Abstract: A housing assembly is described that includes a first member, a second member having an opening formed therein, and a gasket interposed between the first and second members. The first and second members are attached, a gap between the attached first and second members is exposed by the opening formed in the second member, and a dimension of the gap is indicative of a condition of a seal by the gasket of the second member to the first member.

Abstract: The present disclosure provides a motor including a stator, a rotor and a first circuit board. The stator includes a winding assembly including a plurality of coils. A conductive element is extended out from the winding assembly and is electrically connected to a first electrical connector. The first electrical connector penetrates through a pillow of the stator and is electrically connected to the first circuit board. The motor further includes a second circuit board electrically connected to the first circuit board, and a first insulation plate, a second insulation plate and a third insulation plate for fixing and protecting the circuit boards. The motor also includes a clip for fixing and heat dissipating an electronic component disposed on the second circuit board.

Abstract: An electronic device of the present disclosure includes a body unit, and a keyboard unit disposed on the body unit. The keyboard unit includes a keyboard, a housing that has a frame shape and houses the keyboard, and a plurality of retainers connected to the housing to retain the keyboard. A plurality of retainers are formed of a material having a specific rigidity higher than that of the housing.

Abstract: A method includes fabricating a device including a first dielectric layer, an optical waveguide in the first dielectric layer, and a superconducting circuit in the first dielectric layer and on the optical waveguide. The method also includes forming a sacrificial structure on the first dielectric layer, the sacrificial structure aligned with the superconducting circuit, depositing a second dielectric layer on the sacrificial structure, and cutting an opening in the second dielectric layer to expose the sacrificial structure. The method further includes wet etching the sacrificial structure through the opening and sealing the opening in the second dielectric layer with a third dielectric layer to form a micro-channel between the first dielectric layer and the second dielectric layer.

Abstract: An object of the invention is to provide an electronic control unit having a structure that suppresses corrosion of plating and completely seals the substrate side under an environment where corrosion occurs. An electronic control unit 1 includes a printed wiring board 10 in which electronic components are provided, a case 20 in which the printed wiring board 10 is accommodated, and a cover 22 that is provided on the case 20. The case 20 and the cover 22 have joint surfaces that face each other and are connected via a sealing material 28. The joint surface is provided with a screw 30 that passes through the cover 22 or the case 20. A plating 24 is provided in a surface of the case 20 or the cover 22 that is provided with a through hole through which the screw 30 penetrates. An exposed portion 25a of a base material formed by partially peeling off the plating 24 presents inside the case 20 or the cover 22 and on an inner side of the case 20 from the through hole.

Abstract: A reclosable cup lid that can include an upper surface having at least one recess formed therein, that is arcuate in shape. The reclosable cup lid can also include a tab configured to fit within the recess. The tab having an arcuate shape corresponding to the arcuate shape of the recess. The reclosable cup lid can also include an opening disposed within the recess to allow fluid flow therethrough. The tab can be adapted to move within the recess from a first position to a second position so that the opening is at least partially blocked when the tab is located in the first position and the opening is at least partially unobstructed when the tab is located in the second position.

Abstract: A tray includes a body for placement of a component (e.g. electronic component) and a taker disposed on a bottom surface of the body. The taker is used to take a spacer and includes a first taking element and a second taking element. The first taking element includes a first connection portion and a first confinement portion, and the second taking element includes a second connection portion and a second confinement portion. An accommodation space is provided between the first and second connection portions and a passageway is provided between the first and second confinement portions. While the spacer is moved through the passageway and into the accommodation space, it is confined in the accommodation space by the first and second confinement portions such that the taker can take away the spacer to show another tray located under the spacer as the tray is removed.

Abstract: Support bracket and support bracket assemblies for a peripheral component interconnect (PCI) card are shown and disclosed. In one embodiment, the support bracket includes a first planar member having opposed first and second end portions, and a second planar member attached to, or formed with, the second end portion. The second planar member is perpendicular to the first planar member and is attachable to an I/O PCI bracket. The support bracket additionally includes a ledge attached to, or formed with, the first planar member. The ledge extends between the first and second end portions and is perpendicular to the first and second planar members. The ledge is sized to support an end portion of the PCI card when the PCI card is attached to the I/O PCI bracket and when the second planar member is attached to the I/O PCI bracket.

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

Abstract: A card holder includes a card tray, a card cover and a first connecting rod. The card tray is configured to accommodate a data card. The card cover is rotatably connected to the card tray, and includes opposite first and second ends and a first protrusion extending towards the card tray. The first connecting rod has an end connected to the card tray and another end rotatably connected to the card cover, and is configured to rotate relative to the card cover such that the card cover approaches to or is away from the card tray. When the card holder is inserted into a housing and a pushing force is applied to the first end, the card cover is rotatable about the first protrusion such that the first end extends further into the housing and the second end extends out of the housing. An electronic device is also provided.

Abstract: A card holder is used for an electronic device having a housing, and is able to accommodate a data card and be inserted into the housing. The card holder includes a card tray and a card cover. The card tray is configured to accommodate the data card. The card cover is connected to the card tray, is rotatable relative to the card tray, and includes a first end and a second end opposite to each other and a first protrusion extending towards the card tray. When the card holder is in a state of being inserted into the housing and a pushing force is applied to the first end, the card cover is rotatable about the first protrusion such that the first end extends further into the housing and the second end extends out of the housing. An electronic device is also provided.

Abstract: Present disclosure relates to a system for validating target backplane controller chips. The system includes a backplane controller chip validation board. In certain embodiments, the backplane controller chip validation board includes: (a) a program/verify/validate controller chip, (b) one or more backplane controller chip sockets for installing one or more target backplane controller chips, and (c) a backplane simulator. The program/verify/validate controller chip includes backplane controller chip firmware verification software, a USB interface, and a software storage. The backplane simulator is used to simulate functions of drives, LEDs, and other devices of a backplane for verifying all functions of target backplane controller chips. The backplane controller chip validation board is in communication with a host computer, and the host computer has a user interface, a backplane controller chip validation software, a USB interface, and a software storage to store backplane controller chip firmware.

Abstract: Present disclosure relates to a system for programming and verifying backplane controller chip firmware on target backplane controller chips. The system includes a backplane controller chip validation board. In certain embodiments, the backplane controller chip validation board includes: (a) a program/verify/validate controller chip, (b) one or more backplane controller chip sockets for installing one or more target backplane controller chips, and (c) a backplane simulator. The program/verify/validate controller chip includes backplane controller chip firmware verification software, a USB interface, and a software storage. The backplane simulator is used to simulate functions of drives, LEDs, and other devices of a backplane for verifying all functions of backplane controller chip firmware.

Abstract: A semiconductor device includes: semiconductor modules in which a circuit board having at least one or more semiconductor chips mounted thereon is sealed with a mold resin material and an attachment hole is formed; main terminal plates that individually connect individual connection terminals of the plurality of semiconductor modules which are arranged in parallel; and a module storage case into which the plurality of the semiconductor modules connected by the main terminal plates are inserted integrally with the main terminal plates from an opening portion and which holds the plurality of semiconductor modules such that the position of the semiconductor modules can be adjusted during attachment and includes attachment insertion holes facing the attachment holes of the semiconductor modules.

Abstract: A semiconductor device includes: a plurality of semiconductor modules, each of which includes a semiconductor circuit having a circuit board on which at least one or more semiconductor chips are mounted; and a module storage case that accommodates the plurality of semiconductor modules which are arranged in parallel. In the module storage case, a plurality of pairs of positioning guide members, which position and guide the semiconductor modules, are formed on opposite surfaces forming a module storage region for accommodating the semiconductor modules so as to protrude inward and to face each other, so that a distance between the plurality of semiconductor modules in a longitudinal direction can be selected. A pair of fitting concave portions, which are fitted to the pair of positioning guide members, are formed at both ends of each semiconductor module in the longitudinal direction.

Abstract: A latch assembly operable for securing an electronic circuit card in a chassis such that connectors associated with the electronic circuit card and a backplane of the chassis are properly coupled, the latch assembly including: an elongate handle structure, wherein a proximal end of the elongate handle structure defines a hole and includes a protruding portion that is configured to engage a recess or lip associated with the chassis, and wherein a distal end of the elongate handle structure includes a handle portion; a spring structure partially obstructing the hole defined by the proximal end of the elongate handle structure; and a rotation member disposed through the hole and configured to engage the electronic circuit card, wherein the spring structure partially obstructing the hole contacts a portion of the rotation member.

Abstract: A fixing mechanism includes a base, a substrate and a latch. The base includes a constraining component and a contacting component. The substrate is slidably disposed on the base. The substrate includes a body, a fixing hole structure and a connecting portion. The base and the body respectively hold circuit boards. The fixing hole structure is disposed on the body for sheathing the constraining component. The fixing hole structure includes a first opening and a second opening, the second opening is connected to the first opening in a linearly stretching manner. The latch is rotatably disposed on the substrate. The latch includes a bar and a driving portion. The driving portion is disposed on an end of the bar and movably contacts against the contacting component. The driving portion slides relative to the contacting component with rotation of the bar to connect the connectors of the circuit boards.

Abstract: A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the first abutting section being mounted via an elastic unit, the first abutting section and the second abutting section delimit an electronic component receiving volume in which the electronic component is to be received in the receptacle, the elastic unit extends below a bottom side of the electronic component receiving volume, and the elastic unit is adapted to provide a clamping force for clamping the electronic component between the first abutting section and the second abutting section.

Abstract: An electronic device includes a circuit substrate, a bottom case, and a top case. The circuit substrate has a plurality of slits penetrating therethrough. The bottom case has a groove portion positioned at an inside surface of the bottom case such that edge portions of the circuit substrate are slidable and inserted into the groove portion. Besides, a plurality of pin-shaped protrusion portions is provided in the bottom case to be snib-fitted with the top case, and each protrusion portion has a plurality of locking portions at a tip end portion. Each protrusion portion elastically biases the circuit substrate toward the top side of the bottom case and presses the circuit substrate to a top surface of the groove portion by locking the locking portions to the circuit substrate after the locking portions are respectively inserted into the slits.

Abstract: In an electronic device, a circuit substrate is provided with at least one electronic circuit, and a case accommodates the circuit substrate. The case has a pair of groove portions and a side opening portion. The groove portions are provided, such that edge portions of the circuit substrate are slidable and inserted into the groove portions from the side opening portion. A box-shaped cover is disposed to close a bottom opening portion of the case. The cover includes a pair of side walls having top end portions, and a plurality of protrusion portions projecting from the top end portions of the side walls. The protrusion portions are inserted into a space between the edge portions of the circuit substrate and the groove portions, at a bottom side of the circuit substrate, to fix the circuit substrate.

Abstract: The present invention discloses a display panel packaging structure which is directed to avoid the damage of the display panel during transportation. The display panel packaging structure comprises a box and a cover covering the box. The box is adapted to receive a display panel and the box is provided with at least a stopper therein adapted to abut against a side surface of the display panel. The present invention is adapted to fix the display panel.

Abstract: The present invention relates to a packing box for accommodation of plate bodies, which comprises a backplane, and a side plate vertically arranged at the periphery of the backplane, the plate body including a main body, and a PCB plate connected through a flexible sheet to the edge of the main body, a positioning member being further arranged in the space enclosed by the backplane and the side plate for preventing the PCB plate from moving relative to the main body. The positioning member of the present invention can prevent the PCB plate from moving relative to the main body of the plate body, playing a role in protecting the circuit on the flexible sheet and having low costs.

Abstract: An outer circumferential groove filled with a seal material and an opposing surface portion are provided to a fit portion of a case. A tray portion opposing the opposing surface portion and an outer circumferential protruding portion entering the outer circumferential groove are provided to the fit portion of a cover. Master dimensions are set so that an outer clearance A0 between the outer circumferential groove and the outer circumferential protruding portion is always larger than an inner clearance C0 between the former and the latter when center positions of the cover and the case coincide with each other.

Abstract: A package for holding metal-ceramic substrates, the package includes a tray manufactured from a flat material with at least one holder adapted to a format of the metal-ceramic substrates for holding the metal-ceramic substrates, an interior of the at least one holder of the tray being defined by a bottom and circumferentially by an edge and by at least one covering completely accommodating the tray, and the tray is sealed vacuum-tight by the covering and the covering has an interior accommodating the tray, and the tray is impinged with a vacuum so that the metal-ceramic substrates are fixed in the at least one holder by clamping on an edge-side of the tray by forces (F) exerted on the edge resulting from the ambient pressure.

Abstract: A carriage case, in which electronical parts are received for transportation, is provided as being capable of securely holding such parts therein and preventing them from being damaged and hampering dust from attaching on them with the removal of electrostatic charge and reducing gas detrimental to such parts to the minimum. The carriage case comprises: a case body having a base member and a cover member; and a sheet member that is made from an adhesive material of curable composition essentially consisting of component (A): a polyoxyalkylene based polymer having more than one alkenyl groups in one molecule, component (B): a compound having at least two hydrosilyl groups in one molecule and component (C): a hydrosilylation catalyst. The sheet member is applied on an inner bottom side surface of the base member and on the sheet member. The parts are attached so as to be securely positioned in the case.

Abstract: A rigid holder is provided for supporting a flexible article. The rigid holder may include a first frame member and a second frame member which are held together through magnets.

Abstract: A locking apparatus for locking a magazine configured to receive a printed circuit board (PCB) may include an actuator, a rotating block, and a locking member. The actuator may be installed on the magazine. The rotating block may be connected to the actuator. The rotating block may be rotated about a vertical axis. The locking member may be rotatably connected to the magazine about the vertical axis. The locking member may be selectively combined with the rotating block to block a front face of the magazine, thereby preventing breakaway of the PCB from the magazine.

Abstract: A housing for accommodating a circuit board, comprising a first housing part having a first floor and a first side wall, and a second housing part having a second floor and a second side wall. The first housing part has a catch protrusion in an area of at least one corner, said protrusion protruding past the first side wall. The second housing part has a catch recess in the area of at least one corner.

Abstract: A method and system for providing a customized storage container includes a generally rectangular housing and at least one printed circuit board contained within the rectangular housing. The customized storage container encloses a first row of interconnector modules that are positioned adjacent to a first, open end of the rectangular housing. The customized storage container also encloses a second row of interconnector modules positioned adjacent to the first, open end of the rectangular housing. At least one air vent is positioned along a side of the rectangular housing and adjacent to a second, closed end of the rectangular housing. According to one exemplary embodiment, the storage container can comprise a single printed circuit board for supporting the first and second row of interconnector modules. In another exemplary embodiment, the storage container can comprise two printed circuit boards for supporting the first and second rows interconnector modules.

Abstract: The present invention includes a ceiling portion 8, bottom portion 9, a substrate housing portion 3 formed by a side walls 5 to 7, a plurality of wafer slots 11 arrayed in parallel on the inner surface of the side walls 6 and 7, a slit portion 12 formed in an extended manner along the array direction of the wafer slots 11 on each of a second side wall 6 and a third side wall 7, a slide portion 18 movably arrayed along each of the slit portions 12, a plurality of substrate securing pieces arrayed with substantially the same intervals with the intervals of the wafer slots 11 on the inner surface of the slide portion 18, in which, with the slide portion being in a substrate securing position, the substrate housing pieces press and secure the substrate on the wafer slot 11, and in a substrate securing releasing position, the substrate housing pieces move separately from a circumferential portion of the substrate and releases a securing state of the substrate.

Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.

Abstract: The present invention relates to a sealed box apparatus for a pool cleaning machine wherein the sealed box is installed inside the body of the pool cleaning machine. The box contains and seals electronic devices for the cleaning machine. At least one waterproofed tube is provided for inputting and outputting wires for connecting the electronic devices sealed inside the box with peripherals. A transparent portion is installed on one side of the box. A humidity display is installed inside the box, and corresponds to the position of the transparent portion. The sealed box provides an excellent airproof seal for protecting the inside electronic circuits from being waterlogged, and to provide excellent heat elimination, while leakage into the sealed box may be conveniently monitored in real-time.

Abstract: A circuit board storage bag and a storage rack are disclosed. A plurality of printed circuit board storage bags for accommodating a circuit board comprise a front surface portion and a rear surface portion opposed to the obverse and reverse surfaces, respectively, of the circuit board accommodated in the circuit board storage bag and connecting portions for connecting the front surface portion and the rear surface portion. The front surface portion and the rear surface portion bend at the connecting portions to open and close the circuit board storage bag for use in transporting the circuit board. The circuit boards are stored in a storage rack having an inclined mounting surface for mounting the storage bags and a bag stopper at the lower end of the mounting surface. The bags are stored in vertical position on one side at the lower end of the mounting surface.

Abstract: An exemplary chip card holder used in a portable electronic device for holding a chip card is provided. The chip card holder includes a body member, a latching piece and a releasing piece. The body member includes a bottom wall and a first sidewall perpendicularly protrudes from the bottom wall. The latching piece is disposed on the first sidewall opposite to the bottom wall to resist against a chip card assembled within the chip card holder. The releasing piece is disposed on the bottom wall opposite to the first sidewall and is configured to form a receiving space together with the bottom wall and the first side wall to accommodate the chip card. The releasing piece is configured to selectively lock and release the chip card.

Abstract: A thin plate storage transport system including a pressure container for containing a thin plate provided with a container main body for containing one or a plurality of thin plates, a lid body attached by covering the container main body, and a seal for airtightly isolating a containing space formed inside from an outside environment when the container main body is closed and covered by the lid body; and a pressure supply device for setting a pressure inside the containing space at a set pressure higher than an outside pressure by supplying a pressure into the containing space of the pressure container for containing a thin plate. As a result, the inside of the containing space can be kept at high cleanliness for a long time.

Abstract: A circuit board case including: a cover that includes a cover front wall and a rise wall connected to the cover front wall, the cover being attachable to an attaching object at a position on the rise wall opposite the cover front wall; and a case that houses a circuit board and includes a case front wall and a first wall surface oriented toward a direction opposite the case front wall, the case being housed in the cover such that the case front wall opposes the cover front wall. A fitting that engages the first wall surface is formed in the rise wall of the cover so as to urge the case toward the cover front wall and thus hold the case within the cover.

Abstract: A container for storing plates for electronic circuits, able to be used in an automatic store, comprises a supporting base provided with a first face defining a supporting plane and a second face defining a storage plane. The container has at least a portion of wall, disposed in correspondence with one side of the supporting base, converging in a first corner of the supporting base and cooperating with holding elements present in an adjacent side and defining respectively a first abutment plane and a second abutment plane substantially orthogonal with each other and with the supporting plane.

Abstract: Methods, systems, and apparatuses for integrated circuit packages, transport containers, and for transporting integrated circuit packages are provided. A transport container for an integrated circuit package includes a body and a plurality of mounting features. The body has a surface that includes a package receiving region. The plurality of mounting features is positioned in the package receiving region. A first mounting feature is positioned on a first inner surface of the package receiving region and a second mounting feature is positioned on a second inner surface of the package receiving region. The package receiving region is configured to receive an integrated circuit package such that the received package is supported by the plurality of mounting features. The first and second mounting features coincide with respective spaces in first and second edges of an array of solder balls on a surface of the package.

Abstract: The carrier frame relating to the present invention comprises a base layer member, a frame layer member, and a positioning layer member having multiple openings for storing electronic components. A spring layer member is mounted in a hollow part surrounded by the frame layer member between the positioning layer member and the base layer member. At each opening of the spring layer member, a small spring providing an elastic force for fastening the electronic components between an edge of the corresponding opening of the positioning layer member and the small spring is formed integrally with the spring layer member. At one end in the longitudinal direction of the spring layer member, a large spring providing an elastic force along the longitudinal direction by being in contact with an inner surface of the frame layer member in the mounted state is formed integrally with the spring layer member.

Abstract: A vibration isolator device for printed wiring boards. An example vibration isolator device includes a solder tab with an elastomeric material that is adhesively attached to a first side of the solder tab. The second side of the solder tab is attached to a printed wiring board. Solder paste is pre-applied to the printed wiring board prior to attachment of the vibration isolator device. The solder tab has a U-shaped cross section.

Abstract: A test board includes a plurality of sockets for connection to a plurality of integrated circuit chips to be tested. A test control device on the board turns on at least one test engine for testing the plurality of chips simultaneously. A checking circuit verifies the functionality of each chip by comparing outputs of chips with each other or with a golden chip. Failing Chips are disconnected from further testing and passing or failing chips are recorded.

Abstract: A stacking tray for electrical components, such as integrated circuits, particularly those of the ball grid array (BGA) type. The tray is stackable and includes an upper side and a lower side. Both upper and lower sides of the trays include support elements forming ledges and ridges to support the integrated circuit element and stabilize the integrated circuit element in the X-Y directions. In the unstacked configuration, whether the tray is presented in the right side up or upside down configuration, the integrated circuit elements are stabilized in the X-Y directions at two diagonally opposed corners, and hence all four sides of the chip. In a stacked configuration, the laterally inwardly offset ridges of a tray immediately downwardly adjacent from the integrated circuit restrain and stabilize the integrated circuit in the X-Y directions by engaging a first pair of diagonally opposed corners of the integrated circuit.

Abstract: An anti-static polymer composition comprises a thermoformable, moldable, hybrid urethane-vinyl polymer composition which exhibits relatively low surface and volume resistivities and good toughness. The hybrid polymer composition can be made without volatile organic compounds such as solvents, neutralizing amines, or both.

Abstract: A test board includes a plurality of sockets for connection to a plurality of integrated circuit chips to be tested. A test control device on the board turns on at least one test engine for testing the plurality of chips simultaneously. A checking circuit verifies the functionality of each chip by comparing outputs of chips with each other or with a golden chip. Failing chips are disconnected from further testing and passing or failing chips are recorded.

Abstract: A resin container is provided which has a container body and a lid for closing the container body. The container body of the resin container is produced by injection-molding an amorphous thermoplastic resin. The container body form has a peripheral rise portion and a recessed flat portion defined by the peripheral rising portion. The peripheral rise portion has a height of 0.5 to 10 mm, and the recessed flat portion has an area of 1 to 100 cm2, an average wall thickness of not more than 0.25 mm and a flatness of not more than 0.5 mm.

Abstract: An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use, and arranged such that they correspond to a desired alignment of each semiconductor device. For alignment, the semiconductor devices are held by a positioning device comprising a plurality of holders, each holder being configured to generate a force to hold a semiconductor device. Actuators are also provided that are operative to move the positioning device and holders to bias the semiconductor devices against the alignment guides to orientate the semiconductor devices until they are aligned with said alignment guides.

Abstract: Information regarding electrical components and their use is provided with a foldable information sheet having instructions thereon. The sheet has apertures which fit over the electrical components and information is printed on the sheet in proximity to the electrical component or components to which it applies. A portion of the information sheet may be adhered to a planar surface on which the components are mounted and non-adhered portions of the information sheet may be folded over the components.

Abstract: A first construction of a tray for electronic parts according to the present invention is provided with an engaging cut-out corner portion which is formed by cutting a corner portion of a table-like flat portion which is arranged diagonally with respect to a-cut-out corner portion. A second construction of a tray for electronic parts according to the present invention is provided with a pawl engaging protruding portion which is formed on a step-like peripheral edge portion above a cut-out portion. In a third construction of a tray for electronic parts according to the present invention, when two trays are stacked up so that the top faces thereof face each other, an engaging first-shaped protrusion which is formed around a predetermined pocket of one tray engages an engaging second-shaped protrusion which is formed around a predetermined pocket of the other tray.

Abstract: A method of attaching a tamper wrap to a printed circuit board using an installation tool that is placed over the main body portion of the tamper wrap. The side tabs of the tamper wrap are folded up against the side walls of the installation tool, and the tamper wrap and the installation tool are inserted into an enclosing case. The installation tool is then removed, the printed circuit board to be wrapped is placed into the enclosing case, and the side tabs are folded and adhered down onto the top surface of the printed circuit board. Also, a printed circuit board assembly having improved heat sinking capabilities including a thermally conductive material located between a printed circuit board and a tamper wrap such that the electronic components are in thermal contact with an enclosing case for enclosing the printed circuit board and the tamper wrap.