Moving Tool Electrode Patents (Class 205/686)
  • Patent number: 9981401
    Abstract: An apparatus for an electrochemical discharge machining process is provided. The apparatus includes a holder housing having, an inlet hole, an outlet hole, a first side, and a second side, and containing an electrolyte, a tool holder disposed at the first side, and a first electrode having a first end and a second end. The holder housing is configured to sealingly accommodate the electrolyte unless at least one of the inlet hole and the outlet hole is open. The first end is coupled to the tool holder and the second end passes through the second side. Since the apparatus is moved to a machining position of the work-piece by a worker, additional power for controlling the position thereof is not necessary. In addition, the apparatus is easy to carry and use because of its simple structure.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: May 29, 2018
    Assignee: Foundation of Soongsil University-Industry Cooperation
    Inventor: Bohyun Kim
  • Patent number: 9045843
    Abstract: An electropolishing system that includes electropolishing fixtures. The electropolishing fixtures include pendulum assemblies configured to establish electrical contact between a device being electropolished and an anode and to reposition the device during the electropolishing process.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: June 2, 2015
    Assignee: ABBOTT CARDIOVASCULAR SYSTEMS, INC.
    Inventors: Anthony S. Andreacchi, Randolf von Oepen, William E. Webler, Rodney Charles Ow
  • Patent number: 9023188
    Abstract: A method of producing a component includes the steps of: providing a workpiece generated by hot isostatic pressing a powder metal form; and electropolishing a surface of the workpiece to remove a substantially uniform surface layer of the workpiece to produce the component. Following the electropolishing step, the component has substantially the same shape as the workpiece produced by the hot isostatic pressing step.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: May 5, 2015
    Assignee: Rolls-Royce plc
    Inventor: Paul Edward Williams
  • Publication number: 20150118506
    Abstract: The present disclosure generally relates to a sealed metal laminate structure comprising: a metal layer having a first surface and an opposite second surface; a first enamel layer laminated on the first surface of the metal layer, except at an exposed metal protrusion at a perimeter edge of the sealed metal laminate structure; a second enamel layer laminated on the second surface of the metal layer, except at the exposed metal protrusion at the perimeter edge of the sealed laminate structure; and a phosphate sealer deposited on the exposed metal protrusion of the sealed metal laminate structure. The present disclosure also relates to a metal laminate structure without a phosphate sealer. In addition, systems and methods for treating workpieces, including metal laminate structures, are discussed.
    Type: Application
    Filed: October 24, 2013
    Publication date: April 30, 2015
    Applicant: General Electric Company
    Inventors: Yuefeng Luo, William Edward Adis, Michael Lewis Jones
  • Patent number: 8999136
    Abstract: A Method and machine tool for compensating a wear of an electrode that machines a workpiece. The method includes selecting a current pocket from plural pockets of the workpiece; updating a wear compensation to be applied to the electrode for the current pocket based on wear compensation of a previous pocket, where the previous pocket is adjacent to the current pocket; and applying the updated wear compensation to the electrode for machining the current pocket.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: April 7, 2015
    Assignee: Nuovo Pignone S.p.A.
    Inventors: Ugo Cantelli, Garth M Nelson, Yuanfeng Luo, Yimin Zhan, Roberto Ciappi, Massimo Arcioni, Renwei Yuan
  • Publication number: 20150053567
    Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. As opposed to conventional polishing processes in which the product is guided around rollers which direct the product into and out of an electrolyte bath, embodiments of the present invention pass the product through a housing supplied with a continuous directional flow of electrolyte. Thus, the electroplating or electropolishing can be targeted to specific areas of the product, such as the edges and/or the center of a conveyor belt, and straight products can pass through the housing without deformation.
    Type: Application
    Filed: August 22, 2013
    Publication date: February 26, 2015
    Applicant: ASHWORTH BROS., INC.
    Inventors: Matthew James KOVALCHICK, Jay F. DRUMMOND
  • Patent number: 8962085
    Abstract: Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.
    Type: Grant
    Filed: January 8, 2010
    Date of Patent: February 24, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, David W. Porter, Mark J. Willey
  • Publication number: 20150027904
    Abstract: The invention relates to a method for electrochemically machining blades of a turbomachine having at least one U-shaped or trapezoidal cross-sectional profile of the surface to be treated, wherein an electrode array having at least three electrodes that can be moved in different directions is provided. The electrodes are moved from a start position having a first distance to the surface to be machined into an end position having a second distance to the surface to be machined, wherein in the end position, a closed work surface of the electrodes having a negative shape of the surface contour of the surface to be machined is located opposite thereof. The invention further relates to an electrode array for carrying out an electrochemical machining, wherein the electrode array comprises at least three electrodes that can be moved in different directions to one another, and to stationary mounting, wherein the electrodes can be moved from a start position to an end position.
    Type: Application
    Filed: January 25, 2013
    Publication date: January 29, 2015
    Inventors: Albin Platz, Daniela Arbinger
  • Publication number: 20150008140
    Abstract: A method for manufacturing a microchannel cooling passage in a surface of a machine component that includes: forming an elongated open channel in the surface of the machine component, the open channel comprising a cross-sectional profile having a mouth and a floor, and, defined therebetween, a middle region; inserting a corresponding elongated electrode having a directional bias into the channel; and using the electrode as a tooling piece in an electrochemical machining process, widening the middle region of the open channel.
    Type: Application
    Filed: July 3, 2013
    Publication date: January 8, 2015
    Inventors: BENJAMIN PAUL LACY, BIN WEI
  • Patent number: 8911599
    Abstract: A machining system is provided and includes a machining tool comprising a spindle, one or more electrodes configured to perform the electromachining, and one or more tool holding elements configure to conductively hold the respective one or more electrodes and be assembled onto the spindle of the machining tool. The machining system further comprises one or more adapters and one or more power sources configured to electrically connect to the respective one or more adapters and the workpiece. The one or more adapters are configured to conductively contact the respective one or more tool holding elements. Further, the machining system comprises one or more machining solution sources provided to pass one or more machining solutions between the workpiece and the respective one or more electrodes. A tool adapter assembly is also presented.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: December 16, 2014
    Assignee: General Electric Company
    Inventors: Hongtao Li, Bin Wei, Xiaobin Chen, Steven Robert Hayashi, Renwei Yuan, Yuanfeng Luo
  • Patent number: 8888967
    Abstract: A process for creating porous anode foil for use in an electrolytic capacitor of an implantable cardioverter defibrillator is provided. The process includes electrochemical drilling a plurality of etched metal foils in sequence one after the other in a bath containing electrochemical drilling (ECD) solution initially having a pH of less than 5. Alternatively, an etched foil sheet may be passed through the bath in a substantially continuous manner such that a portion of said etched foil sheet is in contact with the ECD solution is electrochemically drilled to generate pores.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: November 18, 2014
    Assignee: Pacesetter, Inc.
    Inventors: Jason Hemphill, Thomas F. Strange
  • Publication number: 20140224669
    Abstract: A wire electrode forwarding device is obtained that can slow down or halt rotation of a rotating body to prevent a wire electrode from being wound around the rotating body for transferring the wire electrode to a wire electrode collecting section. A wire electric discharge machine according to the present invention includes: a wire electrode supporting means that holds one end portion of a wire electrode; and a wire electrode forwarding device that has a forwarding means supplying a fluid to forward the wire electrode from a wire electrode guiding section to a wire electrode collecting section, a rotating body positioned on a path between the forwarding means and the wire electrode collecting section and diverting the forwarding direction of the wire electrode, and a rotation restraining means restraining rotation of the rotating body rotated by the fluid supplied from the forwarding means.
    Type: Application
    Filed: October 13, 2011
    Publication date: August 14, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoji Nakajima, Takuya Ogawa
  • Patent number: 8801906
    Abstract: The invention relates to a device (10) for electrochemically removing a surface of a component (2), in particular a blade of an integrally bladed rotor, comprising at least one electrode (12), which has an outer contour that corresponds to a surface of the component to be produced, and a hydraulic pressure device (14), which has a pressure piston (16) coupled to the electrode (12) and a hydraulic chamber (18) in operative connection with the pressure piston (16) for receiving the hydraulic medium, wherein the pressure piston can be loaded with an actuating force and moved relative to the hydraulic pressure device (14) by means of the hydraulic medium, wherein the hydraulic chamber (18) is fluidically encapsulated relative to the pressure piston (16). The invention further relates to a method for electrochemically removing a surface of a component (2).
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: August 12, 2014
    Assignee: MTU Aero Engines AG
    Inventors: Albin Platz, Roland Huttner
  • Patent number: 8758590
    Abstract: Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface. The tool conducts the metal ions of the substrate and an electric potential is applied so that an electrical potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: June 24, 2014
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Hans-Joachim Quenzer, Gerfried Zwicker
  • Publication number: 20140076739
    Abstract: A device for repositioning a device during an electropolishing process. A fixture is disclosed that is configured to reposition the device during the electropolishing process in order to more evenly electropolish a surface of the device.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: ABBOTT CARDIOVASCULAR SYSTEMS, INC.
    Inventor: Anthony S. Andreacchi
  • Patent number: 8663450
    Abstract: A method of electrically machining a hole in a conductive work piece may include providing a tool having a conductive tool head in close proximity to the conductive work piece. A voltage may be applied across the tool head and the work piece to create an electric field in the hole at the tool head. The electric field may be asymmetric with respect to the centerline of the hole. The orientation of the hole may be altered by removing material from the work piece using the asymmetric electric field.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: March 4, 2014
    Assignee: The United States of America as Represented by the Secretary of the Army
    Inventors: Eric Kathe, Joseph Carter
  • Patent number: 8535507
    Abstract: A process for creating porous anode foil for use in an electrolytic capacitor of an implantable cardioverter defibrillator is provided. The process includes electrochemical drilling a plurality of etched metal foils in sequence one after the other in a bath containing electrochemical drilling (ECD) solution initially having a pH of less than 5. Alternatively, an etched foil sheet may be passed through the bath in a substantially continuous manner such that a portion of said etched foil sheet is in contact with the ECD solution is electrochemically drilled to generate pores. Electrochemical drilling is achieved when a current is passed to the foil or portion of the foil sheet in solution.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: September 17, 2013
    Assignee: Pacesetter, Inc.
    Inventors: Ralph Jason Hemphill, Thomas F. Strange
  • Publication number: 20130168256
    Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.
    Type: Application
    Filed: May 7, 2012
    Publication date: July 4, 2013
    Applicant: ASHWORTH BROS., INC.
    Inventors: Joseph M. LACKNER, Jonathan R. LASECKI, Paul STEINHOFF
  • Patent number: 8471167
    Abstract: A rough machining method for machining a channel in a workpiece includes the steps of: provide a power supply to energize one of a workpiece and an electrode as an anode and the other as a cathode; advance the electrode into the workpiece from a first start point to travel a first toolpath, so as to generate a first annular groove with a first core connecting with the workpiece; advance the electrode into the workpiece from a second start point to travel a second toolpath, so as to generate a second annular groove with a second core connecting with the workpiece, wherein the second annular groove intersects with the first annular groove and the first and the second cores are at least partially broken and disconnected with the workpiece upon intersecting of the first and the second annular grooves; and circulating a cutting fluid cross a working gap between a working face of the electrode and the workpiece.
    Type: Grant
    Filed: April 7, 2008
    Date of Patent: June 25, 2013
    Assignee: General Electric Company
    Inventors: Yuanfeng Luo, Garth Nelson, Ugo Cantelli, Renwei Yuan, Yimin Zhan
  • Patent number: 8431007
    Abstract: An electro-thinning apparatus for removing excess metal from the surface metal layer of the substrate is provided. The apparatus includes an electrolysis bath, a transportation system, an anode roller, a cathode roller, and at least one shielding plate. The electrolysis bath contains an electrolysis liquid. The transportation system is disposed in the electrolysis bath for moving a substrate from an upstream end to a downstream end. The anode roller is disposed relative to the electrolysis bath and located upstream to the transportation system. The cathode roller is located above the transportation system and located downstream to the anode roller. The at least one shielding plate is located downstream to the cathode roller. During electrolysis, the anode roller contacts a surface metal layer of the substrate while the cathode roller is partly immersed in the electrolysis liquid and away from the surface metal layer of the substrate during electrolysis.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: April 30, 2013
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventors: Shin-Luh Tarng, Chao-Fu Weng
  • Patent number: 8323459
    Abstract: An electropolishing system including an anode, a cathode, a rolling block and a motion controller. The anode is configured to removably retain a metal device to be electropolished, and may be formed as a bar made from a solid cylindrical piece of metal or other configurations, such as wires with hooks. The anode transfers the electricity to the metal device while grooming the surface of the metal device as it contacts the rolling block. The cathode may be configured as a mesh and completes the electrical circuit. The rolling block is formed from a relatively smooth, solid material and positioned so as to allow the metal device to roll against the surface of the block. The motion controller is configured to provide vertical and horizontal movement of the anode and metal device, using force transducers to control the compression of the metal device against the rolling block.
    Type: Grant
    Filed: April 10, 2008
    Date of Patent: December 4, 2012
    Assignee: Abbott Cardiovascular Systems Inc.
    Inventors: Anthony S. Andreacchi, Andreina P. Gomez, Han Juanta, Jessie Madriaga, Dan Joel Dirilo
  • Patent number: 8262897
    Abstract: The invention relates to a method for the production of aero-dynamic structures during the production of integrally bladed gas turbine rotors. Aerodynamic structures of an integrally bladed gas turbine rotor are produced on a rotor disk base body, whereon the end contours are precise, by removing material according to an electrochemical removal process, i.e. by means of an electrochemical machining (ECM)-process. The method comprises the following steps: a) preparing a rotor disk base body which is made of a material which is difficult to machine; b) removing the material which is between the blade wings until a specific dimension is obtained, according to a removal process; c) preparing at least one working electrode in order to finish at least one aerodynamic structure of an integrally bladed gas turbine rotor.
    Type: Grant
    Filed: July 25, 2005
    Date of Patent: September 11, 2012
    Assignee: MTU Aero Engines GmbH
    Inventors: Erwin Bayer, Martin Bussmann, Thomas Kraenzler, Albin Platz, Juergen Steinwandel
  • Patent number: 8236162
    Abstract: An electroerosion machining system comprises an electrode, a power supply, an electrolyte supply, an electroerosion controller connected to and monitoring the power supply, and a working apparatus configured to move the electrode relative to the workpiece. The electroerosion machining system further comprises a CNC controller configured to cooperate with the electroerosion controller to control the working apparatus, and to calculate a wear value of the electrode. Further, the CNC controller is configured to segment the toolpath of every layer into a plurality of segments, and to divide the compensation value for every layer to be machined into a plurality of value segments, and further to use the value segments to compensate for electrode wear along the respective toolpath segments during machining of the workpiece. An electroerosion machining method is also presented.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: August 7, 2012
    Assignee: General Electric Company
    Inventors: Yimin Zhan, Bin Wei, Michael Scott Lamphere, Renwei Yuan, Yuanfeng Luo
  • Publication number: 20120103830
    Abstract: The invention relates to a device (10) for electrochemically removing a surface of a component (2), in particular a blade of an integrally bladed rotor, comprising at least one electrode (12), which has an outer contour that corresponds to a surface of the component to be produced, and a hydraulic pressure device (14), which has a pressure piston (16) coupled to the electrode (12) and a hydraulic chamber (18) in operative connection with the pressure piston (16) for receiving the hydraulic medium, wherein the pressure piston can be loaded with an actuating force and moved relative to the hydraulic pressure device (14) by means of the hydraulic medium, wherein the hydraulic chamber (18) is fluidically encapsulated relative to the pressure piston (16). The invention further relates to a method for electrochemically removing a surface of a component (2).
    Type: Application
    Filed: July 8, 2010
    Publication date: May 3, 2012
    Applicant: MTU AERO ENGINES GMBH
    Inventors: Albin Platz, Roland Huttner
  • Publication number: 20120061244
    Abstract: An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources (9?) and (9?) that can be individually adjusted. The partial cathode (12?) and the associated partial anode (7?) are supplied in the region of the diametrically remote partial cathode (12?). Conversely, the partial cathode (12?) is supplied via the base layer of the partial cathode (12?). The required levelling of the layer thickness distribution is inter alia carried out by alternate different adjustments of the quantity of the electroplating current of the two partial cells and by the electrodes (7,12) that rotate relative to each other.
    Type: Application
    Filed: May 18, 2010
    Publication date: March 15, 2012
    Applicant: SOMONT GMBH
    Inventor: Egon Engmark Hübel
  • Publication number: 20120052325
    Abstract: The invention relates to electrochemical machining of metals and alloys and, more particularly, to high-precision dimensional electrochemical machining. The invention may be used for forming a regular nanometric and micrometric layers on an intricately shaped surface. Disclosed is a method of electrochemical machining in neutral electrolytes using current pulses which are synchronized with oscillation phases corresponding to the electrolyte pressure maximum in the interelectrode gap, wherein the oscillation mode of the machining electrode and electrode approach speed are set in a specific way for a predetermined frequency and amplitude, characterized in that the electrode approach speed is set in a way that the maximum value Pmax (t) of the electrolyte pressure at the interelectrode gap does not exceed an acceptable maximum value Pmax of the electrolyte pressure at the interelectrode gap.
    Type: Application
    Filed: April 29, 2011
    Publication date: March 1, 2012
    Applicant: PECM INDUSTRIAL, LLC
    Inventors: Alexandr Nickolaevich ZAYTSEV, Rinat Miyassarovich SALAKHUTDINOV, Timofei Vladimirovich KOSAREV, Nickolay Valerievich SERAVKIN
  • Patent number: 8062494
    Abstract: There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a machining device having a moving means that moves the stage and the probe relative to each other to machine the workpiece by the probe tip, and a micro-machining dust removing device having a first electrode and a second electrode that are arranged in the liquid so as to sandwich the probe tip therebetween, and a voltage application means that applies a voltage to between both the electrodes to move the micro-machining dust in the liquid.
    Type: Grant
    Filed: June 4, 2007
    Date of Patent: November 22, 2011
    Assignees: National University Corporation Shizuoka University, SII Nano Technology Inc.
    Inventors: Futoshi Iwata, Masatoshi Yasutake, Takuya Nakaue, Syuichi Kikuchi, Osamu Takaoka
  • Patent number: 7935230
    Abstract: A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: May 3, 2011
    Assignee: Semitool, Inc.
    Inventors: Daniel J. Woodruff, Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Nigel Stewart, Erik Lund, Steven L. Peace
  • Patent number: 7927469
    Abstract: A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: April 19, 2011
    Assignee: Semitool, Inc.
    Inventors: Nigel Stewart, Daniel J. Woodruff, Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Erik Lund, Steven L. Peace
  • Publication number: 20110073485
    Abstract: A method of electrochemical machining that includes the steps of: positioning a workpiece and a tooling piece in a first position; moving at least one of the workpiece and the tooling piece toward the other such that the workpiece and the tooling piece occupy a second position; moving at least one of the workpiece and the tooling piece away from the other such that the workpiece and the tooling piece occupy a third position; and during at least a portion of the moving of the workpiece and/or the tooling piece from the first position to the second position and from the second position to the third position, using a power supply to apply a voltage across a gap formed between the workpiece and the tooling piece.
    Type: Application
    Filed: September 28, 2009
    Publication date: March 31, 2011
    Inventors: Yuefeng Luo, William E. Adis
  • Patent number: 7909967
    Abstract: An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: March 22, 2011
    Assignee: Semitool, Inc.
    Inventors: Daniel J. Woodruff, Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Erik Lund, Steven L. Peace
  • Patent number: 7824538
    Abstract: The present invention relates to a process for purifying a recycle base solution waste stream of a composition comprising a quaternary ammonium hydroxide comprising the steps of (a) providing an electrolysis cell which comprises an anolyte compartment containing an anode, a catholyte compartment containing a cathode, and a cation-selective membrane separating the anolyte and catholyte compartments, (b) charging the recycle base solution waste stream comprising the quaternary ammonium hydroxide to be purified to the anolyte compartment and charging water, optionally containing a quaternary ammonium hydroxide, to the catholyte compartment, (c) passing a current through the electrolysis cell to produce a purified aqueous quaternary ammonium hydroxide solution in the catholyte compartment, (d) recovering the purified aqueous quaternary ammonium hydroxide solution from the catholyte compartment, (e) washing the anolyte compartment with a suitable solvent, and (f) repeating steps (b)-(e).
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: November 2, 2010
    Assignee: Flexsys B.V.
    Inventors: Fred Korpel, Gerrit Jan Boerman, Roger Keranen Rains
  • Patent number: 7776189
    Abstract: An apparatus and method are provided for simultaneously electropolishing a plurality of metallic stents. A plurality of elongated members on the apparatus are movably engaged with a plate such that movement of the plate relative to the elongated members causes each of the elongated members to rotate on its respective longitudinal axis when immersed in an electrolytic solution. A continuous cathode is located in close proximity to each of the elongated members when they are immersed in the electrolytic solution.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: August 17, 2010
    Assignees: Abbott Laboratories, Accelent Inc.
    Inventors: Sanjay Shrivastava, Frank Moloney, Travis Yribarren, Jeffrey Farina, John Thomas, James Young
  • Publication number: 20100187126
    Abstract: Disclosed is an electrochemical etching system with localized etching capability. The system allows multiple different porous semiconductor regions to be formed on a single semiconductor wafer. Localized etching is achieved through the use of one or more stationary and/or movable computer-controlled inner containers operating within an outer container. The outer container holds the electrolyte solution and acts as an electrolyte supply source for the inner container(s). The inner container(s) limit the size of the etched region of the semiconductor wafer by confining the electric field. Additionally, the current amount passing through each inner container during the electrochemical etching process can be selectively adjusted to achieve a desired result within the etched region. Localized etching of sub-regions within each etched region can also be achieved through the use of different stationary and/or moveable electrode structures and shields within each inner container.
    Type: Application
    Filed: January 29, 2009
    Publication date: July 29, 2010
    Applicants: International Business Machines Corporation, AMD
    Inventors: Matthew J. Sendelbach, Alok Vaid, Shahin Zangooie
  • Publication number: 20100170806
    Abstract: A method and a device with the aid of which a substrate is electrochemically machined, material being removed from the surface of a conductive substrate with the aid of an also conductive tool. The removal takes place as a function of the surface structure which is incorporated into the tool. The core of the present invention is that the substrate and the tool are moved toward one another during the electrochemical etching process. However, it may alternatively also be provided that either the substrate or the tool is locally stationary, while only the counterpart is moved. In a particularly preferred embodiment of the present invention, only the tool is moved toward the substrate.
    Type: Application
    Filed: December 30, 2009
    Publication date: July 8, 2010
    Inventors: Frank Klopf, Arno Stoetzler, Juergen Kober
  • Publication number: 20100126877
    Abstract: An electrochemical grinding electrode comprises an electrically conductive material; an arc resistance material; and an abrasive material different from the arc resistance material. An electrochemical grinding apparatus and a method are also presented.
    Type: Application
    Filed: November 24, 2008
    Publication date: May 27, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Yuanfeng Luo, Bin Wei, Steven Robert Hayashi, Andrew Lee Trimmer, Jian Wu
  • Publication number: 20100078333
    Abstract: An electroerosion machining system comprises an electrode, a power supply, an electrolyte supply, an electroerosion controller connected to and monitoring the power supply, and a working apparatus configured to move the electrode relative to the workpiece. The electroerosion machining system further comprises a CNC controller configured to cooperate with the electroerosion controller to control the working apparatus, and to calculate a wear value of the electrode. Further, the CNC controller is configured to segment the toolpath of every layer into a plurality of segments, and to divide the compensation value for every layer to be machined into a plurality of value segments, and further to use the value segments to compensate for electrode wear along the respective toolpath segments during machining of the workpiece. An electroerosion machining method is also presented.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Yimin Zhan, Bin Wei, Michael Scott Lamphere, Renwei Yuan, Yuanfeng Luo
  • Publication number: 20100059390
    Abstract: The present invention relates to an apparatus and a method of electrochemical mechanical polishing (ECMP) for microelectronics applications. The apparatus and method of electrochemical mechanical polishing can be used planarize NiP substrate for a magnetic storage medium and for a process which allows polishing with a controlled surface finish, and a set of corresponding polishing electrolytes and slurry.
    Type: Application
    Filed: November 7, 2007
    Publication date: March 11, 2010
    Inventor: Yuzhuo Li
  • Publication number: 20100051476
    Abstract: A method and a device for electrochemically machining workpiece having blade end plates at the longitudinal both ends of a blade-shaped portion having aerofoil shape in cross section by extending and retracting divided electrodes. A part of the blade-shaped portion and one blade end plate continued therewith are electrochemically machined by advancing the main electrode in an acute angle direction relative to the longitudinal direction of the blade-shaped portion. At the same time or subsequently, the remaining part of the blade-shaped portion and the other blade end plate continued therewith are electrochemically machined by slidably advancing an auxiliary electrode along the slope of the main electrode forming an acute angle relative to the blade-shaped-portion-machining-surface. Thus, the number of the parts of an electrode unit can be reduced and the structure thereof can be simplified.
    Type: Application
    Filed: June 23, 2006
    Publication date: March 4, 2010
    Inventors: Toshiyuki Matsuo, Kazuhiko Yoshiwaki, Yasuo Fujihara, Masaaki Inoue, Mitsutoshi Watanabe
  • Publication number: 20100038259
    Abstract: The invention relates to a method for machining a coated, subtantially cylindrical frictional contact surface (2) made of electrically conductive material. In said method, the frictional contact surface (2) is machined in an electrochemical manner. Also disclosed is an electrode (3) for electrochemical machining.
    Type: Application
    Filed: October 17, 2007
    Publication date: February 18, 2010
    Applicant: Daimler AG
    Inventors: Christian Martin Erdmann, Karl Holdik, Thomas Kraenzler, Thomas Neudecker
  • Publication number: 20100000877
    Abstract: The present invention provides a method of electrochemical polishing of a workpiece using a polishing pad having a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm; wherein the cellular polymeric layer comprises a plurality of pores that extend through the thickness of the cellular polymeric layer from a polishing surface of the cellular polymeric layer to the conductive substrate; and wherein the plurality of pores exhibit a diameter that is smaller at the polishing surface than at the conductive substrate.
    Type: Application
    Filed: September 14, 2009
    Publication date: January 7, 2010
    Inventors: Joseph G. Ameen, David B. James
  • Patent number: 7637010
    Abstract: A method for machining a blank includes machining a first pocket in the blank having a first sidewall, machining a second pocket in the blank, machining a groove within material located between the first and second pockets to expose a second sidewall opposite the first sidewall, machining the first and second sidewalls, and alternately repeating machining the grove and the sidewalls to step mill the groove deeper in the blank and form a third pocket along which the second sidewall extends.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: December 29, 2009
    Assignee: General Electric Company
    Inventors: Greg M. Burgess, Donald D. Lowe
  • Publication number: 20090308760
    Abstract: A method and apparatus separates recoverable components (210) from conductive matrix composites (200) for further use or reuse. In an embodiment, the process uses an electrochemical apparatus that includes a cathode (220) and an anode. The conductive composite is electrically connected to the anode, and a non-acidic electrolyte (250) is supplied to an inter-electrode gap between the cathode and the anode.
    Type: Application
    Filed: December 22, 2005
    Publication date: December 17, 2009
    Applicant: DIAMOND INNOVATIONS, INC.
    Inventors: Bin Wei, Padraic S. O'Neill
  • Patent number: 7625468
    Abstract: An electrode containing a dielectric layer on a surface of the electrode and an active zone containing a metal embedded below the surface of the electrode, wherein the electrode is configured to form a groove pattern on a workpiece by an electrochemical machining process is disclosed. The electrode is capable of manufacturing a workpiece such as a counter plate, a sleeve journal or a conical bearing containing a groove pattern for fluid dynamics bearing, the groove pattern having a pitch of less than 80 microns. The electrode could be made by a method including depositing a dielectric layer on a surface of a metal, depositing a photoresist layer on the dielectric layer, printing a groove pattern on the photoresist layer, etching or physico-chemically removing portions of the dielectric photoresist layers to form grooves in the dielectric layer; removing the photoresist layer; and filling the grooves with a metal to produce the electrode.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: December 1, 2009
    Assignee: Seagate Technology, LLC
    Inventors: Alexander Parkhomovsky, Lev M. Dvoskin, Roger A. Addy, Robert M. Pelstring
  • Patent number: 7622029
    Abstract: An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during the electropolishing process to change a contact point between the anodes and the medical device. A tilting mechanism can also be used for periodically tilting the anodes during the electropolishing process to allow bubbles to escape from one end of the stent.
    Type: Grant
    Filed: August 11, 2006
    Date of Patent: November 24, 2009
    Assignee: Innovational Holdings, LLC.
    Inventors: Stephen Hunter Diaz, Jeffrey Bruce Anderson
  • Patent number: 7544283
    Abstract: A system for removing a thin metal film is disclosed. The system comprises an inclined metal plate electrode for guiding a downward electrolyte flow, an auxiliary electrode placed on either the upstream or downstream side of the metal plate electrode such that a part of the auxiliary electrode is immersed into the electrolyte, and a power supply for applying a DC voltage to the both electrodes. The system is used to remove a metal thin film on the surface of an insulator by making the electrolyte flowing down the metal plate electrode strike against the metal thin film while the DC voltage is applied to the metal plate electrode and auxiliary electrode.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: June 9, 2009
    Assignee: Hitachi Zosen Corporation
    Inventors: Hiroyuki Daiku, Hidehiko Maehata, Masanori Tsukahara, Shogo Hamada, Tetsuya Inoue, Hiroshi Hamasaki
  • Publication number: 20090127131
    Abstract: Apparatus and method for making a metrological scale by electrochemical machining of a scale substrate using a tool having at least one feature. The method has the steps of passing an electrolyte solution between the tool and the scale substrate and forming an electrical connection between the scale substrate and the tool. Electrochemical dissolution of the scale substrate occurs adjacent to the feature of the tool to produce at least one scale marking. This is suitable for making linear, rotary and two dimensional scales.
    Type: Application
    Filed: August 1, 2005
    Publication date: May 21, 2009
    Applicant: Renishaw PLC
    Inventors: Geoffrey McFarland, David Roberts McMurtry, Alexander David Scott Ellin
  • Patent number: 7513986
    Abstract: A method and a device for locally removing coatings from components. An absorbent medium supplied with a coating removal liquid is brought into contact with one or more areas of a component from which a coating is to be removed.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: April 7, 2009
    Assignee: MTU Aero Engines GmbH
    Inventors: Anton Albrecht, Armin Eberlein, Karsten Gold, Albert Schneider
  • Publication number: 20090038960
    Abstract: An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.
    Type: Application
    Filed: August 7, 2007
    Publication date: February 12, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Laertis Economikos, Catherine Ivers, Xiaoyan Shao
  • Patent number: 7473344
    Abstract: In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatment liquid into contact with the workpieces 9, means 10 for electrical contracting of the workpieces 9 at contacting sites and counterelectrodes 5.x which are so arranged that the workpieces 9 may be arranged opposing them, whereby the counterelectrodes 5.x are each subdivided into at least two electrode segments 13.x such that at least one contact-near electrode segment 13.1 and at least one contact-remote electrode segment 13.4 and possibly further electrode segments 13.2, 13.3 arranged between them are provided and each electrode segment 13.x is fed by a separate current source 15.x.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: January 6, 2009
    Assignee: Atotech Deutschland GmbH
    Inventor: Egon Hübel