Including Shielding Means For Static Electricity Patents (Class 206/709)
  • Patent number: 11450621
    Abstract: A housing is provided for an output stage with power semiconductors of a modular converter. The housing includes a stretchable hood arranged on the base plate. The housing further includes a metallic lattice formed in or on the hood and forming a Faraday cage, wherein the hood is configured to be stretchable so as to enlarge the volume enclosed by the hood in the event of an explosion of a power semiconductor as a result of the explosion energy, without destroying the hood. An output stage, a converter, and an aircraft are also provided.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: September 20, 2022
    Assignee: Rolls-Royce Deutschland Ltd & Co KG
    Inventor: Marco Bohlländer
  • Patent number: 11286097
    Abstract: A more robust packaging structure for maintaining the integrity of compressible biologically active materials during storage and especially during transportation is provided. These containers protect the materials from shock, vibration, deformation, or separation from agitation. The compressible materials may be in the form of synthetic fibers, and may include a composite of fibers and beads or granules. Suitable materials that may benefit from such a robust packaging structure include synthetic materials that comprise a biologically active ceramic or glass.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: March 29, 2022
    Assignee: ETS Technology Holdings LLC
    Inventor: Steven B. Jung
  • Patent number: 11131892
    Abstract: A display device is provided. The display device comprises a display panel, a control circuit board, a driving circuit board and one or multiple electrostatic discharge structures. The display panel has a first ground terminal. The control circuit board has a second ground terminal. The driving circuit board coupled to the display panel and the control circuit board, and the driving circuit board is a COF flexible printed circuit board, and the control circuit board drives the display panel through the driving circuit board. The one or multiple electrostatic discharge structures is coupled to the display panel and the control circuit board, and is electrically connected to the first ground terminal and the second ground terminal. In a projection direction of the driving circuit board, the driving circuit board and the one or multiple electrostatic discharge structures are at least partially overlapped.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: September 28, 2021
    Assignees: HKC Corporation Limited, Chongqing HKC Optoelectronics Technology Co., Ltd.
    Inventor: Bin Qiu
  • Patent number: 11015066
    Abstract: Provided is a conductive polymer dispersion, including: a conductive composite containing a ?-conjugated conductive polymer and a polyanion; a vinyl versatate polymer; and a dispersion medium.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: May 25, 2021
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventor: Sou Matsubayashi
  • Patent number: 10542745
    Abstract: Disclosed are methods, device kits, and systems for improved quantification of mRNA from whole blood. More particularly, the devices and kites related thereto are useful for the controlled and repeatable ex vivo stimulation of whole blood.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: January 28, 2020
    Assignees: Hitachi Chemical Co., Ltd., Hitachi Chemical Company America, Ltd.
    Inventors: Masato Mitsuhashi, Taku Murakami
  • Patent number: 10504762
    Abstract: A bridging front opening unified pod (FOUP) is provided herein. In some embodiments, the bridging FOUP includes a bottom floor, side walls, a ceiling and a back wall that forms an enclosure volume having a front opening, a plurality of supports coupled to the side walls and extending into the enclosure volume, wherein the plurality of supports are configured to support a substrate carrier, a base plate assembly comprising a base plate coupled to the bottom floor, a pair of L-brackets coupled to the base plate, wherein each L-brackets includes a short lift pin, a long lift pin coupled to the base plate, wherein the height of the short lift pins and the long lift pin is selected such that the substrate is kept level when disposed thereon, and a docking support disposed proximate the base plate assembly and configured to support a substrate carrier.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: December 10, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Karrthik Parathithasan, Fang Jie Lim, Sriskantharajah Thirunavukarasu, Eng Sheng Peh
  • Patent number: 7871505
    Abstract: The present invention pertains to a sputtering target transport box having a void the size of a sputtering target, wherein supports for mechanical transport are provided to the bottom plate of the transport box, and a wheel for man-powered transport is provided to the edge portion of the bottom plate. Provided thereby is a sputtering target transport box in which the removal and transport of a sputtering target is easy, and which enables the transport of a sputtering target without causing any damage thereto.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: January 18, 2011
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Fumiya Nemoto, Atsushi Inoue
  • Patent number: 7479605
    Abstract: A glass substrate carrier assembly has a shelf and multiple pickup caps. The shelf is connected electrically to ground and has a bar, two stands and two brackets. The bar has two ends. The stands are mounted respectively on and extend down from the ends of the bar, are connected electrically to ground and are electrically conductive. The brackets are electrically conductive, are mounted respectively on and extend perpendicularly inward from the stands below the bar and face each other, and each bracket is T-shaped and has a distal edge and multiple tabs. The tabs are electrically conductive and are mounted on and extend perpendicularly from the distal edge of the bracket. The pickup caps are electrically conductive and are mounted on the tabs. Static electricity will pass through the pickup cap, the tab, the bracket and the stands to ground so static electricity will be removed from the shelf.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: January 20, 2009
    Assignee: Prime View International Co., Ltd.
    Inventors: Jui-Chung Cheng, Tung-Yin Shiue
  • Patent number: 7358295
    Abstract: An anti-static polymer composition comprises a thermoformable, moldable, hybrid urethane-vinyl polymer composition which exhibits relatively low surface and volume resistivities and good toughness. The hybrid polymer composition can be made without volatile organic compounds such as solvents, neutralizing amines, or both.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: April 15, 2008
    Assignee: Lubrizol Advanced Materials, Inc.
    Inventors: Timothy D. Miller, Yona Eckstein, Alexander V. Lubnin, Gary A. Anderle, Shui-Jen Raymond Hsu
  • Publication number: 20080069669
    Abstract: A method adjusts a pressure in a substrate processing device. The substrate processing device has a processing chamber for executing a predetermined processing for a substrate to be processed mounted on a mounting table; a pressure adjustment unit for the processing chamber which adjusts a pressure within the processing chamber; a transfer chamber connected to the processing chamber via a gate valve; and a pressure adjustment unit for the transfer chamber which adjusts a pressure in the transfer chamber and adjusts a pressure within the processing chamber while the gate valve is opened. The method is to adjust a pressure within the processing chamber to a predetermined pressure by using both the pressure adjustment unit for the processing chamber and the pressure adjustment unit for the transfer chamber.
    Type: Application
    Filed: September 18, 2007
    Publication date: March 20, 2008
    Applicant: TOKYO ELECTON LIMITED
    Inventors: Keisuke Kondoh, Hiroshi Koizumi
  • Patent number: 7342184
    Abstract: The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated completely. Patterned sinusoidal “patterns” that are stamped, molded, cut, or extruded into one or more sides of a “box” provide sufficient EMI shielding, such that the need for gaskets is reduced or eliminated.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: March 11, 2008
    Assignee: Stealthdrive, Inc.
    Inventor: Paul Douglas Cochrane
  • Patent number: 7156233
    Abstract: A tamper protected printed circuit board assembly including a printed circuit board and a tamper wrap attached to the printed circuit board. The tamper wrap includes a plurality of side tabs extending from a main body portion and a plurality of corner protection flaps extending from the side tabs. The tamper wrap covers the entirety of a first surface of the printed circuit board and at least a portion of a second surface opposite the first surface of the printed circuit board. Each of the side tabs covers at least a portion of one of the side walls of the printed circuit board and each of the corner flaps is folded around and covers a respective one of the corner edges of the printed circuit board. The printed circuit board may have a plurality of corner sentinels mounted adjacent to the corners of a surface thereof for protecting such corners.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: January 2, 2007
    Assignee: Pitney Bowes Inc.
    Inventors: Douglas A Clark, Kjell A Heitmann, Paul G Perreault
  • Patent number: 7097900
    Abstract: In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: August 29, 2006
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Minoru Oda, Katsuhisa Ogita, Takeshi Miyakawa, Tetsuo Fujimura, Mikio Shimizu
  • Patent number: 6827218
    Abstract: A packaging container for electronic components, particularly integrated circuits, which includes a tray into which the integrated circuits can be secured, a tray cover which is secured onto the tray, wherein the tray cover is composed of a plastic material, a desiccating material and an electrostatic dissipating product. The tray cover may further include a humidity indicating system incorporated into the tray cover. The packaging container may also be placed within a water and moisture-proof barrier bag for shipment purposes.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: December 7, 2004
    Assignee: Sud-Chemie Inc.
    Inventors: Stefan O. Dick, Michelle B. Martin, Roger Nobilet, Frederic Bouvier
  • Patent number: 6781205
    Abstract: An enclosure for transporting semiconductor wafers includes a pair of sensors that are responsive to electrostatic fields mounted on conductive grounded plates in facing orientations on opposite sides of a position within the enclosure at which a semiconductor wafer is to be located. Electronic circuitry within the enclosure in communication with the sensors supplies monitoring signals to remote circuitry external to the enclosure that isolates sources of contaminants and provides remote balance and gain adjustments. Calibration of the balance and gain adjustments uses a grounded plate for zero balance reference, and uses a plate of insulating material that is charged to a known potential for referencing gain adjustments to produce related outputs.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: August 24, 2004
    Assignee: Ion Systems, Inc.
    Inventors: Lawrence B. Levit, Alexander Ignatenko
  • Patent number: 6719142
    Abstract: Apparatus and method and system for measuring and controlling electrostatic charge on objects such as semiconductor substrates include a cassette having an inner structure with supporting slots and electrically conductive regions, and having isolated conductive outer walls for supporting objects in the slots, and include a charge monitor connected to the conductive regions and the conductive walls for sensing charge applicable to one or more objects carrying static charge positioned within the cassette. Charge neutralization is controlled in response to sensed charge attaining a selected level.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: April 13, 2004
    Assignee: ION Systems, Inc.
    Inventors: John E. Menear, Lawrence B. Levit
  • Patent number: 6421113
    Abstract: A lithography system including a reticle carrier and reticle library cassette designed for electro-static discharge (ESD) protection. A reticle carrier, such as a SMIF (Standard Mechanical Interface) pod, and reticle library cassette are fabricated largely of electrically conductive materials. Such materials may include polycarbonate plastic impregnated with carbon fibers or an electrically conductive stainless steel. The electrically conductive materials used to fabricate the reticle carrier and reticle library cassette may allow static electrical charges to be drained to ground, thereby preventing ESD damage to the reticles. Furthermore, the reticle carrier may incorporate rounded edges and corners, which may aid in the prevention of static charge buildup near the pod.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: July 16, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Lewis Lynn Armentrout
  • Publication number: 20010008216
    Abstract: An assembly for storing semiconductor wafers includes a container, a wafer carrier and a plate. The container may be a box having a substantially rectangular bottom surface. The wafer carrier fits in the container. The wafer carrier has a plurality of slots. Each slot is capable of receiving a semiconductor wafer. The plate has a size and shape so as to snugly fit in a predetermined position in the container. The plate substantially prevents motion of the wafer carrier relative to the container. The plate may be an insert formed of a separate piece of material from the wafer carrier. The insert has a substantially rectangular shape so as to fit snugly on the bottom surface of the box. The insert has at least one mounting feature to snugly hold the wafer carrier. For example, the insert may have at least one groove shaped to receive a tab extending from a bottom of the wafer carrier. The insert may be formed of an acetyl homopolymer, polypropylene, polyethylene, or other soft plastic.
    Type: Application
    Filed: January 12, 2000
    Publication date: July 19, 2001
    Inventors: Joseph C Rauchut, Gary J Reichl, Noel L Rodolfo, James V Roth
  • Patent number: 6121544
    Abstract: An Electromagnetic Shield for Smartcards provides shielding of contactless smartcards or RFID tags from electromagnetic radiation which imparts energy to power the contactless smartcards or RFID tags and thus preventing surreptitious, wireless exchanges of digital data with a remote transceiver. The electromagnetic shield is made of a soft magnetic alloy with a very high initial and maximum magnetic permeability, which has been fully hydrogen annealed to develop optimum magnetic shielding properties. In the preferred embodiment, this magnetic shielding material is sandwiched between two plastic reinforcing shells which allow very thin shielding materials to be used with little regard for their resistance to permanent deformation. The relatively high intrinsic electrical conductivity of the magnetic shielding material sufficiently simulates a Faraday cage to further shield a contactless smartcard/RFID tag from electric fields as well.
    Type: Grant
    Filed: January 15, 1998
    Date of Patent: September 19, 2000
    Inventor: Julie Ann Petsinger
  • Patent number: 5997765
    Abstract: A liquid crystal polyester resin composition comprising a liquid crystal polyester (A) in a continuous phase and a rubber having a functional group reactive with the liquid crystal polyester (B) in a dispersed phase. A liquid crystal polyester resin composition of the present invention is excellent in heat resistance, molding processability and mechanical properties, particularly in impact resistance and tensile property, capable of improving anisotropy of a molded article. Furthermore, film formation processability can be improved at a low cost, and a film produced for the composition has excellent gas barrier property, drawing property and flexibility.
    Type: Grant
    Filed: February 19, 1997
    Date of Patent: December 7, 1999
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Motonobu Furuta, Takanari Yamaguchi
  • Patent number: 5981103
    Abstract: An assembly of an electronic device within a sealed chamber of a flexible container. The electronic device, which may be a printed circuit board, has signal terminals connected to elongated insulated signal conductors. These conductors pass through a laminate construction wall of the container for connection to outside conductors. The signal conductors are electrically isolated from an EMI protection layer which forms part of the laminate construction wall. A grounding device connects a ground conductor of the electronic device to the EMI protection layer. The grounding device comprises a ground element having teeth on one side. A screwthread arrangement extends through the container wall and clamps the ground element onto the wall with the teeth cutting into the EMI protection layer to be in electrical contact therewith. The ground conductor is electrically connected to the screwthread arrangement.
    Type: Grant
    Filed: December 12, 1997
    Date of Patent: November 9, 1999
    Assignee: Northern Telecom Limited
    Inventors: L. Eugene Batten, Jr., Dennis A. McCulloch, David H. Williams
  • Patent number: 5779056
    Abstract: An ESD protection system which shields PCAs during the assembly process comprises transportable support means for holding an ESD bag in a predetermined position which is convenient both for the insertion and extraction of a PCA(s) and for observing stored PCA(s), thus ensuring proper handling. The system has first and second attachment means for attaching the ESD bag to the frame and for holding papers associated with the PCA(s) outside the ESD bag and for providing the weight necessary for maintaining a sealing fold in the bag whenever the PCA(s) are enclosed therein. The transportable support means is a frame which is constructed to mate with a rack designed for accommodating a plurality of frames. When so mated, the rack provides the desired level of stability and orderly positioning of a desired number of frames spaced apart such that the ESD bags attached to the frames may be easily observed for correct loading, closure and paperwork processing.
    Type: Grant
    Filed: August 14, 1996
    Date of Patent: July 14, 1998
    Assignee: Bull HN Information Systems Inc.
    Inventors: Robert J. Russell, Robert W. Romeri
  • Patent number: 5769232
    Abstract: An inflatable protective lining system for shipping containers includes a plurality of double wall inflatable chambers which are interconnected at their edges such that they can be folded to form an enclosure. An article to be protected is placed in the enclosure and the lining system is inserted into a shipping container. The chambers are then inflated via one or more elongate tubes to surround, cushion and protect the enclosed article within the container.
    Type: Grant
    Filed: August 16, 1996
    Date of Patent: June 23, 1998
    Inventors: Ronnie L. Cash, William Scott Sanders
  • Patent number: 5637377
    Abstract: Currugated sheeting for enclosing electrostatically sensitive devices in the form of an undulating sheet medium presenting alternating fluting apexes on opposite sides of the sheet medium, the medium being impregnated with an electrical resistivity of 10,000 ohms per square or less, and a kraft paper liner covering adhered to the fluting apexes on each side of the medium.
    Type: Grant
    Filed: May 31, 1995
    Date of Patent: June 10, 1997
    Assignee: Sunclipse, Inc.
    Inventor: Bob Vermillion
  • Patent number: 5469963
    Abstract: A transportable, sealable container, which has an improved pod liner. The container includes a box, a box door, and a gasket which forms a seal between the box and the box door. The box door has a conductive liner and a conductive path from the conductive liner to ground potential for electrostatic discharge protection. A membrane for isolating the gasket from the interior region of the container is bonded to the gasket and the conductive liner. The membrane may be impervious to gasses to prevent outgassing of the gasket or impervious to particles but not gasses to prevent particulate matter generated by the gasket from entering the interior region of the container.
    Type: Grant
    Filed: April 8, 1992
    Date of Patent: November 28, 1995
    Assignee: Asyst Technologies, Inc.
    Inventors: Anthony C. Bonora, Frederick T. Rosenquist, Sudhir Jain, Mark R. Davis
  • Patent number: 5450959
    Abstract: An apparatus for use in manufacturing an array of parts, such as printed circuit boards arranged in a multi-board panel. The array includes a plurality of the parts joined by frangible connections at a plurality of connection sites, and comprises a receptacle having a profiled upper face configured to generally retain the array in the receptacle in a predetermined orientation with each respective part having a predetermined locus when the array is in the predetermined orientation. The receptacle includes a plurality of apertures traversing the receptacle which are substantially in register with the connection sites when the array is in the predetermined orientation. The apertures are configured to accommodate punching severance of the frangible connections and passing of punched material from the punching severance through the apertures.
    Type: Grant
    Filed: August 30, 1994
    Date of Patent: September 19, 1995
    Assignee: Paragon Electric Company, Inc.
    Inventor: Keith C. Philippi
  • Patent number: 5441150
    Abstract: A container for memory modules comprising a generally rectangular shape with a lid and tray with a multitude of finger-like protrusions forming vertical slots therebetween for receiving memory modules. The interior is formed such that a cavity may be created above and below the memory modules contained inside providing a buffer region, which protects the contents from damage when the exterior of the container is subjected to physical contact.
    Type: Grant
    Filed: June 29, 1994
    Date of Patent: August 15, 1995
    Assignee: Ma Laboratories, Inc.
    Inventor: Abraham C. Ma