Abstract: A method of depositing aluminum onto a substrate is disclosed. In this method, the substrate is disposed as cathode in an electrochemical cell with an anode and a liquid electrodeposition composition comprising an ionic liquid and a source of aluminum, and aluminum is electroplated onto the substrate. Residual water content in the electroplating bath is controlled by exposure to light in the presence of a photo-oxidation catalyst to decompose the water or species associated with water.

Abstract: An object of the present invention is to provide an aluminum foil that can make a positive electrode current collector thinner for size reduction and higher energy density of electrical storage devices, be produced easily and has a low surface resistance. An aluminum foil of the present invention as a means for achieving the object is characterized in that carbonaceous particles are dispersed and supported therein. The aluminum foil with carbonaceous particles dispersed and supported therein of the present invention can be produced by electrolysis.

Abstract: An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25° C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5+n to 4.2+n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol).

Abstract: A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment.

Abstract: An object of the present invention is to provide a method for producing a high-ductility, high-purity aluminum foil at a high film formation rate by electrolysis using a plating solution having a low chlorine concentration. A method for producing an aluminum foil of the present invention as a means for achieving the object is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution at least containing (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by a general formula: R1R2R3R4N.X (wherein R1 to R4 independently represent an alkyl group and X represents a counteranion for the quaternary ammonium cation), and then the film is removed from the substrate.

Abstract: An object of the present invention is to provide an extended-life plating solution that allows an aluminum electroplating process to be performed stably for a long period of time, and also a method for forming an aluminum plating film using the same. An aluminum electroplating solution according to the present invention is characterized by comprising 1.5 to 4.0 mol of an aluminum halide per 10.0 mol of dimethyl sulfone and, relative to the aluminum halide, ammonium chloride in a molar ratio of 1/15 to 1/4 or a tetraalkylammonium chloride in a molar ratio of 1/15 to 1/2. The plating solution has improved electrical conductivity and thus has a further advantage in that it allows the formation of a uniform aluminum plating film on a substrate to be plated even when the plating process is performed by a barrel method.

Abstract: To provide a barrel electroplating method which is less prone to bare spots and adhesion failure such as blisters and peeling, and which makes it possible to obtain uniform plated coatings free from burnt deposits and poor brightness, irrespective of the amount of workpieces. The present invention provides a method for performing barrel electroplating by use of an aluminum or aluminum alloy plating bath, the method comprising rotating, swinging, or vibrating an anode (6) placed inside a barrel (4) receiving workpieces, and simultaneously rotating, swinging, or vibrating the barrel, with a voltage being applied between the anode and a cathode provided on an inner wall surface of the barrel.

Abstract: A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment.

Abstract: Disclosed herein is an electric Al or Al alloy plating bath which comprises (A) an aluminum halide; (B) one kind of compound or at least two kinds of compounds selected from the group consisting of N-alkylpyridinium halides, N-alkylimidazolium halides, N,N?-alkylimidazolium halides, N-alkyl-pyrazolium halides, N,N?-alkylpyrazolium halides, N-alkylpyrrolidinium halides and N,N-alkyl-pyrrolidinium halides; and (C) a high boiling point aromatic hydrocarbon solvent, wherein the molar ratio of the aluminum halide (A) to the compound (B) ranges from 1:1 to 3:1 and the flash point of the plating bath is not less than 50° C. The plating bath never involves any risk of causing an explosion, can be handled industrially with safety and can provide a smooth and fine Al of Al alloy plated film.

Abstract: An object of the present invention is to provide an extended-life plating solution that allows an aluminum electroplating process to be performed stably for a long period of time, and also a method for forming an aluminum plating film using the same. An aluminum electroplating solution according to the present invention as a means for achieving the object is characterized by comprising 1.5 to 4.0 mol of an aluminum halide per 10.0 mol of dimethyl sulfone and, relative to the aluminum halide, ammonium chloride in a molar ratio of 1/15 to 1/4 or a tetraalkylammonium chloride in a molar ratio of 1/15 to 1/2. The plating solution has improved electrical conductivity and thus has a further advantage in that it allows the formation of a uniform aluminum plating film on a substrate to be plated even when the plating process is performed by a barrel method.

Abstract: A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of vias is achieved by applying a static charge on the wafer before it is immersed in the bath, in order to enhance bath accelerators used to control the plating rate. The static charge is applied to the wafer using a supplemental electrode disposed outside the plating bath.

Abstract: Electroplating electrolyte compositions including CA•(nAl(C3H7)3(2?n)AlR3) where n is 0 and less than or equal to 2; C is Li, Na, K, Rb, Cs, NR?4, or mixtures thereof wherein R? is H, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof; A is H, F, Cl, Br, or mixtures thereof; R is H, halogen, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof; and an aromatic hydrocarbon, aliphatic hydrocarbon, or mixtures thereof are described. Aluminum and magnesium/aluminum electroplating compositions including C•(nAl(C3H7)4(1?n)AlR4) where n is 0 and less than or equal to 1, where C is a cation such as, li, Na, K, Rb, Cs, or mixtures thereof; R is H or an alkyl such as, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof are also described. The aluminum and magnesium/aluminum electroplating compositions formulation can include a solvent such as, an aromatic hydrocarbon, aliphatic hydrocarbon, or mixtures thereof.

Abstract: The invention relates to a method for producing electrolyte solutions consisting of trialkylaluminium AlR3, M1AlR4, M2AlR4 and an aromatic hydrocarbon. According to the invention, a mixture of M1OR and M2OR is reacted with trialkylaluminium AlR3 at temperatures below 25° C. in an aromatic hydrocarbon. M1AlR4/M2AlR4 is isolated from the obtained mixture and a ready-for-use electrolyte for the electrochemical deposition of aluminum-magnesium alloys is obtained by the addition of aromatic hydrocarbon.

Abstract: A process for producing a tetrahydrocarbylaluminate is provided. This process comprises contacting sodium potassium alloy and a trihydrocarbylaluminum compound such that a tetrahydrocarbylaluminate is formed as a mixture of its sodium salt and potassium salt.

Abstract: Electroplating electrolyte compositions including CA.(nAl(C3H7)3(2-n)AlR3) where n is 0 and less than or equal to 2; C is Li, Na, K, Rb, Cs, NR′4, or mixtures thereof wherein R′ is H, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof; A is H, F, Cl, Br, or mixtures thereof; R is H, halogen, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof; and an aromatic hydrocarbon, aliphatic hydrocarbon, or mixtures thereof are described. Aluminum and magnesium/aluminum electroplating compositions including C.(nAl(C3H7)4(1−n)AlR4) where n is 0 and less than or equal to 1, where C is a cation such as, li, Na, K, Rb, Cs, or mixtures thereof; R is H or an alkyl such as, CH3, C2H5, C3H7, C4H9, C5H11, C6H13, C7H15, C8H17, or mixtures thereof are also described. The aluminum and magnesium/aluminum electroplating compositions formulation can include a solvent such as, an aromatic hydrocarbon, aliphatic hydrocarbon, or mixtures thereof.

Abstract: The present invention relates to a process for preparing alkali metal tetraalkylaluminates, in particular potassium tetraethylaluminate, and also to the use of such an aluminate complex in aluminum deposition by electroplating-electrolysis.

Abstract: Organoaluminum electrolytes and methods for the coating of electrically conductive materials with aluminum or aluminum-magnesium alloys, essentially and preferably consisting of Na[Et3Al—H—AlEt3] for aluminum coating, or of either K[AlEt4] or Na[Et3Al—H—AlEt3] and Na[AlEt4] and trialkylaluminum for alloy coating using solutions of these electrolytes in liquid aromatic hydrocarbons or mixtures thereof with aliphatic mono- or polybasic ethers, such as dimethoxyethane, and using soluble anodes of aluminum or of aluminum and magnesium, or of aluminum-magnesium alloy.

Abstract: An object is to provide a metallic-conduit-armored type linear member in which a linear member and the like contained in a metallic conduit do not become damaged and a defect in the metallic conduit can be repaired, a metallic conduit for armoring the linear member, and a method and a system for manufacturing the metallic-conduit-armored type linear member. The method comprises a basic process (I) in which a metallic tape (1) is formed into a tubular member, a seam of the tubular member is joined to complete a sealed metallic conduit, and a metallic-conduit-armored type linear member (12) is formed by loading a linear member (5) inside the metallic conduit, and a metallic coating process (II) in which a metallic coating layer is formed on an outer surface of the sealed metallic conduit by performing plating by using a room-temperature molten-salt electrolytic bath subsequent to the basic process (I).

Abstract: The invention is directed to an electrolyte for the electrolytic high-speed deposition of aluminum on continuous products, containing an organometallic aluminum complex of formula (I) MF.2Al(C3H7)3.nAlR3  (I), wherein M=K, Rb, Cs, R=a C3 alkyl group or a mixture of a C3 and a C1-C2 alkyl group, n=from 0.1 to 1, in an aromatic or aliphatic hydrocarbon as solvent.

Abstract: A novel cathode of low hydrogen overvoltage is provided which is useful for electrolysis of water and electrolysis of an aqueous alkali metal chloride such as sodium chloride. A process for producing the cathode is also provided. The low hydrogen overvoltage cathode comprises an electroconductive base material; and a coating layer containing at least one organic compound selected from the group consisting of amino acids, monocarboxylic acids, dicarboxylic acids, monoamines, diamines, triamines, and tetramines, and derivatives thereof at a content of from 0.5% to 18% by weight in terms of carbon, and a metal component selected from the group consisting of nickel, nickel-iron, nickel-cobalt, and nickel-indium at an indium content ranging from 1% to 90% by weight.

Abstract: The invention relates to organoaluminum electrotyles for the electrolytic deposition of aluminum which are characterized in that they consist of KF . 2 AlEt.sub.3 (A), KF . 2 AlMe.sub.3 (B) and MF . 2 Al(iBu).sub.3 (C), wherein M=sodium or potassium or a mixture of both, in a molar ratio of A:B:C of from 2:1:1 to 7:1:1. The organoaluminum electrolytes are dissolved in from 2 to 4.5 moles, based on the amount of MF employed, of an aromatic hydrocarbon which is liquid at 0.degree. C. The invention further relates to a process for the electrolytic deposition of aluminum on electrically conductive materials by using said electrolytes.

Abstract: The present invention relates to an electrochemical cell and a process for converting anhydrous hydrogen halide to halogen gas using a membrane-electrode assembly (MEA) or a separate membrane and electrode arrangement, such as gas diffusion electrodes with a membrane.