Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2?t?0.

Abstract: An LED indicator casing (1R) has: a casing (1a) including a bottom face (S1), a front face (S2) having an aperture (2a) for light emission, and paired side faces (S3 and S4) adjoining the front face (S2); and paired lead terminals (11 and 12), one of which has a light-emitting element (LED)(21) fitted thereto. The paired lead terminals (11 and 12) are led out to the bottom face (S1) via the paired side faces (S3 and S4) of the casing (1a) respectively.

Abstract: A die storage method and apparatus comprising a cover tape and a strip coupled to the cover tape wherein the strip comprises a material that is: flexible or compressible, or combinations thereof.

Abstract: The present invention pertains to a sputtering target transport box having a void the size of a sputtering target, wherein supports for mechanical transport are provided to the bottom plate of the transport box, and a wheel for man-powered transport is provided to the edge portion of the bottom plate. Provided thereby is a sputtering target transport box in which the removal and transport of a sputtering target is easy, and which enables the transport of a sputtering target without causing any damage thereto.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier (5) that are separated from each other, the terminal carrier (5) has spring elements (12a, 12b), which are part of a spring plate (2). The spring plate (2) has a plurality of recesses (11) disposed next to each other for forming a corresponding plurality of receiving pockets (6) for the semi-conductor components, wherein the spring elements (12a, 12b) are formed from the spring plate (2) in one piece.

Abstract: In a carrier tape for supplying an electronic part to an electronic part mounting apparatus for taking out the electronic part from a tape feeder to mount to a board, a tail side connecting portion having a cutout portion is provided to a tail side of the carrier tape mounted to the tape feeder, a front side connecting portion having a chipped portion is provided to a head side of the carrier tape to be used newly, respectively, and in tape splicing operation when a reel is interchanged, the cutout portion is fitted to the chipped portion and adhesive tapes are pasted thereon from two upper and lower faces thereof. Thereby, the tail side connecting portion and the head side connecting portion can be positioned in a longitudinal direction, a width direction and a thickness direction of the tape and held to each other and can efficiently be connected without using an exclusive connecting jig.

Abstract: An electrical apparatus that can be fixed to a supporting frame having a mounting window to receive the electrical apparatus includes a main body having a substantially box-like shape and first fixing elements provided on first and second opposite sides of the body to engage with corresponding second fixing elements the frame and facing the mounting window. The first fixing elements include guiding fixing elements to permit axial and guided sliding of electrical apparatus with respect to the frame in inserting the apparatus into the mounting window. The first fixing elements further include snap-in fixing elements to block axial sliding of the electrical apparatus with respect to the frame once a predetermined snap-in position has been reached.

Abstract: Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or attached to the container. The die contacts the supports so that the die and the container form a cavity that is at least partially filled with a thermally conductive material such as a conductive epoxy to promote thermal conduction between the die and the container. The die electrically connects to the substrate with bond wires that extend through an aperture in the substrate and attach to bond pads provided on the substrate. The aperture is typically filled with a protective layer of resin, epoxy, or other material that also encapsulates the bond wires.

Abstract: A product carrier strip (1) comprising a transponder circuit (2, 3). When the product carrier strip is used, it is possible to trace back medicaments from a patient to a manufacturer, for example, for each individual product strip which is usually sold in an external packaging, together with several other product carrier strips. Product carrier strips with metallic extruded films (7) comprise a recess (8) whose edge is used as an antenna. a non-metallic extruded film is provided according to one varient of the invention.

Abstract: A tray to tube manual exchanger is disclosed herein. The manual exchanger includes a tray-fastening module and a bi-axle-rotating module. The tray-fastening module includes a tray-fastening member, a buffer-rail substrate, and a tube-inserting member. The buffer-rail substrate having a plurality of rails is disposed under the tray-fastening member, and the tube-inserting member is disposed at the outlets of the plurality of rails for respectively receiving tubes. The bi-axle-rotating module is pivotally connected to the tray-fastening module. The tray-fastening module clips a tray carrying a plurality of packaged semiconductor devices at a horizontal position, followed by rotating 180 degrees around a second rotating axle of the bi-axle-rotating module, thereby falling the packaged semiconductor devices of each row of the tray onto each rail.

Abstract: A method and machine-readable medium are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part receiving areas are located within the tape. Each part receiving area is suitable to hold an electronic device. A retention channel encompasses each part receiving area. The retention channel extends substantially an entire length along each edge of each part receiving area. The retention channel comprises an upper tab and a lower tab wherein the upper tab is flush with an upper surface of the flexible tape and extends into the part receiving area and the lower tab extends below a lower surface of the flexible tape and into the part receiving area.

Abstract: A system and apparatus are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part receiving areas are located within the tape. Each part receiving area is suitable to hold an electronic device. A retention channel encompasses each part receiving area. The retention channel extends substantially an entire length along each edge of each part receiving area. The retention channel comprises an upper tab and a lower tab wherein the upper tab is flush with an upper surface of the flexible tape and extends into the part receiving area and the lower tab extends below a lower surface of the flexible tape and into the part receiving area.

Abstract: Information regarding electrical components and their use is provided with a foldable information sheet having instructions thereon. The sheet has apertures which fit over the electrical components and information is printed on the sheet in proximity to the electrical component or components to which it applies. A portion of the information sheet may be adhered to a planar surface on which the components are mounted and non-adhered portions of the information sheet may be folded over the components.

Abstract: An instrument enclosure apparatus has a housing with a sidewall and a pair of retaining posts disposed within the housing and adjacent the sidewall, the retaining posts in combination with the sidewall defining a pair of opposing channels for slidably receiving a complementarily shaped insert part. Vents may be disposed along the sidewall of the housing, and the insert part assists in providing adaptable air flow management design.

Abstract: A tray for handling and retaining a plurality of small components comprising a rigid body portion with a plurality of pockets formed therein. Each of the pockets has an elastomeric contact surface for contacting and retaining a component. The contact surface may be formed from a thermoplastic material having a surface energy between 20 dyne/cm and 100 dyne/cm, and a surface electrical resistivity of between about 1×104 ohms/square and 1×1012 ohms/square. The material for the contact portion may be urethane, polybutylene terephthalate, polyolefin, polyethylene terephthalate, styrenic block co-polymer, styrene-butadiene rubber, polyether block polyamide, or polypropylene/crosslinked EDPM rubber.

Abstract: There is disclosed an electronic parts carrier tape in which a nesting phenomenon, in which superposed embossed portions are fitted together after winding the carrier tape on a reel, is less liable to occur. The electronic parts carrier tape includes a flexible, tape-like member having electronic part-storing embossed portions arranged at predetermined intervals in a longitudinal direction of the tape-like member. At least one rib is formed on and projects outwardly from an outer surface of a peripheral wall of each of the embossed portions. An outer dimension (X) of a bottom of the embossed portion, as seen in a cross-section of the embossed portion through the rib, is larger than a dimension (Y) of an opening in a top of the embossed portion.

Abstract: A device for handling components (i.e. chips) is described. The device utilizes a conveyor belt that has crowns or recesses in a frame configuration into which singled semiconductor chips can be inserted. The conveyor belt has openings or holes between the chip positions that are large enough that the chips can be transported through the openings. It is possible to move the inserted chips by an adapted pick-and-place system, by purely vertical movements, into planes above and below the conveyor belt, in which the chips can be further processed.

Abstract: A connector module designed to be positioned on a carrying belt is disclosed. The module includes pins 30 for engaging in holes made on the carrying belt. The module and carrying belt assembly is designed to be used in a machine for automatically wiring connectors into bundles of cables and notably cables of the flexible circuit type.

Abstract: A packing device (1) is for accommodating electrical connectors (2). The packing device includes a body (10), and a plurality of cavities (11) defined in the body. Each cavity is bounded by a bottom wall having a higher front end (12) and a lower rear end (13), a front wall (14) adjacent the front end, and a rear wall (15) adjacent the rear end. A through slot (18) is defined in the front end. When the packing device filled. with electrical connectors reaches a corner or curve of an assembly line, a rearward one of two adjacent cavities tilts. The front wall at the rearward cavity bends into the slot at the rearward cavity, instead of contacting and bending or distorting the rear wall at the adjacent forward cavity. Thus, the electrical connector in the forward cavity can be reliably picked up by a suction machine of the assembly, line.

Abstract: Receiving pockets are formed by folding open-top box-like structures from paper. The structures are affixed in registration with holes in a tape substrate to receive objects to be packed therein. After the objects are packed, a covering tape is added to secure the packed objects in their respective receiving pockets. The receiving pockets, tape substrate and covering tape are all preferably of paper to permit environmentally friendly disposal after use by incineration or other disposal.

Abstract: A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

Abstract: A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.

Abstract: The present invention provides a low cost carrier tape designed to store chips during transportation. The invention comprises a carrier tape which contains receptacle holes designed to secure chips onto the carrier tape by clasping onto the chip's electrical contacts. The receptacle holes prevent the chip from rotating and physically moving. The receptacle holes are formed in patterns to match the standardized electrical contact patterns of flip chip families. The diameters of the receptacle holes may be sized slightly smaller than the diameter of electrical contacts such that a chip is secured by “snap-fitting” each electrical contact into a receptacle hole. Relief slits may be formed on the edges of the receptacle holes to facilitate the “snap-fitting” of electrical contacts into receptacle holes.

Abstract: A semiconductor apparatus includes a thin film belt-like insulating tape having a plurality of predetermined wire patterns thereon, and a plurality of IC chips that are provided on a surface of the insulating tape at uniform spaces in a lengthwise direction and electrically connected with the wire patterns, and further includes thick film reinforcing tapes with sprocket holes for transport use provided at uniform spaces, the reinforcing tapes being provided on both side portions of the insulating tape, in the lengthwise direction.

Abstract: A tray is constituted by a tray body portion for connecting a plurality of pockets and cushioning portions which are arranged on the bottom portions of the pockets serving as contact positions between the pockets and CSPs when the CSPs are stored in the pockets and which are formed of a soft material having a degree of hardness lower than that of the tray body portion. The tray moderates impact force acting on the CSPs in falling the tray to prevent the CSP from being broken and damaged.

Abstract: The present invention is a part retainer for housing and retaining various electronic and mechanical parts (27) wherein a retaining unit (2) has an engaging piece (7) that stably stops at both a position at which it protrudes toward the opening of a part housing space (5) and a position at which it withdraws, and which can move between these two positions under a specified or more amount of force, and wherein when protruding toward the opening, the engaging piece (7) prevents the part (27) housed in the housing space (5) from jumping out.

Abstract: A portable tote container is provided with an open box configuration. Divider panels and a work surface are disposed within the container. The divider panels allow for parts to be organized within the tote container. The work surface has an outer layer of anti-static material and is configured to couple with the divider panels. The work surface has an inner layer of alternative, less expensive material, which has a cavity formed inside. The cavity houses complete or partially complete components and creates an additional storage space within the container. The work surface is also movable in that it slides over the divider panel to cover the divider panels and to create additional work surface area.

Abstract: Since a distance of adjacent rivets held by a conventional blind rivet holder was large, a blind rivet holder which is smaller in the rivet distance, and which can accommodate a larger number of rivets in an accommodation case of a continuous riveter is provided. The blind rivet holder is designed to include: upper and lower tabs T4, T5 which are continuously arranged at minute constant intervals with narrow slits T3 formed at upper and lower ends of a perpendicular portion T2 having feeder slots for the blind rivet holder T; through hole s T41 and T51 provided so that a rivet R can be passed through the through hole s obliquely; and an oblique, U-shaped groove T21 provided so as to connect the slit T3 between the adjacent upper tabs T4 to the slits T3 between the adjacent lower tabs T5 and to permit bending from groove as a border.

Abstract: A part carrier strip in combination with a part for insertion therein. A flexible planar part carrier strip includes a plurality of part-receiving apertures define by a plurality of side edges. Each of the aperture side edges includes an inwardly projecting and resiliently deflectable tab. Each part is adapted for securement in a corresponding one of the apertures and includes a closed top side, an open bottom side having a peripheral flange, and a plurality of interconnecting sidewalls. Each sidewall is disposed adjacent a corresponding one of the aperture side edges, and each sidewall further includes an outwardly projecting retaining member spaced upwardly from the peripheral sidewall. The retaining members and the sidewall define therebetween a capture area adapted to receive therewithin an adjacent one of the side edge tabs to thereby retain each part on the strip.

Abstract: A carrier tape system for receiving, retaining and quickly releasing small components, such as singulated bare die, integrated circuit (IC) chips, or other small components for automated assembly processing. The carrier tape system is comprised of a longitudinal elongated flexible punched carrier tape frame and a solid width of pressure sensitive adhesive (PSA) tape affixed to one side of the carrier tape frame. The punched carrier tape frame has a plurality of spaced apart aperture cavities therethrough. The solid width of PSA tape also has a plurality of spaced apart configured apertures which are smaller than the plurality of aperture cavities of the punched carrier tape frame. These configured apertures of the PSA tape are centrally aligned and respectively located within the aperture cavities of the carrier tape frame.

Abstract: A carrier tape suitable for facilitating in-line washing of components for use in pick-and-place operations. The components are loaded into their respective pockets after emerging from one or more forming machines, with the components having lubricant remaining thereon, and are placed into respective pockets of the carrier tape with lubricant remaining on the components. The carrier tape has a plurality of pockets for receiving respective components, with the pockets having washing openings through which cleaning fluid is imparted to the components and allowed to drain from the pockets as the pockets are passed through washing and drying stations. After being washed and dried, a cover strip is detachably adhered to the carrier tape to maintain the components in their respective pockets.

Abstract: A parts carrier strip includes a wall portion defining an aperture wherein the wall portion includes a tab portion which is deflectable to permit the tab portion to be placed in a recess in a part to be carried by the strip. Also disclosed is an apparatus for assembling parts in such a strip.

Abstract: A one side resin sealing type semiconductor device has a semiconductor element which is mounted on one side of a circuit board. Wiring patterns are provided on both sides of the circuit board. The semiconductor element mount portion is sealed with resin. External connecting terminals, such as soldering balls, are joined to the wiring pattern on the-other side of the circuit board. The method of manufacturing one side resin sealing type semiconductor devices includes the steps of: positioning and disposing the circuit board formed into an individual piece corresponding to a through-hole formed in a rectangular carrier frame; and conveying the circuit board supported by the carrier frame so as to conduct a series of processing steps such as mounting the semiconductor element, electrically connecting the semiconductor element with the wiring pattern, sealing the semiconductor element mount portion with resin, and connecting the wiring pattern with the external connecting terminals.

Abstract: A carrier tape for electronic or electrical devices which contains a support film containing pockets. The floor of each pocket has been weakened, for example, by means of slits, so that it can be easily deformed. A device is releasably attached to a fastening member in the pocket, for example to a layer of a PSA or an elastomer on the floor of the pocket. When a deforming force is applied to the floor of the pocket, the floor deforms and separates the device from the fastening member, making it easy to remove from the pocket.

Abstract: A carrier tape is provided with a large number of accommodating recesses with each recess having a bottom surface, the top surface being open to accept an electronic part. Each accommodating recess is provided with resilient retainer arms formed together as a unit extending from the top surface of the recess, the resilient retainer arms permitting the electronic part to be inserted into the recess but preventing it from falling off.

Abstract: A component carrier tape used for storing and transporting components, wherein the carrier tape comprises a single layer elongated flexible strip portion having properties suitable for storing and transporting a plurality of components. The single layer strip portion comprises a layer of thermoplastic polymeric foam and has a first surface, a second surface opposite the first surface, and a plurality of openings spaced along the strip portion and extending through the strip portion between the first and second surfaces for receiving the plurality of components. The carrier tape further includes a bottom strip bonded to the second surface of the strip portion, extending along the strip portion, and covering at least a portion of the plurality of spaced openings. The carrier tape may further include a top cover tape realeasably secured to the first surface of the strip portion, extending along the strip portion, and covering at least a portion of the plurality of spaced openings.

Abstract: A new continuous carrier for surface mount or other electrical or mechanical parts, and a method of fabricating same, formed by molding one or a pair of continuous flexible film strips to a side or sides of a series of desired electrical or mechanical components such that the components are attached to the single strip or filament or suspended between the film strips or filaments. The film strips may be provided with sprocket holes or other equivalent structure for advancing the film strips during the molding process and for reeling up the resultant assembly onto a reel for sale or distribution to a PCB assembler. The latter places the reel of molded parts onto a conventional feeding device. The parts are then separated from the supporting strips or filament, picked-up by a pick-and-place device and placed onto the PCB in the normal manner. The filament or strip may be constituted of plastic, paper or metal.

Abstract: A carrier tape (12) is disclosed including a plurality of longitudinally spaced pockets (22) extending parallel to index holes (20). Each pocket (22) includes side walls (24) and a bottom (26) having provisions (28) for holding a microchip (32). Abutments (38) having semicircular cross sections are integrally formed on the side walls (24) for engaging the free ends of the leads (34) of the microchip (32) to prevent their engagement with the side walls (24). A greater number of abutments (38) at lesser spacings are provided than the leads (34) of the microchip (32) to prevent the leads (34) from hooking between the abutments (38). The abutments (38) are arranged to minimize the number of leads (34) actually engaged and to minimize the actual area contacted by the free ends of the leads (34) with the abutments (38). The shape of the abutments (38) also optically disperses major portions of the reflection of the leads (34).

Abstract: An electronic parts storage cassette for supplying a plurality of electronic parts to a mounting machine includes a plurality of electronic parts contained in a case body member for storing the electronic parts and an adaptor member to be attached to the mounting machine. The case body member may be formed of a disposable sheet material such as paper.

Abstract: A flexible carrier tape for storage and delivery of components by an advancement mechanism, comprises a strip portion, a plurality of aligned pockets spaced along the strip portion for carrying the components, wherein each pocket includes a bottom wall, and a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the bottom wall of the pocket for retaining a component in the pocket.

Abstract: Flexible strip on which the electrical connectors are arranged at uniform intervals and placed mechanically without the aid of adhesive substances and/or fixing elements. The strip has, at uniform distances, openings in which the electrical connectors are placed; the contour of the openings is studied so as to ensure simple and reliable containment of the connector and an equally easy and immediate extraction thereof. The contours blanked in the flexible strip are mostly provided, at their ends, with oppositely arranged protrusions that face the mostly circular openings of the connectors in order to retain them. Other mostly circular openings are blanked in the flexible strip at a constant pitch, mostly alternated with the openings for positioning the electrical connectors, and are used for the traction and positioning of the strip in the apparatus for automatically fixing the connector to the electrical conductor.

Abstract: A carrier tape which includes a punched tape with a plurality of aperture cavities, and a backing tape having a thin flexible gel material between a pair of strips of parallel pressure sensitive adhesive material. The flexible gel material covers all of the aperture cavities of the punched tape, so that singulated die and other components with a single flat surface can be placed on the surface of the flexible gel layer to hold the die or other component precisely in place, even during handling or shipping. The gel layer has high resistance to shear forces (movements in X, Y and theta) yet minor resistance to peel forces (removal in the Z-axis). The die is retained within an aperture cavity and it is adhered to the thin flexible gel layer such that the small component is unable to move in the X, Y or theta directions. The gel layer holds the die in place securely while the carrier tape is moving during processing and prevents fallout or dislocation of the die during high speed automated processing.

Abstract: An embossed carrier tape system includes a carrier tape having formed therein a number of pockets spaced at equal intervals longitudinally of the carrier tape for accommodating surface mountable electronic parts. A cover tape extends along the length of the carrier tape in superposition thereover on the side where the pocket opening is provided. The cover tape is provided with an engagement wall adapted to be in contact engagement with the inner walls of the corresponding pockets, and is further provided with a buffer (8) expandable longitudinally of the cover tape and extending transversely of the length of the cover tape at locations over the web portions of the carrier tape between adjacent pockets, whereby the need for adhesively bonding the cover tape and the carrier tape is eliminated.