Abstract: The disclosure provides a cell-based, label-free assay compatible with high-throughput screening (HTS) that can report quantitatively on enzyme activities by measuring mass changes of substrates with MALDI-mass spectrometry.

Abstract: A film deposition device (1A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to be a negative electrode. The solid electrolyte membrane (13) allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part (14) applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane (13) is precipitated on a surface of the base material (B).

Abstract: A bonding wire includes a wire core including a silver-palladium alloy. A coating layer is disposed on a sidewall of the wire core. A palladium content of the silver-palladium alloy ranges from about 0.1 wt % to about 1.5 wt %.

Abstract: An aqueous electrolyte solution including a concentration of citric acid in the range of about 1.6 g/L to about 982 g/L and an effective concentration of ammonium bifluoride (ABF), and being substantially free of a strong acid. Methods of treating the surface of a non-ferrous metal workpiece include exposing the surface to a bath of an aqueous electrolyte solution including a concentration of citric acid less than or equal to about 300 g/L and a concentration of ammonium bifluoride greater than or equal to about 10 g/L, and having no more than about 3.35 g/L of a strong acid, controlling the temperature of the bath to be greater than or equal to about 54° C., connecting the workpiece to the anode of a DC power supply and immersing a cathode of the DC power supply in the bath, and applying a current across the bath.

Abstract: An electrode for use in bio-electrochemical systems is described, including: a substantially planar electrode material; a frame comprising a non-conductive substance; and one or more first conductive substances linked or secured to the frame. Bio-electrochemical systems, racks for inserting the electrode, and methods of using the racks are also described.

Abstract: A treated rotor is provided by a method in which a surface of a ferrous rotor having cooling elements is heat-treated to produce a microporous, outermost surface layer, then the heat-treated rotor is coated by electrodepositing a coating layer of an electrocoat coating composition on the heat-treated the surface of to provide a electrocoat coating directed on the surface of the heat-treated rotor. The electrocoat coating layer has a throwpower of at least about 40% and the coating layer is continuous on cooling elements of the rotor. The microporous outermost layer is a controlled iron oxide layer.

Abstract: A thermoplastic composition is described that can be directly coated with a metal according to a metallization process with no intervening base coat formation process necessary. The thermoplastic composition includes a polyarylene sulfide and a filler having a selectively controlled average length and aspect ratio. Molded articles formed of the thermoplastic composition can have an ultra-smooth surface so as to directly accept a metallization coating.

Abstract: A composite article (1; 10; 40) comprises a plurality of inclusions (5) of a magnetocalorically active material embedded in a matrix (4) of a magnetocalorically passive material. The inclusions (5) and the matrix (4) have a microstructure characteristic of a compacted powder.

Abstract: A method for shrinking a linewidth on a substrate includes the steps of applying a stretching force on the substrate, defining a line on a top surface of the substrate and releasing the applied stretching force. The applied force is executed by mechanical stretching or thermal expansion and has a direction parallel to the line.

Abstract: A curved, three-dimensional, ordered micro-truss structure comprising: a plurality of first struts extending along a first direction; a plurality of second struts extending along a second direction; and a plurality of third struts extending along a third direction, wherein the first, second, and third struts interpenetrate one another at a plurality of nodes, wherein the pluralities of first struts, second struts, third struts, and nodes form a plurality of ordered unit cells within the micro-truss structure, and wherein the plurality of ordered unit cells define a curved surface.

Abstract: Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. The primer layer is formed of a resin composition including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B).

Abstract: Disclosed are methods for producing carbon, metal and/or metal oxide porous materials that have precisely controlled structures on the nanometer and micrometer scales. The methods involve the single or repeated infiltration of porous templates with metal salts at controlled temperatures, the controlled drying and decomposition of the metal salts under reducing conditions, and optionally the removal of the template. The carbon porous materials are involve the infiltration of a carbon precursor into a porous template, followed by polymerization and pyrolysis. These porous materials have utility in separations, catalysis, among others.

Abstract: A method of manufacturing a fuel cell includes thermally treating a hydrogen permeable membrane in a given temperature higher than an actual operating temperature of the fuel cell, and forming an electrolyte layer on the hydrogen permeable membrane subjected to the thermal treatment. The hydrogen permeable membrane is composed of a polycrystalline metal.

Abstract: A method for inhibiting growth of tin whiskers is provided. The method includes providing a metal substrate, treating the metal substrate by an annealing process, and forming a tin layer to cover a surface of the metal substrate, wherein the surface of the tin layer has no tin whisker.

Abstract: The invention relates to a coating method for a workpiece, including the following method steps: a) applying a coating liquid to the workpiece, wherein the coating liquid comprises an ionic liquid containing ions of at least one element, b) electrochemically depositing a layer of the at least one element from the coating liquid on the workpiece, c) removing the workpiece from the coating liquid, d) removing excess coating liquid from the workpiece. In order to suggest an industrially suitable coating process, particularly for workpieces having at least a partial metal surface, using stable, durable baths, it is provided that the temperature of the workpiece is set such that the temperature of the coating liquid deviates by no more than 10° C.

Abstract: A filter membrane includes a substrate, a polymer layer provided on the substrate and a plurality of filter openings each having a width of from about 2 nanometers to about 5 nanometers provided in the polymer layer. A method of controlling pore size of a filter membrane and a method of decontaminating a filter membrane are also disclosed.

Abstract: This invention relates to novel calcium phosphate coated implantable medical devices, and electrochemical deposition processes for making same. A process of coating an implantable medical device with a calcium phosphate coating comprising: (a) subjecting a substrate to a surface pretreatment whereby adhesion of the calcium phosphate coating to the substrate is enhanced; (b) immersing the pretreated substrate in an electrolyte comprising calcium and phosphate species; and (c) coating calcium phosphate onto the substrate by electrochemical deposition.

Abstract: Articles having a first substance, naturally having a first crystalline structure, confined between surfaces of a second substance having a second crystalline structure, whereby the first substance has a third (unusual) crystalline structure different from said first crystalline structure and methods of making same. Substances having unusual crystalline structures and methods of making same.

Abstract: A method of manufacturing a fuel cell includes thermally treating a hydrogen permeable membrane in a given temperature higher than an actual operating temperature of the fuel cell, and forming an electrolyte layer on the hydrogen permeable membrane subjected to the thermal treatment. The hydrogen permeable membrane is composed of a polycrystalline metal.

Abstract: A process is described for analyzing enzyme-catalyzed conversions of nonpolymeric substrates to nonpolymeric products with the aid of MALDI-TOF mass spectrometry, preferably in the presence of an internal standard on a specific carrier material.

Abstract: A substrate processing apparatus and method which employs the so-called batch processing method of processing a plurality of substrates simultaneously, thereby increasing the throughput, and which can carry out processing, such as electroless plating, stably and securely with a relatively simple apparatus. The substrate processing apparatus includes: a processing bath (14) for holding a processing liquid (12); and a substrate holder (16) which is vertically movable relative to the processing bath (14) and which includes a plurality of substrate holding portions (40) for holding a plurality of substrates (W) in parallel.

Abstract: In the case of connecting a line for making connection between communication unit 12 mounted in a vehicle-mounted terminal 10 and center communication unit 21 of an information center 20 and acquiring information accumulated in storage unit 23 of the information center 20, control unit 13 of the vehicle-mounted terminal 10 predicts the necessity for connection between the communication unit 12 and the information center 20 and when it is decided that there is a possibility of the connection and there is the necessity, start processing of line connection to the information center is previously started and information can be immediately sent via a line in which the connection is completed at a point in time of actually sending information from the side of the vehicle-mounted terminal 10 to the side of the information center 20.

Abstract: Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the barrier layer. The method continues by performing in situ surface treatment of the metal-seed layer to form a passivation layer on the metal-seed layer. In another embodiment of a method of this invention, a substrate is provided into an electroplating tool chamber. The substrate has a barrier layer formed thereon, a metal seed layer formed on the barrier layer and a passivation layer formed over the metal seed layer. The method continues by annealing the substrate in forming gas to reduce the passivation layer. A conductive material is deposited on the substrate using an electrolytic plating or electroless plating process.

Abstract: A method of forming a bump structure through the use of an electroplating solution, comprising the following steps. A substrate having an overlying conductive structure is provided. A patterned dry film resist is formed over the conductive structure. The patterned dry film resist having a trench exposing a portion of conductive structure. The patterned dry film resist adhering to the conductive structure at an interface. The structure is treated with a treatment that increases the adherence of the patterned dry film resist to the conductive structure at the interface. A conductive plug is over the exposed portion of the conductive structure within the trench through the use of the electroplating solution. The increased adhesion of the patterned dry film resist to the conductive structure at the interface preventing the electroplating solution from penetrating the interface of the patterned dry film resist and the conductive structure during the formation of the conductive plug.

Abstract: A method for creating a material library of surface areas having different properties in which a substrate is coated. The substrate is subjected to a combined pretreatment procedure.

Abstract: A process for forming a multilayer composite coating on a substrate is provided. The process includes forming an electrodeposition coating layer on the substrate by electrodeposition of a curable electrodepositable coating composition over at least a portion of the substrate. Optionally, the coated substrate is heated to a temperature and for a time sufficient to cure the electrodeposition coating layer. A basecoating layer is formed on the electrodeposition coating layer by depositing an aqueous curable basecoating composition directly onto at least a portion of the electrodeposition coating layer. Optionally, the basecoating layer is dehydrated. A top coating layer is formed on the basecoating layer by depositing a curable top coating composition which is substantially pigment-free directly onto at least a portion of the basecoating layer. The top coating layer, the basecoating layer, and, optionally, the electrodeposition coating layer are cured simultaneously.

Abstract: The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via hole in the insulating layer, thermally curing the insulating layer, and reducing at least one oxidized layer formed on the other conductive surface of the substrate during the curing operation. Alternatively, the thermal cure may be accomplished in an atmosphere (e.g., reducing gas, inactive gas, or mixtures thereof) not conducive to oxide formation on metallized circuit surfaces.

Abstract: Disclosed herewithin is an apparatus for fabricating a stent which involves processing a tubular member whereby no connection points to join the edges of a flat pattern are necessary. The process includes the steps of: a) preparing the surface of a tubular member, b) coating the outside surface of the tubular member with a photo-sensitive resist material, c) placing the tubular member in an apparatus designed to simultaneously rotate the tubular member while passing a specially configured photographic frame negative between a light source and the tubular member, d) exposing the tubular member to a photoresist developer, e) rinsing the excess developer and uncured resist from the exposed tubular member, f) sealing the inner lumen of the tubular member, and g) treating the tubular member with a chemical or electro-chemical process to remove uncovered metal. By modifying the photographic negative, this process can be employed to fabricate a virtually unlimited number of stent designs and configurations.

Abstract: The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via hole in the insulating layer, thermally curing the insulating layer, and reducing at least one oxidized layer formed on the other conductive surface of the substrate during the curing operation. Alternatively, the thermal cure may be accomplished in an atmosphere (e.g., reducing gas, inactive gas, or mixtures thereof) not conducive to oxide formation on metallized circuit surfaces.

Abstract: A method of providing a decorative metal pattern on an electrically non-conductive substrate, such as a glass or plastic substrate, which includes applying a mixture of heat fusible material, such as glass or plastic, with a metal having a particle size less than about 500 mesh constituting at least 50% of the mixture, to the substrate in the desired pattern, heating the so-applied mixture until the heat fusible material fuses and bonds to the substrate, cleaning the substrate with the pattern thereon, and a electroplating the pattern with the desired finish metal. In one method in which the mixture includes glass, a negative resist is adhesively secured to the substrate and the mixture is applied. The resist disintegrates upon heating. In another method, used when the substrate is plastic, a mixture of plastic and metal in past form is applied to the substrate by silk screening or pad printing to form the pattern.

Abstract: Disclosed are a method for producing an aluminum support for lithographic printing plates, comprising subjecting an aluminum plate in sequence to (1) a surface roughening treatment, (2) a heat treatment, (3) a treatment of dissolving from 0.01 to 5 g/m2 of said aluminum plate, and then (4) an anodization treatment; a method for producing an aluminum support for lithographic printing plates, comprising subjecting an aluminum plate to an electrochemical surface roughening treatment both before and after an electrolytic treatment in an aqueous neutral salt solution using the aluminum plate as a cathode.

Abstract: Methods to at least partially reduce a niobium oxide are described wherein the process includes heat treating the niobium oxide in the presence of a getter material and in an atmosphere which permits the transfer of oxygen atoms from the niobium oxide to the getter material, and for a sufficient time and at a sufficient temperature to form an oxygen reduced niobium oxide. Niobium oxides and/or suboxides are also described as well as capacitors containing anodes made from the niobium oxides and suboxides.

Abstract: Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the barrier layer. The method continues by performing in situ surface treatment of the metal-seed layer to form a passivation layer on the metal-seed layer.

Abstract: A method for creating a material library of surface areas having different properties in which a substrate is coated. The substrate is subjected to a combined pretreatment procedure.

Abstract: A method of anodizing an aluminum substrate comprising heating the substrate to a first temperature of 200° C. to about 380° C.; suspending the substrate into a first electrolyte and applying a first anodizing current to the first electrolyte; rinsing the substrate; heating the substrate to a second temperature of 200° C. to about 380° C.; and suspending the substrate into a second electrolyte and applying a second anodizing current to the second electrolyte, wherein the first electrolyte and second electrolyte each comprise an aqueous solution of at least one salt of alpha-hydroxy acid.

Abstract: A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating.

Abstract: A method of anodizing an aluminum substrate comprising heating the substrate to a first temperature of 200° C. to about 380° C.; suspending the substrate into a first electrolyte and applying a first anodizing current to the first electrolyte; rinsing the substrate; heating the substrate to a second temperature of 200° C. to about 380° C.; and suspending the substrate into a second electrolyte and applying a second anodizing current to the second electrolyte, wherein the first electrolyte and second electrolyte each comprise an aqueous solution of at least one salt of alpha-hydroxy acid.

Abstract: A method is disclosed for speeding workpiece thoughput in low pressure, high temperature semiconductor processing reactor. The method includes loading a workpiece into a chamber at atmospheric pressure, bringing the chamber down to an intermediate pressure, and heating the wafer while under the intermediate pressure. The chamber is then pumped down to the operating pressure. The preferred embodiments involve single wafer plasma ashers, where a wafer is loaded onto lift pins at a position above a wafer chuck, the pressure is rapidly pumped down to about 40 Torr by rapidly opening and closing an isolation valve, and the wafer is simultaneously lowered to the heated chuck. Alternatively, the wafer can be pre-processed to remove an implanted photoresist crust at a first temperature and the chamber then backfilled to about 40 Torr for further heating to close to the chuck temperature. At 40 Torr, the heat transfer from the chuck to the wafer is relatively fast, but still slow enough to avoid thermal shock.

Abstract: A process for manufacturing a composite membrane for separation of hydrogen gas using palladium, which employs the step of electroplating under vacuum an alloy of a palladium compound and a transition metal.

Abstract: Magnetic disk substrates are produced by subjecting glass substrates to at least steps of degreasing, etching, sensitization with tin chloride, activation and sensitivity-enhancing treatment in that order, then plating the pretreated substrates with a nickel/phosphorus film, and thereafter polishing the plated substrates. In the process, the substrates being processed are washed with hot pure water at a temperature of not lower than 50° C. for a period of from 20 to 90 seconds, after the sensitization step but before the activation step, and heated at a temperature of not lower than 70° C. for a period of from 5 to 100 minutes, after the sensitization step but before the nickel/phosphorus-plating step.

Abstract: There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can reinforce the thin portion of the seed layer and can embed copper completely into the depth of the fine recesses.

Abstract: A heated platen or chuck is employed in connection with a wet chemistry process cell, such as a plating cell for plating a flat substrate. A flow of electrolyte or other wet process solution is introduced into the cell across the surface of the substrate which is mounted on a the chuck or holder. A cathode ring may be disposed to make electrical contact with the substrate. The cathode ring can include a thin metal thieving ring. A fluid-powered rotary blade or wiper may be employed to draw bubbles or other impurities from the substrate, and a megasonic transducer can apply megasonic acoustic energy to the solution. The cell can be used for electroless or galvanic plating. A heater in the chuck heats the substrate to a temperature significantly above that of the electrolyte. Heating the substrate during plating improves the grain structure of the plated metal.

Abstract: According to one aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a substrate holder, and a temperature control device. The substrate holder is configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank. The temperature control device provides selective control of temperature in various regions of the substrate during plating so as to control plating over the first face of the substrate.

Abstract: Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density J.sub.O, to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.

Abstract: A coated article comprising a stainless steel base having an etched surface and having on the etched surface a coated layer. The coating layer may comprise a fluororesin and can be provided: after sensitizing the stainless steel base through heating, treating with an acid, subjecting to etching, and subjecting to a solution treatment; after immersing in an aqueous acid solution or an aqueous ferric chloride solution to cause the base to be dissolved to such an extent that the gloss of the surface disappears; after uniformly abrading the surface of the base through buffing or blasting to the weight corresponding to a thickness of 1.0 .mu.m or more of the base, immersing in an aqueous acid solution or an aqueous ferric chloride solution to cause the base to be dissolved to such an extent that the gloss of the surface disappears, and subjecting to etching; or after subjecting to electrolytic etching at 15.degree. C. or less.

Abstract: A method for manufacturing a substrate useful as a color filter for LCD and having window-shaped coating films and a frame-shaped, functional coating film at the regions not occupied with the window-shaped coating films, which comprises the steps of:(a) forming a functional coating film on a transparent substrate having electrically conductive circuits on a surface thereof,(b) superposing a photomask having a predetermined pattern on the surface of the coating film formed in step (a), and exposing the thus masked coating film to light,(c) subjecting the intermediate product to developing to leave a frame-shaped coating film, and(d) subjecting the resulting substrate formed through steps (a) to (c) to electro-deposition to form electro-deposition coating films on the electrically conductive circuits, enables production of coating films of fine pattern with improved precision.

Abstract: A method for manufacturing a nickel alloy electroplated cold-rolled steel sheet excellent in press-formability and phosphating-treatability, which comprises the steps of: (a) cold-rolling a hot-rolled steel sheet at a reduction ratio of from 60 to 85% to prepare a cold-rolled steel sheet consisting essentially of: up to 0.06 wt. % carbon, up to 0.5 wt. % silicon, up to 2.5 wt. % manganese, up to 0.1 wt. % phosphorus, up to 0.025 wt. % sulfur, up to 0.10 wt. % soluble aluminum, up to 0.05 wt. % nitrogen, and the balance being iron and incidental impurities; then, (b) subjecting the cold-rolled steel sheet to a continuous annealing treatment which comprises heating the cold-rolled steel sheet to a recrystallization temperature and then slowly cooling same; then, (c) forming, on at least one surface of the annealed cold-rolled steel sheet, a nickel alloy electroplating layer having a plating weight of from 5 to 60 mg/m.sup.

Abstract: A method of preventing galling between first and second metallic surfaces which are disposed in contacting, substantially stationary relation, one to each other, includes coating at least one of the first and second metallic surfaces with a layer of hard chromium plating.

Abstract: A process for the manufacture of tinplates comprising electroplating a substrate in a fused-chloride tin plating bath at a temperature of about 150.degree. to 350.degree. C., a current density of about 100 to 500 A/dm.sup.2 in an atmosphere of a non-oxidizing gas. This process may be converted to a process for the manufacture of reflow type tinplates by only changing the bath temperature, and vice versa. For the manufacture of no-reflow type tinplates, the bath is kept at 150.degree. to 232.degree. C., while for the manufacture of reflow type tinplates, the bath is kept at 233.degree. to 350.degree. C. In these cases, the bath includes SnCl.sub.2 and at least one member selected from the group consisting of KCl, NaCl, LiCl and AlCl.sub.3, and may preferably be operated while flowing the bath at a flow rate of about 0.1 m/sec higher.

Abstract: A graphite path is formed along the surface of a diamond plate, preferably a CVD diamond plate, by means of a laser or ion-implantation induced conductivity. The path advantageously can be the surface of a sidewall of a via hole drilled by the laser through the plate or a path running along a side surface of the plate from top to bottom opposed major surfaces of the plate. The graphite path is metallized, as by electroplating or electroless plating. In this way, for example, an electrically conducting connection can be made between a metallized backplane located on the bottom surface of the plate and a wire-bonding pad located on the top surface of the plate.