Abstract: A pore forming method in which a pore is formed in such a way that a first voltage is applied between electrodes that are disposed with a film in an electrolytic solution therebetween; a second voltage, which is lower than the first voltage, is applied between the electrodes; a current that flows between the electrodes owing to the application of the second voltage is measured; it is judged whether a value of a current is equal to or larger than a predefined threshold; and if the value of the current is smaller than the threshold, the above sequence is repeated until a pore is formed. In this case, the second voltage is a voltage that makes the value (IPF) of the current flowing through the film practically 0. With the use of the above method, a nanopore is formed in the film simply, easily, and accurately.

Abstract: A negative electrode for a lithium secondary battery includes: a negative active material disposed on a current collector; a negative active material layer including a first binder and a conductive agent; and a protective layer disposed on the negative active material layer, wherein the protective layer is in direct contact with the current collector and includes a nonaqueous or aqueous second binder and an inorganic material, wherein, in the protective layer including the aqueous second binder and the inorganic material, the amount of the inorganic material may be about 65 parts by weight or greater, based on 100 parts by weight of the protective layer, and wherein the protective layer including the nonaqueous second binder and the inorganic material, the amount of the inorganic material may be in a range of about 5 parts to about 25 parts by weight, based on 100 parts by weight of the protective layer.

Abstract: The invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides that enables accurate and controllable formation of pore within those thin layer(s) with sub-nanometer precision.

Abstract: Disclosed is a method for the electrochemical machining of a workpiece, in which at least one electrode is situated adjacent to a surface to be machined and current pulses are generated in pulsed operation to ablate material from the workpiece. Before and/or at the beginning and/or during the electrochemical ablation, data of the current pulses are registered and analyzed to identify a starting phase or a transient phase comparable to a starting phase and/or to regulate the spacing of the electrode to the surface to be machined and/or the current flow during a starting phase or a transient phase comparable to a starting phase.

Abstract: A method is provided for fabricating a nanopore in a membrane. The method includes: applying an electric potential across the membrane, where value of the electric potential is selected to induce an electric field which causes a leakage current across the membrane; monitoring current flow across the membrane while the electric potential is being applied; detecting an abrupt increase in the leakage current across the membrane; and removing the electric potential across the membrane in response to detecting the abrupt increase in the leakage current.

Abstract: A multi-step electrochemical stripping method includes providing a determined electrode potential between a reference electrode and an article submerged in an electrolyte; recording a current peak value of a current signal flowing through the article; removing the voltage provided to the article when the current signal falls to a determined first current value after passing the current peak value; refreshing the electrolyte; providing the determined electrode potential again for a determined time and determining whether the current signal is less than a determined second current value during the determined time, if not, goes back to the refreshing step; and if yes, the process ends.

Abstract: In the BB transfer, or so called electrochemical delamination process, a transfer film is firstly spray-coated on a stack formed by two graphene sandwiching a metal (Cu or Cr) foil as a protection layer. Then, direct current (dc) voltage is applied to the first stack as a cathode and an anode (from be a platinum wire, a carbon rod, or others) in an electrolyte aqueous solution. With application of the electrolysis potential, hydrogen bubbles appear at the graphene/metal foil interfaces, while oxygen bubble appear at the anode due to the reduction of water. These H2 bubbles provide a gentle but persistent force to detach the graphene film from the copper foil at its edges, and the process is aided by the permeation of the electrolyte solution into the interlayers as the edges delaminate.

Abstract: A method for manufacturing an all solid-state lithium-ion rechargeable battery includes forming a first active material layer on a base, forming a solid electrolyte layer connected to the first active material layer, forming a second active material layer connected to the solid electrolyte layer, and repairing a short-circuit defect produced between the first active material layer and the second active material layer by supplying a repair current between the first active material layer and the second active material layer.

Abstract: Embodiments of the present invention include systems and methods for low-rate electrochemical (wet) etch that use a net cathodic current or potential. In particular, some embodiments achieve controlled etch rates of less than 0.1 nm/s by applying a small net cathodic current to a substrate as the substrate is submerged in an aqueous electrolyte. Depending on the embodiment, the aqueous electrolyte utilized may comprise the same type of cations as the material being etched from the substrate. Some embodiments are useful in etching thin film metals and alloys and fabrication of magnetic head transducer wafers.

Abstract: A production apparatus is provided for producing a near field optical head that includes, during its production process, a substrate, at least one protuberance extending from a surface of the substrate, an electrically conductive shielding film covering the protuberance and the substrate, and a parent film, as a mother material for an air bearing, covering the shielding film. The production apparatus has an etchant for etching the parent film and a container for storing the etchant and for containing the substrate, the shielding film, and the parent film so that the substrate, the shielding film, and the parent film are immersed in the etchant. At least one electrode is fixedly mounted in the container so as to be immersed in the etchant. A measuring device measures an electrical characteristic between the electrode and the shielding film.

Abstract: Substantially anhydrous electropolishing electrolyte solutions. The substantially anhydrous electropolishing electrolyte solutions described herein do not use water as a solvent; instead, such electropolishing electrolyte solutions use anhydrous alcohols and/or glycols as a solvent. For example, an electropolishing electrolyte solution, as described herein, may include an alcohol, at least one mineral acid, and phosphorous pentoxide (“P2O5”). Methods of electropolishing metal articles using such electropolishing electrolyte solutions are disclosed herein as well.

Abstract: Embodiments of the present invention include systems and methods for low-rate electrochemical (wet) etch that use a net cathodic current or potential. In particular, some embodiments achieve controlled etch rates of less than 0.1 nm/s by applying a small net cathodic current to a substrate as the substrate is submerged in an aqueous electrolyte. Depending on the embodiment, the aqueous electrolyte utilized may comprise the same type of cations as the material being etched from the substrate. Some embodiments are useful in etching thin film metals and alloys and fabrication of magnetic head transducer wafers.

Abstract: A cathode containing a metal substrate that possesses a micro-roughened surface imparted by spark anodization is provided. The surface is formed by contacting the substrate with an electrolytic solution and applying a voltage to form a dielectric sub-oxide layer. The voltage is raised to a sufficiently high level to initiate “sparking” at the surface of the substrate, which is believed to create high local surface temperatures sufficient to etch away the substrate. This results in the formation of a “micro-roughened” surface having a plurality elevated regions. These elevated regions can increase the effective surface area and thus allow for the formation of capacitors with increased cathode capacitance for a given size and/or capacitors with a reduced size for a given capacitance. The elevated regions may also exhibit excellent adhesion to additional electrochemically-active materials and provide enhanced stability in certain liquid electrolytes.

Abstract: An electrochemical machining apparatus and method for machining a workpiece (60). The apparatus provides a pulse of electric power, which is conducted from the workpiece (60), to an electrolyte (68) flowing through a gap (62), and then to an electrode (58). Material is eroded from the workpiece (60) when the pulse of electric power is applied, thus machining the workpiece (60). The apparatus includes a power supply (12) to supply the electric power and a switching portion (40) for producing the pulse by switching the electric power ON and OFF. The switching portion (40) is capable of producing a pulse of electric power with a pulse duration of about 2 microseconds and a current of at least about 2800 amperes.

Abstract: A method and system for pad conditioning in an electrochemical mechanical planarization (eCMP) tool is disclosed. A polishing pad having a pad electrode is placed onto a platen of the eCMP tool. A conditioning disk, having a second electrode is placed on the polishing pad, such that the pad electrode and conditioning disk form an electrode pair. An electric potential is established between the conditioning disk and the pad electrode. This causes debris from the polishing pad to become ionized, and attracted to the conditioning disk. The conditioning disk is then removed from the eCMP tool, allowing the eCMP tool to resume operation on normal semiconductor wafers.

Abstract: An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the medical implant to be electropolished. One of the advantages of the apparatus and method is that marks generated around the electrical contact between the anode and the medical implant are minimized. In addition, the medical implant is polished more evenly than conventional electropolishing systems.

Abstract: An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the medical implant to be electropolished. One of the advantages of the apparatus and method is that marks generated around the electrical contact between the anode and the medical implant are minimized. In addition, the medical implant is polished more evenly than conventional electropolishing systems.

Abstract: Components which are subject to operating loads can often be passed for refurbishment by means of an acid treatment. The time for which the components remain in the acid has hitherto been determined empirically, which means that individual loads are not taken into account. The process according to the invention for the surface treatment of a component proposes that at least repeatedly a measurement voltage be applied to the component, resulting in the flow of a current, the time profile of which represents the state of the surface treatment and is used to decide upon when to terminate or interrupt the acid treatment.

Abstract: Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response to the detected breakthrough. In another embodiment, the target endpoint is adjusted relative to an amount of underlying layer exposed through the conductive layer.

Abstract: A method for restoration of a metallic coating (2) of a component (1), in which the coating includes a consumed portion (3, 4), includes a. identifying the consumed portion (3, 4) as a function of the location on the component (1); b. removing at least the consumed portion (3, 4) as a function of the location as identified in step a.; c. applying new metallic coating (7) in a manner at least compensating for the coating removed in step b.; and d. optionally verifying the quality of the restored metallic coating (2).

Abstract: Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is determined for each bias when the amount of charge removed for a bias substantially equals a respective target charge calculated for the bias.

Abstract: Methods and apparatuses for detecting characteristics of a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from the first and second spaced apart electrodes, contacting the microelectronic substrate with a polishing surface of a polishing medium, removing conductive material from the microelectronic substrate by moving the substrate and/or the electrodes relative to each other while passing a variable electrical signal through the electrodes and the substrate, and detecting a change in the variable electrical signal or a supplemental electrical signal passing through the microelectronic substrate. The rate at which material is removed from the microelectronic substrate can be changed based at least in part on the change in the electrical signal.

Abstract: A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.

Abstract: The invention provides a method of determining at least one electrochemical characteristic of a chemical-mechanical or electrochemical-mechanical polishing system comprising application of a potential between a polishing substrate and an electrode to generate a current, and determining the at least one electrochemical characteristic by analysis of the current as a function of time.

Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.

Abstract: An electrochemical machining apparatus and method for machining a workpiece. The apparatus provides a pulse of electric power, which is conducted from the workpiece, to an electrolyte flowing through a gap, and then to an electrode. Material is eroded from the workpiece when the pulse of electric power is applied, thus machining the workpiece. The apparatus includes a power supply to supply the electric power and a switching portion for producing the pulse by switching the electric power ON and OFF. The switching portion is capable of producing a pulse of electric power with a pulse duration of about 2 microseconds and a current of at least about 2800 amperes.

Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

Abstract: A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer insulation film, and a plating method and plating apparatus able to deposit a flat copper film. The polishing method comprises the steps of measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region thereof, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, performing electrolytic polishing by electrolytic elution or anodic oxidation and chelation and removal of a chelate film in the same region preferentially from projecting portions of the film until removing the target amount of film obtained from the thickness equivalent data, and repeating steps of moving the cathode member to another region to flattening the regions over the entire surface.

Abstract: An electrolytic polishing apparatus for electrolytic-polishing a conductive film subject to formed on a substrate including a resistance measuring unit for measuring the resistance of the film. The electrolytic polishing apparatus may also include a termination point detecting portion for detecting a termination point of polishing by reading a variation of the resistance value measured by the resistance measuring unit, or a polishing control portion for terminating electrolytic polishing on the basis of the termination point of polishing detected by the termination point detecting portion.

Abstract: A method for determining an end point of a planarization process for removing metal from a surface of a substrate submerged in an electrolytic solution or slurry. A first electrode is provided which is operable to contact the surface of the substrate, such as a working electrode of a potentiostat system. A second electrode is provided which is operable to contact the electrolytic solution, such as a reference electrode of the potentiostat system. The first electrode is contacted to the surface of the substrate and an electrochemical property is measured, such as the electrochemical potential between the first and second electrodes, where the electrochemical property is indicative of an electrochemical characteristic of the substrate-slurry system. The planarization process is preferably stopped when a substantial change in the electrochemical potential of the system is measured.

Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

Abstract: Various embodiments of a planarization device and methods of using the same are provided. In one aspect, a device for planarizing a surface of a semiconductor workpiece is provided that includes a table for holding a quantity of an electrically conducting solution thereon. A member is included for holding the semiconductor workpiece such that the surface is in contact with the solution and operates as a working electrode. The member has a first conductor for establishing electrical connection with the semiconductor workpiece. A counter electrode is provided for making electrical connection with the solution and a reference electrode is provided for making electrical connection with the solution with a known electrode potential. A power source is operable to control the electric potential between the working electrode and the counter electrode. Slurry consumption may be dramatically reduced and static etch rate due to aborts may be virtually eliminated.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).

Abstract: The invention relates to a method for electrochemically processing a workpiece (61) in which a pulsating or alternating electrical voltage is applied between the workpiece and a workpiece electrode (62) which are arranged at a distance from one another in an electrolyte. A distance range is defined by precisely dimensioning the mean value of the applied pulsating voltage and of the voltage amplitudes measured with regard to this mean value. A double layer charge reversal on the workpiece which is sufficient for bringing about the desired electrochemical reaction results within said distance range, whereas workpiece areas situated at further distances do not experience a sufficient double layer charge reversal. The dimensions of the space between the workpiece and the workpiece electrode are proportioned in such a way that only points of the area of the workpiece to be processed lie within said distance range.

Abstract: An electrochemical machining apparatus and method for machining a workpiece. The apparatus provides a pulse of electric power, which is conducted from the workpiece, to an electrolyte flowing through a gap, and then to an electrode. Material is eroded from the workpiece when the pulse of electric power is applied, thus machining the workpiece. The apparatus includes a power supply to supply the electric power and a switching portion for producing the pulse by switching the electric power ON and OFF. The switching portion is capable of producing a pulse of electric power with a pulse duration of about 2 microseconds and a current of at least about 2800 amperes.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).

Abstract: A method for on-line removal of cathode depositions during electrochemical process. The process control means (30) are arranged to alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2 to the work piece (2) and the cathode (3). The process control means comprise an arrangement to determine the amount of cathode depositions on-line based on the operational parameter. Only in case the operational parameter exceeds the allowable level, the process control means (30) alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2. In this case the cathode wear is minimized.

Abstract: A method of manufacturing electrode foil for aluminum electrolytic capacitors and an AC power supply unit used therewith. An etching is performed on an aluminum foil immersed in a electrolytic solution by applying an AC current to a pair of electrodes in the electrolytic solution. A waveform of the AC current is a deformed sine wave including a period of time (a) when an electric current rises from zero to a peak value, and another period of time (b) when the electric current falls from the peak value to zero. With the periods of time (a) and (b) made different from each other, the surface area of the aluminum foil is expanded by the etching efficiently and an enhancement of electric capacity of the electrode foil is obtained.

Abstract: Disclosed is an electrochemical machining process for fabrication of cylindrical microprobes, which is effected by the tool acting as the cathode against the workpiece acting as the anode, taking advantage of a chemical reaction occurring between the workpiece and the tool, both being beneath the surface of an electrolyte, under such a controlled electric field that the workpiece can be machined to have a uniform diameter throughout its entire length. The electrochemical machining can be carried out with greater precision because a precise machining process because the volume to be additionally processed owing to the surface tension generated when the workpiece is dipped into the electrolyte is taken into consideration.

Abstract: A method of shaping a tool comprises the steps of defining a shape of an article to be formed with the tool as a plurality of first elements; defining an initial shape of the tool as a plurality of second elements; determining an electric potential of each of the first and second elements; determining an equipotential line between the article and the initial shape of the tool based on the electric potential of the first and second elements; and forming the tool to have a shape coincident with the equipotential line.

Abstract: An apparatus for electrochemically machining of a workpiece by means of an electrode has an actuator for setting a gap between the electrode and the workpiece. The apparatus further has a channel for flushing the gap with an electrolyte and a container for containing the electrolyte. Power cords and are provided for feeding an electric current I supplied by a power supply through the electrolyte in the gap. Near the gap an antenna is provided to pick up electromagnetic waves radiated from the gap. The antenna is connected to a band-pass filter which passes signals in a frequency band of 40 to 100 MHz to a level detector. The level detector compares the amplitude of the filtered signal with a threshold value and supplies a stop signal to the control unit when the amplitude exceeds the threshold value. The control unit is programmed to open a switch in the power supply in response to the stop signal.

Abstract: A method of making a needle electrode is such that a neck portion is formed in a thin wire made of a tungsten single crystal and the thin wire is cut at the neck portion by feeding an electric current in electrolyte.