Moving Tool Electrode Patents (Class 205/686)
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Patent number: 11376681Abstract: A method of forming a curved-shaped processing hole in a workpiece by electromechanical machining includes a step of feeding an electrolytic solution through an inner channel of a processing electrode and jetting the electrolytic solution from an outlet opening of the inner channel disposed on a tip surface of the processing electrode, a step of applying a potential difference between the processing electrode and the workpiece while jetting the electrolytic solution from the outlet opening of the processing electrode, and a step of forming the curved-shaped processing hole in the workpiece. In the jetting step, at least one of a current density distribution on the tip surface of the processing electrode or a flow velocity distribution of the electrolytic solution jetted from the outlet opening is eccentric to a downstream side of a curving direction of the processing hole with respect to an axial center of the tip surface.Type: GrantFiled: July 2, 2018Date of Patent: July 5, 2022Assignee: MITSUBISHI POWER, LTD.Inventors: Kota Matsumoto, Masako Idota, Takuro Hashimoto
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Patent number: 9981401Abstract: An apparatus for an electrochemical discharge machining process is provided. The apparatus includes a holder housing having, an inlet hole, an outlet hole, a first side, and a second side, and containing an electrolyte, a tool holder disposed at the first side, and a first electrode having a first end and a second end. The holder housing is configured to sealingly accommodate the electrolyte unless at least one of the inlet hole and the outlet hole is open. The first end is coupled to the tool holder and the second end passes through the second side. Since the apparatus is moved to a machining position of the work-piece by a worker, additional power for controlling the position thereof is not necessary. In addition, the apparatus is easy to carry and use because of its simple structure.Type: GrantFiled: October 1, 2015Date of Patent: May 29, 2018Assignee: Foundation of Soongsil University-Industry CooperationInventor: Bohyun Kim
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Patent number: 9045843Abstract: An electropolishing system that includes electropolishing fixtures. The electropolishing fixtures include pendulum assemblies configured to establish electrical contact between a device being electropolished and an anode and to reposition the device during the electropolishing process.Type: GrantFiled: September 14, 2012Date of Patent: June 2, 2015Assignee: ABBOTT CARDIOVASCULAR SYSTEMS, INC.Inventors: Anthony S. Andreacchi, Randolf von Oepen, William E. Webler, Rodney Charles Ow
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Patent number: 9023188Abstract: A method of producing a component includes the steps of: providing a workpiece generated by hot isostatic pressing a powder metal form; and electropolishing a surface of the workpiece to remove a substantially uniform surface layer of the workpiece to produce the component. Following the electropolishing step, the component has substantially the same shape as the workpiece produced by the hot isostatic pressing step.Type: GrantFiled: December 13, 2012Date of Patent: May 5, 2015Assignee: Rolls-Royce plcInventor: Paul Edward Williams
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Publication number: 20150118506Abstract: The present disclosure generally relates to a sealed metal laminate structure comprising: a metal layer having a first surface and an opposite second surface; a first enamel layer laminated on the first surface of the metal layer, except at an exposed metal protrusion at a perimeter edge of the sealed metal laminate structure; a second enamel layer laminated on the second surface of the metal layer, except at the exposed metal protrusion at the perimeter edge of the sealed laminate structure; and a phosphate sealer deposited on the exposed metal protrusion of the sealed metal laminate structure. The present disclosure also relates to a metal laminate structure without a phosphate sealer. In addition, systems and methods for treating workpieces, including metal laminate structures, are discussed.Type: ApplicationFiled: October 24, 2013Publication date: April 30, 2015Applicant: General Electric CompanyInventors: Yuefeng Luo, William Edward Adis, Michael Lewis Jones
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Patent number: 8999136Abstract: A Method and machine tool for compensating a wear of an electrode that machines a workpiece. The method includes selecting a current pocket from plural pockets of the workpiece; updating a wear compensation to be applied to the electrode for the current pocket based on wear compensation of a previous pocket, where the previous pocket is adjacent to the current pocket; and applying the updated wear compensation to the electrode for machining the current pocket.Type: GrantFiled: September 14, 2010Date of Patent: April 7, 2015Assignee: Nuovo Pignone S.p.A.Inventors: Ugo Cantelli, Garth M Nelson, Yuanfeng Luo, Yimin Zhan, Roberto Ciappi, Massimo Arcioni, Renwei Yuan
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Publication number: 20150053567Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. As opposed to conventional polishing processes in which the product is guided around rollers which direct the product into and out of an electrolyte bath, embodiments of the present invention pass the product through a housing supplied with a continuous directional flow of electrolyte. Thus, the electroplating or electropolishing can be targeted to specific areas of the product, such as the edges and/or the center of a conveyor belt, and straight products can pass through the housing without deformation.Type: ApplicationFiled: August 22, 2013Publication date: February 26, 2015Applicant: ASHWORTH BROS., INC.Inventors: Matthew James KOVALCHICK, Jay F. DRUMMOND
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Patent number: 8962085Abstract: Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.Type: GrantFiled: January 8, 2010Date of Patent: February 24, 2015Assignee: Novellus Systems, Inc.Inventors: Steven T. Mayer, David W. Porter, Mark J. Willey
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Publication number: 20150027904Abstract: The invention relates to a method for electrochemically machining blades of a turbomachine having at least one U-shaped or trapezoidal cross-sectional profile of the surface to be treated, wherein an electrode array having at least three electrodes that can be moved in different directions is provided. The electrodes are moved from a start position having a first distance to the surface to be machined into an end position having a second distance to the surface to be machined, wherein in the end position, a closed work surface of the electrodes having a negative shape of the surface contour of the surface to be machined is located opposite thereof. The invention further relates to an electrode array for carrying out an electrochemical machining, wherein the electrode array comprises at least three electrodes that can be moved in different directions to one another, and to stationary mounting, wherein the electrodes can be moved from a start position to an end position.Type: ApplicationFiled: January 25, 2013Publication date: January 29, 2015Inventors: Albin Platz, Daniela Arbinger
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Publication number: 20150008140Abstract: A method for manufacturing a microchannel cooling passage in a surface of a machine component that includes: forming an elongated open channel in the surface of the machine component, the open channel comprising a cross-sectional profile having a mouth and a floor, and, defined therebetween, a middle region; inserting a corresponding elongated electrode having a directional bias into the channel; and using the electrode as a tooling piece in an electrochemical machining process, widening the middle region of the open channel.Type: ApplicationFiled: July 3, 2013Publication date: January 8, 2015Inventors: BENJAMIN PAUL LACY, BIN WEI
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Patent number: 8911599Abstract: A machining system is provided and includes a machining tool comprising a spindle, one or more electrodes configured to perform the electromachining, and one or more tool holding elements configure to conductively hold the respective one or more electrodes and be assembled onto the spindle of the machining tool. The machining system further comprises one or more adapters and one or more power sources configured to electrically connect to the respective one or more adapters and the workpiece. The one or more adapters are configured to conductively contact the respective one or more tool holding elements. Further, the machining system comprises one or more machining solution sources provided to pass one or more machining solutions between the workpiece and the respective one or more electrodes. A tool adapter assembly is also presented.Type: GrantFiled: January 20, 2011Date of Patent: December 16, 2014Assignee: General Electric CompanyInventors: Hongtao Li, Bin Wei, Xiaobin Chen, Steven Robert Hayashi, Renwei Yuan, Yuanfeng Luo
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Patent number: 8888967Abstract: A process for creating porous anode foil for use in an electrolytic capacitor of an implantable cardioverter defibrillator is provided. The process includes electrochemical drilling a plurality of etched metal foils in sequence one after the other in a bath containing electrochemical drilling (ECD) solution initially having a pH of less than 5. Alternatively, an etched foil sheet may be passed through the bath in a substantially continuous manner such that a portion of said etched foil sheet is in contact with the ECD solution is electrochemically drilled to generate pores.Type: GrantFiled: May 30, 2013Date of Patent: November 18, 2014Assignee: Pacesetter, Inc.Inventors: Jason Hemphill, Thomas F. Strange
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Publication number: 20140224669Abstract: A wire electrode forwarding device is obtained that can slow down or halt rotation of a rotating body to prevent a wire electrode from being wound around the rotating body for transferring the wire electrode to a wire electrode collecting section. A wire electric discharge machine according to the present invention includes: a wire electrode supporting means that holds one end portion of a wire electrode; and a wire electrode forwarding device that has a forwarding means supplying a fluid to forward the wire electrode from a wire electrode guiding section to a wire electrode collecting section, a rotating body positioned on a path between the forwarding means and the wire electrode collecting section and diverting the forwarding direction of the wire electrode, and a rotation restraining means restraining rotation of the rotating body rotated by the fluid supplied from the forwarding means.Type: ApplicationFiled: October 13, 2011Publication date: August 14, 2014Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yoji Nakajima, Takuya Ogawa
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Patent number: 8801906Abstract: The invention relates to a device (10) for electrochemically removing a surface of a component (2), in particular a blade of an integrally bladed rotor, comprising at least one electrode (12), which has an outer contour that corresponds to a surface of the component to be produced, and a hydraulic pressure device (14), which has a pressure piston (16) coupled to the electrode (12) and a hydraulic chamber (18) in operative connection with the pressure piston (16) for receiving the hydraulic medium, wherein the pressure piston can be loaded with an actuating force and moved relative to the hydraulic pressure device (14) by means of the hydraulic medium, wherein the hydraulic chamber (18) is fluidically encapsulated relative to the pressure piston (16). The invention further relates to a method for electrochemically removing a surface of a component (2).Type: GrantFiled: July 8, 2010Date of Patent: August 12, 2014Assignee: MTU Aero Engines AGInventors: Albin Platz, Roland Huttner
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Patent number: 8758590Abstract: Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface. The tool conducts the metal ions of the substrate and an electric potential is applied so that an electrical potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.Type: GrantFiled: April 20, 2007Date of Patent: June 24, 2014Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Inventors: Hans-Joachim Quenzer, Gerfried Zwicker
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Publication number: 20140076739Abstract: A device for repositioning a device during an electropolishing process. A fixture is disclosed that is configured to reposition the device during the electropolishing process in order to more evenly electropolish a surface of the device.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: ABBOTT CARDIOVASCULAR SYSTEMS, INC.Inventor: Anthony S. Andreacchi
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Patent number: 8663450Abstract: A method of electrically machining a hole in a conductive work piece may include providing a tool having a conductive tool head in close proximity to the conductive work piece. A voltage may be applied across the tool head and the work piece to create an electric field in the hole at the tool head. The electric field may be asymmetric with respect to the centerline of the hole. The orientation of the hole may be altered by removing material from the work piece using the asymmetric electric field.Type: GrantFiled: November 19, 2010Date of Patent: March 4, 2014Assignee: The United States of America as Represented by the Secretary of the ArmyInventors: Eric Kathe, Joseph Carter
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Patent number: 8535507Abstract: A process for creating porous anode foil for use in an electrolytic capacitor of an implantable cardioverter defibrillator is provided. The process includes electrochemical drilling a plurality of etched metal foils in sequence one after the other in a bath containing electrochemical drilling (ECD) solution initially having a pH of less than 5. Alternatively, an etched foil sheet may be passed through the bath in a substantially continuous manner such that a portion of said etched foil sheet is in contact with the ECD solution is electrochemically drilled to generate pores. Electrochemical drilling is achieved when a current is passed to the foil or portion of the foil sheet in solution.Type: GrantFiled: January 11, 2008Date of Patent: September 17, 2013Assignee: Pacesetter, Inc.Inventors: Ralph Jason Hemphill, Thomas F. Strange
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Publication number: 20130168256Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.Type: ApplicationFiled: May 7, 2012Publication date: July 4, 2013Applicant: ASHWORTH BROS., INC.Inventors: Joseph M. LACKNER, Jonathan R. LASECKI, Paul STEINHOFF
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Patent number: 8471167Abstract: A rough machining method for machining a channel in a workpiece includes the steps of: provide a power supply to energize one of a workpiece and an electrode as an anode and the other as a cathode; advance the electrode into the workpiece from a first start point to travel a first toolpath, so as to generate a first annular groove with a first core connecting with the workpiece; advance the electrode into the workpiece from a second start point to travel a second toolpath, so as to generate a second annular groove with a second core connecting with the workpiece, wherein the second annular groove intersects with the first annular groove and the first and the second cores are at least partially broken and disconnected with the workpiece upon intersecting of the first and the second annular grooves; and circulating a cutting fluid cross a working gap between a working face of the electrode and the workpiece.Type: GrantFiled: April 7, 2008Date of Patent: June 25, 2013Assignee: General Electric CompanyInventors: Yuanfeng Luo, Garth Nelson, Ugo Cantelli, Renwei Yuan, Yimin Zhan
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Patent number: 8431007Abstract: An electro-thinning apparatus for removing excess metal from the surface metal layer of the substrate is provided. The apparatus includes an electrolysis bath, a transportation system, an anode roller, a cathode roller, and at least one shielding plate. The electrolysis bath contains an electrolysis liquid. The transportation system is disposed in the electrolysis bath for moving a substrate from an upstream end to a downstream end. The anode roller is disposed relative to the electrolysis bath and located upstream to the transportation system. The cathode roller is located above the transportation system and located downstream to the anode roller. The at least one shielding plate is located downstream to the cathode roller. During electrolysis, the anode roller contacts a surface metal layer of the substrate while the cathode roller is partly immersed in the electrolysis liquid and away from the surface metal layer of the substrate during electrolysis.Type: GrantFiled: November 25, 2009Date of Patent: April 30, 2013Assignee: Advanced Semiconductor Engineering Inc.Inventors: Shin-Luh Tarng, Chao-Fu Weng
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Patent number: 8323459Abstract: An electropolishing system including an anode, a cathode, a rolling block and a motion controller. The anode is configured to removably retain a metal device to be electropolished, and may be formed as a bar made from a solid cylindrical piece of metal or other configurations, such as wires with hooks. The anode transfers the electricity to the metal device while grooming the surface of the metal device as it contacts the rolling block. The cathode may be configured as a mesh and completes the electrical circuit. The rolling block is formed from a relatively smooth, solid material and positioned so as to allow the metal device to roll against the surface of the block. The motion controller is configured to provide vertical and horizontal movement of the anode and metal device, using force transducers to control the compression of the metal device against the rolling block.Type: GrantFiled: April 10, 2008Date of Patent: December 4, 2012Assignee: Abbott Cardiovascular Systems Inc.Inventors: Anthony S. Andreacchi, Andreina P. Gomez, Han Juanta, Jessie Madriaga, Dan Joel Dirilo
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Patent number: 8262897Abstract: The invention relates to a method for the production of aero-dynamic structures during the production of integrally bladed gas turbine rotors. Aerodynamic structures of an integrally bladed gas turbine rotor are produced on a rotor disk base body, whereon the end contours are precise, by removing material according to an electrochemical removal process, i.e. by means of an electrochemical machining (ECM)-process. The method comprises the following steps: a) preparing a rotor disk base body which is made of a material which is difficult to machine; b) removing the material which is between the blade wings until a specific dimension is obtained, according to a removal process; c) preparing at least one working electrode in order to finish at least one aerodynamic structure of an integrally bladed gas turbine rotor.Type: GrantFiled: July 25, 2005Date of Patent: September 11, 2012Assignee: MTU Aero Engines GmbHInventors: Erwin Bayer, Martin Bussmann, Thomas Kraenzler, Albin Platz, Juergen Steinwandel
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Patent number: 8236162Abstract: An electroerosion machining system comprises an electrode, a power supply, an electrolyte supply, an electroerosion controller connected to and monitoring the power supply, and a working apparatus configured to move the electrode relative to the workpiece. The electroerosion machining system further comprises a CNC controller configured to cooperate with the electroerosion controller to control the working apparatus, and to calculate a wear value of the electrode. Further, the CNC controller is configured to segment the toolpath of every layer into a plurality of segments, and to divide the compensation value for every layer to be machined into a plurality of value segments, and further to use the value segments to compensate for electrode wear along the respective toolpath segments during machining of the workpiece. An electroerosion machining method is also presented.Type: GrantFiled: September 30, 2008Date of Patent: August 7, 2012Assignee: General Electric CompanyInventors: Yimin Zhan, Bin Wei, Michael Scott Lamphere, Renwei Yuan, Yuanfeng Luo
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Publication number: 20120103830Abstract: The invention relates to a device (10) for electrochemically removing a surface of a component (2), in particular a blade of an integrally bladed rotor, comprising at least one electrode (12), which has an outer contour that corresponds to a surface of the component to be produced, and a hydraulic pressure device (14), which has a pressure piston (16) coupled to the electrode (12) and a hydraulic chamber (18) in operative connection with the pressure piston (16) for receiving the hydraulic medium, wherein the pressure piston can be loaded with an actuating force and moved relative to the hydraulic pressure device (14) by means of the hydraulic medium, wherein the hydraulic chamber (18) is fluidically encapsulated relative to the pressure piston (16). The invention further relates to a method for electrochemically removing a surface of a component (2).Type: ApplicationFiled: July 8, 2010Publication date: May 3, 2012Applicant: MTU AERO ENGINES GMBHInventors: Albin Platz, Roland Huttner
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Publication number: 20120061244Abstract: An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources (9?) and (9?) that can be individually adjusted. The partial cathode (12?) and the associated partial anode (7?) are supplied in the region of the diametrically remote partial cathode (12?). Conversely, the partial cathode (12?) is supplied via the base layer of the partial cathode (12?). The required levelling of the layer thickness distribution is inter alia carried out by alternate different adjustments of the quantity of the electroplating current of the two partial cells and by the electrodes (7,12) that rotate relative to each other.Type: ApplicationFiled: May 18, 2010Publication date: March 15, 2012Applicant: SOMONT GMBHInventor: Egon Engmark HĂĽbel
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Publication number: 20120052325Abstract: The invention relates to electrochemical machining of metals and alloys and, more particularly, to high-precision dimensional electrochemical machining. The invention may be used for forming a regular nanometric and micrometric layers on an intricately shaped surface. Disclosed is a method of electrochemical machining in neutral electrolytes using current pulses which are synchronized with oscillation phases corresponding to the electrolyte pressure maximum in the interelectrode gap, wherein the oscillation mode of the machining electrode and electrode approach speed are set in a specific way for a predetermined frequency and amplitude, characterized in that the electrode approach speed is set in a way that the maximum value Pmax (t) of the electrolyte pressure at the interelectrode gap does not exceed an acceptable maximum value Pmax of the electrolyte pressure at the interelectrode gap.Type: ApplicationFiled: April 29, 2011Publication date: March 1, 2012Applicant: PECM INDUSTRIAL, LLCInventors: Alexandr Nickolaevich ZAYTSEV, Rinat Miyassarovich SALAKHUTDINOV, Timofei Vladimirovich KOSAREV, Nickolay Valerievich SERAVKIN
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Patent number: 8062494Abstract: There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a machining device having a moving means that moves the stage and the probe relative to each other to machine the workpiece by the probe tip, and a micro-machining dust removing device having a first electrode and a second electrode that are arranged in the liquid so as to sandwich the probe tip therebetween, and a voltage application means that applies a voltage to between both the electrodes to move the micro-machining dust in the liquid.Type: GrantFiled: June 4, 2007Date of Patent: November 22, 2011Assignees: National University Corporation Shizuoka University, SII Nano Technology Inc.Inventors: Futoshi Iwata, Masatoshi Yasutake, Takuya Nakaue, Syuichi Kikuchi, Osamu Takaoka
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Patent number: 7935230Abstract: A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.Type: GrantFiled: December 7, 2006Date of Patent: May 3, 2011Assignee: Semitool, Inc.Inventors: Daniel J. Woodruff, Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Nigel Stewart, Erik Lund, Steven L. Peace
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Patent number: 7927469Abstract: A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.Type: GrantFiled: August 25, 2006Date of Patent: April 19, 2011Assignee: Semitool, Inc.Inventors: Nigel Stewart, Daniel J. Woodruff, Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Erik Lund, Steven L. Peace
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Publication number: 20110073485Abstract: A method of electrochemical machining that includes the steps of: positioning a workpiece and a tooling piece in a first position; moving at least one of the workpiece and the tooling piece toward the other such that the workpiece and the tooling piece occupy a second position; moving at least one of the workpiece and the tooling piece away from the other such that the workpiece and the tooling piece occupy a third position; and during at least a portion of the moving of the workpiece and/or the tooling piece from the first position to the second position and from the second position to the third position, using a power supply to apply a voltage across a gap formed between the workpiece and the tooling piece.Type: ApplicationFiled: September 28, 2009Publication date: March 31, 2011Inventors: Yuefeng Luo, William E. Adis
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Patent number: 7909967Abstract: An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.Type: GrantFiled: July 13, 2006Date of Patent: March 22, 2011Assignee: Semitool, Inc.Inventors: Daniel J. Woodruff, Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Erik Lund, Steven L. Peace
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Patent number: 7824538Abstract: The present invention relates to a process for purifying a recycle base solution waste stream of a composition comprising a quaternary ammonium hydroxide comprising the steps of (a) providing an electrolysis cell which comprises an anolyte compartment containing an anode, a catholyte compartment containing a cathode, and a cation-selective membrane separating the anolyte and catholyte compartments, (b) charging the recycle base solution waste stream comprising the quaternary ammonium hydroxide to be purified to the anolyte compartment and charging water, optionally containing a quaternary ammonium hydroxide, to the catholyte compartment, (c) passing a current through the electrolysis cell to produce a purified aqueous quaternary ammonium hydroxide solution in the catholyte compartment, (d) recovering the purified aqueous quaternary ammonium hydroxide solution from the catholyte compartment, (e) washing the anolyte compartment with a suitable solvent, and (f) repeating steps (b)-(e).Type: GrantFiled: October 7, 2002Date of Patent: November 2, 2010Assignee: Flexsys B.V.Inventors: Fred Korpel, Gerrit Jan Boerman, Roger Keranen Rains
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Patent number: 7776189Abstract: An apparatus and method are provided for simultaneously electropolishing a plurality of metallic stents. A plurality of elongated members on the apparatus are movably engaged with a plate such that movement of the plate relative to the elongated members causes each of the elongated members to rotate on its respective longitudinal axis when immersed in an electrolytic solution. A continuous cathode is located in close proximity to each of the elongated members when they are immersed in the electrolytic solution.Type: GrantFiled: March 7, 2006Date of Patent: August 17, 2010Assignees: Abbott Laboratories, Accelent Inc.Inventors: Sanjay Shrivastava, Frank Moloney, Travis Yribarren, Jeffrey Farina, John Thomas, James Young
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Publication number: 20100187126Abstract: Disclosed is an electrochemical etching system with localized etching capability. The system allows multiple different porous semiconductor regions to be formed on a single semiconductor wafer. Localized etching is achieved through the use of one or more stationary and/or movable computer-controlled inner containers operating within an outer container. The outer container holds the electrolyte solution and acts as an electrolyte supply source for the inner container(s). The inner container(s) limit the size of the etched region of the semiconductor wafer by confining the electric field. Additionally, the current amount passing through each inner container during the electrochemical etching process can be selectively adjusted to achieve a desired result within the etched region. Localized etching of sub-regions within each etched region can also be achieved through the use of different stationary and/or moveable electrode structures and shields within each inner container.Type: ApplicationFiled: January 29, 2009Publication date: July 29, 2010Applicants: International Business Machines Corporation, AMDInventors: Matthew J. Sendelbach, Alok Vaid, Shahin Zangooie
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Publication number: 20100170806Abstract: A method and a device with the aid of which a substrate is electrochemically machined, material being removed from the surface of a conductive substrate with the aid of an also conductive tool. The removal takes place as a function of the surface structure which is incorporated into the tool. The core of the present invention is that the substrate and the tool are moved toward one another during the electrochemical etching process. However, it may alternatively also be provided that either the substrate or the tool is locally stationary, while only the counterpart is moved. In a particularly preferred embodiment of the present invention, only the tool is moved toward the substrate.Type: ApplicationFiled: December 30, 2009Publication date: July 8, 2010Inventors: Frank Klopf, Arno Stoetzler, Juergen Kober
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Publication number: 20100126877Abstract: An electrochemical grinding electrode comprises an electrically conductive material; an arc resistance material; and an abrasive material different from the arc resistance material. An electrochemical grinding apparatus and a method are also presented.Type: ApplicationFiled: November 24, 2008Publication date: May 27, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Yuanfeng Luo, Bin Wei, Steven Robert Hayashi, Andrew Lee Trimmer, Jian Wu
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Publication number: 20100078333Abstract: An electroerosion machining system comprises an electrode, a power supply, an electrolyte supply, an electroerosion controller connected to and monitoring the power supply, and a working apparatus configured to move the electrode relative to the workpiece. The electroerosion machining system further comprises a CNC controller configured to cooperate with the electroerosion controller to control the working apparatus, and to calculate a wear value of the electrode. Further, the CNC controller is configured to segment the toolpath of every layer into a plurality of segments, and to divide the compensation value for every layer to be machined into a plurality of value segments, and further to use the value segments to compensate for electrode wear along the respective toolpath segments during machining of the workpiece. An electroerosion machining method is also presented.Type: ApplicationFiled: September 30, 2008Publication date: April 1, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Yimin Zhan, Bin Wei, Michael Scott Lamphere, Renwei Yuan, Yuanfeng Luo
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Publication number: 20100059390Abstract: The present invention relates to an apparatus and a method of electrochemical mechanical polishing (ECMP) for microelectronics applications. The apparatus and method of electrochemical mechanical polishing can be used planarize NiP substrate for a magnetic storage medium and for a process which allows polishing with a controlled surface finish, and a set of corresponding polishing electrolytes and slurry.Type: ApplicationFiled: November 7, 2007Publication date: March 11, 2010Inventor: Yuzhuo Li
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Publication number: 20100051476Abstract: A method and a device for electrochemically machining workpiece having blade end plates at the longitudinal both ends of a blade-shaped portion having aerofoil shape in cross section by extending and retracting divided electrodes. A part of the blade-shaped portion and one blade end plate continued therewith are electrochemically machined by advancing the main electrode in an acute angle direction relative to the longitudinal direction of the blade-shaped portion. At the same time or subsequently, the remaining part of the blade-shaped portion and the other blade end plate continued therewith are electrochemically machined by slidably advancing an auxiliary electrode along the slope of the main electrode forming an acute angle relative to the blade-shaped-portion-machining-surface. Thus, the number of the parts of an electrode unit can be reduced and the structure thereof can be simplified.Type: ApplicationFiled: June 23, 2006Publication date: March 4, 2010Inventors: Toshiyuki Matsuo, Kazuhiko Yoshiwaki, Yasuo Fujihara, Masaaki Inoue, Mitsutoshi Watanabe
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Publication number: 20100038259Abstract: The invention relates to a method for machining a coated, subtantially cylindrical frictional contact surface (2) made of electrically conductive material. In said method, the frictional contact surface (2) is machined in an electrochemical manner. Also disclosed is an electrode (3) for electrochemical machining.Type: ApplicationFiled: October 17, 2007Publication date: February 18, 2010Applicant: Daimler AGInventors: Christian Martin Erdmann, Karl Holdik, Thomas Kraenzler, Thomas Neudecker
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Publication number: 20100000877Abstract: The present invention provides a method of electrochemical polishing of a workpiece using a polishing pad having a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm; wherein the cellular polymeric layer comprises a plurality of pores that extend through the thickness of the cellular polymeric layer from a polishing surface of the cellular polymeric layer to the conductive substrate; and wherein the plurality of pores exhibit a diameter that is smaller at the polishing surface than at the conductive substrate.Type: ApplicationFiled: September 14, 2009Publication date: January 7, 2010Inventors: Joseph G. Ameen, David B. James
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Patent number: 7637010Abstract: A method for machining a blank includes machining a first pocket in the blank having a first sidewall, machining a second pocket in the blank, machining a groove within material located between the first and second pockets to expose a second sidewall opposite the first sidewall, machining the first and second sidewalls, and alternately repeating machining the grove and the sidewalls to step mill the groove deeper in the blank and form a third pocket along which the second sidewall extends.Type: GrantFiled: December 1, 2005Date of Patent: December 29, 2009Assignee: General Electric CompanyInventors: Greg M. Burgess, Donald D. Lowe
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Publication number: 20090308760Abstract: A method and apparatus separates recoverable components (210) from conductive matrix composites (200) for further use or reuse. In an embodiment, the process uses an electrochemical apparatus that includes a cathode (220) and an anode. The conductive composite is electrically connected to the anode, and a non-acidic electrolyte (250) is supplied to an inter-electrode gap between the cathode and the anode.Type: ApplicationFiled: December 22, 2005Publication date: December 17, 2009Applicant: DIAMOND INNOVATIONS, INC.Inventors: Bin Wei, Padraic S. O'Neill
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Patent number: 7625468Abstract: An electrode containing a dielectric layer on a surface of the electrode and an active zone containing a metal embedded below the surface of the electrode, wherein the electrode is configured to form a groove pattern on a workpiece by an electrochemical machining process is disclosed. The electrode is capable of manufacturing a workpiece such as a counter plate, a sleeve journal or a conical bearing containing a groove pattern for fluid dynamics bearing, the groove pattern having a pitch of less than 80 microns. The electrode could be made by a method including depositing a dielectric layer on a surface of a metal, depositing a photoresist layer on the dielectric layer, printing a groove pattern on the photoresist layer, etching or physico-chemically removing portions of the dielectric photoresist layers to form grooves in the dielectric layer; removing the photoresist layer; and filling the grooves with a metal to produce the electrode.Type: GrantFiled: March 15, 2006Date of Patent: December 1, 2009Assignee: Seagate Technology, LLCInventors: Alexander Parkhomovsky, Lev M. Dvoskin, Roger A. Addy, Robert M. Pelstring
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Patent number: 7622029Abstract: An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during the electropolishing process to change a contact point between the anodes and the medical device. A tilting mechanism can also be used for periodically tilting the anodes during the electropolishing process to allow bubbles to escape from one end of the stent.Type: GrantFiled: August 11, 2006Date of Patent: November 24, 2009Assignee: Innovational Holdings, LLC.Inventors: Stephen Hunter Diaz, Jeffrey Bruce Anderson
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Patent number: 7544283Abstract: A system for removing a thin metal film is disclosed. The system comprises an inclined metal plate electrode for guiding a downward electrolyte flow, an auxiliary electrode placed on either the upstream or downstream side of the metal plate electrode such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film on the surface of an insulator by making the electrolyte flowing down the metal plate electrode strike against the metal thin film while the DC voltage is applied to the metal plate electrode and auxiliary electrode.Type: GrantFiled: April 11, 2005Date of Patent: June 9, 2009Assignee: Hitachi Zosen CorporationInventors: Hiroyuki Daiku, Hidehiko Maehata, Masanori Tsukahara, Shogo Hamada, Tetsuya Inoue, Hiroshi Hamasaki
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Publication number: 20090127131Abstract: Apparatus and method for making a metrological scale by electrochemical machining of a scale substrate using a tool having at least one feature. The method has the steps of passing an electrolyte solution between the tool and the scale substrate and forming an electrical connection between the scale substrate and the tool. Electrochemical dissolution of the scale substrate occurs adjacent to the feature of the tool to produce at least one scale marking. This is suitable for making linear, rotary and two dimensional scales.Type: ApplicationFiled: August 1, 2005Publication date: May 21, 2009Applicant: Renishaw PLCInventors: Geoffrey McFarland, David Roberts McMurtry, Alexander David Scott Ellin
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Patent number: 7513986Abstract: A method and a device for locally removing coatings from components. An absorbent medium supplied with a coating removal liquid is brought into contact with one or more areas of a component from which a coating is to be removed.Type: GrantFiled: April 19, 2002Date of Patent: April 7, 2009Assignee: MTU Aero Engines GmbHInventors: Anton Albrecht, Armin Eberlein, Karsten Gold, Albert Schneider
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Publication number: 20090038960Abstract: An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.Type: ApplicationFiled: August 7, 2007Publication date: February 12, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Laertis Economikos, Catherine Ivers, Xiaoyan Shao