Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 ?g/dm2 of Ni and said Cr layer containing 10-100 ?g/dm2 of Cr is provided.

Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

Abstract: A process is provided for making a composite work article suitable for fabricating rigid sheet metal can components. A steel sheet having first and second surfaces is pre-treated to enhance reception and retention of a multi-layer polymer coating on the pre-treated first surface. The multi-layer polymer coating is melt extruded on the pre-treated first surface and beyond opposite lateral edges of the work article to establish overhang portions, then solidified. The multi-layer polymeric coating has a tie polymeric layer contacting the pre-treated first surface, and a finish-surface polymeric layer.

Abstract: In one aspect, a copper foil for lamination to a dielectric substrate includes a layer deposited on a surface of the copper foil. The layer is formed from chromium and zinc ions or oxides and is treated with an aqueous solution containing at least 0.5% silane. In another aspect, a peel strength enhancement coating is disposed between a copper foil laminate and a dielectric substrate. The peel strength enhancement coating comprises a metal and metal oxide mixture containing a metal selected from groups 5B, 6B, and 7B of the periodic table of the elements. The effective thickness of the peel strength enhancement coating is that thickness capable of providing less than or equal to 10% loss of peel strength, when measured in accordance with IPC-TM-650 Method 2.4.8.5 using a ⅛ inch wide test specimen, after being immersed in 4N HCl at about 60° C. for 6 hours.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss of peel strength in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in brass-plated anti-corrosive copper foil. The Another object is to impart excellent moisture resistance to the surface-treated copper foil.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil.

Abstract: A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.

Abstract: To establish a technique of further improving the oxidation resistance of the glossy surface of a copper foil that has a composite layer containing chromium, zinc, and phosphorus on its glossy surface is achieved by a copper foil having excellent oxidation resistance characterized by a composite layer containing chromium, zinc, phosphorus, and nickel formed on the glossy surface of the foil and also to a method of manufacturing the same by electrolysis.

Abstract: A method is provided for enhancing the adhesion of organic polymer coatings to electrolytically passivated (CDC) tin-plated steel strip. The method includes applying a solution comprising 0.1 to 7 percent of an adhesion promoter to the electrolytically tin-plated strip during the processing of the strip on an electrolytic tin-plating line. The adhesion promoter may be at least one selected from the group consisting of: where n is within a range of from 4 to 99; (b) C16H33+N(CH3) 3 M where M is member of the halogen group; and (c) Rn—Si—(X)4−n where R is a non-hydrolyzable organic radical selected from the group consisting of glycol, epoxy, amine, diamine or mercapto groups, and mixtures thereof, containing from 3 to 10 carbon atoms; the number n is an integer from 1 to 3; and X is a hydrolyzable group selected from the group consisting of Cl—, OCH3, OCH2CH5, OOCCH3, OCH2OCH3, amine, diamine, triamine, acyloxy and alkoxysilanes, and mixtures thereof.

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Abstract: In one embodiment, the present invention relates to a method of treating metal foil including sequentially contacting the metal foil with a first solution containing a metal foil oxidizer and less than about 5 g/l of a hydroxide compound, contacting the metal foil with a chromium containing electrolytic bath and electrolyzing the bath, wherein the bath contains about 0.1 to about 5 g/l of a chromium compound, and contacting the metal foil with a second solution containing from about 0.1 to about 10% v/v of a silane compound, with the proviso that the metal foil is not contacted with a reducing agent after contact with the first solution.

Abstract: A process for producing a Zn--Cr alloy-electroplated steel plate, comprising immersing a steel plate in an acidic bath containing Zn.sup.+2 ions and Cr.sup.+3 ions and subjecting the steel plate to electroplating in the bath, wherein 0.01 g/-20 g/l of an additive comprising one or more members selected from the group consisting of polyethyleneoxyphenol derivatives with a sulfonic group (--SO.sub.3 H), sulfate group (--SO.sub.4 H), amino group (--NH.sub.2), carboxyl group (--COOH), nitro group (--NO.sub.2) or halogen (--F, --Cl, --Br or --I) as a substituent in the benzene ring, alkyl sulfonic acid compounds and polyethyleneoxyalkyl sulfonic acid compounds are added to the bath. The plating process makes it possible to produce Zn--Cr alloy-properties steel plates at a low cost without the additives having any adverse effect on the properties of the plating.

Abstract: There is disclosed a method of manufacturing a plated steel sheet with a Zn--Cr alloy plating, including the steps of preparing a plating bath having a pH of 1 to 3 by adding 50 to 250 g/l of ammonium sulfate to a sulfuric acid plating bath and forming a Zn--Cr alloy plating film on a steel sheet using the resultant plating bath.

Abstract: There is disclosed a treating process whereby the thermal oxidation resistance on the shiny side of a copper foil is enhanced so that the shiny side will not discolor on heating to higher temperatures than usual, without impairing the foil's solder wettability, adhesion to resist, and other properties. A Zn-Ni alloy layer which comprises 50-97 wt % Zn and 3-50 wt % Ni or a Zn-Co alloy layer which comprises 50-97 wt % Zn and 3-50 wt % Co is formed on the shiny side of a copper foil at a deposition quantity of 100-500 .mu.g/dm.sup.2 and then the alloy surface is treated for Cr-base corrosion-preventive coating. The Cr-base corrosion-preventive treatment comprises (1) a treatment for forming a coating film of chromium oxide alone, (2) a treatment for forming a mixed coating film of chromium oxide and zinc and/or zinc oxide or (1)+(2). The roughened side of the copper foil may be treated to form thereon a layer of single metal or alloy of two or more metals chosen from among Cu, Cr, Ni, Fe, Co, and Zn.

Abstract: A method of preventing galling between first and second metallic surfaces which are disposed in contacting, substantially stationary relation, one to each other, includes coating at least one of the first and second metallic surfaces with a layer of hard chromium plating.

Abstract: A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compound of tri-valent chromium, which protection layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.

Abstract: There is disclosed a method of manufacturing a plated steel sheet with a Zn--Cr composite plating, wherein a total of 0.01 to 300 g/l of at least one type of salt having a pH buffering action in a pH range of 2 to 6 in a bath containing only zinc are added to an acidic Zn--Cr composite plating bath containing zinc ions and trivalent chromium ions to prepare a plating bath, and plating film is formed on a steel sheet using the resultant plating bath.

Abstract: A method of manufacturing a stamper includes the steps of coating a flat surface of a substrate with photosensitive material; directing light to a specified position on the photosensitive material to expose it; developing the photosensitive material to make a minute photoresist pattern; etching the substrate to a specified depth with a mask of the photoresist pattern; removing the photoresist as the mask to make a glass master; arbitrarily forming a first nickel layer on a surface of the glass master; forming an intermediate layer of a metal having a smaller linear expansion coefficient than nickel over the first nickel layer; forming a second nickel layer on the intermediate layer to form a conductive film having a two- or three-stratum structure; arbitrarily subjecting the whole substrate to a process to make nickel passive; forming an electroformed layer on the conductive film by an electroforming process; and separating the conductive film from the glass master.

Abstract: The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials. A chromium-zinc coating is electrolytically applied to copper or copper based alloy surface using a caustic electrolyte solution. The coated material is then rinsed in an aqueous solution containing a phosphate salt of alkali metals or alkaline earth metals, or a borate salt of alkali metals or alkaline earth metals. The pH of the rinse solution is maintained from about 5 to about 12 and preferably from about 7 to about 10.

Abstract: A copper foil for an inner layer circuit of a multi-layered printed circuit board, which comprises a black metal plated layer formed on at least the rough surface which becomes a surface of an inner layer circuit of a copper foil having both sides roughened in advance, in order to enhance the bonding strength to a prepreg, make it safe from haloing and facilitate optical checking of the copper foil.

Abstract: A copolyester film was laminated onto a steel sheet, this sheet having double layers consisting of a lower layer of metallic chromium and an upper layer of hydrated chromium oxide on a tin plated steel sheet in which 5 to 40% of the surface of the steel sheet is covered with plated tin and the remainder of the steel surface is exposed and the space between plated tin particles is 0.5 to 50 .mu.m, and a method for production of this copolyester resin film laminated steel sheet which comprises: (a) electroplating with tin under restricted conditions, (b) formation of said double layer on the plated tin and exposed steel surface and (c) lamination of the copolyester resin film at a temperature above the melting temperature of tin.

Abstract: The present invention provides a method of producing a zinc-chromium alloy-plated steel sheet having excellent properties such as bare corrosion resistance, corrosion resistance after coating, plating adhesiveness and weldability.The method is characterized by plating the surface of the steel sheet using an acid plating bath containing zinc ion (Zn.sup.2+) and chromium ion (Cr.sup.3+) at a molar concentration ratio of about 0.1.ltoreq.Cr.sup.3+ /(Zn.sup.3+ +Cr.sup.3+).ltoreq.0.9 in a total amount of at least about 0.5 mol/1 within the dissolution range, and about 0.1 to 30 g/1 of at least one nonionic organic additive having at least a triple bond, at a bath temperature of about 25.degree. to 70.degree. C. and a pH of about 1.0 to 4.0 with a current density of about 50 to 200 A/dm.sup.2.

Abstract: A method for producing a tin free steel having double layers consisting of a lower layer of flatly deposited metallic chromium and an upper layer of insoluble hydrated chromium oxide which is characterized by a dissolution of soluble hydrated chromium oxide after the formation of three layers consisting of a bottom layer of metallic chromium, a middle layer of insoluble hydrated chromium oxide and an upper layer of soluble hydrated chromium oxide on a steel base by using a chromic acid electrolyte with a small amount of fluoride compound.By using this tin free steel, a welded can body can be produced at high speed without the removal of the plated layer in the welded part because this tin free steel has an excellent weldability.