Abstract: A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds.

Abstract: Systems and methods for tin antimony plating are provided. One plating method includes doping a tin (Sn) plating solution with antimony (Sb). One method also includes electroplating a component using the antimony-doped tin plating. The antimony-doped tin plating formed by one method includes between about 1% and about 3% antimony.

Abstract: A process for printing a metal wire pattern on a substrate, including: printing a first salt solution including a metal ion that will undergo a reduction half-reaction; printing a second salt solution containing a reductant that will undergo an oxidation half-reaction in contact with the first salt solution, resulting in the reduction of the metal ions of the first salt solution; and allowing the first and second salt solutions to react by a galvanic reaction, causing reduced metal ions of the first salt solution to precipitate as a solid, on the substrate.

Abstract: The present quantum crystals are produced by a method characterized in that an aqueous solution of plasmon metal complex made from a ligand and a plasmon metal selected from the group consisting of gold, silver, copper, nickel, zinc, aluminum, and platinum is prepared and brought into contact with a carrier made of a metal or a metal alloy having an electrode potential lower than an electrode potential of the plasmon metal in the aqueous solution. When the plasmon metal complex is precipitated as quantum crystals arranged on the carrier, the metal complex crystals are formed as metal quantum dots.

Abstract: A metal implant for use in a surgical procedure is provided with a surface layer that is integral with the metal substrate, and which incorporates a biocidal material. The surface layer may be grown from the metal substrate, by anodizing, and the biocidal material incorporated in it by ion exchange. Alternatively the layer may be deposited by electroplating, followed by diffusion bonding so as to become integral with the metal substrate. In either case, silver is a suitable biocidal material; and both the release rate and the quantity of biocidal material should be low to avoid toxic effects on body cells. Electropolishing the surface before formation of the surface layer is also beneficial, and this may be achieved by electropolishing.

Abstract: There is provided a method of forming a gold thin film, the method including: forming a nickel plating layer on a surface of an object through electroless nickel (Ni) plating; forming a palladium-copper mixture plating layer on the nickel plating layer through electroless plating using a palladium-copper (Pd—Cu) mixture; and forming a first gold thin film by immersing the palladium-copper mixture plating layer in a gold (Au) galvanic electrolytic liquid to replace a portion of copper (Cu) particles in the palladium-copper mixture plating layer with gold particles through a replacement reaction.

Abstract: A method of making a membrane permeable to hydrogen gas (H2?) is disclosed. The membrane is made by forming a palladium layer, depositing a layer of copper on the palladium layer, and galvanically displacing a portion of the copper with palladium. The membrane has improved resistance to poisoning by H2S compared to a palladium membrane. The membrane also has increased permeance of hydrogen gas compared to palladium-copper alloys. The membrane can be annealed at a lower temperature for a shorter amount of time.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: A Ti02-based photocatalyst is fabricated as a composite of titania with adhered nanostructures which contain a non-noble metal in galvanic contact with a noble metal. The catalyst effectively overcome aging and/or deactivation effects observed in a system free of the non-noble metal. The composite material showed a corrosion protective effect on the photoactivity of fresh catalyst for over 180-240 days, and it enhanced the rate of the water reduction reaction relative to bare Ti02. Variations in porosity and non-noble metal content of the alloy portion of the nanostructures influenced the performance of the catalyst composite. The protective effect of the non-noble metal is through a cathodic corrosion protection mechanism.

Abstract: An apparatus and method for the synthesis and treatment of electrocatalyst particles in batch or continuous fashion is provided. In one embodiment, the apparatus is comprised of a three-electrode cell which includes a reference electrode, a counter electrode, and a working electrode. The working electrode is preferably a cylindrical vessel having an electrically conductive region. The electrode assembly is introduced into a slurry containing metal ions and a plurality of particles. During operation an electrical potential is applied and the working electrode is rotated at a predetermined speed. When particles in the slurry collide with the electrically conductive region the transferred charge facilitates deposition of an ad-layer of the desired metal. In this manner film growth can commence on a large number of particles simultaneously. This process is especially suitable as a commercial thin film deposition process for forming catalytically active layers on nanoparticles for use in energy conversion devices.

Abstract: Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.

Abstract: Embodiments of the invention generally provide core-sheath nanostructures and methods for forming such nanostructures. In one embodiment, a method for forming core-sheath nanostructures includes stirring an aqueous dispersion containing silver nanostructures while adding a catalytic metal salt solution to the aqueous dispersion and forming catalytic metal coated silver nanostructures during a galvanic replacement process. The method further includes stirring an organic solvent dispersion containing the catalytic metal coated silver nanostructures dispersed in an organic solvent while adding a nickel salt solution to the organic solvent dispersion, and thereafter, adding a reducing solution to the organic solvent dispersion to form silver-nickel core-sheath nanostructures during a nickel coating process.

Abstract: The present invention relates to methods of fabricating nanostructures using a replacement reaction. In a preferred embodiment, metal particles in an inert atmosphere undergo a replacement reaction to form a layer on the metal particle which is removed to form a high surface area nanostructure. A preferred embodiment includes the fabrication of heater elements, powders and heater assemblies using the nanostructures.

Abstract: The present invention relates to a method of electrochemically desorbing or adsorbing a cryptate [18F] fluoride complex using a substituent substituted cryptand A. The present invention also relates to an apparatus and a kit for performing this method. A: which can be used for nucleophilic radiofluorination.

Abstract: A method of producing a substrate provided with a metal nanostructure on the surface thereof, including: forming a layer containing a block copolymer having a plurality of polymers bonded on a surface of a substrate, and subjecting the layer to phase separation, selectively removing a phase of at least one polymer of the plurality of copolymers constituting the block copolymer from the layer to expose part of the surface of the substrate, and allowing a metal ion to come into contact with the exposed surface of the substrate to effect an electrochemical reaction between the surface of the substrate and the metal ion, thereby depositing a metal on the surface of the substrate; and a substrate provided with a metal nanostructure on the surface thereof produced by the same method.

Abstract: A method for fabricating nanostructures, which includes the steps of forming a multi-segmented nanowire; and performing a galvanic displacement reaction on the multi-segmented nanowire. The method utilizes template directed electrodeposition to fabricate nanowires with alternating layers of sacrificial/noble metal, enabling a new level of control over particle spacing, aspect ratio, and composition. Moreover, by exploiting the redox potential dependent reaction of galvanic displacement, nanopeapod materials can be extended (semiconductor/metal, p-type/n-type, metal/metal, ferromagnetic/nonmagnetic, etc.) beyond the fundamental metal/metal-oxide nanopeapods synthesized by high temperature techniques. In accordance with an exemplary embodiment. Co/Au and Ni/Au multisegmented nanowires were used to create Te/Au nanopeapods by galvanic displacement, producing Te nanotubes and nanowires with embedded Au particles, respectively.

Abstract: The present invention relates to methods of fabricating nanostructures using a replacement reaction. In a preferred embodiment, metal particles in an inert atmosphere undergo a replacement reaction to form a layer on the metal particle which is removed to form a high surface area nanostructure. A preferred embodiment includes the fabrication of heater elements, powders and heater assemblies using the nanostructures.

Abstract: A method of making a membrane permeable to hydrogen gas (H2?) is disclosed. The membrane is made by forming a palladium layer, depositing a layer of copper on the palladium layer, and galvanically displacing a portion of the copper with palladium. The membrane has improved resistance to poisoning by H2S compared to a palladium membrane. The membrane also has increased permeance of hydrogen gas compared to palladium-copper alloys. The membrane can be annealed at a lower temperature for a shorter amount of time.

Abstract: A method for forming a block copolymer pattern on a substrate, wherein the areal density of nanostructures in the pattern is increased by increasing the thickness of the block copolymer film that is applied to the substrate.

Abstract: A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (?) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability.

Abstract: A method for passivating at least part of the feed conducting conduit of a pyrolysis furnace to reduce the deposition of coke in that conduit, the passivation being accomplished by employing at least one phosphorous containing compound.

Abstract: The present invention relates to a method of preparing a porous silicon nanorod structure composed of columnar bundles having a diameter of 50-100 nm and a length of 2-5 ?m, and a lithium secondary cell using the porous silicon nanorod structure as an anode active material. The present invention provides a high-capacity and high-efficiency anode active material for lithium secondary cells, which can overcome the low conductivity of silicon and improve the electrode deterioration attributable to volume expansion because it is prepared by electrodepositing the surface of silicon powder with metal and simultaneously etching the silicon powder partially using hydrofluoric acid.

Abstract: A method of processing a superhydrophobic surface and a solid body having the superhydrophobic surface processed by the method are provided. The method forming a plurality of nano-scale holes having nano-scale diameter on a surface of a metal body through an anode oxidation process, forming a replica by immersing the metal body provided with the nano-scale holes in a hydrophobic polymer material and solidifying the hydrophobic polymer material, and forming the superhydrophobic surface by removing the metal body with an anode oxide. The solid body includes a base, and a surface structure having micro-scale unevenness formed by a plurality of bunches formed by a plurality of adjacent pillars that are formed on the base and have a nano-scale diameter.

Abstract: A method of producing an electronic component includes forming a film of a first metal above a substrate; converting partly the film of the first metal into a film containing a second metal by replacement of at least part of the first metal with the second metal; forming a film of a third metal above the film containing the second metal; and removing the film of the first metal other than the film containing the second metal by wet etching using the film of the third metal as a mask.

Abstract: The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 ?m.

Abstract: An improved process for treating an electrically conductive surface of a workpiece by cleaning or coating the surface is provided, comprising the steps of deploying the electrically conducting surface of the workpiece to form a cathode in an electrolytic cell; establishing a DC voltage between the cathode and an anode; forming a working gap between the anode and the cathode, and establishing a seal around the working gap to form a sealed treatment zone; delivering into the working gap an electrically conductive medium selected from the group consisting of: (A) an aqueous electrolyte from which a foam is created; (B) a foam; and a mixture of components (A) and (B), so that electrically conductive medium consisting of a foam comprising a gas/vapor phase and a liquid phase fills the working gap, wherein said electrically conductive medium enters the electrolytic cell through tubes having discharge ends oriented at approximately ten degrees from parallel to the workpiece, and wherein turbulence is created within

Abstract: A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid and 0.02 mol/L to 0.3 mol/L of sulfite, and has a pH adjusted to 5.0 to 8.5. A method for copper plating according to the present invention is characterized by that it comprises using the copper plating solution above. The copper plating solution and the method for copper plating according to the present invention stably provide a uniform copper plating film excellent in adhesion on the surface of an article to be plated, such as rare earth metal-based permanent magnet.

Abstract: The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of the invention also contain at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms. The present invention also relates to methods for depositing zinc alloy protective coatings on aluminum and aluminum alloy substrates comprising immersing the aluminum or aluminum alloy substrate in the non-cyanide acidic immersion plating solutions of the invention. Optionally, the zinc alloy coated aluminum or aluminum alloy substrate is plated using an electroless or electrolytic metal plating solution.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: A method and apparatus wherein an electrically conductive element is placed inside a previously installed metallic water vessel such as a supply pipe or well. A direct current voltage is then applied between the element and the conductive wall of the vessel. The conductive element can be a partially insulated wire. For causing deposition on the vessel, the voltage applied to the conductive element is of an amount sufficient to cause the potential of the metallic vessel to be lowered below the potential of the element by at least ?0.3 volts, and more adequately ?1.3 volts. An alternative embodiment involves reversing the polarity of the voltage applied between the conductive element and the vessel, causing the oxidation/reduction reaction to reverse, resulting in calcium carbonate being removed from the vessel by the production of acid at the surface of the vessel.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: A solvent, such as deionized water, is heated up to boil to remove the oxygen dissolved in the water before preparing the plating solutions for the growth of copper interconnects. The resistance of the copper grown from the EDD solutions having undergone the oxygen-removing process is greatly improved, down to a value very close to copper's ideal value.

Abstract: The invention relates to a method of depositing a layer of metal and to a method of regenerating a solution containing metal ions in a high oxidation state. To regenerate tin ions consumed from a tin plating solution by metal deposition, it has been known in the art to carry the plating solution over metallic tin to cause tin (II) ions to form. However, the amount of tin contained in thus regenerated baths slowly and continuously increases. The solution to this problem is to utilize an electrolytic regeneration cell that is provided with at least one auxiliary cathode and with at least one auxiliary anode. Tin serving for regeneration is electrolytically deposited from the solution onto the at least one auxiliary cathode in the electrolytic regeneration cell. The solution is carried over the tin serving for regeneration in order to reduce formed tin (IV) ions to tin (II) ions.

Abstract: A film carrier tape for mounting electronic devices thereon has a tin-bismuth alloy deposit in which the bismuth content in the deposit is substantially uniform along a thickness direction thereof. The film carrier tape can be produced by plating at least a part of a wiring pattern with a tin-bismuth alloy and washing the tin-bismuth alloy deposit formed by plating with a water-ejecting washing nozzle within 6 seconds after the plating is completed. A plating apparatus for use in the above production includes a washing nozzle for washing the film carrier tape within 6 seconds after the film carrier tape has exited a plating tank.

Abstract: The invention relates to a method for coating workpieces. According to said method, an alloy containing at least phosphorus and nickel is precipitated from an electrolyte to produce a functional, especially corrosion-resistant and wear-resistant metallic coating. The aim of the invention is to provide a means of increasing wear resistance and hardness and improving the anti-corrosion effect with a significantly higher rate of incorporation of elementary phosphorus. To this end, an at least quarternary alloy with the components nickel, cobalt, wolfram and phosphorus is electrolytically precipitated in the form of a coating. The invention also relates to a corrosion-resistant and wear-resistant coating with essentially the following composition: 0.5 to 2.0 wt. % wolfram; 1.0 to 2.0 wt % cobalt; 15 to 20 wt. % phosphorus and at least 10 wt. % nickel.

Abstract: A method for producing an inner tin film on the surface of plumbing components, such as those made of red brass or yellow brass, for drinking water supply. The lead content on the inner surface of the hollow component parts is first reduced by treatment with an acid-based aqueous reducing solution. For this purpose, chloride-free and sulfate-free, non-oxidizing hydracids may be used. The hollow component parts are subsequently chemically internally tinned.

Abstract: A method for controlling plating with two independent power sources, wherein the high voltage power source is used for controlling the electrical swimming speed of the metal positive ions while the other is low-voltage power source for being used to control rate of plating rate. Positively charged metal ions of the strong electric field in the plating solution can reach to the negatively charged and unevenly distributed surface of the extraction negative pole more quickly, which is in turn connected to the negative of the low voltage power source. The ions aggregate at the recess of the extraction negative pole surface and waiting incoming electrons so as to perform electric extraction and produce uniform plating. The present invention also provides the apparatus for carrying out the mentioned method and therefore achieves better plating quality.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, ampihateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: A process for plating copper on particulate graphite comprises cleaning and drying the graphite particles; wetting the graphite particles with an aqueous solution of cupric sulfate and glacial acetic acid; dripping the graphite particles as wetted with a layer of the aqueous solution on a rotating metal (including zinc, aluminum and iron) disk to conduct a displacement reaction to plate copper, as displaced by the metal existing in situ on the metal disk, on each graphite particle; and washing the graphite particles as plated by copper with water and then drying the copper-plated graphite particles.

Abstract: A process for enhancing the solderability of a surface, particularly copper surfaces upon printed circuit boards, is disclosed. The surface is plated using a silver plating solution. The plated surface is then further treated with a solution that comprises an organic heterocyclic mercapto compound and most preferably an alkali metal hydroxide.

Abstract: The present invention provides an ozone generating system that combines single-use elements or segments with an extended use fixture that is used to activate the single-use elements. One embodiment of the invention consists of a strip of proton exchange membrane (PEM) having the ozone producing catalyst applied directly onto one side of membrane. Optionally, the application of this catalyst may be divided into segments or patches, wherein each segment represents the limited-use portion of the ozone generator. Each segment may be advanced into a fixture that provides the balance of the electrochemical system required for operation of the ozone generator. This balance of system may include additional subsystems, with a power supply, water source, electrical contacts, electronic controllers, sensors and feedback components, being typical examples.

Abstract: The present invention describes a method of producing gold coating on a workpiece having a palladium surface, having the steps of: a) making an aqueous solution containing at least one compound selected from the group of compounds containing gold(I) and gold(III) ions and additionally at least one organic compound selected from the group consisting of formic acid, aromatic carboxylic acids having the chemical formula: where R1, . . . , R4=H, alkyl, alkenyl, alkynyl, OH, and the salts, esters or amides of these compounds; b) adjusting the pH of the solution to 1 to 6 using pH adjusting agents; and c) bringing the workpiece into contact with the solution such that gold coating is plated onto the palladium surface.

Abstract: The invention is directed to corrosion and wear resistant metallic coatings containing nickel, boron, particles. The coatings are preferably deposited on catalytically active substrates from an electroless coating bath containing nickel ions, a stabilizer, a metal ion complexing agent, particles and a borohydride reducing agent, at a pH of about 10 to about 14.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: Acidic electrolyte for dip-tin-plating aluminum alloys, containing tin salts, surfactants and additives yielding halogen ions, fluorine complexes, having the optimum effective halogen content that corresponds to its maximum solubility, being added as additives yielding halogen ions.

Abstract: A method of preparing a hard disc comprising steps of:immersing an aluminum or aluminum alloy substrate in a zincate solution containing a zinc compound, an alkali hydroxide, and at least one amine to thereby form a zincate film on the surface of the substrate,immersing the zincate film-formed substrate in an electroless nickel plating solution comprising a water-soluble nickel salt, a complexing agent, and a hypophosphite to thereby form a nickel--phosphorus alloy layer on the surface of the zincate film-coated substrate, and forming a magnetic layer on the nickel--phosphorus alloy layer.

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver. REEXAMINATION RESULTS The questions raised in reexamination proceedings Nos. 90/012,336 and 90/009,934, filed Jun. 4, 2012 and Aug.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.