Abstract: An electrical connector includes: an insulative housing; and a row of contacts secured to the insulative housing, the row of contacts including one or more power contacts and one or more signal and/or ground contacts, wherein the one or more power contacts are plated with a first material and the one or more signal and/or ground contacts are plated with a second material different from the first material. A related method of manufacturing such connector includes separate plating of the row of power contacts from the row of signal and ground contacts with a different material.

Abstract: There is provided a coaxial cable connector, etc., configured such that the outer conductor shell and the connector carrier are linked by a carrier linkage part provided to part of the edge portion between the distal end and the portion of the outer conductor shell of a coaxial cable connector excluding the crimper, and the connector carrier is disposed on the distal end side of the outer conductor shell (the opposite side from the housing carrier), which simplifies the configuration of the apparatus used to manufacture the coaxial cable connector, and allows the coaxial cable connector to be assembled with the fixing position of the outer conductor shell stabilized while still linked to the connector carrier in the manufacturing process.

Abstract: A connecting blade includes an insulation board having an adjustment region; and paired differential lines disposed on the insulation board. Each of the paired differential lines has contact points at both ends thereof for connecting to a circuit connecting member. The paired differential lines include a straight pair and a cross pair. The straight pair is formed of two first lines not crossing each other. The cross pair is formed of two second lines having a crossing region where the two second lines cross each other without contacting with each other. The cross pair is arranged so that the cross pair contacts with the adjustment region at least partially. The adjustment region has a specific size and a permittivity so that a signal transmission time lag between the cross pair and the straight pair is reduced.

Abstract: A female terminal fitting includes terminal holding plates stacked on one another are configured of a basic terminal holding plate formed integrally with one end of an electric wire connecting portion and auxiliary terminal holding plates which are formed on corresponding edges of the basic terminal holding plate via corresponding bending margins and which are folded up and then down on to the basic terminal holding plate so that the auxiliary terminal holding plates are in a stacked state on the basic terminal holding plate. A fixing piece is formed integrally on an auxiliary terminal holding plate which is stacked at an uppermost level at an edge portion on a side which lies opposite to a side where the bending margin is provided, so as to be brought into engagement with a locking portion on the basic terminal holding plate to fix the stacked state.

Abstract: A contact element for an electrical plug connecting device, having a molded first end section and a molded elongated receiving section which defines a longitudinal axis for mechanical and electrical coupling and/or receiving a mating contact element designed to be complementary to the contact element of a plug connecting device to be paired with the electrical plug connecting device, both of which are manufactured of an electrically conductive material. The elongated receiving section extends essentially cylindrically from the first end section. This end section as well as the elongated cylindrical receiving section are molded to be free of seams and butt joints by shaping the electrically conducting material by means of a force acting at least predominantly parallel to the longitudinal axis, and at least the receiving section molded by shaping the electrically conducting material forms a cylindrical interior sheathed by the molded electrically conducting material along the longitudinal axis.

Abstract: A combination of a carrier tape and electronic components for a tape and reel product feed, includes components arranged along the carrier tape held by an adhesive surface. Also, a dispensing device receives the carrier tape and includes a mechanism for peeling the components from the carrier tape onto a staging surface. The mechanism includes a gap and the carrier tape extends through the gap and the components are peeled from the carrier tape over the gap and onto the staging surface. A method is provided for carrying components on a tape using an adhesive surface and peeling the components off of the tape in a controlled fashion, one component after another, onto a staging surface for removal by a pick device.

Abstract: A method of at least one embodiment of the present invention for packing a TAB tape is a method in which the TAB tape is wound on a core reel so as to be packed, the TAB tape being a tape-shaped insulating film on which circuits are provided in a repeated manner, the circuits each of which is made up of metal wiring and a solder resist. In at least one embodiment, the method includes a first step of winding at least the TAB tape on an outer peripheral surface of a core reel having a cylindrical shape, the core reel having a shaft hole on its inner peripheral side. This makes it possible to provide (i) a method for packing a TAB tape which method makes it possible to reduce a packing size, and (ii) a smaller packing structure for a TAB tape.

Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.

Abstract: A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2?t?0.

Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.

Abstract: A die storage method and apparatus comprising a cover tape and a strip coupled to the cover tape wherein the strip comprises a material that is: flexible or compressible, or combinations thereof.

Abstract: In a carrier tape for supplying an electronic part to an electronic part mounting apparatus for taking out the electronic part from a tape feeder to mount to a board, a tail side connecting portion having a cutout portion is provided to a tail side of the carrier tape mounted to the tape feeder, a front side connecting portion having a chipped portion is provided to a head side of the carrier tape to be used newly, respectively, and in tape splicing operation when a reel is interchanged, the cutout portion is fitted to the chipped portion and adhesive tapes are pasted thereon from two upper and lower faces thereof. Thereby, the tail side connecting portion and the head side connecting portion can be positioned in a longitudinal direction, a width direction and a thickness direction of the tape and held to each other and can efficiently be connected without using an exclusive connecting jig.

Abstract: To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.

Abstract: Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or attached to the container. The die contacts the supports so that the die and the container form a cavity that is at least partially filled with a thermally conductive material such as a conductive epoxy to promote thermal conduction between the die and the container. The die electrically connects to the substrate with bond wires that extend through an aperture in the substrate and attach to bond pads provided on the substrate. The aperture is typically filled with a protective layer of resin, epoxy, or other material that also encapsulates the bond wires.

Abstract: A real-time tape position sensor to accurately determine the location of several consecutive carrier tape pockets in order to pick or place electronic semiconductor devices into or out of a tape pocket. The invention generates an on-going map of the pocket locations by coupling data from a photosensor inspecting between the tape pockets with data from an encoder that records the position of the carrier tape as it moves.

Abstract: A coupling terminal unit (30) has terminal fittings (20) coupled in parallel by a coupling portion (31) and is stamped from a metallic plate so that the coupling portion (31) is extendible in an arranging direction of the terminal fittings (20). An arrangement pitch (A) of the terminal fittings (20) is narrower than an arrangement pitch of the terminal insertion holes (14). Then, since the coupled terminal unit (30) is stamped out such that the arrangement pitch (A) of the terminal fittings (20) is narrower than that of the terminal insertion holes (14), unnecessary portions between the terminal fittings (20) can be reduced. Thus, the utilization efficiency of a material for the production of the coupled terminal unit (30) can be improved.

Abstract: A carrier tape for receiving, seating, storing and transporting components having an upper surface, a lower surface, four corners and four sidewalls. The tape includes a strip of material with a plurality of pockets. Each pocket includes a plurality of corner guides with angled engagement members for guiding, centering and supporting a component by its lower peripheral corner without any other contact between the component and the pocket. The pocket may include at least one support shelf positioned so as to contact a corner of the component upon misalignment of the component and thereby prevent further downward movement of the component in the pocket.

Abstract: A modular tray system for holding component carriers includes a rectangular frame having retaining elements in the form of slots or pegs along opposite sides. Rails or partitions are arranged in parallel and selectively spaced apart along the opposite sides, and spaced apart along the opposite sides, and spanning between the opposite sides. Component carriers such as strips of thermoformed component-holding carrier tape are supported on the spaced apart rails. The modules can be stacked to allow for the holding of component carriers having relatively deep component-holding pockets.

Abstract: A ring-shaped device is provided for protecting an electrostatic discharge sensitive electronic component. The protective device has a thin film support structure, adhesive material for securing the support structure to the leads of the electronic component, and conductive material for electrically connecting the leads together. The adhesive material may be a pressure sensitive adhesive. The conductive material may be an annular layer of metal deposited on the support structure. In addition, a central opening is provided in the support structure to accommodate a top portion of the electronic component. The electronic component may be protected while it is stored, handled and assembled into a larger system or device, such as a circuit board. The protective device may be used with a variety of electronic components, including components with different leads configurations and also taped components.

Abstract: A cover tape adapted to seal individual components in respective recesses of a carrier tape or a two dimensional carrier tray, including a randomly embossed layer, an adhesive layer covered over one side of the randomly embossed layer, and a non-adhesive layer adhered to the adhesive layer to prevent the components from adhering to the adhesive layer, the randomly embossed layer including an adhesion portion adapted for fastening to the carrier tape through the adhesive layer, a torn strip portion adapted to enhance the cohesive strength of the randomly embossed layer through the non-adhesive layer, and a stress concentration zone disposed between the contact border line of the adhesion portion and the contact border line of the non-adhesive layer, the torn strip portion being peeled off from the adhesion portion along the stress concentration zone before the removal of the encased components from the carrier tape, the applied tearing force to peel off the torn strip portion from the adhesion portion along th

Abstract: A support arrangement for mechanically securing and electrically contacting electronic components has a support member consisting of an electrically conducting material and having a contacting side. The support member has perpendicularly projecting hollow pins at the contacting side. The hollow pins are stamped into the support member. The electronic components have connecting tabs including an opening. The tabs are placed onto the hollow pins. The hollow pins project through the openings and the tabs. The heads of the hollow pins are then mechanically deformed and engage radially outwardly the circumferential edge of the openings of the tabs.

Abstract: A terminal strip packing arrangement including two insulative packing sheets and a terminal strip sandwiched in between the insulative packing sheets and rolled up with them into a roll for storage, wherein the terminal strip has an auxiliary strip integral with linked terminals thereof at one side, the auxiliary strip having outwardly extended protective arms adapted to stop against the insulative packing sheets to protect curved tails of the linked terminals from being compressed by the insulative packing sheets during storage.

Abstract: A component carrier tape which can be molded as an integral member from flexible sheet material. The carrier tape includes a substrate having a plurality of spaced pallet/component-receiving apertures, walls projecting from the substrate and surrounding the apertures, one or more pedestal tabs extending from each wall into the associated aperture and one or more finger tabs extending from each wall into the associated aperture. The pedestal tabs have a sloping pedestal wall and a pedestal edge which extend into the aperture at an angle. The pedestal tabs engage and support a first surface of pallets positioned within the apertures at a pedestal height. The finger tabs extend from the wall into the aperture at a finger tab height which is vertically displaced from the pedestal height, and engage and support a second surface of pallets positioned within the apertures.

Abstract: By a manufacturing method including a process of supplying a connection-releasable connecting material (4) onto a surface of a plurality of chip parts (3) and a process of connecting the plurality of chip parts (3) by the connecting material (4), there is formed a chip assembly (1) comprised of the plurality of chip parts (3) connected with each other by means of the releasable connecting material (4). Further provided is a method of preparing the chip assembly (1), a process of releasing connection achieved by the connecting material (4) between a target chip part and an adjacent chip part, and a process of mounting the target chip part separated through releasing of the connection onto a board and soldering the same, thereby providing chip parts capable of easily coping with an increase of operation speed of chip parts on the process of mounting line, achieving an improved space efficiency, and suppressing waste of resources.

Abstract: A flexible carrier tape used for protecting components while they are being transported, wherein the carrier tape comprise a strip portion having a component-receiving surface and first and second longitudinal edge surfaces. At least two side walls having inner and outer major surfaces extend upwardly from the component-receiving surface between the longitudinal edge surfaces forming at least one component-receiving area. The inner major surface of at least one side wall is inclined inwardly toward the component-receiving area, forming an angle greater than 0 degrees but less than 90 degrees with the component-receiving surface of the carrier tape. When a component is placed in the component-receiving area, the inclined inner major surface advantageously exerts a force on the component that prevents the component from moving within or falling out of the component-receiving area.

Abstract: A supply feedstock intended for use in a workpiece finishing machine wherein individual workpieces are successively separated and presented in a predetermined fashion to an automated loading means. The feedstock includes a plurality of individual workpieces arranged in side-by-side order in the form of a continuous belt, or bandolier, of workpieces, each of the workpieces being interconnected at head and tail portions of the workpieces by integral webs, successive workpieces being trimmed from the bandolier and presented to a loading means, while the separated webs are discharged to waste.

Abstract: A supply feedstock intended for use in a workpiece finishing machine wherein individual workpieces are successively separated and presented in a predetermined fashion to an automated loading means. The feedstock includes a plurality of individual workpieces arranged in side-by-side order in the form of a continuous belt, or bandolier, of workpieces, each of the workpieces being interconnected at head and tail portions of the workpieces by integral webs, successive workpieces being trimmed from the bandolier and presented to a loading means, while the separated webs are discharged to waste.