Abstract: The invention is directed to the use of copper as via and interconnect structures for an integrated circuit. The process in accordance with a preferred embodiment produces an interconnect layer of continuous copper with superior adhesion while requiring only a minimum number of steps for its production. This process addresses the current need in semiconductor manufacturing for reliable and performance-oriented vias and interconnect structures, while not being susceptible to many of the problems which plague the use of aluminum for similar structures. Fabrication of an integrated circuit in accordance with a preferred embodiment of the invention begins with the formation of semiconductor devices on a silicon wafer. Next, an intermetallic dielectric layer (IDL) is formed by materials such as silicon dioxide (SiO2), polymide, or silicon nitride over the devices. This step is followed by the laying of a diffusion barrier layer on the IDL surface.

Abstract: A method for pickling products in a metal alloy containing iron, and products in titanium and alloys thereof, in the absence of nitric acid as an oxidizing agent, and for the recovery of the exhausted solutions, characterized in that the recovery of the exhausted solutions deriving from pickling comprises the following steps: sending of the pickling solution, both as catholyte and as anolyte, in an electro-chemical cell optionally of the membrane type to separate the Fe2+ (or Ti2+) ions to be disposed of, from the Fe3+ (or of the Ti3+ and Ti4+) ions to be recovered, obtained by reduction at the cathode of the Fe3+ ions which are in the catholyte to Fe2+ (or of the Ti3+ and Ti4+ ions to Ti2+) and of oxidation at the anode Fe2+ (or Ti2+) ions which are in the anolyte to Fe3+ (to Ti3+ and Ti4+); treating the catholytic solution coming out of the cell and enriched in Fe2+ (or Ti2+) ions as to allow the separation in two phases, a

Abstract: The invention relates to a process for the demetallization of highly acidic baths based on phosphoric acid and sulphuric acid, and also to a process for the electropolishing of stainless-steel surfaces, in which a regeneration of, in particular, spent electrolyte compositions for electropolishing can be achieved by separate electrolytic reduction of Fe(III) to Fe(II) and subsequent removal of precipitates.