Predominantly Aluminum Substrate Patents (Class 205/153)
  • Patent number: 10950854
    Abstract: The present application provides an electrode and an electrochemical device comprising the electrode. The electrode comprises a current collector; and an inorganic layer arranged on a surface of the current collector, wherein the inorganic layer comprises a metal oxide and does not comprise a polymer. The electrode of the lithium ion battery provided by the present application has little influence on the volume energy density of the lithium ion battery while improving the safety performance of the lithium ion battery.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: March 16, 2021
    Assignee: Ningde Amperex Technology Limited
    Inventors: Wei Cui, Chaowang Lin, Changchuan Shi, Yisong Su
  • Patent number: 10927437
    Abstract: The invention relates to an aluminium alloy for the production of lithographic printing plate supports and also to an aluminium strip produced from the aluminium alloy, a process for the production of the aluminium strip and also its use for the production of lithographic printing plate supports. The object of providing an aluminium alloy as well as an aluminium strip from an aluminium alloy that permits the production of printing plate supports having improved bending-strength fatigue transverse to the rolling direction without adversely affecting the tensile strength values before and after the annealing process and while preserving the roughening properties, is achieved by the fact that the aluminium alloy contains the following alloy components in weight percent: 0.4%<Fe?1.0%, 0.3%<Mg?1.0%, 0.05%?Si?0.25%, Mn?0.25%, Cu?0.04%, Ti<0.1%, the remainder being Al and unavoidable impurities, individually at most 0.05% and totaling at most 0.05%.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: February 23, 2021
    Assignee: Hydro Aluminium Deutschland GmbH
    Inventors: Bernhard Kernig, Jochen Hasenclever, Henk-Jan Brinkman, Gerd Steinhoff, Christoph Settele
  • Patent number: 10285543
    Abstract: The kit for personalizing a bath mat is a set of one or more appliques that may be applied to the floor of a bathroom washing facility or to a bath mat. The appliques may improve the appearance of the surface to which they are applied. The appliques may improve the safety characteristics of the surface to which they are applied by providing a non-slip surface. Embodiments of the kit for personalizing a bath mat may be applied directly to a shower or bathtub floor or to a commercially available bath mat. Embodiments of the kit for personalizing a bath mat may comprise a specific bath mat with designated targets for guiding placement of the appliques or having superior bonding characteristics for the adhesive backing of the appliques.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: May 14, 2019
    Inventor: Levenston Hall
  • Patent number: 10141261
    Abstract: A method for manufacturing of a device including a first substrate including a plurality of sets of nanostructures arranged on the first substrate, wherein each of the sets of nanostructures is individually electrically addressable, the method including the steps of: providing a substrate having a first face, the substrate having an insulating layer including an insulating material arranged on the first face of the substrate forming an interface between the insulating layer and the substrate; providing a plurality of stacks on the first substrate, wherein each stack includes a first conductive layer and a second conductive layer; heating the first substrate having the plurality of stacks arranged thereon in a reducing atmosphere to enable formation of nanostructures on the second conductive material; heating the first substrate having the plurality of stacks arranged thereon in an atmosphere such that nanostructures are formed on the second layer.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: November 27, 2018
    Inventor: Waqas Khalid
  • Patent number: 9805876
    Abstract: A porous aluminum electrode has a porous layer formed by sintering aluminum powder on the surface of an aluminum core. The porous aluminum electrode, when subjected to a formation to a voltage of 200V or more, is boiled and then subjected to a first forming process in which formation is performed in an aqueous solution of ammonium adipate at a temperature of 80° C. or below and a second forming process in which formation is performed in a boric acid aqueous solution. When heat depolarization is first carried out, washing with water is performed for five minutes or more before heat depolarization; therefore, the porous layer is not destroyed.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: October 31, 2017
    Assignee: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Masahiko Katano, Yuya Yoshida, Yoshihiro Taguchi, Asami Shirai, Yuta Shimizu, Toshifumi Taira, Masashi Mehata
  • Patent number: 9455181
    Abstract: A microelectronic unit can include a substrate having front and rear surfaces and active semiconductor devices therein, the substrate having a plurality of openings arranged in a symmetric or asymmetric distribution across an area of the rear surface, first and second conductive vias connected to first and second pads exposed at the front surface, pluralities of first and second conductive interconnects extending within respective ones of the openings, and first and second conductive contacts exposed for interconnection with an external element. The plurality of first conductive interconnects can be separated from the plurality of second conductive interconnects by at least one of the plurality of openings, the at least one opening at least partially filled with an insulating material. The distribution of the openings can include at least m openings spaced apart in a first direction and n openings spaced apart in a second direction transverse to the first direction.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: September 27, 2016
    Assignee: Tessera, Inc.
    Inventors: Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia
  • Patent number: 9359195
    Abstract: Nano-structure includes a substrate and a non-oxidized portion of a metal layer (having an expansion coefficient, during oxidation, that is more than 1) on the substrate. An oxide layer is formed on the non-oxidized portion. A plurality of metal oxide nano-pillars is grown from the oxide layer. Each nano-pillar is grown through a plurality of pores defined in a template. A space is defined between adjacent nano-pillars. A continuous metal oxide cap layer is over the nano-pillars and over, but not in, the space between adjacent nano-pillars. The cap layer is formed from end portions of the nano-pillars that merge together over a template surface. The cap layer is in contact with all of the nano-pillars. The oxide layer, the nano-pillars, and the oxide cap layer are formed from anodization of portions of the metal layer.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: June 7, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Peter Mardilovich, Qingqiao Wei, Anthony M. Fuller
  • Patent number: 9206494
    Abstract: A strip for the production of a substrate for lithographic printing plates consisting of aluminum or an aluminum alloy and has at least to some extent a microcrystalline surface layer as a result of hot and/or cold roll passes. When analyzed in a two-dimensional microprobe analysis according to the mapping method of a surface region of the microcrystalline surface of the strip, the surface portion having an intensity ratio I/Ibulk(avg) of greater than 3 in the spectral range of the K?1 line of the X-ray emission spectrum of oxygen of the measured microcrystalline surface layer is less than 10%, preferably less than 7%, wherein, during the two-dimensional microprobe analysis, an excitation voltage of 15kV, a beam current of 50 nA and a beam cross section of 1 ?m is used with a step size of 16.75 ?m for the electron beam.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: December 8, 2015
    Assignee: Hydro Aluminium Deutschland GmbH
    Inventors: Bernhard Kernig, Henk-Jan Brinkman
  • Publication number: 20150135979
    Abstract: A lithographic printing plate support of the invention includes an aluminum plate and an anodized aluminum film which has micropores extending from a surface of the anodized film opposite from the aluminum plate in a depth direction of the anodized film; the micropores each have a large-diameter portion extending from the anodized film surface to an average depth (depth A) of 75 to 120 nm and a small-diameter portion which communicates with the bottom of the large-diameter portion; the average diameter of the large-diameter portion at the anodized film surface is at least 10 nm but less than 30 nm; a ratio of the depth A to the average diameter (depth A/average diameter) of the large-diameter portion is more than 4.0 but up to 12.0; and an average diameter of the small-diameter portion at the communication level is more than 0 but less than 10 nm.
    Type: Application
    Filed: January 23, 2015
    Publication date: May 21, 2015
    Applicant: FUJIFILM CORPORATION
    Inventors: Yoshiharu TAGAWA, Shinya KUROKAWA, Atsushi MATSUURA, Yuya MIYAGAWA, Hirokazu SAWADA, Atsuo NISHINO
  • Publication number: 20140326151
    Abstract: The present invention provides a lithographic printing plate support, comprising an aluminum plate and an anodized film of aluminum formed on the aluminum plate and having micropores extending in the anodized film from a surface of the anodized film opposite from the aluminum plate in a depth direction, wherein each of the micropores has a large-diameter portion having a specific shape and a small-diameter portion having a specific shape and communicating with a bottom of the large-diameter portion; at least a part of an inside of the small-diameter portion is sealed with protrusions made of boehmite; and a ratio of an average height of protrusions made of boehmite inside the large-diameter portion to an average diameter of the large-diameter portion at the surface of the anodized film is up to a predetermined value.
    Type: Application
    Filed: July 15, 2014
    Publication date: November 6, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Yusuke NAMBA, Keio OKANO, Shinya KUROKAWA, Hirokazu SAWADA
  • Patent number: 8784637
    Abstract: The present invention provides a method of manufacturing anode foil for aluminum electrolytic capacitors with high capacitance and decreased leakage current. The method has the following steps: dipping etched aluminum foil into pure water having a temperature of 90° C. or higher so as to form a hydrated film on the foil; attaching organic acid to the surface of the hydrated film; performing main chemical conversion on the aluminum foil with application of formation voltage after the attaching step; performing depolarization on the aluminum foil after the main chemical conversion step; and performing follow-up chemical conversion on the aluminum foil after the main chemical conversion step. The main chemical conversion treatment has two-or-more stages. In the first stage of the treatment, the foil is dipped into a phosphate aqueous solution, and in the last stage, it is dipped into an aqueous solution different from the phosphate aqueous solution.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: July 22, 2014
    Assignee: Panasonic Corporation
    Inventors: Naomi Kurihara, Katsunori Matsuda, Fumiaki Kawaguchi, Takahiro Suzuki
  • Publication number: 20140127911
    Abstract: A palladium plated aluminum component of a semiconductor plasma processing chamber comprises a substrate including at least an aluminum or aluminum alloy surface, and a palladium plating on the aluminum or aluminum alloy surface of the substrate. The palladium plating comprises an exposed surface of the component and/or a mating surface of the component.
    Type: Application
    Filed: November 7, 2012
    Publication date: May 8, 2014
    Applicant: LAM RESEARCH CORPORATION
    Inventors: Hong Shih, Lin Xu, Rajinder Dhindsa, Travis Taylor, John Daugherty
  • Publication number: 20140076373
    Abstract: Methods for fabricating a nanowire array epoxy composite with high structural integrity and low effective thermal conductivity to achieve a power conversion efficiency goal of approximately 20% and power density of about 104 W/m2 with a maximum temperature below about 380° C. Further, a method includes fabricating a self-supporting thick 3-D interconnected nanowire array with high structural integrity and low effective thermal conductivity to achieve a power conversion efficiency goal of 20% and power density of about 104 W/m2 with a maximum temperature of about 700° C., the nanowire array having substantially only air between nanowires.
    Type: Application
    Filed: September 8, 2012
    Publication date: March 20, 2014
    Inventors: Timothy D. Sands, Kalapi G. Biswas
  • Publication number: 20130101902
    Abstract: Disclosed is a cathode current collector for an electrical energy storage device and a method for manufacturing the same, which improves adhesion between a current collector and an electrode material and provide a high reaction surface area, thereby improving the performance of the electrical energy storage. In particular, a first alumina film is formed on the surface of an aluminum foil using an anodic oxidation process. Next, the first alumina film formed on a surface of the aluminum foil is removed through etching and a second alumina film is formed on the surface of the aluminum foil, from which the first alumina film is removed, using the anodic oxidation process again. Subsequently, a carbon layer is coated on a surface of the aluminum foil on which the second alumina film is formed.
    Type: Application
    Filed: January 11, 2012
    Publication date: April 25, 2013
    Applicant: HYUNDAI MOTOR COMPANY
    Inventors: Sam Ick Son, Hee Yeon Ryu, Dae Gun Jin
  • Publication number: 20120267250
    Abstract: A method for making a metallic cover including the following steps. Drawing an aluminum alloy sheet that has a yield strength in a range from about 80 MPa to about 150 MPa, an elongation ratio in a range from about 15% to about 28%, and a hardness in a range from about 45 HV0.2 to about 70 HV0.2 to form a preformed cover. The preformed cover includes a bottom base and a plurality of side walls, and each of the side wall and the bottom base are connected by a curved-cornered edge. Pressing the curved-cornered edge of the preformed cover into a sharp-cornered edge structure by a forming die. Polishing the preformed cover. Anodizing the polished preformed cover to form the metallic cover.
    Type: Application
    Filed: July 3, 2012
    Publication date: October 25, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: HONG-ZHAN YI, AI-JUN XU, LONE-WEN TAI, ZI-LI WU, JUN DAI, XIAO-BO YUAN
  • Patent number: 7704368
    Abstract: A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of vias is achieved by applying a static charge on the wafer before it is immersed in the bath, in order to enhance bath accelerators used to control the plating rate. The static charge is applied to the wafer using a supplemental electrode disposed outside the plating bath.
    Type: Grant
    Filed: January 25, 2005
    Date of Patent: April 27, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Chung-Liang Chang, Shau-Lin Shue
  • Publication number: 20080297983
    Abstract: A method for manufacturing an electrode sheet for capacitors includes the step of thermally spraying mixed powder 6 in which intermetallic compound powder of Al and valve action metal other than Al, such as Ti, Zr, Nb, Ta and Hf, and Al powder are mixed, onto a surface of an aluminum foil 2, or supplying intermetallic compound powder 7 of Al and valve action metal other than Al, such as Ti, Zr, Nb, Ta and Hf, and Al powder 8 from different positions and thermally spraying the intermetallic compound powder and the Al powder onto a surface of an aluminum foil 2, to thereby form an Al-valve action metal alloy layer on at least one surface of the aluminum foil 2.
    Type: Application
    Filed: March 24, 2005
    Publication date: December 4, 2008
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiroyuki Kawabata, Atsushi Otaki, Tomoaki Yamanoi
  • Patent number: 6994919
    Abstract: The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of the clad layer a plated layer of nickel-tin alloy, such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and have a composition with the proviso that the mol-ratio of Ni:Sn is in the range of 10:(0.5 to 9).
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: February 7, 2006
    Assignees: Corus Aluminium Walzprodukte GmbH, Corus Technology BV
    Inventors: Jacques Hubert Olga Joseph Wijenberg, Adrianus Jacobus Wittebrood, Joop Nicolaas Mooij
  • Patent number: 6844082
    Abstract: A new and improved, anodized aluminum gas distribution plate for process chambers, particularly an etch chamber. The gas distribution plate includes an aluminum body having multiple gas flow openings extending therethrough and an alumina anodized coating or layer on the plate. The gas distribution plate is characterized by enhanced longevity and durability and resists particle-forming deterioration and damage throughout prolonged use.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: January 18, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Huan-Liang Tzeng, Jung-Hsiang Chang, Ping-Jen Cheng
  • Patent number: 6843175
    Abstract: A support for a lithographic printing plate, wherein scum resistance is improved when processed into a lithographic printing plate by performing treatment for water wettablity and, in addition, press life is excellent. A support for a lithographic printing plate, which is obtained by performing at least anodizing treatment and silicate treatment on an aluminum plate, wherein a ratio of the number of atoms of alkali-earth metal and silicon existing on a surface thereof is 0.1 to 0.95.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: January 18, 2005
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Ikuo Kawauchi, Tadashi Endo, Hiroji Tokunaga
  • Publication number: 20030205479
    Abstract: We have discovered that the formation of particulate inclusions at the surface of an aluminum alloy article, which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminum oxide protective film, can be controlled by maintaining the content of mobile and nonmobile impurities within a specific range and controlling the particulate size and distribution of the mobile and nonmobile impurities and compounds thereof; by heat-treating the aluminum alloy at a temperature less than about 330° C.; and by creating the aluminum oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminum oxide protective film is obtained.
    Type: Application
    Filed: May 3, 2002
    Publication date: November 6, 2003
    Inventors: Yixing Lin, Brian T. West, Shun Jackson Wu, Clifford C. Stow, Senh Thach, Hong Wang, Jennifer Y. Sun
  • Patent number: 6596150
    Abstract: Disclosed is a production method of an aluminum support for a lithographic printing plate, capable of stable and low-cost production of an aluminum support for a lithographic printing plate, the support being scarcely subject to generation of treatment unevenness called streaks or grainy unevenness ascribable to the different in the aluminum dissolving rate due to the difference in the orientation of the crystal grain. The aluminum support is produced by surface graining and then polishing an aluminum plate or by polishing an aluminum plate while etching it in an aqueous acid or alkali solution. The aluminum plate may be subjected to polishing and then to anodization or may be subjected to polishing, to surface graining, again to or not to polishing and then to anodization. A production method for producing a high-quality support for a lithographic printing plate, free of local unevenness is also disclosed.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: July 22, 2003
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi, Masahiro Endo
  • Patent number: 6540900
    Abstract: Disclosed is a process for the continuous anodizing of aluminum foil for use in aluminum electrolytic capacitors. Specifically, etched anode foil is anodized to relatively low voltage in a two-step reel-to-reel process. The process is particularly useful for anodizing highly-etched aluminum foil for use in surface mount aluminum capacitors containing conductive polymer cathode material. The process is economical and provides high foil quality. Specifically, the process for anodizing aluminum foil comprises anodizing the foil in a first electrolyte a solution, passing the foil through an oven, anodizing the foil in a second anodizing solution wherein the first electrolyte solution and second electrolyte solution each comprise about 5 wt % to about 50 wt % glycerine, about 0.01 wt % to about 0.2 wt % ammonium phosphate, and de-ionized water, and wherein the foil is anodized in the first electrolyte solution for at least 3.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: April 1, 2003
    Assignee: Kemet Electronics Corporation
    Inventors: John Tony Kinard, Brian John Melody, Philip Michael Lessner, Albert Kennedy Harrington, David Alexander Wheeler, Erik Karlsen Reed, Duane Earl Stenziner
  • Publication number: 20030030970
    Abstract: A process for edge forming a slit and cut-to-length foil having a dielectric oxide film on its face comprising anodizing the foil in an aqueous oxalic acid electrolyte, further forming the foil in an aqueous citrate electrolyte, preferably dibasic ammonium citrate electrolyte, depolarizing the foil, and then forming the foil in an aqueous phosphate electrolyte, preferably an ammonium dihydrogen phosphate.
    Type: Application
    Filed: June 6, 2001
    Publication date: February 13, 2003
    Inventors: Daniel Francis Persico, Philip Michael Lessner, Albert Kennedy Harrington, Lisa Ann Sayetta
  • Publication number: 20020191371
    Abstract: A process for edge forming a slit and cut-to-length foil having a dielectric oxide film on its face comprising forming the foil in an aqueous citrate electrolyte, preferably an aqueous ammonium citrate electrolyte, depolarizing the foil, and forming the foil in an aqueous phosphate electrolyte, preferably an ammonium dihydrogen phosphate electrolyte. Using this formation process, a foil with excellent hydration resistance and capacitance is produced.
    Type: Application
    Filed: June 6, 2001
    Publication date: December 19, 2002
    Inventors: Philip Michael Lessner, Albert Kennedy Harrington, Brian John Melody, John Tony Kinard
  • Patent number: 6475368
    Abstract: A method of anodizing an aluminum substrate comprising heating the substrate to a first temperature of 200° C. to about 380° C.; suspending the substrate into a first electrolyte and applying a first anodizing current to the first electrolyte; rinsing the substrate; heating the substrate to a second temperature of 200° C. to about 380° C.; and suspending the substrate into a second electrolyte and applying a second anodizing current to the second electrolyte, wherein the first electrolyte and second electrolyte each comprise an aqueous solution of at least one salt of alpha-hydroxy acid.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: November 5, 2002
    Assignee: Kemet Electronics Corporation
    Inventors: Albert Kennedy Harrington, Brian John Melody, John Tony Kinard, Philip Michael Lessner, David Alexander Wheeler
  • Patent number: 6440288
    Abstract: Disclosed is a method for forming an aluminum oxide film of a large surface area on an electrode for a high voltage electrolytic capacitor. In accordance with the method, an oxide film of a uniform thickness is formed, prior to a process of etching the oxide film. A re-anodization is then partially conducted for an etched portion of the oxide film. The resultant oxide film has an increased surface area. The method of the invention makes it possible to prepare a dielectric oxide film having characteristics of a uniform thickness and a large surface area. In accordance with the invention, it is possible to expect an increase in the capacitance of electrolytic capacitors.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: August 27, 2002
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Su Il Pyun, Woo Jin Lee
  • Patent number: 6374737
    Abstract: A process for making printing plate material suitable for imaging by laser radiation. A metal substrate is electrocoated in a bath containing a polymeric resin and laser-sensitive particles, thereby depositing a laser ablatable layer on a principal surface of the metal substrate. In one embodiment, the laser-ablatable layer is treated with a corona discharge for a time sufficient to render the layer non-ink wettable. In other preferred embodiments, the laser-ablatable layer is overcoated with an overlayer such as a non-ink wettable silicone layer or a water-wettable layer comprising an organophosphorus polymer, preferably a copolymer of acrylic acid and vinylphosphonic acid.
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: April 23, 2002
    Assignee: Alcoa Inc.
    Inventors: David S. Bennett, Sallie L. Blake, Robert E. Bombalski, Kenneth A. Bowman, Joseph D. Guthrie, Thomas L. Levendusky, Daniel L. Serafin, Jean Ann Skiles
  • Publication number: 20010038908
    Abstract: A substrate for a planographic printing plate and a method of fabrication thereof. After a surface roughening treatment and before an anodizing treatment, an aluminum alloy plate to be used as the substrate is washed in an alkali solution, and then in an acidic solution. After surface-roughening, overlap points of Fe and Si macularly distributed at the surface of the aluminum alloy plate have a surface coverage of not more than 0.5%, and there are no more than 800 per 1 mm2 of overlap points which have sizes larger than 1.6×10−7 mm2. The planographic printing plate of the present invention has excellent printing capabilities in that, irrespective of printing conditions, soiling does not occur at a non-image portion of the planographic printing plate.
    Type: Application
    Filed: March 9, 2001
    Publication date: November 8, 2001
    Inventors: Masaya Matsuki, Yoshinori Hotta, Hirokazu Sawada, Akio Uesugi
  • Patent number: 6299752
    Abstract: An anode foil treatment method produces a useful high quality oxide with inherently high capacitance at voltages as high as 750 Volts or more. The anode foil treatment method comprises a series of formation and relaxation steps. Oxide layer formation is performed in a forming mixture that includes a high molecular weight dicarboxylic acid that is made into a salt and a strong base. The concentration of the dicarboxylic acid is carefully monitored and kept within a narrow band. The complex by-product of the dicarboxylic salt created during formation process is kept below a fixed maximum level.
    Type: Grant
    Filed: March 10, 1999
    Date of Patent: October 9, 2001
    Assignee: Pacesetter, Inc.
    Inventors: Thomas F. Strange, Timothy R. Marshall
  • Patent number: 6261433
    Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: July 17, 2001
    Assignee: Applied Materials, Inc.
    Inventor: Uziel Landau
  • Patent number: 6203936
    Abstract: Thin, light weight bipolar plates for use in electrochemical cells are rapidly, and inexpensively manufactured in mass production by die casting, stamping or other well known methods for fabricating magnesium or aluminum parts. The use of a light metal, such as magnesium or aluminum minimizes weight and simultaneously improves both electrical and thermal conductivity compared to conventional carbon parts. For service in electrochemical cells these components must be protected from corrosion. This is accomplished by plating the surface of the light weight metal parts with a layer of denser, but more noble metal. The protective metal layer is deposited in one of several ways. One of these is deposition from an aqueous solution by either electroless means, electrolytic means, or a combination of the two. Another is deposition by electrolytic means from a non-aqueous solution, such as a molten salt.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: March 20, 2001
    Assignee: Lynntech Inc.
    Inventors: Alan J. Cisar, Oliver J. Murphy, King-Tsai Jeng, Carlos Salinas, Stan Simpson, Dacong Weng
  • Patent number: 6183880
    Abstract: This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate.
    Type: Grant
    Filed: August 7, 1998
    Date of Patent: February 6, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Junshi Yoshioka, Shinichi Obata, Makoto Dobashi, Takashi Kataoka
  • Patent number: 6149790
    Abstract: A method for making an aluminium material which is electroplated on its aluminum or aluminium alloy base with iron or an iron alloy containing 2-20 weight % of chromium, and which can be utilized as a new structural or functional material in various industrial fields. The material is characterized in having an inter-diffusion layer produced between the base and the plating and/or having such fine cracks produced in the plating which can reserve well machine oil, work well for painting it, and be impregnated with a resin for improving its wear resistance and so on.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: November 21, 2000
    Assignee: Nippon Platec, K.K.
    Inventors: Wataru Oikawa, Eiichi Takeuchi
  • Patent number: 6127050
    Abstract: An archival medium, such as a compact disc, is made of a metal such as aluminum which is mechanically gained with particulate material under conditions that embed particulate material into the surface of the medium and visibly imageable by selective exposure to infrared laser radiation. A mechanically grained aluminum medium can also be anodically oxidized under conditions that do not impair the ability of the substrate to be laser imaged. The archival medium can be coated with opaque and transparent polymer coatings before or after imaging for security and/or protection. The coating can be a laser ablatable coating to provide a tamper-proof medium.
    Type: Grant
    Filed: May 15, 1998
    Date of Patent: October 3, 2000
    Inventors: Howard A. Fromson, William J. Rozell
  • Patent number: 6096184
    Abstract: An inventive method of preparing an aluminum foil used in a high voltage aluminum electrolytic capacitor is disclosed. The method involves:(a) immersing an aluminum foil in a first forming solution,(b) applying a first voltage to said aluminum foil immersed in said first forming solution,(c) immersing said aluminum foil to which said first voltage is applied in a second forming solution, without passing current, and(d) applying a second voltage to said aluminum foil immersed in said second forming solution.Also disclosed is an aluminum foil that renders an electrolytic capacitor having properties of both high electrostatic capacity and small leak current.
    Type: Grant
    Filed: July 14, 1998
    Date of Patent: August 1, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Yoshida, Mitsuhisa Yoshimura, Takahiro Suzuki, Koichi Kojima
  • Patent number: 6024858
    Abstract: An aluminum support for a planographic printing plate is produced by (1) etching a surface of an aluminum plate chemically in an acidic or alkaline aqueous solution, (2) roughening the surface of the aluminum plate electrochemically in an acidic aqueous solution by applying DC voltage to form honeycomb pits having an average diameter from 0.5 to 10 .mu.m and to leave plateau portions, (3) etching the surface of the aluminum plate to render the plateau portions less than 10% of the surface, (4) roughening the surface of the aluminum plate electrochemically in an acidic aqueous solution using direct current or alternating current to form honeycomb pits having an average diameter from 0.1 to 2 .mu.m, (5) etching the surface of the aluminum plate chemically, and (6) anodizing the surface of the aluminum plate in an acidic solution. A low current density starting zone, or soft starting zone, may be provided at a first roughening stage.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: February 15, 2000
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Akio Uesugi
  • Patent number: 5851373
    Abstract: A process for the anodization of an aluminum material which can form an anodized film free from local destruction or spalling even if supplied with electric current through the surface of the anodized film in the double-power supplied electrolytic process and/or multi-stage power supply electrolytic process to secure the desired quality and properties. A process for the anodization of an aluminum material can be provided, which comprises anodizing the surface of elongated aluminum or aluminum alloy which advances through a power supply part and an electrolytic part, and then supplying electric current to the surface of said anodized web through another power supply part in such a manner that the following relationships among the current density, the electric supply time and the amount of anodized film thus produced are satisfied:(Current density).sup.4/3 .times.(Supply time).sup.3/2 .times.(Amount of anodized film).sup.2/3 .ltoreq.5,100 (1)1.ltoreq.(Supply time).ltoreq.10,0.5.ltoreq.(Amount of anodized film).
    Type: Grant
    Filed: July 1, 1997
    Date of Patent: December 22, 1998
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Hiroo Kubota, Yuzo Inukai
  • Patent number: 5811215
    Abstract: According to the present invention there is provided a method for preparing a hydrophilic surface of an aluminum lithographic base comprising the steps of roughening and anodizing a side of an aluminum foil and sealing said side of the aluminum foil with hot water within a temperature range from 70.degree. C. to 100.degree. C. for at least 5 seconds and rinsing said side of the aluminum foil with water characterized in that between said hot water treatment and said rinsing said side of the aluminum foil is treated with an aqueous silicate solution within a temperature range from 70.degree. C. to 100.degree. C. for at least 5 seconds.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: September 22, 1998
    Assignee: Agfa-Gevaert, N.V.
    Inventors: Marc Van Damme, Joan Vermeersch
  • Patent number: 5755949
    Abstract: A plate-, foil- or web-shaped workpiece of aluminum or an alloy thereof is subjected, in an electrolyte bath, to an alternating current at a frequency of 0.1 to 25 Hz. During the AC treatment, an anodic potential is imposed on the workpiece, in the range of 0 to 5 Volts. The total charge input is 10 to 60 kC/m.sup.2. Prior to the electrochemical graining, the workpiece is mechanically grained. After the graining steps, an etching treatment as well as an anodical oxidation and, thereafter, a hydrophilization are performed.
    Type: Grant
    Filed: December 22, 1994
    Date of Patent: May 26, 1998
    Assignee: AGFA-Gevaert AG
    Inventor: Martin Philip Amor
  • Patent number: 5731124
    Abstract: The present invention provides a method for preparing an aluminium foil comprising the steps of roughening an aluminium foil and subsequently anodizing said aluminium foil characterized in that after said anodization said aluminium foil is cleaned using an aqueous bicarbonate containing solution. The present invention further provides a mono-sheet silver salt diffusion transfer material having as a support the alumium foil obtainable from the above defined method. The step of cleaning in the bicarbonate containing solution improves the adhesion of an image receiving layer containing physical development nuclei to the aluminum foil as revealed from the increased amount of silver precipitated in the image receiving layer when the aluminum foil provided with an image receiving layer is used in a diffusion transfer reversal (DTR) process.
    Type: Grant
    Filed: June 26, 1996
    Date of Patent: March 24, 1998
    Assignee: AGFA-Gevaert, N.V.
    Inventors: Marcus Jonckheere, Paul Coppens
  • Patent number: 5693208
    Abstract: A process for producing an oxide layer with a pore structure on the surface of a strip or wire of aluminum or an aluminum alloy is such that the strip or wire is passed continuously through an electrolyte and simultaneously anodized under conditions that create pores and at an anodizing voltage creating the desired thickness of oxide layer. In a first stage of the process, in order to form a fine pore structure, the anodizing voltage is set at an initial level (U.sub.1) and subsequently, in a second stage to form a coarser pore structure, raised to a final level (U.sub.2) required to reach the desired thickness of oxide layer.
    Type: Grant
    Filed: March 5, 1996
    Date of Patent: December 2, 1997
    Assignee: Alusuisse Technology & Management Ltd.
    Inventor: Jean-Fran.cedilla.ois Paulet
  • Patent number: 5651871
    Abstract: Smooth planar metal surfaces, usually an aluminum web, intended for a lithographic printing plate, are roughened by brush graining with fine abrasive particles which are hard and dense and have a radial or disk-like configuration such that the abrasive particles are forged into the surface of the metal forming cavities in which the abrasive particles remain embedded. The embedded abrasive particles are dislodged and removed from the cavities by subjecting the web to an anodic treatment employing electrolyte materials and concentrations, temperatures and voltage which will dislodge and remove the particles while retaining the surface texture or morphology of the as-roughened surface. The web is then subjected to a second anodic treatment under conditions which favor oxide formation in order to provide a final anodized product.
    Type: Grant
    Filed: September 27, 1995
    Date of Patent: July 29, 1997
    Assignee: Howard A. Fromson
    Inventors: Howard A. Fromson, William J. Rozell, Robert F. Gracia
  • Patent number: 5616231
    Abstract: Aluminum alloy articles are electrobrightened in an acidic solution containing phosphoric acid, water, and suspended mineral particles. The solution preferably also contains sulfuric acid. Aluminum alloy sheet electrobrightened in the solution has a less directional appearance when the suspended mineral particles are present.
    Type: Grant
    Filed: May 8, 1996
    Date of Patent: April 1, 1997
    Assignee: Aluminum Company of America
    Inventors: Albert L. Askin, Paul B. Schultz, Daniel L. Serafin
  • Patent number: 5556531
    Abstract: A process for the treatment of a material having an aluminum oxide layer comprising (a) treating the aluminum oxide layer with an aqueous solution of a pure and crystalline alkali metal silicate, and (b) rinsing the treated aluminum oxide layer with ion-containing water. A substrate so produced is useful in offset printing.
    Type: Grant
    Filed: May 5, 1995
    Date of Patent: September 17, 1996
    Assignee: Agfa-Gevaert AG
    Inventor: Wolfgang Wiedemann
  • Patent number: 5503074
    Abstract: A photosensitive lithographic printing plate requiring no fountain solution, which comprises an aluminum base and, formed thereon in the following order, a primer layer, a photosensitive layer, and a silicone rubber layer, wherein the aluminum base has a roughened surface with an average roughness (R.sub.a) of from 0.2 .mu.m to 0.8 .mu.m and a whiteness of from 0.10 to 0.35, and the primer layer is a homogeneous layer comprising a binder as the main component. The lithographic printing plate requiring no fountain solution is excellent in tone reproducibility, suitability for plate inspection, suitability for plate scanner examination, and press life.
    Type: Grant
    Filed: January 9, 1995
    Date of Patent: April 2, 1996
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Tsumoru Hirano, Takahiro Matsushita, Toshihiko Hiruma
  • Patent number: 5449448
    Abstract: This invention includes a first step for dipping etched aluminium foil into pure water of high temperature for a predetermined period of time, a second step for dipping the aluminium foil into an aqueous solution containing an organic acid and at least one kind of a salt thereof after the first step, and a third step for subjecting the aluminium foil to a forming treatment in an electrolytic solution after the second step, wherein either straight saturated dicarboxylic acid having an odd number of carbons or trans-straight unsaturated dicarboxylic acid is used or organic acid having an aromatic ring and a carboxyl group is used as the organic acid in the second step, whereby leakage current characteristics are improved by weakening a dissolving action to a hydrated film and strengthening a bonding action to the hydrated film.
    Type: Grant
    Filed: March 16, 1994
    Date of Patent: September 12, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naomi Kurihara, Kazuo Okamura, Yoshihito Yoshimura, Tetsuo Sonoda, Kouichi Kojima
  • Patent number: 5417839
    Abstract: Aluminum foils used as a material of electrodes in electrolytic capacitors are manufactured by a method which comprises a step of forming at first an initial internal oxide coating 5 to 50 .ANG. thick on the surface of the aluminum foils before they are electrochemically or chemically etched later. The aluminum foils are then subjected to high temperature heat treatment such that the whole thickness of the oxide coating does not exceed 70 .ANG..
    Type: Grant
    Filed: August 9, 1994
    Date of Patent: May 23, 1995
    Assignee: Showa Aluminum Corporation
    Inventors: Masashi Sakaguchi, Tadao Fujihira, Kiyoshi Tada, Hisatsugu Nakaya, Shozo Umetsu, Takashi Tamura
  • Patent number: 5368719
    Abstract: A process for plating aluminum and aluminum alloy substrates, such as 390 aluminum alloy pistons, with iron comprises (a) cathodically activating the aluminum-containing substrate in an acid bath and (b) plating iron from an iron sulfate-containing bath,
    Type: Grant
    Filed: May 12, 1993
    Date of Patent: November 29, 1994
    Assignee: Hughes Aircraft Company
    Inventor: Sue Troup-Packman
  • Patent number: RE40218
    Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.
    Type: Grant
    Filed: July 17, 2003
    Date of Patent: April 8, 2008
    Inventor: Uziel Landau