Fabric Substrate Patents (Class 205/160)
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Patent number: 11729917Abstract: A method for optimized filling holes and manufacturing fine lines on a printed circuit board (PCB) carries out the two processes separately. The inner wall of the hole is metalized with reduced graphene oxide (rGO) and then electroplated to fill the hole with copper. The processes are individually performed and thus operating parameters are considered independently. As a result, the copper-plating fillings are evenly compact and the fine lines have square profiles.Type: GrantFiled: July 15, 2021Date of Patent: August 15, 2023Assignees: TRIALLIAN CORPORATIONInventors: Albert Yeh, Nick Yang
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Patent number: 10280450Abstract: Provided are methods and devices for detection of unlabeled nucleic acids. The detection methods are based on change of solubility of hydrophobic probes upon hybridization with a polynucleotide. In one embodiment, the probes are morpholino probes, having a fluorophore attached thereto. The morpholino probes are immobilized on a substrate that has fluorescence quenching functionality.Type: GrantFiled: November 13, 2014Date of Patent: May 7, 2019Assignee: New York UniversityInventors: Rastislav Levicky, Wanqiong Qiao, Yatao Liu
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Patent number: 9786590Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate formed with one or more connection pads. The semiconductor package may include a semiconductor device including at least one bump. The semiconductor package may include an anisotropic conductive fabric including conductive fibers and configured to electrically couple the at least one connection pad to the at least one bump.Type: GrantFiled: March 15, 2016Date of Patent: October 10, 2017Assignee: SK hynix Inc.Inventors: In Chul Hwang, Ki Young Kim, Myung Geun Park
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Patent number: 9728804Abstract: A flexible secondary battery includes: an electrode stack structure including a first electrode layer, a second electrode layer, and a separator disposed between the first and second electrode layers; and a binding structure surrounding the electrode stack structure, where the binder structure is in fixed contact with a first side of the electrode stack structure and is in slidable contact with a second side of the electrode stack structure.Type: GrantFiled: November 11, 2014Date of Patent: August 8, 2017Assignee: SAMSUNG ELECTRONICS CO., LTDInventors: Yeonil Lee, Moonseok Kwon, Euncheol Do, Jaeman Choi
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Patent number: 9017539Abstract: A method for fabricating a heat sink may include: providing a carbon fiber fabric having carbon fibers and openings, the openings leading from a first side to a second side of the fabric; and electroplating the fabric with metal, wherein metal is deposited with a higher rate at the first side than at the second side of the fabric. Another method for fabricating a heat sink may include: providing a carbon metal composite having metal-coated carbon fibers and openings, the openings leading from a first side to a second side of the carbon metal composite; disposing the composite over a semiconductor element such that the first side of the composite faces the semiconductor element; and bonding the composite to the semiconductor element by means of an electroplating process, wherein metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the openings.Type: GrantFiled: August 22, 2012Date of Patent: April 28, 2015Assignee: Infineon Technologies AGInventor: Friedrich Kroener
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Publication number: 20140057127Abstract: A method for processing at least one carbon fiber according to an embodiment may include: electroplating a metal layer over at least one carbon fiber, wherein the metal layer contains a metal, which forms a common phase with carbon and a common phase with copper; and annealing the at least one carbon fiber and the metal layer. A method for processing at least one carbon fiber according to another embodiment may include: electroplating a first metal layer over at least one carbon fiber, wherein the first metal layer contains a metal, which forms a common phase with carbon and a common phase with nickel; electroplating a second metal layer over the first metal layer, wherein the second metal layer contains nickel; and annealing the at least one carbon fiber, the first metal layer and the second metal layer.Type: ApplicationFiled: August 22, 2012Publication date: February 27, 2014Applicant: INFINEON TECHNOLOGIES AGInventor: Friedrich Kroener
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Publication number: 20140054020Abstract: A method for fabricating a heat sink may include: providing a carbon fiber fabric having carbon fibers and openings, the openings leading from a first side to a second side of the fabric; and electroplating the fabric with metal, wherein metal is deposited with a higher rate at the first side than at the second side of the fabric. Another method for fabricating a heat sink may include: providing a carbon metal composite having metal-coated carbon fibers and openings, the openings leading from a first side to a second side of the carbon metal composite; disposing the composite over a semiconductor element such that the first side of the composite faces the semiconductor element; and bonding the composite to the semiconductor element by means of an electroplating process, wherein metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the openings.Type: ApplicationFiled: August 22, 2012Publication date: February 27, 2014Applicant: INFINEON TECHNOLOGIES AGInventor: Friedrich Kroener
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Publication number: 20110033692Abstract: A composite material is composed of a metal matrix in which CNT filaments are distributed. The CNT filaments are intertwined, interwoven, or tied together, and the matrix is cold-worked. The matrix material is thereby filled with a higher percentage of CNT filaments than when dispersed CNT are electrodeposited. In a method for producing such a composite material, suitable semifinished products such as knitted fabrics, woven fabrics, nets, fleeces, or papers made of CNT filaments are coated (preferably electroplated) with the metal matrix.Type: ApplicationFiled: April 1, 2009Publication date: February 10, 2011Applicant: Siemens AktiengesellschaftInventors: Frank Heinrichsdorff, Jens Dahl Jensen, Manuela Schneider, Raymond Ullrich, Gabriele Winkler
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Publication number: 20090133910Abstract: Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 ?m or below.Type: ApplicationFiled: November 21, 2008Publication date: May 28, 2009Applicants: AJINOMOTO CO., INC, SHINKO ELECTRIC INDUSTRIES CO.,LTD.Inventors: Seiichiro OHASHI, Eiichi Hayashi, Shigeo Nakamura, Takaaki Yazawa, Junichi Nakamura
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Patent number: 7384532Abstract: A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of a platable coating composition to the substrate prior to plating. The platable coating composition is cured to render the substrate more receptive to conventional plating techniques. In one embodiment, the process utilizes an epoxy resin system that upon being cured is receptive to electroless plating and electrolytic plating techniques that are the same or similar to those conventionally employed for electroplating ABS and/or PC/ABS substrates.Type: GrantFiled: November 16, 2004Date of Patent: June 10, 2008Assignee: Lacks Enterprises, Inc.Inventors: Dennis R. Parsons, II, Ling Hao, Daniel W. Irvine
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Patent number: 6783895Abstract: A hydrophilic collector for alkaline secondary batteries is formed of a nonwoven fabric plated with nickel in which the nonwoven fabric is hydrophilized by sulfonation, a gaseous fluorine treatment, or vinyl monomer grafting. A method for making the collector includes a hydrophilizing step of a nonwoven fabric comprising at least one of a polyolefin fiber and a polyamide fiber, and a plating step of applying nickel plating to the hydrophilic nonwoven fabric. Preferably, the nickel plating is electroless plating, and the nonwoven fabric has a plurality of micropores extending from one surface to the other surface thereof. An electroplating film may be deposited on the electroless plated film, if necessary. This collector facilitates assembling a battery which exhibits improved high-rate discharge characteristics due to improved adhesiveness of the plated nickel film to the nonwoven fabric.Type: GrantFiled: February 21, 2001Date of Patent: August 31, 2004Assignees: Mitsubishi Materials Corporation, Japan Vilene Company, Ltd.Inventors: Hiroyuki Imai, Kaori Yoshida, Toshiaki Takase, Kazuya Satou
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Patent number: 6772489Abstract: A hydrophilic collector for alkaline secondary batteries is formed of a nonwoven fabric plated with nickel in which the nonwoven fabric is hydrophilized by sulfonation, a gaseous fluorine treatment, or vinyl monomer grafting. A method for making the collector includes a hydrophilizing step of a nonwoven fabric comprising at least one of a polyolefin fiber and a polyamide fiber, and a plating step of applying nickel plating to the hydrophilic nonwoven fabric. Preferably, the nickel plating is electroless plating, and the nonwoven fabric has a plurality of micropores extending from one surface to the other surface thereof. An electroplating film may be deposited on the electroless plated film, if necessary. This collector facilitates assembling a battery which exhibits improved high-rate discharge characteristics due to improved adhesiveness of the plated nickel film to the nonwoven fabric.Type: GrantFiled: November 4, 2002Date of Patent: August 10, 2004Assignees: Mitsubishi Materials Corporation, Japan Vilene Company, Ltd.Inventors: Hiroyuki Imai, Kaori Yoshida, Toshiaki Takase, Kazuya Satou
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Patent number: 6764586Abstract: Provided is a process for metallizing an insulating substrate by depositing a uniform thin film of a metal on the insulating substrate. The process comprises placing the insulating substrate in an electrochemical cell which contains as the electrolyte a solution of a salt of the metal in a solvent, and which comprises an anode of the metal and a cathode in direct contact with the insulating substrate. A conducting film, which will constitute the cathode, is initially applied to one end of the substrate. The substrate is placed in the electrochemical cell in such a way that the surface to be metallized is vertical and the cathode is located in the upper part. A current is imposed on the electrochemical cell with an intensity such that it creates a current density of between 1 and 50 mA/cm2 in the horizontal section of the electrochemical cell level with the growth front of the film which is deposited.Type: GrantFiled: April 9, 2002Date of Patent: July 20, 2004Assignee: Centre National de la Recherche ScientifiqueInventor: Vincent Fleury
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Publication number: 20040129571Abstract: The optical fiber manufacturing method according to the present invention is characterized by having the steps of forming, on the peripheral surface of a bare fiber having been exposed by removing a resin cover and on which a metallic coating has not been provided, a subbing layer consisting of an electroless Ni plating layer and an electrolytic Au plating layer; subjecting the bare fiber on which the subbing layer has been formed, to end face treatment by means of an optical-fiber cleaver to expose an end face portion of the bare fiber; and subjecting the bare fiber on which the end face treatment has been carried out, to electrolytic plating to form a metallic coating as a surface layer, consisting of an electrolytic Ni plating layer and an electrolytic Au plating layer.Type: ApplicationFiled: December 15, 2003Publication date: July 8, 2004Applicant: SUMITOMO METAL MINING CO., LTD.Inventor: Yoichi Onosato
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Patent number: 6743501Abstract: The invention concerns the manufacture of complex metallic or metallized porous structures, wherein the electroplating metal over the entire developed surface is preceded by a specific pre-metallization of the basic structure. The pre-metallization is obtained by depositing a conductive polymer, which is deposited on the entire developed surface of the structure by the steps of an oxidizing pre-treatment of the structure, depositing in the liquid phase, a monomer having a polymerized form that is electrically conductive, and polymerizing by oxidation-doping of the monomer. The structures according to the invention are particularly intended for use as electrodes for the electrolysis of liquid effluents, as electrode supports for electrochemical generators, as catalyst supports, filtration media, phonic insulation, electromagnetic and nuclear protection structures, or for other applications.Type: GrantFiled: July 12, 2001Date of Patent: June 1, 2004Assignee: S.C.P.S. Societe de Conseil et de Prospective Scientifique S.A.Inventors: Bernard Bugnet, Max Costa, Denis Doniat
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Publication number: 20030150740Abstract: A complex porous structure of a reticulated foam, felt or fabric types, wherein their metallisation over their entire developed surface, by electrolysis of lead or lead alloys, is made possible by a specific preliminary conductive activation treatment obtained by using two consecutive phases of coating the developed surface of the structures, comprising a first deposition of a conductive polymer, which provides the structures with the required conductivity, and a second thin deposition of conductive lacquer or varnish which ensures the surface protection of the conductive polymer against the deactivating effect of the conductive nature of the latter, due to the cathodic polarisation of the said structures in the electrolytic lead-coating bath.Type: ApplicationFiled: January 30, 2003Publication date: August 14, 2003Inventors: Bernard Bugnet, Denis Doniat
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Publication number: 20030102225Abstract: The conductive fabric is fabricated by preparing a base fibrous fabric substrate having the form of a woven, non-woven, or mesh sheet, forming a first layer formed on the fibrous fabric substrate in accordance with an electroless plating process, the first layer being made of copper, and forming a second layer as an externally exposed layer, on the first layer continuously, the second layer being made of gold or platinum.Type: ApplicationFiled: January 2, 2003Publication date: June 5, 2003Inventor: Sun-Ki Kim
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Patent number: 6468593Abstract: Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight %; and executing electroless plating on a surface of the coating film. Also provided are products produced by this method.Type: GrantFiled: November 25, 1998Date of Patent: October 22, 2002Assignees: Kanto Kasei Co., Ltd., Tanabe Chemical Industry Co., Ltd.Inventors: Tsutomu Iizawa, Takuya Ishida, Tamotsu Murayama, Takayuki Yagi
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Patent number: 6447561Abstract: An abrasive body for grinding optical glass, precious and natural stones such as marble, or other material such as wood, metal, plastic or the like is provided. The abrasive body comprises a base body of woven, knitted or embroidered fabric made of carbon fibers, or of a graphite foil. A uniform, homogeneous diamond or boron nitride coating is deposited on the base body as a grinding layer.Type: GrantFiled: July 10, 2000Date of Patent: September 10, 2002Assignee: Winter CVD Technik GmbHInventors: Ernst Michael Winter, Hans-Joachim Wiemann
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Patent number: 6428674Abstract: A process for the removal of galvanic electrolytic residues from galvanically reinforced fiber structure frames, where the fiber structure frame is produced through chemical metallization of a textile substrate based on fleeces or felts made of synthetic fibers and then through galvanic reinforcement of the metallized textile substrate in a galvanic bath containing a galvanic electrolyte. The invention provides that the galvanic electrolytic residues are removed by suction from the fiber structure frame. The fiber structure frame then makes contact at least once under high pressure with the wash liquid in a wash station, and subsequently the wash liquid is removed by suction from the fiber structure frame. In order to remove by suction, the galvanic electrolytic residues or the wash liquid, a belt-shaped porous supporting device is inserted between the suction port and a main area of the fiber structure frame.Type: GrantFiled: October 30, 2000Date of Patent: August 6, 2002Assignee: DaimlerChrysler AGInventors: Otwin Imhof, Holger Kistrup, Karl-Ernst Noreikat
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Publication number: 20010054555Abstract: A blended solution is made by melting LiOH•H2O into distilled water, and then, Co metallic powders are added into the blended solution to make a reactive solution. The reactive solution is charged into an autoclave, and held at a predetermined temperature. Then, a pair of platinum electrodes are set into the reactive solution, and a given voltage is applied between the pair of platinum electrode. As a result, a compound thin film, made of crystal LiCoO2 including Li element of the blended solution and Co element of the Co metallic powders, is synthesized on the platinum electrode constituting the anode electrode.Type: ApplicationFiled: March 16, 2001Publication date: December 27, 2001Inventors: Masahiro Yoshimura, Takeshi Fujiwara, Seung-wan Song, Tomoaki Watanabe, Ryo Teranishi, Kyoo-Seung Han
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Publication number: 20010031402Abstract: A hydrophilic collector for alkaline secondary batteries is formed of a nonwoven fabric plated with nickel in which the nonwoven fabric is hydrophilized by sulfonation, a gaseous fluorine treatment, or vinyl monomer grafting. A method for making the collector includes a hydrophilizing step of a nonwoven fabric comprising at least one of a polyolefin fiber and a polyamide fiber, and a plating step of applying nickel plating to the hydrophilic nonwoven fabric. Preferably, the nickel plating is electroless plating, and the nonwoven fabric has a plurality of micropores extending from one surface to the other surface thereof. An electroplating film may be deposited on the electroless plated film, if necessary. This collector facilitates assembling a battery which exhibits improved high-rate discharge characteristics due to improved adhesiveness of the plated nickel film to the nonwoven fabric.Type: ApplicationFiled: February 21, 2001Publication date: October 18, 2001Applicant: Mitsubishi Materials CorporationInventors: Hiroyuki Imai, Kaori Yoshida, Toshiaki Takase, Kazuya Satou
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Patent number: 6290832Abstract: The invention concerns the manufacture of complex metallic or metallized porous structures, wherein the electroplating metal over the entire developed surface is preceded by a specific pre-metallization of the basic structure. The pre-metallization is obtained by depositing a conductive polymer, which is deposited on the entire developed surface of the structure by the steps of an oxidizing pre-treatment of the structure, depositing in the liquid phase, a monomer having a polymerized form that is electrically conductive, and polymerizing by oxidation-doping of the monomer. The structures according to the invention are particularly intended for use as electrodes for the electrolysis of liquid effluents, as electrode supports for electrochemical generators, as catalyst supports, filtration media, phonic insulation, electromagnetic and nuclear protection structures, or for other applications.Type: GrantFiled: August 2, 1996Date of Patent: September 18, 2001Assignee: S.C.P.S. Societe de Conseil et de Prospective Scientifique S.A.Inventors: Bernard Bugnet, Max Costa, Denis Doniat
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Patent number: 6045680Abstract: A polymeric yarn to be coated with electroless nickel is pretreated with an acid and a surfactant to render the yarn surfaces water wettable and not substantially mechanically degraded. All surfaces of yarn formed of polymeric monofilament fibers are coated with a layer of electroless nickel which can also include an electrolytic metal such as copper on the nickel. The yarn is passed through an electroless Ni aqueous bath under little or no tension so that the electroless Ni can coat all of the monofilament surface substantially uniformly. The nickel coated yarn then can be coated with electrolytic metal such as copper in an electrolytic metal plating step.Type: GrantFiled: May 30, 1996Date of Patent: April 4, 2000Assignee: E. I. du Pont de Nemours and CompanyInventors: John D. Cawston, Merwin F. Hoover, Thomas F. Burke, Thomas H. Stearns
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Patent number: 5879531Abstract: Electrical conductors (2) embedding filaments (4) of a fabric (3), and substantially filling interstices (5) that coextend with the imbedded filaments (4), are fabricated by plating conductive material onto a surface (14) of a passivated cathode against which the fabric (3) is held. Resist material (19) conforms the conductive material to form an array of electrical conductors (2).Type: GrantFiled: September 27, 1996Date of Patent: March 9, 1999Assignee: The Whitaker CorporationInventors: George Robert Schmedding, Basil Daniel Washo
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Patent number: 5674373Abstract: A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable reagent, and (d) electrolytically depositing at least one metal film (11) on said film (9).Type: GrantFiled: April 12, 1996Date of Patent: October 7, 1997Assignee: TrefimetauxInventors: Marcel Negrerie, Guy de Hollain, Van Huu N'Guyen, Serge Insenga
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Patent number: 5597471Abstract: A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at least one water soluble polymer selected from the group consisting of homopolymers and copolymers, and at least one aromatic compound which chemically polymerizes the water-soluble polymer and the aromatic compound to form a conductive polymer, and electroplating the conductive polymer. Each water-soluble polymer contains uncharged structural elements or is cationic polyelectrolyte. Additionally, each water soluble polymer is capable of protonizing/deprotonizing reactions, formation of hydrogen bridge compounds and van der Waals interactions.Type: GrantFiled: April 11, 1995Date of Patent: January 28, 1997Assignee: Atotech Deutschland GmbHInventors: Andrea Ragge, Heinrich Meyer, Gonzalo Urrutia Desmaison
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Patent number: 5545308Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.Type: GrantFiled: June 19, 1995Date of Patent: August 13, 1996Assignee: Lynntech, Inc.Inventors: Oliver J. Murphy, G. Duncan Hitchens, Dalibor Hodko, Eric T. Clarke, David L. Miller, Donald L. Parker
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Patent number: 5421989Abstract: A process for applying a principal metal coating to a non-conductive substrate without employing an electroless coating is disclosed comprising:(a) contacting the substrate with a suspension comprising a noble metal colloid suspended in a polymer matrix to obtain a coated substrate;(b) optionally removing at least part or substantially all of the polymer matrix from said coated substrate;(c) electrolytically coating the substrate obtained after step (a) or (b) with a solution of the principal metal coating. The polymer matrix is selected to combine with the metal of the noble metal coating or principal metal or both. Prior to contacting the substrate with the suspension, it may be contacted with a conditioner that will combine with the noble metal or principal metal or both to obtain a conditioned substrate. The conditioned substrate is then contacted with the suspension.Type: GrantFiled: September 3, 1993Date of Patent: June 6, 1995Assignee: Atotech Deutschland GmbHInventors: Lutz Stamp, Elisabeth Zettelmeyer-Decker, Norbert Tiemann
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Patent number: 5102423Abstract: A cloth treatment method includes the steps of dipping a cloth in a solution of a treating substance to wet the cloth therewith, squeezing the cloth to uniformly impregnate it with the substance, disposing the cloth impregnated with the treating solution between two electrode rolls parallel to each other, and applying a voltage to the two electrode rolls to pass an electric current between therebetween through the treating solution with which the cloth is impregnated, whereby heat generated due to electric resistance of the treating solution promotes fixation of the treatment substance to the fabric.Type: GrantFiled: April 11, 1989Date of Patent: April 7, 1992Assignee: Naigai Special Dyeing Co., Ltd.Inventor: Hideo Iwami