surface-embossing plastic-coated wooden or laminated panels. Each flaw is repaired by surrounding it with a mask, pickling, and galvanically metallizing it. For a simplified and cost-favorable repair or touch-up, a galvanic solution is applied to the masked and pickled flaw for microgalvanizing damaged areas smaller than 14 mm.sup.2 by dipping the tip of an electrode into the solution. The pickled flaw can first be provided with a thin, microgalvanically applied nickel layer, and it is then copper-plated. The copper build-up is restructured by hand, if necessary, and covered with a hardened cobalt layer.

Abstract: In an electrically corrosion-proofing process in which the polarity of a metal member having a coating film is set at negative, the duration of setting the polarity of the metal member immersed in an aqueous solution of NaCl at negative is made discontinuous, and a positive-set duration in which the polarity of the metal member is set at positive, is interposed between a proceeding negative-set duration and a succeeding negative-set duration. The switching-over of the polarity is carried out by a polarity switch-over relay between the metal member and a DC power source. In the negative-set duration, the treatment for corrosion-proofing of the metal member is carried out, but the peeling-off of the coating film from a starting point provided by a damaged portion is produced. In the positive-set duration, an electrolytic product is produced in an exposed portion of the metal member, and the peeling-off of the coating film in the next negative-set duration is prevented by the electrolytic product.

Abstract: Metal, e.g. copper, is electrolytically deposited within the recess formed over a plugged hole of a component of a pyrometallurgical vessel, e.g. a cooling block, to form a seamless seal with the surface of the component. The method comprises the steps of inserting a mechanical plug into a channel opening of the component such that a recess is formed between the external surface of the plug and the outer surface of the component; positioning an anode adjacent the recess; providing an aqueous solution containing metallic ions, e.g. a solution of copper sulfate, between the anode and the mechanical plug; and creating an electric potential across the anode and the mechanical plug such that metal is deposited within the recess, preferably until the recess is filled with the electrodeposited metal. In alternative embodiments, the process can be used to secure fittings and the like to the components or to repair ruptured or weakened areas along the perimeter of such fittings.

Abstract: A method of forming a mask for photolithography comprises forming a transparent conductive film on a transparent substrate. The substrate and an electrode having a sharp front end are immersed in an electrolytic solution. The sharp front end of the electrode and the transparent film are then positioned close to each other while controlling a distance therebetween. The substrate and the electrode are then scanned relative to each other in two-dimensions while maintaining the distance between the sharp front end of the electrode and the transparent film constant. Thereafter, an electrochemical reaction is processed on the substrate while a voltage is applied between the transparent film and the electrode to form a mask pattern on the substrate. During repair of the mask thus formed, the substrate and the electrode are immersed in the electrolytic solution.

Abstract: A thick non-magnetic metal plating (18) constituting a sleeve on the surface of the tube (12) is produced by electroplating a region to be repaired. The plating has a thickness greater than 0.5 mm, and preferably close to 1 mm, and by itself can ensure the mechanical integrity of the tube in service. Preferably, the thick non-magnetic plating is made of a nickel-boron alloy with less than 5% by weight of boron.

Abstract: An aqueous coating composition that is particularly adapted for repairing defects in coated metal articles comprises an aqueous dispersion having as its major ingredient an epoxy phosphate ester polymer, a cross-linking agent for the epoxy phosphate ester polymer which may be an aminoplast or phenoplast resin, and an effective quantity of an organic solvent having a solubility parameter in the range of 8.5-10 and being soluble in water at 20.degree. C. to the extent of less than 10%. The composition is desirably electrocoated upon the object at a temperature in the range of from 80.degree. to 120.degree. F. and preferably from about 90.degree.-100.degree. F.

Abstract: During shutdown of the nuclear reactor, the closure head of the vessel having been dismounted and the vessel (3) and the pool of the reactor both being filled with water, an inner zone of the penetration tube (6) for penetrating the bottom head of the vessel (3) is isolated between two seals (39,42), from the upper level of the pool. An electrolyte is caused to flow in the isolated zone inside the penetration tube (6) and a current is passed through the electrolyte in order to deposit a metallic electroplating layer onto the inner surface of the penetration tube (6) in the isolated zone. The metallic layer is preferably a layer of nickel of a thickness of approximately 0.1 mm.

Abstract: The invention is a metal tube such as a heat exchanger tube which has been treated by in situ electrodeposition to repair one or more degraded sections. The repaired metal tube section has an electroformed structural layer which has an ultrafine grain microstructure of sufficient thickness to restore the degraded section at least to its original mechanical specifications.

Abstract: A process for repairing degraded sections of metal tubes, such as heat exchanger tubes, by in situ electroforming utilizes a probe containing an electrode. The probe is movable through the tube to the site of degradation and is sealed in place, thereby creating an electrochemical cell. Electrolyte flows from a reservoir through the cell and a structural layer of metal is deposited on the tube using a pulsed direct current and a duty cycle of 10-60%. The metal layer so formed possesses an ultrafine grain size preferably with a highly twinned microcrystalline structure giving the layer excellent mechanical properties.

Abstract: A process for repairing degraded sections of metal tubes, such as heat exchanger tubes, by in situ electroforming utilized a flexible probe containing an electrode. The probe is movable through the tube to the site of degradation and is sealed in place, thereby creating an electrochemical cell. Electrolyte flows from a reservoir through the cell and a structural layer of metal is deposited on the tube using a pulsed direct current and a duty cycle of 10-40%. The metal layer so formed possesses an ultrafine grain size preferably with a highly twinned microcrystalline structure giving the layer excellent mechanical properties.

Abstract: A process of applying a finish to an electrically conductive vehicle body by passing the body through a water-based electrocoating bath while applying a voltage between the body and the bath to electro-coat the body with constituents of the bath. The coat is dehydrated to a state of sufficient dryness to permit spray application of a water-base primer while maintaining the coat cool enough to avoid fusing the coat. A coating of water-base primer is then sprayed over the dehydrated but otherwise untreated E coat. The coat and coating are then baked to concurrently fuse both of them. The primer sprayed on an interior portion of the body is pigmented to a desired finished color. Selected portions of the baked coating on the exterior of the body are light sanded to remove entrained dirt and thereafter finish coating is applied to the body.

Abstract: An apparatus and method for plating metal on a conductor and/or across gaps on insulating substrates is described incorporating two probes, a probe positioner, first circuitry for applying alternating-current electrical power wherein the magnitude of the voltage is controlled as a function of time, and second circuitry for applying alternating-current electrical power wherein the magnitude of the current is controlled as a function of time. The invention overcomes the problem of providing an automatic apparatus for reliably repairing defective wiring or completing seeded sections of wiring having a wide range of initial thermal and electrical characteristics.