Abstract: A surgical-implement count and capture system including a carrier tape having a plurality of spaced-apart receiving areas disposed longitudinally along the carrier tape. Each of the plurality of spaced-apart receiving areas being configured to receive a surgical-implement. The carrier tape is configured to follow a first pathway. A deposit station is located along the first pathway and is adapted to accommodate deposition of a plurality of the surgical-implements respectively into successive ones of the spaced-apart receiving areas when resident at the deposit station. A counting station is located along the first pathway downstream of the deposit station. The counting station includes a sensor adapted to detect the plurality of the surgical-implements in the respective receiving areas.

Abstract: An automatic parts counter with an x-ray imaging system to image parts disposed in at least one of a component reel, component trays, cut tape; an image processing algorithm to count the image parts; and a docking interface for docking to a storage unit.

Abstract: A carrier tape system, in some embodiments, comprises: a tape; a series of index holes along a length of said tape; a series of pockets along said length; a first series of standoff units along said length; and a second series of standoff units along said length, wherein the series of pockets is positioned between the first series of standoff units and the second series of standoff units, wherein the standoff units create a clearance space between the bottom surfaces of said pockets and the tape when said tape is wound on a reel.

Abstract: A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.

Abstract: A carrier tape includes a longitudinally extending central portion having pockets formed therein. Each pocket respectively comprises a plurality of sidewalls and a bottom. First and second side portions are disposed adjacent to opposite sides of the central portion and extend longitudinally therewith. Each of the first and second side portions includes a respective adhesion zone that is spaced apart from the central portion. Discontinuous raised features disposed between and contacting adjacent pockets. The raised features each respectively extend between the first and second side portions and include a transverse raised platform terminated at opposite ends by first and second longitudinal ribs that are integrally formed with the raised platform. Adjacent pairs of adjacent raised features are separated from one another by first and second collinear transverse channels. A carrier tape assembly included the carrier tape, a cover film, and electronic components disposed in the pockets of the carrier tape.

Abstract: A carrier tape may include a tape, a plurality of pockets, and a plurality of vents in each of the plurality of pockets. The plurality of vents may provide a vapor egress path for vapor that may occur during a dry bake process of the carrier tape.

Abstract: A formulation for producing a polymeric material including high-density polyethylene, a chemical blowing agent, and other optional components is described.

Abstract: A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of placing the component (30) on a first main side (11) of the substrate, applying a machine vision step to estimate a position of the electric contacts, depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, calculating partitioning lines depending on the estimated position of the electric contacts, partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.

Abstract: An electronic component packaging sheet formed of a styrene resin composition includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.

Abstract: According to embodiments of the invention, a tape cartridge adapted to house solid state storage may be provided. The cartridge may include a cartridge housing. The cartridge may also include a reel located within the cartridge housing, wherein the reel includes one or more radial grooves adapted to hold one or more solid state storage elements. According to other embodiments, the cartridge may also include one or more solid state storage elements held within the reel, wherein each solid state storage element includes a first electrical connector.

Abstract: The storage body includes a tape formed with recess portions that dip in in a thickness direction formed at intervals along the tape length direction and a cover that is superimposed on the tape and closes off openings of the recess portions. The tape is fixed to the tape by intermediate fixing portions and a pair of side fixing portions. The intermediate fixing portions are formed between the mutually adjacent recess portions. The pair of side fixing portions include overlapping portions and connect portions. The overlapping portions are formed at the two tape width direction sides of the intermediate fixing portions so as to overlap with the intermediate fixing portions along the tape length direction. The connect portions are formed with constant width connecting together the respective overlapping portions disposed in lines along the tape length direction.

Abstract: Disclosed is a cover film and an electronic component package that uses the cover film as a lid material for a thermoplastic resin carrier tape, the cover film having at least a substrate layer, an intermediate layer, and a heat sealing layer having a thermoplastic resin which can be heat-sealed to a carrier tape, the intermediate layer including a metallocene straight-chain low density polyethylene, the metallocene straight-chain low density polyethylene having a TMA softening temperature of 90 to 109° C. according to JIS K7196, and the cover film in some instances having a release layer between the intermediate layer and the heat sealing layer.

Abstract: A method of at least one embodiment of the present invention for packing a TAB tape is a method in which the TAB tape is wound on a core reel so as to be packed, the TAB tape being a tape-shaped insulating film on which circuits are provided in a repeated manner, the circuits each of which is made up of metal wiring and a solder resist. In at least one embodiment, the method includes a first step of winding at least the TAB tape on an outer peripheral surface of a core reel having a cylindrical shape, the core reel having a shaft hole on its inner peripheral side. This makes it possible to provide (i) a method for packing a TAB tape which method makes it possible to reduce a packing size, and (ii) a smaller packing structure for a TAB tape.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape (100) relating to the present invention includes a plurality of layers including at least a base layer (110) and a heat seal layer (140). At least two layers of these plurality of layers are laminated with an adhesive layer (120) interposed. The adhesive layer (120) contains an antistatic agent in an amount that makes up 10 wt % or more and 70 wt % or less of the adhesive layer (120). The antistatic agent contains an alkylene carbonate and a surfactant as the primary components.

Abstract: A device and method for tape and reel packaging of small electronic components providing positioning mechanisms to allow one or more components to be placed in a desired orientation and alignment within a tape carrier pocket. The device is an insert fitting within the carrier pocket including positioning mechanisms such as protruding shapes, protruding ridges, and/or frame work, or the like, which engage with inner surfaces, outer surfaces, or perimeters, or a combination, of the component to be packaged. A method for tape and reel packaging including further delineation of regions within a tape carrier pocket for disposition of electronic components is also disclosed.

Abstract: A wafer-retaining unit has a plurality of vertically superimposed single-wafer retaining sections, each having a wafer-retaining frame abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer, a wafer-securing frame disposed vertically movably relative to the wafer-retaining frame to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer, and wafer lift members that lift the semiconductor wafer to a position where it is upwardly separate from the wafer-retaining frame and keeps the semiconductor wafer in this position. Consequently, a plurality of semiconductor wafers can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers. At the same time, the semiconductor wafers can be loaded and unloaded satisfactorily.

Abstract: A rigid holder is provided for supporting a flexible article. The rigid holder may include a first frame member and a second frame member which are held together through magnets.

Abstract: A packaged article containing an electronic device which comprises an electronic device-packaging carrier tape and an electronic device-packaging cover tape, wherein a layer in the cover tape contacting with the carrier tape contains an adhesive resin (A), an electrically-charged resin. (B) charging opposite to the charging polarity of the adhesive resin (A) generating at the time of friction between the adhesive resin (A) and the electronic device, and a metallic filler and/or carbon, and wherein the packaged article containing an electronic device is capable of preventing the adhesion of the electronic devices to the cover tape (pickup failure) resulting from the static and the part breakage by ESD, by inhibiting the static caused by the friction between the contained electronic devices, particularly small/light weight electronic devices, and the cover tape.

Abstract: A semiconductor package holder includes two plates, and each plate defining a through-hole. Each of the plates has a set of first members along a periphery of the through-hole and extending into the through-hole. The first members of one of the plates are positioned to overlie the first members of the other of the plates. One of the at least two plates further has a set of second members along a periphery of the through-hole and extending into the through-hole.

Abstract: A taped component includes a career tape having an upper surface having recesses provided therein, and products stored in the recesses, respectively. Each of the recesses has a bottom on which each of the products is placed. The bottom has an aperture provided therein, and the aperture faces a position different from the center of gravity of each of the products. This taped component allows the product to be mounted efficiently.

Abstract: The present invention provides a cover tape for packaging a semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for the semiconductor device using the cover tape for packaging the semiconductor device. The cover tape for packaging the semiconductor device has a net-shaped structure at least in a portion, and the cover tape for packaging the semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices. The package for the semiconductor device contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging the semiconductor device.

Abstract: A method of at least one embodiment of the present invention for packing a TAB tape is a method in which the TAB tape is wound on a core reel so as to be packed, the TAB tape being a tape-shaped insulating film on which circuits are provided in a repeated manner, the circuits each of which is made up of metal wiring and a solder resist. In at least one embodiment, the method includes a first step of winding at least the TAB tape on an outer peripheral surface of a core reel having a cylindrical shape, the core reel having a shaft hole on its inner peripheral side. This makes it possible to provide (i) a method for packing a TAB tape which method makes it possible to reduce a packing size, and (ii) a smaller packing structure for a TAB tape.

Abstract: A die storage method and apparatus comprising a cover tape and a strip coupled to the cover tape wherein the strip comprises a material that is: flexible or compressible, or combinations thereof.

Abstract: The present disclosure provides a packaged article containing an electronic device being capable of preventing the adhesion of the electronic devices to the cover tape (pickup failure) resulting from the static and the part breakage caused by ESD, by inhibiting the static caused by the friction between the contained electronic devices (especially small/light weight electronic devices) and the cover tape. A packaged article containing an electronic device which comprises an electronic device-packaging carrier tape and an electronic device-packaging cover tape, wherein a layer in said cover tape contacting with said carrier tape contains an adhesive resin (A) and an electrically-charged resin (B) charging opposite to the charging polarity of said adhesive resin (A) generating at the time of friction between said adhesive resin (A) and said electronic device.

Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.

Abstract: The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.

Abstract: A component verification method for a mounter (100) that is capable of performing component verification with less labor. The method includes a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.

Abstract: Disclosed is a carrier tape manufactured by using polymer materials comprising polypropylene, polystyrene and a styrene-butadiene copolymer. The carrier tape has excellent impact strength, excellent dimensional stability and low surface energy, and thus allows easy detachment of materials to be transported.

Abstract: To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.

Abstract: A component carrier tape includes a longitudinal flexible strip having a plurality of component receiving pockets positioned therein. The component carrier tape further includes a plurality of indicators positioned longitudinally on the longitudinal strip and configured for indicating the position of each of the plurality of pockets. The indicators are positioned between adjacent pockets.

Abstract: A carrier tape body having an embossed tape continuously having pockets which contain an electronic component sealed with a cover tape, where the cover tape has a peeling static electrification amount of from ?9 to +9 nC when the cover tape has a surface resistivity of at least 1011 ?, and where the cover tape has a peeling static electrification amount of from ?3 to +3 nC when the cover tape has a surface resistivity of less than 1011 ?.

Abstract: Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or attached to the container. The die contacts the supports so that the die and the container form a cavity that is at least partially filled with a thermally conductive material such as a conductive epoxy to promote thermal conduction between the die and the container. The die electrically connects to the substrate with bond wires that extend through an aperture in the substrate and attach to bond pads provided on the substrate. The aperture is typically filled with a protective layer of resin, epoxy, or other material that also encapsulates the bond wires.

Abstract: A carrier tape for electrical components is provided comprising a tape having a length and a plurality of cavities along the length of the tape. Each cavity comprises inner side walls and a bottom surface and is capable of containing an electrical component.

Abstract: An apparatus for packaging electronic components, particularly integrated circuits, which includes a carrier tape into or on which the integrated circuits can be secured, a packing reel, to which is secured the carrier tape, wherein one or more components of the packing reel is composed of a plastic material and a desiccating material, and preferably a copolymer, and optionally an electrostatic dissipating product. The packing reel may further include a humidity indicating system. The apparatus may also be placed within a water and moisture-proof barrier bag for shipment purposes.

Abstract: An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use, and arranged such that they correspond to a desired alignment of each semiconductor device. For alignment, the semiconductor devices are held by a positioning device comprising a plurality of holders, each holder being configured to generate a force to hold a semiconductor device. Actuators are also provided that are operative to move the positioning device and holders to bias the semiconductor devices against the alignment guides to orientate the semiconductor devices until they are aligned with said alignment guides.

Abstract: A container for a long electrode sheet for electric double layer capacitor includes a cover closing the opening of the container body, a sealing member sealing a gap between the container body and the cover, a stem fixed to either the container body or the cover so that a bobbin is mounted thereon and formed with a male thread, a bobbin fixing unit including a fastening member having a female thread hole, and a holding unit including two presser plates, the female thread hole of the fastening member being threadedly engage with the male thread of the stem so that the presser plates are fastened thereby to be fixed, the holding unit holding the electrode sheet so as to prevent the electrode sheet from being detached from the bobbin by pressing two ends of electrode sheet.

Abstract: A method and system for economically packaging microarrays into sealed reaction chambers and storage vessels. A pocket strip is manufactured as a linear sequence of pockets, or wells, into which microarrays are positioned. A cover strip is then heat sealed to the upper surface of the pocket strip to create a linear sequence of sealed reaction chambers or storage vessels each containing a microarray. Mechanical features or optical features are included along the length of the pocket strip to facilitate mechanical translation and positioning of microarrays embedded within the microarray strip. Septa are affixed to, or embedded within, the cover strip to provide resealable ports through which solutions can be introduced into, or extracted from, the reaction chambers.

Abstract: In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.

Abstract: A tape carrier package (TCP) film for use with liquid crystal displays. The tape carrier package (TCP) film includes depressions and punch holes that enable fast, efficient separation of a tape carrier part, which includes driving integrated circuits, from a peripheral part. The tape carrier part has an “I” shape that is formed by depressions. Punching holes are provided along the depressions to reduce the length of the connection between the tape carrier package part and the peripheral part. The peripheral part includes a plurality of sprocket holes along the edges of the tape carrier package film.

Abstract: A carrier structure comprises a carrier base which is not thermally deformable and a portion of which is also transparent to electromagnetic radiation. An adhesive layer is disposed on a surface of the carrier base. Semiconductor chips or other items adhere to the adhesive layer, which is cross-linked when it is desired to remove the chips. Once the chips have been removed, the adhesive layer may be removed from the carrier base. The carrier base can be re-used to transport and hold semiconductor chips after application of a new adhesive layer. A carrier frame may releasably support the carrier base.

Abstract: An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the electronic component and wherein the pocket has a protrusion at a bottom and wherein a top of the protrusion contacts with the second surface of the electronic component, and a second film covering the pocket and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely.

Abstract: An embossed carrier tape includes a plurality of device pockets (device holes) in which electronic devices are held one by one; and support portions each of which is formed at a surrounding area of each of the device pockets. The support portions are of step-shaped on which the electronic devices are put and supported.

Abstract: A reel adapted to have chip carrier tape wound thereabout includes at least one flange and a plastic rail. The flange is made from a paper-based material. The plastic rail is attached an interior major surface of the paper flange. The plastic rail may extend along a radial direction of the flange and/or along a circumferential direction of the flange, for example. The plastic rail may be substantially straight and/or curved, for example. The plastic rail is preferably made from a static dissipative material. The plastic rail reduces or eliminates the generation of paper particles from the paper-based flange while reeling/unreeling chip carrier tape from the reel.

Abstract: A transport tape for accommodating electronic or optoelectronic components is disclosed, having a multiplicity of pockets for accommodating the components and a multiplicity of pivotable or displaceable lids for closing the pockets.

Abstract: Wafer holder and semiconductor manufacturing equipment in which the holder is installed, the wafer holder having a wafer-carrying surface, wherein incidence of warping and cracking when the wafer holder is heated is slight. In the wafer holder having a wafer-carrying surface, electrical circuitry consisting of one or more sinter laminae is formed on the face or in the interior of the wafer holder; and by rendering pores present in the circuitry, the incidence of warping and cracking can be made very slight. The electrical circuitry is preferably any of an electrode circuit for an electrostatic chuck, a resistive-heating-element circuit, an RF-power electrode circuit, and a high-voltage-generating electrode circuit.

Abstract: A magazine for a screwdriver. The magazine is provided with a magazine strip used to store screws which can be successively inserted into and extracted from an object. The magazine strip has a central web and a flange running along each edge. The magazine has a guide made up of a guiding part with a guiding slit on each side of the magazine strip. The guiding part is dimensioned in such a way that the enlargement extends respectively in positive fit outside the guiding part when the belt piece is inserted into the guiding slit.

Abstract: It is an object to provide an apparatus and method for inspecting a film carrier tape for mounting electronic component, in which film carrier tapes for mounting electronic component provided with a plurality of electronic component mounting portions in multiple stripes in a transverse direction are exactly used and, which can be inspected at a time, so that an inspection efficiency can be enhanced very greatly, and furthermore, the film carrier tapes for mounting electronic component are separated into individual stripes after the inspection and can be taken upon individual reels without a winding shift.

Abstract: A connector module designed to be positioned on a carrying belt is disclosed. The module includes pins 30 for engaging in holes made on the carrying belt. The module and carrying belt assembly is designed to be used in a machine for automatically wiring connectors into bundles of cables and notably cables of the flexible circuit type.

Abstract: A packing device (1) is for accommodating electrical connectors (2). The packing device includes a body (10), and a plurality of cavities (11) defined in the body. Each cavity is bounded by a bottom wall having a higher front end (12) and a lower rear end (13), a front wall (14) adjacent the front end, and a rear wall (15) adjacent the rear end. A through slot (18) is defined in the front end. When the packing device filled. with electrical connectors reaches a corner or curve of an assembly line, a rearward one of two adjacent cavities tilts. The front wall at the rearward cavity bends into the slot at the rearward cavity, instead of contacting and bending or distorting the rear wall at the adjacent forward cavity. Thus, the electrical connector in the forward cavity can be reliably picked up by a suction machine of the assembly, line.