Abstract: A chemical etch is performed on a sheet of material. An electrochemical etch is performed on the sheet of material after the chemical etch is performed on the sheet of material. A capacitor is fabricated such that an electrode included in the capacitor includes material from the sheet of material after the electrochemical etch was performed on the sheet of material. In some instances, the chemical etch included at least partially immersing the sheet of material in an etch bath that includes molybdenum. Additionally or alternately, the chemical etch can be performed for a period of time less than 60 s.

Abstract: A method for electropolishing a metal substrate comprises submerging at least part of the metal substrate in an electrolyte solution and applying electrical current to the metal substrate to form an electrical circuit where the metal substrate is the anode. The electrolyte solution comprises phosphoric acid and at least one acrylic monomer and/or acrylic polymer.

Abstract: The invention relates to a weld cleaning fluid, and method of cleaning weld or discolouration especially on stainless steel. Stainless steel welds, such as those done by TIG welding, require cleaning to remove the resulting surface discolouration and also to passivate the steel. This is often done using an electro-cleaning apparatus with the assistance of electrolyte cleaning fluids. A new cleaning fluid has been developed that has a generally neutral pH, instead of the highly acidic nature of previously used fluids, which avoids environmental and safety issues. The cleaning fluid composition preferably has potassium or sodium orthophosphate salts as the main active ingredient, or similar such salts, and has a pH of around 7. It may also include a sequestering or chelating agent such as a sodium and/or potassium salt of EDTA, and colouring and fragrance.

Abstract: Substantially anhydrous electropolishing electrolyte solutions. The substantially anhydrous electropolishing electrolyte solutions described herein do not use water as a solvent; instead, such electropolishing electrolyte solutions use anhydrous alcohols and/or glycols as a solvent. For example, an electropolishing electrolyte solution, as described herein, may include an alcohol, at least one mineral acid, and phosphorous pentoxide (“P2O5”). Methods of electropolishing metal articles using such electropolishing electrolyte solutions are disclosed herein as well.

Abstract: In an electropolishing method passing large current, an electrolytic solution is given a viscosity by reacting an organic acid (a phosphoric acid solution or a mixed solution of phosphoric acid and sulfuric acid) with a silicon dioxide as a gelling agent, the electrolytic solution is continuously introduced to an electrolysis case and concurrently the first introduced electrolytic solution is discharged to progress the electropolishing. The electrolysis case has a cathode at a specific height from a lower open end of a frame in a specific size and depth, an introduction port on the cathode for introducing the electrolytic solution with specific viscosity, and a discharge port for discharging the solution from the frame. It is possible to shorten the distance of the cathode in the electrolysis case from the open end corresponding to the work-piece surface, and control the resistant of the electrolytic solution, so that the large current can be passed and the operation time can be reduced.

Abstract: Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.

Abstract: The present invention relates to a portable device for generating ozone in water, purifying the water and making it drinkable. The device comprises a housing; at least two electrodes, including an anode and a cathode extending from the housing into the water and each having semi-rough or rough surfaces in contact with the water. The device also comprises a power supply operatively connected to the electrodes for generating between them a difference of potential creating a current and the hydrolysis of the water creating ozone that purifies the water. The electrodes may have a plate or a rode and tube configuration with a plurality of holes with rough edges. The roughness of the surfaces and of the edges of the holes leads to a coalescence of tiny hydrogen bubbles into larger hydrogen bubbles. The hydrogen may be also removed by absorption in a conductive material and regenerated for reuse.

Abstract: A substantially anhydrous electropolishing electrolyte solution that includes at least one sulfate salt. The substantially anhydrous electropolishing electrolyte solutions described herein do not use water as a solvent; instead, such electropolishing electrolyte solutions use anhydrous alcohols and/or glycols as a solvent. For example, an electropolishing electrolyte solution, as described herein, may include an alcohol, at least one mineral acid, and at least one sulfate salt. The at least one sulfate salt can act as a source of sulfate ions to replenish sulfate ions consumed in the electropolishing process. Anhydrous sulfate salts can also act as water scavengers by reacting with water to form sulfate salt hydrates. Methods of electropolishing metal articles using such electropolishing electrolyte solutions are disclosed herein as well.

Abstract: Substantially anhydrous electropolishing electrolyte solutions. The substantially anhydrous electropolishing electrolyte solutions described herein do not use water as a solvent; instead, such electropolishing electrolyte solutions use anhydrous alcohols and/or glycols as a solvent. For example, an electropolishing electrolyte solution, as described herein, may include an alcohol, at least one mineral acid, and phosphorous pentoxide (“P2O5”). Methods of electropolishing metal articles using such electropolishing electrolyte solutions are disclosed herein as well.

Abstract: An implant and method for producing an implant, in particular an intraluminal endoprosthesis, with a body, wherein the body contains iron or an iron alloy, comprising the following steps: a) providing the implant body (1), b) applying a metallic coating comprising as main constituent at least one element of the group containing tantalum, niobium, zirconium, aluminum, magnesium, vanadium, molybdenum, hafnium, and wolfram onto at least a portion of the body surface, and c) plasmachemical treatment of the portion of the body surface provided with the coating in an aqueous solution for producing a plasmachemically generated layer (3, 5, 7) by means of applying a plasma-generating pulsating voltage to the body of the implant, wherein the pulsating voltage has sufficient energy that the metallic coating (3, 5, 7) is temporarily and sectionally ionized up to the underlying implant body (1) in such a manner that the generated layer has pores (5) which extend at least partially up to the implant body.

Abstract: A solution and method for electrolytically removing chromium carbide coatings from the surface of substrates are provided. The solution includes 20-200 g/L alkali, the alkali being soluble alkali metal hydroxides; 20-150 g/L accelerant, the accelerant being a complexant and can combine with chromium ion; and 0.5-10 g/L auxiliary agent, the auxiliary agent being soluble polyphosphates. The method for removing chromium carbide coating on the substrate mainly includes electrolysis using the substrate having the coating as the anode and using the solution as the electrolyte.

Abstract: An electrolyte for removing titanium-containing coatings from substrates is provided. The electrolyte includes alkali, accelerant, and inhibiter. The alkali is hydroxide. The accelerant is a complexant capable of complexing with titanium. The inhibiter is polyphosphate. A method for removing titanium-containing coatings from substrates is also described there.

Abstract: A method for altering a dimension of an element made of an amorphous metallic material is provided. The method includes providing an anode comprising the amorphous metallic material, wherein the amorphous metallic material comprises at least two primary constituents, providing a cathode disposed in a spaced-apart relationship with the anode, providing an electrolyte in contact with the anode and the cathode, and applying an electrical potential between the anode and the cathode.

Abstract: The present invention describes a cost-saving and environmentally conserving process for the electrochemical polishing of steel, in particular of low-alloy steels. The workpieces are rinsed after electropolishing in an arid phosphoric acid-sulfuric acid-bath in a first rinsing step with a phosphoric acid-containing solution, whereby a chemical attack on the freshly polished surfaces is avoided without the use of environmentally harmful and unhealthy inhibitors such as chromates. By recycling of the acids and the rinsing solution, these acids and solutions can be regenerated, whereby the process can be designed effluent-free.

Abstract: Compositions and methods suitable for the electrochemical mechanical planarization of a conductive material layer on a semiconductor workpiece. Compositions contain a phosphonic acid based electrolyte, a corrosion inhibitor, a chelating agent, a pH adjusting agent, and a solvent as the remainder.

Abstract: Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, two or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, one or more pH adjusting agents, and one or more electrically resistive additives.

Abstract: The invention is directed to an electropolishing solution for products or devices made from at least in part a cobalt-chromium alloy. The invention is particularly suitable for medical devices or intravascular stents made at least in part of cobalt-chromium. More particularly, the electropolishing process of the invention is particularly suited for use on implantable medical devices, such as stents, due to the biocompatibility of cobalt-chromium alloys. The invention is directed to an improved stent formed from a cobalt-chromium alloy, that possesses an ultrasmooth shiny surface. This invention is also directed to a method of electropolishing such a stent using an acidic electrolytic solution comprising a mixture of 6 parts of about 98% sulfuric acid (H2SO4), 1 part of about 37% hydrochloric acid (HCl) and 1 part by of about 85% concentrated phosphoric acid (H3PO4) to produce an exceptionally smooth surface.

Abstract: Deionisation and clarification process of the aqueous medium used in an electroerosion machine and product for this process, where the electroerosion machines are comprised of a purification circuit for this aqueous medium, which includes an ion exchange phase between some cationic and anionic resins with the aqueous dielectric medium, which has a conductivity of less than 40 ?S/cm, and to which a solution of oxalic acid and phosphoric acid in distilled/deionised water is added in the approximate proportion of oxalic acid between 0.18 and 0.035 moles and phosphoric acid between 1.28 and 2.5 moles per liter of solution.

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

Abstract: Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, two or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, one or more pH adjusting agents, and one or more electrically resistive additives.

Abstract: A method of producing electrodes for electrolytic capacitors by etching metal foil in a low pH etching electrolyte is disclosed. The low pH electrolyte is an aqueous solution, which comprises hydrochloric acid, glycerol, sodium perchlorate or perchloric acid, sodium persulfate and titanium (111) chloride. Anode foils etched according to the method of the invention maintain high capacitance gains, electrical porosity and strength. The electrical porosity of the etched foils is sufficiently high such that the overall Equivalent Series Resistance (ESR) is not increased in multilayer anodes configurations. Also described is a low pH electrolyte bath composition. Anode foils etched according to the present invention and electrolytic capacitors incorporating the etched anode foils are also disclosed.

Abstract: Electric conductivity is enhanced without causing coagulation or precipitation of polishing abrasive grains. In addition, good planarization is realized without inducing defects in a metallic film or a wiring which are to be polished.

Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

Abstract: A method is provided for the manufacture of an implant, in particular of a metallic implant, comprising the steps of roughening the surface of the implant by blasting with blasting particles and of treating the surface with a solvent which selectively dissolves the blasting particles.

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

Abstract: A process for forming a plurality of bumps on a wafer comprises forming a first UBM (under ball metallurgy) over an active surface of a wafer. A second UBM is formed over the first UBM. A part of the second UBM is removed to expose the first UBM. A plurality of solders are respectively formed to cover the second UBM and the first UBM not covered by the second UBM. The first UBM not covered by the second UBM and not covered by the solders is removed.

Abstract: An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH between about 3 and about 10 which is environmentally friendly and does not present hazardous operation concerns. The composition may further comprise one or more additives selected from a group consisting of benzotriazole, ammonium citrate, ethlylenediamine, tetraethylenepentamine, triethylenetetramine, diethylenetriamine, amino acids, ammonium oxalate, ammonia, ammonium succinate, and citric acid.

Abstract: Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, two or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, one or more pH adjusting agents, and one or more electrically resistive additives.

Abstract: The method according to the invention comprises a macrographic etching step followed by a “bleaching” step by electrolytic etching by means of a bath containing at least phosphoric acid and a weak acid. This method allows components made of superalloys to be easily and effectively inspected, including when they contain elements such as rhenium or ruthenium.

Abstract: A process for edge forming a slit and cut-to-length foil having a dielectric oxide film on its face comprising anodizing the foil in an aqueous oxalic acid electrolyte, further forming the foil in an aqueous citrate electrolyte, preferably dibasic ammonium citrate electrolyte, depolarizing the foil, and then forming the foil in an aqueous phosphate electrolyte, preferably an ammonium dihydrogen phosphate.

Abstract: A process for edge forming a slit and cut-to-length foil having a dielectric oxide film on its face comprising forming the foil in an aqueous citrate electrolyte, preferably an aqueous ammonium citrate electrolyte, depolarizing the foil, and forming the foil in an aqueous phosphate electrolyte, preferably an ammonium dihydrogen phosphate electrolyte. Using this formation process, a foil with excellent hydration resistance and capacitance is produced.

Abstract: A method of reducing cutting tool wear in a lubricated metal cutting operation has been developed. An electrical cutting cell is provided having an anodic conductive cutting tool and a cathodic conductive work-piece connected to a DC current supply; the lubricant contains platable wear reducing agents. The lubricant is located to bathe the contacting interface between the cutting tool and work-piece to constitute an electrolyte. Next, the electrical current flow through the contacting interface is controlled to be in the range of 25-500 milli-amps. Lastly, the cutting tool is moved into and along cutting contact with the work-piece while current flows there-between to electro-chemically deposit the wear reducing agents on at least the contacting interface to reduce cutting tool wear and improve ease of mass removal.

Abstract: A method and apparatus for cleaning conductive bodies using an electrolytic cleaning solution. An inverter power source is used to supply a high voltage, low current output for the electrolytic cleaning. The outside surfaces of a metallic body are cleaned by spraying the cleaning solution on to the body and passing a current through the cleaning solution on the conductive body, thereby causing the cleaning solution to electrolytically clean the body. The body is connected to the negative terminal of the power supply. The positive terminal of the power supply is connected to a spray nozzle and causes a current to pass through the spray to the cleaning solution on the body for the electroytic cleaning. Alternatively, a current can be induced in the cleaning solution on the body by placing a grid near the body and connecting the grid to the positive terminal, thereby generating an electric field.

Abstract: An aqueous electrochemical etchant for etching metals in the presence of one or more metals not to be etched, the etchant including glycerol in the concentration range of 1.30 to 1.70 M, a sulfate compound having a sulfate ion concentration in the range of 0 to 0.5 M, and a phosphate compound having a phosphate ion concentration in the range of 0.1 to 0.5 M.

Abstract: Methods for producing by electrochemical reduction a carbon-containing material with its surface modified by organic groups, in particular functionalized organic groups. Certain embodiments of the methods include contacting the carbon-containing material with an organic diazonium salt in solvent, optionally in the presence of an electrolyte and negatively polarizing the carbon-containing material relative to an anode also in contact with an electrolytic solution separate from said diazonium salt solution, wherein the electrochemical reduction is carried out on an organic diazonium salt in protic solvent in an acid medium. Carbon-containing materials with a surface modified by organic groups and the use of these modified materials, for example for producing composite materials or for fixing molecules of biological interest, are taught.

Abstract: An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.

Abstract: A process for removing or reducing the directionality or anisotropy of a surface and for making the surface specular on a substrate material consisting of aluminium or an aluminium alloy, by (a) chemically etching the substrate material, (b) subjecting the etched substrate material substrate material to electrochemical polishing by using a solution, and (c) subjecting the substrate material to additional chemical etching and electrochemical polishing directly after step (b), wherein the surface of the substrate material is not exposed to air between the etching and the electrochemical polishing.

Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

Abstract: Disclosed herewithin is an apparatus for fabricating a stent which involves processing a tubular member whereby no connection points to join the edges of a flat pattern are necessary. The process includes the steps of: a) preparing the surface of a tubular member, b) coating the outside surface of the tubular member with a photo-sensitive resist material, c) placing the tubular member in an apparatus designed to simultaneously rotate the tubular member while passing a specially configured photographic frame negative between a light source and the tubular member, d) exposing the tubular member to a photoresist developer, e) rinsing the excess developer and uncured resist from the exposed tubular member, f) sealing the inner lumen of the tubular member, and g) treating the tubular member with a chemical or electro-chemical process to remove uncovered metal. By modifying the photographic negative, this process can be employed to fabricate a virtually unlimited number of stent designs and configurations.

Abstract: The method according to the invention comprises a macrographic etching step followed by a “bleaching” step by electrolytic etching by means of a bath containing at least phosphoric acid and a weak acid. This method allows components made of superalloys to be easily and effectively inspected, including when they contain elements such as rhenium or ruthenium.

Abstract: It is an object of this invention to provide a process for manufacturing a lead frame by polishing a blank for a lead frame electrolytically and plating the electrolytically polished surface of the blank with a metal, which process enables the electrolytic polishing of the blank to be continued for a long time by employing a contactless electrolytic polishing apparatus, and can form an electrolytically polished surface which is sufficiently smooth to allow it to be plated with a very good metal coating.The contactless electrolytic polishing apparatus is employed for applying a direct current with ripples having a frequency of 40 to 120 Hz alternately to the anode and cathode in an electrolytic polishing tank filled with an electrolytic polishing solution, so that the time for which the blank positioned between both electrodes functions as the anode may be at least 3.3 times longer than that for which it functions as the cathode, and the blank is, then, plated with a metal by employing a customary method.

Abstract: Aluminum alloy articles are electrobrightened in an acidic solution containing phosphoric acid, water, and suspended mineral particles. The solution preferably also contains sulfuric acid. Aluminum alloy sheet electrobrightened in the solution has a less directional appearance when the suspended mineral particles are present.

Abstract: Disclosed herein are methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.

Abstract: A method of etching an aluminum foil for electrolytic capacitors, comprising the steps of electrolytically etching an aluminum foil for electrolytic capacitors that has a high cubic texture in an electrolyte containing a chloride to form pits, and enlarging the pits formed in the above step by etching, in which step of forming pits the current density is increased from 0 to a maximum value quickly and then is decreased gradually.

Abstract: The present invention relates to a method of etching aluminum foil for electrolytic capacitors that is improved in etching efficiency, wherein when the aluminum foil is etched by applying alternating current in an electrolytic solution containing chloride ions and the like, the alternating current contains, during the positive half period and the negative half period, two half waves having different waveforms, amplitudes, and applied times, and a rest period between the half waves with the amplitude being 0 or with microcurrent being applied on the positive side or the negative side at at most 1/15 of the maximum amplitude during a half period.