Abstract: This invention provides a process for producing a membrane electrode assembly which has high and stable catalytic activity, and suppressed deterioration in catalytic activity during operation, and can prevent a deterioration in performance attributable to a structural factor of the membrane electrode assembly. The process comprises the step of, after the washing/removing step, drying the catalyst electrode in an atmosphere having a lower oxygen partial pressure than the air. The anode/cathode is a covered catalyst electrode having a structure formed by supporting/depositing a catalytically active material composed mainly of platinum/ruthenium subjected to the potential holding step, the washing/removing step, and the drying step, on a porous electroconductive carrier to cover at least a part of the porous electroconductive carrier with the ion conductive material.

Abstract: The present invention demonstrates the synthesis by electropolymerization of a new stable n-doping conjugated polymer poly(3,4-difluorothiophene) that may easily be electrochemically characterized.

Abstract: Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy layer.

Abstract: The object of the present invention is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrolytic apparatus for forming a molecular assembly, including two electrodes and an electrolytic cell holding an electrolyte and the two electrodes, wherein the gap between the two electrodes is from 1 nm to 100 ?m, by allowing the electrolytic cell to hold an electrolyte containing molecules that is to constitute the molecular assembly, and applying a voltage across the two electrodes in the state wherein the electrolyte and the two electrodes are in contact.

Abstract: The present invention provides a mold for fine electroforming M having a simple structure. In order to improve the productivity of a metal product, an electrode portion can be arranged with a much higher density, and a metal thin film formed on the electrode portion can easily be peeled off. The present invention provides a manufacturing method for manufacturing the mold M with a higher accuracy and by an easier way. The mold for fine electroforming M has a conductive substrate 1 to function as a cathode during electroforming and insulation layer 2 having an opening 21, which has a shape corresponding to a shape of a plane shape of the metal product P and is through to the conductive substrate 1, and composed of an inorganic insulation material having a thickness T2 of not less than 10 nm and less than one-half the thickness T1 of the metal product P. The surface of the conductive substrate 1 exposed at the opening 21 is adapted to serve as the electrode portion.

Abstract: Methods for the preparation of long, dimensionally uniform, metallic nanowires that are removable from the surface on which they are synthesized. The methods include the selective electrodeposition of metal nanowires at step edges present on a stepped surface, such as graphite, from an aqueous solution containing a metal or metal oxide. Where a metal oxide is first deposited, the metal oxide nanowires are reduced via a gas phase reduction at elevated temperatures to metal nanowires. Alternatively, beaded or hybrid nanowires comprising a metal A into which nanoparticles of a metal B have been inserted may be prepared by first electrodepositing nanoparticles of metal B selectively along step edges of a stepped surface, capping these nanoparticles with a molecular layer of an organic ligand, selectivley electrodepositing nanowire segments of metal A between nanoparticles of metal B and then heating the surface of the hybrid nanowire under reducing conditions to remove the ligand layer.

Abstract: A continuous electroforming process to form a strip for battery electrodes, comprising the steps of providing a mandrel having on its surface a reusable pattern subdivided into conductive and non-conductive areas; moving said mandrel through an electroforming bath to deposit a metal layer on said mandrel while it moves through the electroforming bath until the metal layer has assumed the shape of the conductive pattern and a thickness at least sufficient to provide strength for the layer to be removed from said mandrel; and separating said layer from said mandrel; is characterised by moving said strip through at least one subsequent bath in which electrodeposition of metal takes place on both sides of said strip while it is moved through said subsequent bath, applying a current density of at least 10 A/dm2 and up to 300 A/dm2 to the conductive surface of the moving mandrel and to the metal surface of the strip in each of the subsequent baths; and directing a forced flow of electrolyte onto the surface of the

Abstract: A method of producing metal ferrules and an apparatus therefore enable metal ferrules to be produced with high productivity and high dimensional accuracy by arranging a plurality of long-sized core wires. A jig receives a metal to be electroformed and is placed in an electroforming tank, a holding unit in which a plurality of core wire holder for holding core wires are held in circumferential array is installed in the electroforming tank, and the core wire holders and the holding unit are rotatable on their respective axes. It is preferable that the resistivity of the core wires be 5×10?6 ?cm or less. A core wire plated within a thin layer of metal having a resistivity of 5×10?6 ?cm or less may be used. A conductive electric discharge body may be provided on the front end of the core wire.

Abstract: A method for manufacturing a metal mask that facilitates easy dimensional control in the manufacturing process and can manufacture multiple metal masks having high and consistent precision. A Cr film 2 having a mask pattern 2a is formed on the surface of a glass plate 1, a dry film 4 is formed on the Cr film 2, the dry film 4 is exposed from the glass plate 1 side with the Cr film 2 as a mask, a mask pattern 4a having the same shape as that of the mask pattern 2a is formed on the dry film 4, and a metal plating layer 6 is formed on the Cr film 2. The metal plating layer 6 is separated to form a metal mask 7.

Abstract: A two-layered anode (1?) has a lower layer (2) including a non-conductive carrier material to which a conductive electrode layer (3?) is applied. Non-conductive areas, formed by partial removal of the electrode layer, have a predetermined structure corresponding to the structure of a structured polymer film (11) to be formed. The anode (1?) is connected with a platinum cathode in an electrolyte into which compounds of low molecular weight, preferably monomers of the polymer film (11), are introduced. During current flow, a conductive polymer film (11) of the predetermined structure is formed on conductive areas brought into contact with the electrolyte. A non-conductive substrate layer (13) is applied to the structured polymer film (11). The structured polymer film (11) adheres to the non-conductive substrate layer (13) and can be released from the electrode (1?) without damaging the electrode.

Abstract: A method is disclosed for the manufacture of colloidal rod particles as nanobarcodes. Template membranes for the deposition of materials are prepared using photolithographic techniques.

Abstract: The present invention relates to an edge insulation member for an electrode plate used for electrolytic refinement of metal, and to a fixing method for it. On a tip portion 22A of a main body 22, a fitting groove 23 and a jaw portion 24 for tightly fitting an electrode plate 1 are formed to extend along the lengthwise direction of the main body 22. On a base end portion of the main body 22, an engagement notch 25 for fitting a support rod 26 is formed to extend along the lengthwise direction of the main body 22. A plurality of pin insertion holes 27 are formed on the side surface of the jaw portion 24. Fitting jigs made up from a pin 30 and a stopper 40 is removably fitted in this pin insertion hole 27. The support rod 26 is removably fitted in the engagement notch 25.

Abstract: Methods for the preparation of long, dimensionally uniform, metallic nanowires that are removable from the surface on which they are synthesized. The methods include the selective electrodeposition of metal nanowires at step edges present on a stepped surface, such as graphite, from an aqueous solution containing a metal or metal oxide. Where a metal oxide is first deposited, the metal oxide nanowires are reduced via a gas phase reduction at elevated temperatures to metal nanowires. Alternatively, beaded or hybrid nanowires comprising a metal A into which nanoparticles of a metal B have been inserted may be prepared by first electrodepositing nanoparticles of metal B selectively along step edges of a stepped surface, capping these nanoparticles with a molecular layer of an organic ligand, selectivley electrodepositing nanowire segments of metal A between nanoparticles of metal B and then heating the surface of the hybrid nanowire under reducing conditions to remove the ligand layer.

Abstract: Methods for the preparation of long, dimensionally uniform, metallic nanowires that are removable from the surface on which they are synthesized. The methods include the selective electrodeposition of metal nanowires at step edges present on a stepped surface, such as graphite, from an aqueous solution containing a metal or metal oxide. Where a metal oxide is first deposited, the metal oxide nanowires are reduced via a gas phase reduction at elevated temperatures to metal nanowires. Alternatively, beaded or hybrid nanowires comprising a metal A into which nanoparticles of a metal B have been inserted may be prepared by first electrodepositing nanoparticles of metal B selectively along step edges of a stepped surface, capping these nanoparticles with a molecular layer of an organic ligand, selectivley electrodepositing nanowire segments of metal A between nanoparticles of metal B and then heating the surface of the hybrid nanowire under reducing conditions to remove the ligand layer.

Abstract: A porous nickel foil for a negative electrode of an alkaline battery formed by an electrolytic deposition method, wherein the porous nickel foil is flexible and has a thickness of 10-35 &mgr;m and a Vickers hardness of 70-130. An electrodeposition drum for producing porous metal foil by an electrolytic deposition method including a drum having a surface onto which metal foil is deposited, a plurality of holes formed in the surface and an insulating resin filled in the holes, wherein the ratio of depth L and diameter D (L/D) of the hole is at least 1 and no clearance, into which deposited metal otherwise cuts in a wedge shape, exists at the boundary between the insulating resin filled in the hole and an opening edge of the hole.

Abstract: A method of producing metal ferrules and an apparatus therefore, wherein metal ferrules are produced with high productivity and high dimensional accuracy by arranging a plurality of long-sized core wires. A metal ferrule producing method and apparatus, characterized in that a jig for receiving a metal to be electroformed is placed in an electroforming tank, a holding unit in which a plurality of core wire holder for holding core wires are held in circumferential array is installed in the electroforming tank, and the core wire holders and the holding unit are rotatable on their respective axes. It is preferable that the resistivity of the core wires be 5×10−6 &OHgr;cm or less. A core wire plated within a thin layer of metal having a resistivity of 5×10−6 &OHgr;cm or less may be used. Further, it is advisable to provide a conductive electric discharge body on the front end of the core wire.

Abstract: A method and apparatus for maintaining electro-deposition of metal on a cathode in an electrolytic cell. The cell comprises a metal anode, a cathode, an electrolytic bath and a main power supply to apply an electric potential across the anode and cathode resulting in a forward current and deposition of metal from said anode to the cathode. An auxiliary power supply is also provided for connection to the cell. In cases where the mains power supply falls below a predetermined value, the auxiliary power supply maintains a predetermined direction and quantity of current flow in the cell. The auxiliary power supply may be continuous or activated only when the current flow and/or direction of current falls below said predetermined value.

Abstract: 1. A method and an apparatus for the continuous manufacture of electrical and/or electronic film components.

Abstract: An apparatus and method for fabricating metal fibers using electroforming are provided in which continuous metal fibers can be fabricated. Here, any kind of metal which can be electroplated is electro-deposited on the surface of a negative electrode in diameter of a desired size corresponding to a plurality of non-conductive patterns of the negative electrode surface in an electrolyzer, and the electro-deposited metal is continuously separated.

Abstract: The invention has an object to obtain a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. And in particular, the invention has an object to obtain an electrolytic copper foil that can be finely patterned and has excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton represented by undermentioned general formula (1) obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.

Abstract: A surface treatment for a wrought copper foil relatives to a surface treatment procedure for a wrought cooper foil for use on a flexible PCB. The surface treatment comprises the steps of bi-polar electrochemical degreasing, acid etching and nodularization, electroplating a barrier layer and an anti-tarnish layer and coating a silane coupling agent layer to a copper foil. One side of the copper foil is nodularization, and a Zn—Ni barrier layer and a Cr—Zn anti-tarnish layer are electroplated on the copper foil. Finally, the organic silane coupling agent is coated to the roughened surface of the copper foil to modify the surface characters to impart the peel strength. Whereby, the cooper foil has very low profile, high peel strength, finer-pattern property, low HCl undercut and high thermal oxidation property.

Abstract: The present invention relates to a method for manufacturing a low roughness electrodeposited copper foil, and an electrodeposited copper foil manufactured thereby, and uses an electrolyte which basically consists of a sulfuric acid, a copper ion and a chloride ion is adapted with an additive which consists of a HEC (Hydroxyethyl Cellulose) of 0.05˜50 ppm, a SPS (bis(sodiumsulfopropyl)disulfide) of 0.05˜20 ppm, and a gelatin of 0.1˜100 ppm. The present invention is adapted to manufacture a low roughness electrodeposited copper foil using a conventional copper foil manufacture facility and the electrodeposited copper foil according to the present invention is adapted as a material for a copper clad laminate for a printed circuit substrate and an electrode material for a lithium ion battery.

Abstract: The present invention generally relates to an electrolyte solution used to manufacture an electrolytic copper foil for a secondary battery electrode collector and a printed circuit, and based on a 1-liter electrolyte solution, the present invention contains: 0.5 to 40 mg of at least one sulfur compound selected from a disulfur compound, dialkylamino- T-oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt; 1 to 1000 mg of at least more than one kind of an organic compound selected from a group consisting of a poly aklylene glycol-type surfactant and low molecular gelatin; and 0.1 to 80 mg of chlorine ion.

Abstract: A continuous electroforming process to form a strip for battery electrodes, comprising the steps of providing a mandrel having on its surface a reusable pattern subdivided into conductive and non-conductive areas; moving said mandrel through an electroforming bath to deposit a metal layer on said mandrel while it moves through the electroforming bath until the metal layer has assumed the shape of the conductive pattern and a thickness at least sufficient to provide strength for the layer to be removed from said mandrel; and separating said layer from said mandrel; is characterised by moving said strip through at least one subsequent bath in which electrodeposition of metal takes place on both sides of said strip while it is moved through said subsequent bath, applying a current density of at least 10 A/dm2 and up to 300 A/dm2 to the conductive surface of the moving mandrel and to the metal surface of the strip in each of the subsequent baths; and directing a forced flow of electrolyte onto the surface of the

Abstract: A process for in situ electroforming a structural reinforcing layer of selected metallic material for repairing an external surface area of a degraded section of metallic workpieces, especially of tubes and tube sections, is described. Preferably, the metal layer coatings are made of fine-grained metals, metal alloys or metal matrix composites. The plating system can be used on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. A suitable apparatus is assembled on or near the degraded site and is sealed in place to form the plating cell. Also described is a process for plating “patches” onto degraded areas by selective plating including brush plating.

Abstract: The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.

Abstract: The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.

Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for printed circuit boards, comprises a barrier layer formed of ternary alloy of Zn—Co—As on the copper foil. According to another aspect of the invention a surface treatment method of an electrodeposited copper foil for printed circuit boards is performed comprises the steps of electrolytically treating the copper foil in the electrolytic solution containing pyrophosphoric acid potassium of 10˜200 g/l, Zn of 0.1˜20 g/l, Co of 0.1˜20 g/l and As of 0.05˜5 g/l. Further, the electrolytic solution remains at the temperature of 20˜50° C. and pH=9˜13, and the copper foil is electrolytically treated for 2˜20 seconds at the cathode current density of 0.5˜20 A/dm2.

Abstract: The rigidified mesh structure includes filaments of at least one of metal and non-metal assembled in a mesh configuration, wherein the filaments are configured in a rigid structure by plating with metal. Desirably, the filaments include adjacent contact points which are fused together by the plated metal.

Abstract: Electroforming is performed in an electroforming bath with a cathode of a metal wire member immersed in an electroforming solution to electrodeposit nickel around the aluminum alloy wire member. The aluminum alloy wire member is removed by dissolution with an alkaline solution from an obtained nickel electroformed product. Accordingly, a nickel cylinder is obtained, which has a through-hole formed corresponding to the wire member. The cylinder is cut into those having a predetermined length. The outer circumference is subjected to cutting based on the through-hole to obtain a ferrule. The inner diameter accuracy of the through-hole of the ferrule is determined by the outer diameter accuracy of the wire member. Therefore, it is unnecessary to perform polishing for the through-hole. The highly accurate ferrule is obtained in accordance with the simple process at low cost. The PC polishing for the ferrule for effecting PC junction of optical fibers is extremely easy, because the ferrule is made of metal.

Abstract: A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate dissolved therein, in which said electrolyte contains a small amount of lead (Pb) ions, which comprises adding a salt of a metal of Group IIA of the periodic table to the electrolyte in an amount of 10 to 150 mols per mol of lead (Pb) ions contained in the electrolyte so that the lead (Pb) ions contained in the electrolyte react with the metal of Group IIA of the periodic table to thereby form an insoluble composite substance to precipitate, the insoluble composite substance followed by removing it from the electrolyte and forming an electrodeposited copper foil in the electrolyte having the lead (Pb) ions removed therefrom.

Abstract: This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer, preferably by electrodeposition. The organic release layer preferably is a heterocyclic compound selected from triazoles, thiazoles, imidazoles, or their derivatives, and provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

Abstract: This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

Abstract: A process for the preparation by electrodeposition of metal oxide film and powder compounds for ferroelectric memory materials and ferrites wherein the metal oxide includes a plurality of metals. The process comprises providing an electrodeposition bath, providing soluble salts of the metals to this bath, electrically energizing the bath to thereby cause formation of a recoverable film of metal on the electrode, recovering the resultant film as a film or a powder, and recovering powder formed on the floor of the bath. The films and powders so produced are subsequently annealed to thereby produce metal oxide for use in electronic applications. The process can be employed to produce metal-doped metal oxide film and powder compounds for transparent conductors. The process for preparation of these metal-doped metal oxides follows that described above.

Abstract: An electroforming process and apparatus for creating a nickel or like substrate encapsulated by another material to prevent wear to the nickel substrate. The encapsulation of the nickel substrate requires encapsulation of the inner and outer diameter of the nickel substrate. The encapsulating material must adhere to the nickel substrate. Encapsulation of the nickel substrate prevents exposure of the nickel and thus avoids the hazardous nickel dust particles that can occur when the nickel is exposed.

Abstract: The electrochemical method of this invention allows deposition of an electrically conductive trans-polyacetylene film on a substrate from a solution comprising substantially dehydrated ethyl alcohol.

Abstract: To prepare a screen printing stencil, a pattern of resist, having a complementary design to the final screen printing stencil, is applied to a conductive mandrel. A patterned layer is electroformed onto the exposed surface of the mandrel such that the layer corresponds to the exposed orifices of the pattern of resist. The resulting screen printing stencil can have an overgrowth geometry or a straight-wall geometry depending on the type of photoresist employed, and can be used in the electronic substrate fabrication and electronic assembly industries.

Abstract: A process of producing a metallic foil by electrolysis by depositing the metallic foil on a cathode by electrolysis from a sulfuric acid acidic solution is disclosed, which comprises using an electrode having a coating of an electrode active material containing a platinum group metal oxide as an anode and carrying out the electrolysis in an electrolyte containing from 1 to 20 ppm of a lead component when a fluorine component does not exist in the electrolyte or an electrolyte containing from 0.2 to 1 ppm of a fluorine component and from 0.1 to 20 ppm of a lead component when a fluorine component exists in the electrolyte. The life of the electrode can be prolonged and a metallic foil can be stably produced by electrolysis for a long period of time by preventing the lead component(s) derived from the raw material from mixing into the metallic foil.

Abstract: An edge protector for an electrolysis electrode, has an outer surface shape in the central portion thereof which reduces the thickness in that portion to improve uniformity of cooling, and thereby reduce stress cracking as a result of the reduced buildup of thermal stresses. The outer surfaces may be inclined planes or suitable curved shapes that converge from an outer jaw toward an inner jaw. In one embodiment an edge protector includes a sealing member made of a sealing material such as silicone rubber, either integrally formed with the inner jaws, or affixed after forming. A spreader bar has a shape which enables clamping of the edge protector onto a mother blank without excessive expansion of the outer jaw, thereby lengthening service life, and easing installation. A tapered spreader bar for end insertion, and embodiments of spreader bars having flattened surfaces for edgewise insertion and then rotation for tightening are disclosed.

Abstract: A layered photosensitive imaging member is modified to reduce the effects of interference within the member caused by reflections from coherent light incident on a base ground plane. The modification described is to form the ground plane surface by an electroforming process which leaves the surface with a black finish. Light incident on the ground plane is absorbed, eliminating the reflections which contribute to the interference effect at the imaging member surface.

Abstract: A working duplicate of an endless master band having a pattern impressed on its surface for use in the production of laminated boards is produced by first making a polyurethane cast of the impressed pattern in the form of an endless, flexible plastic band. A metal layer is galvanically deposited over the pattern on the plastic band to form a galvanic band which functions as a working duplicate after the plastic band has been peeled off. The resultant galvanic band is an exact duplicate of the original master band and is utilized in a press for impressing the pattern on the surface of laminated boards.

Abstract: A process for producing a released film made of at least two layers, one or more of which has been formed by a vapor deposition technique. The process involves anodizing a metal substrate comprising a valve metal or valve metal alloy to form an anodic oxide layer on the substrate, the anodization being carried out in the presence of an adhesion-reducing agent (e.g. fluoride) which makes the anodic layer detachable from the valve metal, coating the anodic layer with one or more layers of desired materials by a vapor deposition technique (e.g. sputtering or vacuum evaporation, etc.) to form a film of desired structure which is releasable from the metal substrate, and then detaching the releasable film from the metal substrate. The film can, if desired, be transferred to another substrate by attaching the other substrate to the releasable film before the releasable film is detached from the metal substrate.

Abstract: A metal foil made by electroforming from a master pattern with the interposition of a negative form, and serving as packing for sheet guiding cylinders and/or drums of rotary printing machines, including a substantially planar member having one flat face and an opposite face with a textured surface structure corresponding to an upper side of the master pattern, the upper side of the master patten having been roughened by a jet treatment and coated with a levelling galvano-layer in order to eliminate undercuts, the master pattern per se, and method of manufacture.

Abstract: A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.

Abstract: Process for producing color change devices incorporating areas of contrasting appearance, and the devices so produced. The process involves masking limited areas of a layer of a color generating metal (e.g. Ta or Nb, especially commercially sputtered Ta foil), with a mask made of a material which permits anodization of an underlying surface and permits penetration of fluoride as an adhesion-reducing agent at levels employed in the process. The masked metal layer is anodized to form an anodic film on the metal, the anodization being carried out in an electrolyte containing fluoride at a concentration high enough to (a) weaken the adhesion of the anodic film to the underlying metal over the entire area of the film, and (b) to introduce voids in the anodic film in areas not covered by the mask to reduce the density, and thus the refractive index, of the film in these areas compared to areas covered by the mask. Finally the mask is removed.

Abstract: An apparatus for stripping starting sheets of the present invention comprises stripping rods which are horizontally disposed at positions opposite to the right and left sides of both surfaces of a mother board, which is stripped at the upper end and is suspended and transferred by a trolley conveyor, so that they can be inserted into the stripped upper end when the mother board reaches a predetermined stripping position; elevating members which respectively carry the stripping rods through attachments so as to upwardly and downwardly move the stripping rods at small distances from the surfaces of the mother board between an upper position above the stripped upper end of the mother board and a lower position under the lower ends of the starting sheets; and a driving member for upwardly and downwardly moving the elevating members in synchronism with each other.