Electroforming Or Composition Therefor Patents (Class 205/67)
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Patent number: 11935693Abstract: Methods and apparatus for producing helix windings used for a transformer are provided. For example, apparatus comprise an electrically conductive mandrel comprising an elongated body, a head comprising an eyelet detail, and a winding structure disposed along the elongated body.Type: GrantFiled: March 10, 2023Date of Patent: March 19, 2024Assignee: Enphase Energy, Inc.Inventor: Michael J. Harrison
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Patent number: 11840769Abstract: The present invention is directed to devices and methods for assembling particulates through the use of non-contact electrokinetic forces applied to polymeric, organic, non-organic, and metallic micro- and nano-particulates in an aqueous solution. The present invention features an electrode comprising a conductive substrate with a layer of photosensitive polymer disposed on it with a plurality of windows etched into the layer. The plurality of windows expose certain portions of the conductive substrate. Applying electric signals to the conductive substrate (e.g. by a function generator) causes materials to attract to only the exposed portions of the conductive substrate. The materials may comprise a plurality of organic, non-organic, and metallic micro- and nano-particulates disposed in an aqueous solution.Type: GrantFiled: May 7, 2021Date of Patent: December 12, 2023Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Lawrence Kulinsky, Tuo Zhou
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Patent number: 11542617Abstract: An electroplating system includes an enclosure with an interior, an anode lead extending through the enclosure and into the interior, and a porous body. The porous body is supported within the interior of the enclosure for coupling an electroplating solution within the interior with a workpiece. A conduit extends through the enclosure and into the interior of the enclosure to provide a flow of nitrogen enriched air to the interior of enclosure for drying and removing oxygen from the electroplating solution.Type: GrantFiled: March 19, 2021Date of Patent: January 3, 2023Assignee: Hamilton Sundstrand CorporationInventors: Lei Chen, Blair A. Smith, Haralambos Cordatos
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Patent number: 11542835Abstract: An assembly for use in a bearing compartment having an axis includes a bearing outer race configured to be located in the bearing compartment. The assembly further includes at least one annular spring positioned in the bearing outer race and being asymmetric in at least one of the axial direction or the circumferential direction relative to the axis to reduce the likelihood of amplification of vibration experienced by the at least one annular spring.Type: GrantFiled: January 29, 2021Date of Patent: January 3, 2023Assignee: Raytheon Technologies CorporationInventors: Adam G. Smedresman, Michael Winter, Ramin M. Rafatpanah
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Patent number: 11229986Abstract: An annular grindstone includes a grindstone portion including a binding material, and abrasive grains which are dispersed into the binding material to be fixed, in which the binding material contains a nickel-iron alloy. Preferably, a contained ratio of iron in the nickel-iron alloy is in a range of 5 wt % or more to less than 60 wt %. More preferably, a contained ratio of iron in the nickel-iron alloy is in a range of 20 wt % or more to 50 wt % or less. Preferably, the annular grindstone includes the grindstone portion only. In addition, the annular grindstone further includes an annular base including a grip portion, in which the grindstone portion is exposed at an outer peripheral edge of the annular base.Type: GrantFiled: March 21, 2019Date of Patent: January 25, 2022Assignee: DISCO CORPORATIONInventor: Hiroki Aikawa
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Patent number: 11027574Abstract: The invention relates to a process for the production of a part provided with an external element comprising the following steps: provide an electrically conductive substrate having an upper surface and a pattern forming a recess in said upper surface deposit an electrically insulating layer into the pattern so that the insulating layer extends as far as the upper surface deposit a metal layer onto the upper surface of the substrate by galvanic growth so that at the end of this step the metal layer partly rests on the insulating layer dissolve the insulating layer cover an assembly comprising the substrate and the metal layer with a mass of a base material of the part, wherein the mass forms an imprint of the assembly separate the mass and the metal layer from the substrate, wherein the mass then exhibits an external element with a shape corresponding to the imprint of the pattern.Type: GrantFiled: May 10, 2017Date of Patent: June 8, 2021Assignee: The Swatch Group Research and Development LtdInventors: Pascal Grossenbacher, Stewes Bourban, Pierry Vuille, Yves Winkler
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Patent number: 10619486Abstract: A leading-edge shield (32) for a turbomachine blade (16) includes a pressure-side wing (34) and a suction-side wing (36). Each of the wings (34, 36) extends along a height (H) from a bottom edge (50) to a top edge (51) and along a length, from the leading edge to a respective rear edge, and are connected together over the leading edge. At least one of the wings from among the suction-side wing (36) and the pressure-side wing (34) presents a segment (S1), adjacent to the top edge (51) and extending over at least 10% of the height (H), wherein the rear edge (42) slopes towards the top edge (51).Type: GrantFiled: December 21, 2016Date of Patent: April 14, 2020Assignee: Safran Aircraft EnginesInventors: Frédéric Jean-Bernard Pouzadoux, Alain Jacques Michel Bassot, Jérémy Guivarc'h, Jean-Louis Romero, Thibault Ruf
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Patent number: 10591359Abstract: An apparatus includes a top surface configured to couple to a variable aperture mechanism (VAM), where the top surface has an opening configured to align with an aperture of the VAM. The apparatus also includes a bottom portion configured to couple to a cooled object and a contact portion configured to couple to a strut, where the top surface, bottom portion, and contact portion form a continuous body. The apparatus further includes a plurality of baffles within the continuous body, where each of the baffles has an opening configured to align with the aperture of the VAM. In addition, the apparatus includes a reinforcement ring comprised in or within the continuous body and disposed to be aligned with the strut when the strut is coupled to the continuous body.Type: GrantFiled: August 12, 2019Date of Patent: March 17, 2020Assignee: Raytheon CompanyInventors: Gavin L. Avers, Michael L. Brest, Mark C. Elbogen, Christopher J. Cobb, Daniel W. Rinehart, Jason S. Graham
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Patent number: 10546607Abstract: Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.Type: GrantFiled: July 19, 2016Date of Patent: January 28, 2020Assignee: MicroContinuum, Inc.Inventor: W. Dennis Slafer
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Patent number: 10378958Abstract: An Infrared Detector Dewar system includes a housing and an infrared detector. The system also includes one or more strut members coupled on a first end to the housing. The system further includes cold shield coupled to the infrared detector and to a second end of the one or more strut members. The cold shield includes a reinforcement ring aligned with the one or more strut members. The cold shield is formed by forming a support member having disc encased by a support ring. The support member is positioned within a mandrel such that the reinforcement ring is disposed to align with a strut position. The cold shield is then formed by electroplating copper over the mandrel and at least a portion of the support member, and then by removing/dissolving all aforementioned mandrels.Type: GrantFiled: April 10, 2017Date of Patent: August 13, 2019Assignee: Raytheon CompanyInventors: Gavin L. Avers, Michael L. Brest, Mark C. Elbogen, Christopher J. Cobb, Daniel W. Rinehart, Jason S. Graham
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Patent number: 10347838Abstract: The present disclosure provides a manufacturing method for thin film transistors and a display panel, in which a semiconductor channel layer is formed by embossing on a semiconductor solution material directly by using an embossing template having a semiconductor channel layer pattern, thus it does not need to form a photoresist layer on the semiconductor solution material to form a semiconductor channel layer, the erosion of the semiconductor channel layer caused by the photoresist can be avoided, thereby the product quality and the device performance are improved.Type: GrantFiled: March 10, 2017Date of Patent: July 9, 2019Assignee: WUHAN CHINA STAR OPTOELECTRONICS, TECHNOLOGY CO., LTDInventor: Zhe Liu
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Patent number: 10294797Abstract: The present disclosure relates generally to a fan blade assembly. In an embodiment, the fan blade assembly includes an airfoil having a forward edge covered by a sheath. The airfoil and the sheath are made from dissimilar conductive materials. A nonconductive coating is applied the an airfoil contact surface of the sheath before it is bonded to the leading edge of the airfoil.Type: GrantFiled: September 12, 2014Date of Patent: May 21, 2019Assignee: UNITED TECHNOLOGIES CORPORATIONInventor: Sean A. Whitehurst
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Patent number: 9751263Abstract: A method for forming a three-dimensional object uses a three-dimensional object printer to form a printed part and an injection molding system is used to form a molded part that adjoins the printed part and completes the three-dimensional object formation. The method includes operating an ejector head of a three-dimensional object printer to eject drops of material onto a platen to form the printed part, operating an actuator to move the printed part from the platen to a cavity of an injection mold of an injection molding system, and operating injectors of the injection molding system to inject material into the cavity of the injection mold to form the molded part that adjoins the printed part to form the three-dimensional object.Type: GrantFiled: April 20, 2015Date of Patent: September 5, 2017Assignee: Xerox CorporationInventors: Christopher D. Atwood, Mark A. Adiletta
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Patent number: 9719182Abstract: Method for manufacturing an electroformed timepiece component: the same first alloy including a first precious metal is selected to make both functional inserts and an electroformed shell; these inserts are made; an electroforming substrate having a complementary profile to the inner profile of this component is formed in a second sacrificial material; these inserts are inserted into housings made on this substrate, to form an equipped sacrificial substrate, which is provided with the resists necessary to obtain, by means of an electroforming process, a bare electroformed component, with deposition of material on this substrate, acting as a core to form this electroformed shell, and on each accessible surface of each insert to secure the insert to this electroformed shell; then this sacrificial substrate is destroyed and all of these resists are removed.Type: GrantFiled: July 15, 2015Date of Patent: August 1, 2017Assignee: The Swatch Group Research and Development LtdInventor: Enzo Agustoni
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Patent number: 9541519Abstract: Embodiments of the invention provide electrochemical analyte sensors having elements designed to modulate their electrochemical reactions as well as methods for making and using such sensors.Type: GrantFiled: March 25, 2010Date of Patent: January 10, 2017Assignee: Medtronic MiniMed, Inc.Inventors: Rajiv Shah, Rebecca K. Gottlieb, Gopikrishnan Soundararajan, James D. Holker
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Patent number: 9333598Abstract: A method of fabricating a nozzle that includes providing a first material capable of undergoing multiphoton reaction; forming a first microstructured pattern in the first material using a multiphoton process; replicating the first microstructured pattern in a second material to make a first mold comprising a second microstructured pattern in the second material; replicating the second microstructured pattern in a third material to make a second mold comprising a third microstructured pattern comprising microstructures in the third material; replicating the third microstructured pattern in a fourth material to make a replicated structure; planarizing the replicated structure to expose tops of the microstructures in the plurality of microstructures in the third microstructured pattern; and removing the third material resulting in the nozzle having a plurality of holes in the fourth material.Type: GrantFiled: July 29, 2010Date of Patent: May 10, 2016Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Barry S. Carpenter, Jaime B. Willoughby, Jennifer J. Sahlin
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Patent number: 9163886Abstract: A cooling device for an electronic component, includes: a metal pipe; a metal foil provided on an external surface of the metal pipe; and a thermally-cured resin layer that bonds the external surface of the metal pipe and the metal foil together.Type: GrantFiled: November 22, 2011Date of Patent: October 20, 2015Assignee: TOYODA IRON WORKS CO., LTD.Inventors: Masahiro Watanabe, Shintaro Suzuki
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Patent number: 9083008Abstract: A bipolar plate assembly for a fuel cell is provided. The bipolar plate assembly includes a cathode plate disposed adjacent an anode plate, the cathode and anode plates formed having a first thickness of a low contact resistance, high corrosion resistance material by a deposition process. The first and second unipolar plates are formed on a removable substrate, and a first perimeter of the first unipolar plate is welded to a second perimeter of the second unipolar plate to form a hermetically sealed coolant flow path. A method for forming the bipolar plate assembly is also described.Type: GrantFiled: February 25, 2011Date of Patent: July 14, 2015Assignee: GM Global Technology Operations LLCInventors: Gayatri Vyas Dadheech, Gerald W. Fly
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Publication number: 20150147219Abstract: A micro-structured article is disclosed comprising a free-standing network of interconnected traces surrounding randomly-shaped cells wherein the interconnected traces comprise at least partially-joined nanoparticles. In a preferred embodiment, the nanoparticles comprise a conductive metal. The article is preferably formed by coating a nanoparticle-containing emulsion onto a substrate and drying the emulsion. The nanoparticles self-assemble into the network pattern which is subsequently removed from the substrate. A preferred method of removing the network from the substrate comprises the steps of electroplating the traces and subsequently exposing the traces to acid to release the network from the substrate.Type: ApplicationFiled: December 15, 2014Publication date: May 28, 2015Inventor: Arkady Garbar
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Publication number: 20150140740Abstract: A method of fabrication, a device structure and a submount comprising high thermal conductivity (HTC) diamond on a HTC metal substrate, for thermal dissipation, are disclosed. The surface roughness of the diamond layer is controlled by depositing diamond on a sacrificial substrate, such as a polished silicon wafer, having a specific surface roughness. Following deposition of the diamond layer, an adhesion layer, e.g. comprising a refractory metal, such as tantalum, and at least one layer of HTC metal is provided. The HTC metal substrate is preferably copper or silver, and may be provided by electroforming metal onto a thin sputtered base layer, and optionally bonding another metal layer. The electrically non-conductive diamond layer has a smooth exposed surface, preferably ?10 nm RMS, suitable for patterning of contact metallization and/or bonding to a semiconductor device. Methods are also disclosed for patterning the diamond on metal substrate to facilitate dicing.Type: ApplicationFiled: December 15, 2014Publication date: May 21, 2015Applicant: Advanced Diamond Technologies, Inc.Inventors: Nicolaie A. Moldovan, John A. Carlisle, Hongjun Zeng
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Patent number: 8951400Abstract: The invention relates to novel compositions of disubstituted bipyridyl osmium complexes useful for the synthesis of labeled proteins, nucleic acids, and for the modification of electrodes.Type: GrantFiled: July 20, 2011Date of Patent: February 10, 2015Assignee: OHMX CorporationInventors: Michael Ahrens, Paul A. Bertin, Harry B. Gray, Thomas J. Meade
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Patent number: 8936709Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The metallic article has a plurality of electroformed elements that are configured to serve as an electrical conduit for a photovoltaic cell. A first electroformed element has at least one of: a) a non-uniform width along a first length of the first element, b) a change in conduit direction along the first length of the first element, c) an expansion segment along the first length of the first element, d) a first width that is different from a second width of a second element in the plurality of electroformed elements, e) a first height that is different from a second height of the second element in the plurality of electroformed elements, and f) a top surface that is textured.Type: GrantFiled: November 13, 2013Date of Patent: January 20, 2015Assignee: GTAT CorporationInventors: Steve Babayan, Robert Brainard, Arvind Chari, Alejandro de la Fuente Vornbrock, Venkatesan Murali, Gopal Prabhu, Arthur Rudin, Venkateswaran Subbaraman, David Tanner, Dong Xu
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Patent number: 8916038Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The mandrel has an outer surface with a preformed pattern, wherein at least a portion of the metallic article is formed in the preformed pattern. The metallic article is separated from the electrically conductive mandrel, which forms a free-standing metallic article that may be coupled with the surface of a semiconductor material for a photovoltaic cell.Type: GrantFiled: March 13, 2013Date of Patent: December 23, 2014Assignee: GTAT CorporationInventors: Steve Babayan, Robert Brainard, Arvind Chari, Alejandro de la Fuente Vornbrock, Venkatesan Murali, Gopal Prabhu, Venkateswaran Subbaraman, Dong Xu, Arthur Rudin, David Tanner
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Publication number: 20140295208Abstract: Roll-to-roll fabrication of predetermined or ordered three-dimensional nanostructure arrays is described. Provided methods can comprise imprinting a substrate with a two-dimensional (2-D) pattern by rolling a cylindrical pattern comprising a 2-D array of structures against a substrate. In addition, control or determination of nanostructure parameters via control of process parameters is provided.Type: ApplicationFiled: March 10, 2014Publication date: October 2, 2014Applicant: The Hong Kong University of Science and TechnologyInventors: Zhiyong Fan, Siu-Fung Leung
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Patent number: 8845874Abstract: Disclosed are a porous electroformed shell for forming a grain pattern and a manufacturing method thereof. The method includes the step of implanting a fiber into a patterned surface of a negative-type silicone cast; applying, laminating, and curing an epoxy resin on the patterned surface of the negative-type silicone cast, and transferring the fiber from the negative-type silicone cast to an epoxy mandrel during demolding of the epoxy mandrel; forming a conductive thin film on the patterned surface of the epoxy mandrel, and causing the patterned surface to be conductive; removing the fiber having the conductive thin film from a surface of the epoxy mandrel; forming an electrodeposited layer by electrodepositing an electroforming metal on the conductive thin film while generating and growing a fine pore at a position of a hole due to the removal of the fiber; and demolding the electrodeposited layer having the fine pore from the epoxy mandrel.Type: GrantFiled: July 28, 2010Date of Patent: September 30, 2014Assignee: Moltex Co., Ltd.Inventor: Kyung-Ho Lee
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Publication number: 20140272458Abstract: Embodiments of the current disclosure are related to electrodeposition.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Applicant: Xtalic CorporationInventors: Shiyun Ruan, Witold Paw, John Hunter Martin, Alan C. Lund
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Publication number: 20140261661Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The mandrel has an outer surface layer having a preformed pattern. The outer surface layer has a dielectric region and an exposed metal region. The metallic article has a plurality of electroformed elements that are formed on the exposed metal region of the outer surface layer of the electrically conductive mandrel. A first electroformed element has an overplated portion formed above the outer surface layer of the mandrel. The metallic article is configured to serve as an electrical conduit for a photovoltaic cell, and forms a unitary, free-standing piece when separated from the electrically conductive mandrel.Type: ApplicationFiled: December 23, 2013Publication date: September 18, 2014Applicant: GTAT CORPORATIONInventors: Steve Babayan, Robert Brainard, Arvind Chari, Alejandro de la Fuente Vornbrock, Venkatesan Murali, Gopal Prabhu, Arthur Rudin, Venkateswaran Subbaraman, David Tanner, Dong Xu
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Publication number: 20140209470Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.Type: ApplicationFiled: February 19, 2014Publication date: July 31, 2014Inventors: Jeffrey A. Thompson, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley
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Patent number: 8778162Abstract: According to one embodiment, a stamper manufacturing method comprises electroless plating by using a master includes a substrate, a conductive underlayer formed on the substrate and having catalytic activity, projecting patterns having no catalytic activity and partially formed on a surface of the conductive underlayer having catalytic activity, and regions in which the conductive underlayer having catalytic activity is exposed between the projecting patterns to deposit selectively an amorphous conductive layer between the projecting patterns and in the regions in which the conductive underlayer is exposed, and forming stamper projections, electroplating on the stamper projections includes the projecting patterns and the amorphous conductive layer by using the amorphous conductive layer and the conductive underlayer as electrodes to form a stamper main body made of a crystalline metal, and releasing a stamper includes the stamper projections and the stamper main body from the master.Type: GrantFiled: March 31, 2011Date of Patent: July 15, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Masatoshi Sakurai, Takuya Shimada, Shinobu Sugimura, Satoshi Shirotori
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Publication number: 20140178235Abstract: A method for use in producing a stator for a progressing cavity apparatus which includes the use of electroforming to produce the stator tube. A stator tube for a progressing cavity apparatus which is produced using electroforming and a stator for a progressing cavity apparatus which includes a stator tube produced using electroforming.Type: ApplicationFiled: December 17, 2013Publication date: June 26, 2014Applicant: Halliburton Energy Services, Inc.Inventor: David Joe Steele
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Patent number: 8734631Abstract: The invention relates to novel compositions and methods for the detection of analytes using the nuclear reorganization energy, ?, of an electron transfer process.Type: GrantFiled: October 17, 2008Date of Patent: May 27, 2014Assignee: OHMX CorporationInventors: Michael Ahrens, Paul A. Bertin, Amanda Eckermann, Dimitra Georganopoulou, Harry B. Gray, Thomas J. Meade, Markus Franz Wunder
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Patent number: 8646306Abstract: A method for manufacturing a gas sensor element includes (a) printing a wiring pattern of a conductive paste on a green sheet for an oxygen-ion conductive solid electrolyte; (b) laminating a plurality of green sheets including the green sheet having been subjected to step (a) and integrating the plurality of green sheets; (c) cutting out a plurality of element bodies from the laminated body; (d) baking the element body cut out by step (c); (e) heating the element body having been subjected to step (d), in a reducing atmosphere; (f) driving the element body having been subjected to step (e), in an inspection-purpose gas atmosphere for a predetermined time period; and (g) inspecting electrical characteristics of the element body having been subjected to step (f). The element body having passed the inspection of step (g) is assembled as a sensor element in a gas sensor.Type: GrantFiled: November 12, 2010Date of Patent: February 11, 2014Assignees: NGK Insulators, Ltd., NGK Ceramic Device Co., Ltd.Inventors: Hiroyuki Shindo, Kiyotaka Sugiura
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Patent number: 8636485Abstract: A method for use in producing a stator for a progressing cavity apparatus which includes the use of electroforming to produce the stator tube. A stator tube for a progressing cavity apparatus which is produced using electroforming and a stator for a progressing cavity apparatus which includes a stator tube produced using electroforming.Type: GrantFiled: January 24, 2007Date of Patent: January 28, 2014Assignee: Halliburton Energy Services, Inc.Inventor: David Joe Steele
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Patent number: 8623228Abstract: The invention relates to a gear train (51, 51?) including an arbour (53, 53?) a first end of which is fitted with an integral collar (52, 52?), a first wheel set (55, 55?) made of micro-machinable material being fitted onto the second end of the arbour (53, 53?). According to the invention, the gear train (51, 51?) includes a second wheel set (57, 57?) made of micro-machinable material, which is independent of the movements of said first wheel set and which includes an aperture (58, 58?) whose wall is mounted opposite said arbour so that the second wheel set (57, 57?) is freely mounted on said first end of the arbour (53, 53?).Type: GrantFiled: October 6, 2010Date of Patent: January 7, 2014Assignee: Nivarox-FAR S.A.Inventors: Pierre Cusin, Jean-Philippe Thiebaud
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Publication number: 20130313119Abstract: A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.Type: ApplicationFiled: May 25, 2012Publication date: November 28, 2013Inventor: Trevor Pearson
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Publication number: 20130310192Abstract: A golf club head is provided having a club body and a contact plate secured to the club body. The contact plate defines at least a portion of a striking surface having a plurality of striking surface grooves. The contact plate is formed using an electroforming process.Type: ApplicationFiled: May 16, 2012Publication date: November 21, 2013Inventors: Bret H. Wahl, Xinhui Deng
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Publication number: 20130292253Abstract: Formation of an article having capped nano-pillars is provided for herein, the article including a substrate with a nano-structure array formed thereon, the nano-structure array including a plurality of nano-pillars having stem portions of a first thickness and cap portions of a second thickness, different than the first thickness.Type: ApplicationFiled: October 21, 2010Publication date: November 7, 2013Inventors: Peter Mardilovich, Qingqiao Wei, Anthony M. Fuller
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FABRICATION OF MULTILAYERED NANOSIZED POROUS MEMBRANES AND THEIR USE FOR MAKING NOVEL NANOSTRUCTURES
Publication number: 20130228466Abstract: Multilayer porous membranes and methods for fabricating the membranes may have applications in filtration, separation, and nanomanufacturing. The layers of the membrane may be selected based on different physiochemical properties, such as ionization rate and/or etch rate. The pores may be formed by high energy particle bombardment and chemical etching. In some embodiments, the multilayer porous membrane may be utilized to form complex nanostructures by selecting different materials for the layers based on physiochemical properties, layer thickness, stacking sequence, and/or varying the pore generation process.Type: ApplicationFiled: February 25, 2013Publication date: September 5, 2013Applicant: University of HoustonInventor: Li Sun -
Patent number: 8512539Abstract: The invention relates to a method (3) of fabricating a mould (39, 39?, 39?) that includes the following steps: a) providing (10) a substrate (9, 9?) that has a top layer (21, 21?) and a bottom layer (23, 23?) made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, intermediate layer (22, 22?); b) etching (11, 12, 14, 2, 4) at least one pattern (26, 26?, 27) in the top layer (21, 21?) as far as the intermediate layer (22, 22?) to form at least one cavity (25, 25?) in said mould; c) coating (6, 16) the top part of said substrate with an electrically insulating coating (30, 30?); d) directionally etching (8, 18) said coating and said intermediate layer to limit the presence thereof exclusively at each vertical wall (31, 31?, 33) formed in said top layer. The invention concerns the field of micromechanical parts, in particular, for timepiece movements.Type: GrantFiled: March 12, 2010Date of Patent: August 20, 2013Assignee: Nivarox-FAR S.A.Inventors: Pierre Cusin, Clare Golfier, Jean-Philippe Thiebaud
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Method of duplicating nano pattern texture on object's surface by nano imprinting and electroforming
Publication number: 20130192994Abstract: Disclosed is a method of duplicating a nano-pattern texture of the surface of an object through electroforming using an imprint mold, including selecting the object having the surface texture to be duplicated; disposing the selected object and pre-treating the surface thereof; nano-imprinting the surface of the pretreated object, thus duplicating it on a plastic mold; metallizing the surface of the plastic mold through vapor deposition, and performing electroforming, thus manufacturing metal module master molds; trimming the edges of the metal module master molds, performing micro-processing, connecting the metal module master molds, and then performing electroforming, thus manufacturing a large-area metal unit master mold; and electroforming the metal unit master mold, thus producing a duplicate having the surface texture, thus exhibiting an effect in which the skin of a selected natural object can be duplicated on metal having a uniform thickness.Type: ApplicationFiled: December 22, 2009Publication date: August 1, 2013Applicant: EMOT CO., LTD.Inventors: Kyung Wook Lee, Kyung Yul Lee, Jun Sang Jeong -
Publication number: 20130192992Abstract: An article is provided, the article including a substrate having a surface, a nano-structure array formed on the substrate, the nano-structure array including a plurality of nano-structures extending from the surface of the substrate, and a cover layer formed on and around the nano-structures to anchor the cover layer to the substrate.Type: ApplicationFiled: October 21, 2010Publication date: August 1, 2013Inventors: Peter Mardilovich, Anthony M. Fuller, Qingqiao Wei
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Publication number: 20130168253Abstract: A nano-structure (100, 100?) includes an oxidized layer (14?), and at least two sets (24, 24?) of super nano-pillars (20) positioned on the oxidized layer (14?). Each of the at least two sets (24, 24?) of super nano-pillars (20) includes a plurality of super nano-pillars (20), where each set (24, 24?) is separated a spaced distance from each other set (24, 24?).Type: ApplicationFiled: October 21, 2010Publication date: July 4, 2013Inventors: Peter Mardilovich, Qingqiao Wei, Irina Nikolaevna Milonova, Anthony M. Fuller
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Patent number: 8470154Abstract: The method of fabricating metal microstructures includes the following steps: a) taking a substrate that has a conductive strike surface; b) to d) forming a first resin mould by UV photolithography, the apertures in the first resin mould revealing the conductive strike surface of the substrate; e) electroforming the first element by galvanic deposition of a first metal material in the apertures of the first resin mould, f) removing the first mould around the first element to expose the conductive strike surface of the substrate; g) to i) forming a new resin mould by UV photolithography, the apertures in the new resin mould revealing the first element, and the conductive strike surface of the substrate; j) electroforming the second element by galvanic deposition of a second metal material in the apertures of the new resin mould to form said metal microstructure; k) separating said metal microstructure from the substrate and from said new mould.Type: GrantFiled: October 7, 2009Date of Patent: June 25, 2013Assignee: Nivarox-FAR S.A.Inventor: Gilles Rey-Mermet
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Patent number: 8431184Abstract: Some embodiments include methods of forming conductive material within high aspect ratio openings and low aspect ratio openings. Initially, the high aspect ratio openings may be filled with a first conductive material while the low aspect ratio openings are only partially filled with the first conductive material. Additional material may then be selectively plated over the first conductive material within the low aspect ratio openings relative to the first conductive material within the high aspect ratio openings. In some embodiments, the additional material may be activation material that only partially fills the low aspect ratio opening, and another conductive material may be subsequently plated onto the activation material to fill the low aspect ratio openings.Type: GrantFiled: May 7, 2011Date of Patent: April 30, 2013Assignee: Micron Technology, Inc.Inventor: Nishant Sinha
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Publication number: 20130056357Abstract: Sulfonate-, sulfate-, or carboxylate-capped, alkoxylated anti-misting agents having the structure: R((AO)nX)m((AO)nH)p, and methods of suppressing mist from electrolyte solutions by adding a mist-suppressing amount of one or more compounds selected from the group consisting of compounds of the Formulas R((AO)nX)m((AO)nH)p and R3N+(CH3)2R4, and mixtures thereof, to electrolyte solutions.Type: ApplicationFiled: November 5, 2012Publication date: March 7, 2013Applicant: Cognis IP Management GmbHInventor: Cognis IP Management GmbH
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Patent number: 8349163Abstract: According to one embodiment, an electroforming master comprises a patterns of protrusions and recesses formed on one major surface of an Si substrate having two major surfaces, corresponding to information for positioning of a read/write head (a preamble, address, and burst), recording tracks or recording bits. Impurity ions are doped in the surface of this patterns of protrusions and recesses. The impurity ion concentration distribution in the film thickness direction of the Si substrate has a peak in a portion from the patterns of protrusions and recesses surface to a depth of 40 nm in the film thickness direction. The impurity concentration of this peak is 1×1020 to 2×1021 ions/cm3.Type: GrantFiled: December 6, 2010Date of Patent: January 8, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Satoshi Shirotori, Akira Watanabe, Yoshiyuki Kamata, Masatoshi Sakurai
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Publication number: 20120288698Abstract: A method of fabrication, a device structure and a submount comprising high thermal conductivity (HTC) diamond on a HTC metal substrate, for thermal dissipation, are disclosed. The surface roughness of the diamond layer is controlled by depositing diamond on a sacrificial substrate, such as a polished silicon wafer, having a specific surface roughness. Following deposition of the diamond layer, an adhesion layer, e.g. comprising a refractory metal, such as tantalum, and at least one layer of HTC metal is provided. The HTC metal substrate is preferably copper or silver, and may be provided by electroforming metal onto a thin sputtered base layer, and optionally bonding another metal layer. The electrically non-conductive diamond layer has a smooth exposed surface, preferably ?10 nm RMS, suitable for patterning of contact metallization and/or bonding to a semiconductor device. Methods are also disclosed for patterning the diamond on metal substrate to facilitate dicing.Type: ApplicationFiled: March 19, 2012Publication date: November 15, 2012Applicant: Advanced Diamond Technology, IncInventors: Nicolaie A. MOLDOVAN, John Arthur Carlisle, Hongjun Zeng
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Patent number: 8308928Abstract: A method is provided for applying a cover layer (9) to a net structure (4) to be used for medical purposes, in particular a thrombosis filter. The net structure (4) is applied to a planar substrate (1) that covers openings (5) of the net structure on one side, wherein the openings (5) across the uncovered side are filled with a sacrificial material (7), in particular copper. The net structure (4) is lifted from the substrate (1). A cover layer (9) is deposited on the surface previously covered by the substrate, and the sacrificial material (7) is removed.Type: GrantFiled: August 24, 2007Date of Patent: November 13, 2012Assignee: Acandis GmbH & Co. KGInventors: Eckhard Quandt, Christiane Zamponi, Clemens Schmutz
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Patent number: 8287713Abstract: The present invention provides a water-cooled heat sink having an integrated structure, and having inside a precise, freely formed flow path, the water-cooled heat sink being produced without using a technique for pasting a plurality of metal sheets. In a water-cooled heat sink 1, a formed body 2 is provided outwardly, a flow path 3 for passage of a liquid is formed inwardly of the formed body 2, and an inlet 5 and an outlet 4 for the liquid, which communicate with the flow path 3, are formed in the main body of the heat sink 1. The entire formed body 2 of the heat sink 1 is integrally formed by thick coating layers applied by electroplating, and has no joints.Type: GrantFiled: November 17, 2006Date of Patent: October 16, 2012Assignee: Tecnisco, Ltd.Inventors: Houkichi Yoshioka, Takahisa Yoshimura, Tohru Natsume
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Publication number: 20120217163Abstract: Electrodes, components, apparatuses, and methods for electrochemical machining (ECM) are disclosed. ECM may be employed to provide burr-free or substantially burr-free ECM of electrically-conductive workpieces (e.g. shrouds). As one non-limiting example, the electrically-conductive workpiece may be a shroud that is used as an electrical component in electronics boards. While the ECM components, apparatuses, and methods disclosed herein reduce burrs, ECM can provide imprecise machining and cause stray erosions to occur in the machined electrically-conductive workpiece. In this regard, the electrodes, components, apparatuses, and methods for ECM disclosed herein provide features that allow for precise machining of the machined electrically-conductive workpiece and also allow avoidance of stray erosions in the machined electrically-conductive workpiece.Type: ApplicationFiled: February 27, 2012Publication date: August 30, 2012Inventors: Terry George Collins, Dominick John Forenz, Mark Lee Humphrey