Abstract: A steel sheet is provided. The steel sheet includes a multilayer coating including at least one zinc-based layer being 0.1% to 20% magnesium by weight which is covered by a fine temporary protective layer of 5 to 100 nm. The fine temporary protective layer is composed of metal or metal oxide selected from the group consisting of aluminum, chromium, aluminum oxides AlOx, with x being strictly between 0.01 and 1.5 and chromium oxides CrOy, with y being strictly between 0.01 and 1.5. The at least one zinc-based layer is not alloyed with the temporary protective layer. Manufacturing methods for a sheet and part are also provided.

Abstract: A flat steel product having a base layer of a steel material and a multilayer coating applied thereto, and a method for producing the flat steel product. The method having the following steps: providing a steel base layer; applying a zinc layer to the base layer by electrolytic coating; applying an aluminum layer to the surface of the zinc layer, wherein no treatment is made to the surface of the zinc layer in regard to the oxides and sulfides present thereon at the end of the electrolytic zinc coating step or occurring during the course of the aluminum coating step; applying a magnesium layer to the aluminum layer; and subsequently heat treating the flat steel product in such a way that an MgZn2 layer forms in the coating above the Al layer.

Abstract: A disk drive includes a disk including a magnetizable layer of material, and a transducer. The transducer has a read element that includes a first shield layer, a pinned layer, a metallic spacer, an AP (anti-parallel) free layer, and a second shield layer. The pinned layer has a surface area which is greater than the area of the AP free layer. The read element also includes an anti-ferromagnetic layer for substantially fixing the magnetic orientation of a plurality of domains in the pinned layer. The ferromagnetic layer is adjacent the pinned layer. The pinned layer, and the anti-ferromagnetic layer both have surface areas which are greater than the area associated with the AP free layer. The anti-ferromagnetic layer, in one embodiment, has a pinning strength in the range of 0.5 erg/cm2 to 1.5 erg/cm2.

Abstract: A tungsten carbide coated chamber component of semiconductor processing equipment includes a metal surface, optional intermediate nickel coating, and outer tungsten carbide coating. The component is manufactured by optionally depositing a nickel coating on a metal surface of the component and depositing a tungsten carbide coating on the metal surface or nickel coating to form an outermost surface.

Abstract: A method for providing a structure in a magnetic recording transducer is described. The method includes plating a first layer in a plating bath using a first plurality of plating conditions. The first layer has a first galvanic potential. The method also includes modifying the plating bath and/or the first plurality of plating conditions to provide a modified plating bath and/or a second plurality of plating conditions. The method further includes plating a second layer using the modified plating bath and/or the second plurality of plating conditions. The second layer has a second galvanic potential. The first galvanic potential is between the second galvanic potential and a third galvanic potential of a third layer if the third layer adjoins the first layer. The second galvanic potential is between the first galvanic potential and the third galvanic potential of the third layer if the third layer adjoins the second layer.

Abstract: A coated article includes a substrate, a Ni layer formed on the substrate, and a vacuum coated layer formed on the Ni layer. The vacuum coated layer is made of material selected from a group consisting of Al, Ti, Cr and Zn. A method for manufacturing an article is also provided.

Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.

Abstract: A first preferred method for increasing the solderability of a substrate comprising: preparing the substrate for nickel plating by cleaning and removal of surface contaminants; plating a first nickel film of the desired thickness directly onto the substrate; preparing the nickel film comprising thoroughly cleaning the surface; depositing a substantially pure nickel film directly on the first nickel film using a suitable PVD technique; and applying solder to the substantially pure nickel film. Another preferred method for increasing the solderability of a substrate comprising plating a first nickel layer directly onto the substrate by using an electrolytic or electroless nickel plating process; depositing a substantially pure nickel film directly on the first nickel film using physical vapor deposition; and applying solder to the substantially pure nickel film.

Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.

Abstract: The invention relates to a method for producing a hardened profiled structural part from a hardenable steel alloy with cathodic corrosion protection. The method includes applying a coating to a sheet made of a hardenable steel alloy, wherein the coating comprises zinc, and the coating further comprises one or several elements with affinity to oxygen in a total amount of 0.1 weight-% to 15 weight-% in relation to the total coating. After applying the coating, the coated sheet steel is roller-profiled in a profiling device. Thereafter, the coated sheet steel is heated to a structural change required for hardening. A skin made of an oxide of the element(s) with affinity to oxygen is formed on the surface of the coating. After sufficient heating the sheet is cooled, wherein the rate of cooling is set in such a way that hardening of the sheet alloy is achieved.

Abstract: A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.

Abstract: A flat steel product provided with a coating system, which in the coated state possesses an optimized combination of corrosion resistance and welding capacity, includes a base layer formed from a steel and a corrosion protection system applied onto the base layer. The corrosion protection system comprises a metallic coating less than 3.5 ?m thick, formed from a first metallic layer applied onto the base layer and a second metallic layer applied onto the first metallic layer, wherein the second metallic layer has formed a metallic alloy with the first metallic layer. The corrosion protection system also comprises a plasma polymer layer applied onto the metallic coating.

Abstract: A method is provided for electroplating a high temperature coating onto an airfoil. The method includes providing a shield having a recess defining one or more walls conforming to the shape of at least a portion of a pressure side and a suction side of the airfoil to be electroplated, introducing the portions of the pressure side and the suction side of the airfoil to be electroplated into the recess of the shield, attaching an anode and cathode to the airfoil, submerging at least the shield and the portions of the pressure side and the suction side of the airfoil to be electroplated into an electroplating tank containing an electrolyte, and electroplating a coating of a high temperature resistant metal onto the portions of the pressure side and the suction side of the airfoil to be electroplated to a predetermined minimum thickness.

Abstract: An electrically conductive body, which in particular includes a metal and/or an alloy and/or a semiconductor, includes an adhesion promoter layer provided on at least one surface of the electrically conductive body. The adhesion promoter layer includes a metal, in particular zinc, and a porous, in particular platelike and/or needle-shaped and/or sponge-like, surface structure.

Abstract: A method of chromium coating a substrate is described, which method comprises: a) depositing, preferably electrodepositing, a metallic layer onto the substrate comprising chromium from a plating bath that includes trivalent chromium and no, or substantially no, hexavalent chromium; b) physical vapor depositing a layer comprising chromium cn the layer deposited from step a). In one embodiment, in step a), the layer is chromium and is electrodeposited from a plating bath that includes trivalent chromium and no, or substantially no, hexavalent chromium. The metallic layer deposited in step a) is preferably a metal or an alloy of two or more metals and may be selected from the group consisting of chromium, copper, nickel, cobalt, zinc, lead iron, palladium and tin and alloys thereof, e.g. copper tin, copper zinc, tin lead, tin nickel, tin cobalt, tin zinc, iron nickel, cobalt nickel, zinc nickel, zinc iron, zinc iron nickel, zinc iron cobalt or palladium nickel. Copper and nickel are especially preferred.

Abstract: Disclosed is a multi-step process for the coating of a substrate without re-racking the substrate between the coating operations comprising: providing a substrate holder with an inert protective polymeric coating covering a substantial portion of the holder; affixing a substrate to the substrate holder; electroplating a coating onto the substrate; without re-racking the substrate, applying a physical vapor deposition coating to the coated substrate; and removing the twice coated substrate from the substrate holder.

Abstract: A method for preparing nano metallic particles comprises the steps of dipping a conductive substrate in an electroplating solution containing metallic ions and performing an electroplating process to form the nano metallic particles on the conductive substrate by the reduction reaction of the metallic ions. The nano metallic particles can be used as a catalyst to perform a chemical vapor deposition process to form carbon nanotubes on the conductive substrate. Subsequently, fluorescent material can be positioned on the carbon nanotubes to form a light-emitting device. When a predetermined voltage is applied between the conductive substrate and the fluorescent material, the carbon nanotubes on the conductive substrate emit electrons due to the point discharge effect, and the electrons bombard the fluorescent material to emit light beams.

Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by physical vapor deposition, at least one vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The physical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.

Abstract: An electrical resistive device, including: an array of titania nanotubes open at an outwardly-directed end formed by anodizing at least a portion of a titanium layer; a plurality of palladium (or other noble metal) clusters having been deposited atop the nanotube array; and the nanotube array mechanically supported by an integral support member. The array of titania nanotubes may include a dopant. An exposure of titania nanotube array to radiant energy emitted within a range of frequencies from visible to ultraviolet, in the presence of oxygen, removes a contaminant, if present. The titanium layer may be deposited atop the integral support; or the unique doped titanium layer can be produced, prior to the anodizing thereof, by depositing titanium along with dopant atop the integral support member by a co-deposition process. Also, supported: method(s) of producing the electrical resistive devices.

Abstract: Carbon nanotubes are directly grown on a substrate surface having three metal layers thereon by a thermal chemical vapor deposition at low-temperature, which can be used as an electron emission source for field emission displays. The three layers include a layer of an active metal catalyst sandwiched between a thick metal support layer formed on the substrate and a bonding metal layer. The active metal catalyst is iron, cobalt, nickel or an alloy thereof; the metal support and the bonding metal independently are Au, Ag, Cu, Pd, Pt or an alloy thereof; and they can be formed by sputtering, chemical vapor deposition, physical vapor deposition, screen printing or electroplating.

Abstract: A method for forming electroplating cathode contacts around the periphery of a semiconductor wafer including forming an insulating layer over a conductive layer extending at least around the periphery of a semiconductor wafer substrate; etching a plurality of openings around a peripheral portion of the semiconductor wafer substrate through the insulating layer to extend through a thickness of the insulating layer in closed communication with the conductive layer said conductive area in electrical communication with a central portion of the semiconductor wafer substrate; filling the plurality of openings with metal to form electrically conductive pathways; planarizing the electrically conductive pathway surfaces; and, forming a metal layer over the electrically conductive pathway surfaces to form a plurality of contact pads for contacting a cathode for carrying out an electroplating process.

Abstract: A method of manufacturing a honeycomb extrusion die has the steps of: preparing a die base metal in which a plurality of intersecting slits are arranged in a front surface thereof and a plurality of raw material feeding holes communicated with the slits are arranged in a back surface thereof; forming a plating layer on the die base metal by means of electrolytic plating; (1) and forming a TiCN layer on the plating layer by means of CVD (chemical vapor deposition); or (2) forming a TiN layer on the plating layer by means of CVD (chemical vapor deposition); and forming a TiCN layer on the TiN layer by means of CVD. In this manner, the honeycomb extrusion die is obtained.

Abstract: Methods of forming a nano-supported catalyst on a substrate and at least one carbon nanotube on the substrate are comprised of configuring a substrate with an electrode (102), immersing the substrate with the electrode into a solvent containing a first metal salt and a second metal salt (104) and applying a bias voltage to the electrode such that a nano-supported catalyst is at least partly formed with the first metal salt and the second metal salt on the substrate at the electrode (106). In addition, the method of forming at least one carbon nanotube is comprised of conducting a chemical reaction process such as catalytic decomposition, pyrolysis, chemical vapor deposition, or hot filament chemical vapor deposition o grow at least one nanotube on the surface of the nano-supported catalyst (108).

Abstract: A tip of rotor blade which rotates is an abradable surface. An inner wall of a shroud as a jacket for the rotor blade is an abrasive surface. A part of an abrasive particle protrudes from the abradable surface. When the tip of the rotor blade which rotates contacts the inner wall of the shroud, the protruding section of the abrasive particle slides with the abrasive surface so as to be ground. By doing this, a turbine which can maintain an appropriate clearance between the rotor blade and the shroud and can be used for a long period under high-temperature conditions with easy restoration and remaking thereof.

Abstract: The present invention provides for an etch and mar resistant low VOC clear coating composition most suitable for use as a top clear coat in multi-layered OEM or refinish automotive coatings. The coating composition includes isocyanate, carbonate and melamine components. The isocyanate component includes an aliphatic polyisocyanate. The composition may be formulated as a two-pack or one-pack coating composition, wherein the isocyanate functionalities are blocked with a blocker such as a mono-alcohol.

Abstract: An electrolyte for use in electrolytic platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, Pt(NH3)2(NO2)2 or variants thereof and 0.1 to 240 g/lit of alkali metal carbonate M2CO3 or bicarbonate MHCO3 where M is selected from a group comprising lithium (Li), sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). A method of improving oxidation resistance of a platinum modified aluminide diffusion coating on a substrate, comprises electroplating the substrate using this electrolyte and then aluminizing the electroplated substrate at an elevated temperature to grow a platinum modified aluminide diffusion coating.

Abstract: A diffusion aluminide coating having a graded structure is applied over a nickel base superalloy substrate. The coating has an inner region of a diffusion aluminide adjacent to the substrate rich in a reactive element, typically Hf, Si or combinations of the two. The near surface region is a diffusion aluminide which is substantially free of reactive elements. Such coatings when used as bond coats in thermal barrier coating systems exhibit improved spallation performance.

Abstract: A method is described for catalyst-induced growth of carbon nanotubes, nanofibers, and other nanostructures on the tips of nanowires, cantilevers, conductive micro/nanometer structures, wafers and the like. The method can be used for production of carbon nanotube-anchored cantilevers that can significantly improve the performance of scaning probe microscopy (AFM, EFM etc). The invention can also be used in many other processes of micro and/or nanofabrication with carbon nanotubes/fibers. Key elements of this invention include: (1) Proper selection of a metal catalyst and programmable pulsed electrolytic deposition of the desired specific catalyst precisely at the tip of a substrate, (2) Catalyst-induced growth of carbon nanotubes/fibers at the catalyst-deposited tips, (3) Control of carbon nanotube/fiber growth pattern by manipulation of tip shape and growth conditions, and (4) Automation for mass production.

Abstract: A CVD outwardly grown platinum aluminide diffusion coating on a nickel or cobalt base superalloy substrate wherein the platinum modified aluminide diffusion coating is modified to include silicon, hafnium, and optionally zirconium and/or other active elements (e.g. Ce, La, Y, etc.) each in a concentration of about 0.01 weight % to about 8 weight % of the outer additive (Ni,Pt)(Al,Si) layer of the coating. A particular coating includes about 0.01 weight % to less than 2 weight % of each of silicon, hafnium, and zirconium in the outer additive layer, preferably with a Hf/Si ratio less than about 1 and, when Zr also is present, a Hf+Zr/Si ratio of less than about 1. A coating microstructure is provided characterized by an inner diffusion zone or region adjacent the substrate and the outer additive (Ni,Pt)(Al,Si) layer including hafnium silicide second phase particles or regions dispersed throughout the outer additive layer of the coating.

Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by physical vapor deposition, at least one vapor deposited coating layer on the electroplated article.

Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by chemical vapor deposition, at least one chemically vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The chemical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.

Abstract: This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 .ANG. to about 80 .ANG.; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.

Abstract: A process and structure for enhancing electromigration resistance within a copper film using impurity lamination and other additives to form intermetallic compounds to suppress metal grain boundary growth and metal surface mobility of a composite copper film. The present invention provides an alloy seed layer and laminated impurities to incorporate indium, tin, titanium, their compounds with oxygen, and their complexes with oxygen, carbon, and sulfur into other films. The intermetallics form and segregate to grain boundaries during an annealing process to reduce copper atom mobility. A further aspect of the present invention is the use of high-temperature, inter-diffusion of additives included in an alloy seed layer to form a barrier layer by combining with materials otherwise unsuitable for barrier material functions.

Abstract: A method for depositing a multi-layered protective and decorative coating on the article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by physical vapor deposition, at least one vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The physical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.

Abstract: A photovoltaic cell exhibiting an overall conversion efficiency of 13.6% is prepared from a copper-indium-gallium-diselenide precursor thin film. The film is fabricated by first simultaneously electrodepositing copper, indium, gallium, and selenium onto a glass/molybdenum substrate (12/14). The electrodeposition voltage is a high frequency AC voltage superimposed upon a DC voltage to improve the morphology and growth rate of the film. The electrodeposition is followed by physical vapor deposition to adjust the final stoichiometry of the thin film to approximately Cu(In.sub.1-n Ga.sub.x)Se.sub.2, with the ratio of Ga/(In+Ga) being approximately 0.39.

Abstract: A thin film diode (8) between a data line (12) and a drive electrode (13), which is free from breakage in an upper layer film (4), is formed on one inner surface of a glass substrate (1) sealing a liquid crystal of a liquid crystal display device. To form such a thin film diode, a lower layer film (2) is formed on the glass substrate (1) such that the lower layer film (2) overlaps with the upper layer film (4) and the lower layer film (2) has a plurality of differences in level. An insulating film (3) is formed by oxidizing the surface of the lower layer film (2) with an anodic oxidation technique. The upper layer film (4) is formed, thereby completing the thin film diode. Alternately, an insulating film material (7,7') may be formed either on the lower layer film (2) or on the peripheral region thereof in the form of a film, and the insulating film (3) may be formed by oxidizing the insulating film material (7,7').

Abstract: A method of improving oxidation resistance of a platinum modified aluminide diffusion coating on a substrate involves electroplating the substrate with a platinum layer from an aqueous hydroxide based electroplating solution and aluminizing the substrate to grow the platinum modified aluminide diffusion coating on said layer. The electroplating solution preferably includes an alkali element and/or alkaline earth element that is incorporated in the platinum layer and in the aluminide diffusion coating formed thereon to significantly improve oxidation resistance of the coating.

Abstract: High quality thin films of copper-indium-gallium-diselenide useful in the production of solar cells are prepared by electrodepositing at least one of the constituent metals onto a glass/Mo substrate, followed by physical vapor deposition of copper and selenium or indium and selenium to adjust the final stoichiometry of the thin film to approximately Cu(In,Ga)Se.sub.2. Using an AC voltage of 1-100 KHz in combination with a DC voltage for electrodeposition improves the morphology and growth rate of the deposited thin film. An electrodeposition solution comprising at least in part an organic solvent may be used in conjunction with an increased cathodic potential to increase the gallium content of the electrodeposited thin film.

Abstract: An article is coated with a multilayer coating comprising a semi-bright nickel layer deposited on the surface of the article, a bright nickel layer deposited on the bright nickel layer, a gold layer deposited on the semi-bright nickel layer, a ruthenium layer deposited on the gold layer, a refractory metal, preferably zirconium, strike layer deposited on the ruthenium layer, and a refractory metal compound, preferably zirconium nitride, deposited on the refractory metal strike layer. The coating provides the color of polished brass to the article and also provides abrasion and corrosion protection.

Abstract: A ceramic thermal barrier coating layer for a superalloy article is caused to adhere to the superalloy article by applying platinum to the superalloy article and heat treating at a temperature of 1100.degree. C. to 1200.degree. C. for one hour. This causes aluminum to diffuse from the superalloy article into the platinum to form a platinum enriched outer layer which generally includes a platinum enriched gamma phase and a platinum enriched gamma prime phase. An alumina layer is formed between the platinum enriched outer layer and a ceramic coating. The platinum enriched gamma phase and the platinum enriched gamma prime phase in the outer layer reduces the migration of transition metal elements to the ceramic coating to enable a very pure alumina layer to be formed.

Abstract: The use of a bi-layer thin film structure consisting of aluminum or aluminide on a refractory metal layer as a diffusion barrier to oxygen penetration at high temperatures for preventing the electrical and mechanical degradation of the refractory metal for use in applications such as a capacitor electrode for high dielectric constant materials.

Abstract: A magnetic recording medium having a substrate made of aluminum or aluminum alloy and an anodic-oxide film, e.g., alumite film, formed by effecting the anodic oxidation process, wherein the surface of the alumite film has protruding portions formed in addition to micro-irregularities which are formed in response to the cell-pore structure of the alumite film and height of the protruding portions is higher than that of the micro-irregularity, and density of the protruding portions is ranging from 10.sup.2 to 10.sup.7 per one square millimeter, these protruding portions are formed by processing the alumite film in the fluorine-contained solution (e.g., hydrofluoric acid) or in solution containing one of the acid (HCl), base (NaOH) and strong-acid salt ((NH.sub.4)SO.sub.4), Cr film and magnetic film are sequentially formed on the alumite film by the sputtering process.

Abstract: An article is coated with a multilayer coating comprising a nickel layer deposited on the surface of the article, a nickel-tungsten-boron alloy layer deposited on the nickel layer, a refractory metal, preferably zirconium, strike layer deposited on the nickel-tungsten-boron alloy layer, and a refractory metal compound, preferably zirconium nitride, deposited on the refractory metal strike layer. The coating provides the color of polished brass to the article and also provides abrasion and corrosion protection.