Abstract: A transfer system for wafer cassettes includes a tray and a rail compatible with the tray. The tray includes a base plate, a through hole, a wall, and a pair of first positioning features. The through hole is disposed on a center of the base plate, in which the through hole has a first direction axis and a second direction axis perpendicular to the first direction axis. The wall extends from a surface of the base plate and surrounding the through hole, in which the wall separates the base plate into an interior region and an exterior region. The pair of first positioning features having a first level height are in the interior region and arranged parallel to the first direction axis.

Abstract: A method of processing component carriers is disclosed. The method includes providing a plurality of arrays each comprising a plurality of component carriers, providing a plurality of separator bodies, forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body, and carrying out at least one process, in particular at least one back-end process, using the stack. A separator sheet for spacing arrays and a method of using separator sheets for spacing arrays during processing the arrays are also provided.

Abstract: Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.

Abstract: An analog multiplexer includes a plurality of voltage-protecting transmission gate circuits to select an input voltage signal among different input signals. Each voltage-protecting transmission gate circuit includes a pass gate pFET interconnected between an input pFET and an output pFET, as well as a parallel pass gate nFET. The pFET includes a first source/drain connected in series with the input pFET. A second source/drain is connected in series with the output pFET. A pFET gate receives a gate select signal that operates the transmission gate circuit in a blocking mode, a first passing mode, or a second passing mode. The nFET includes a first nFET source/drain connected to the input pFET to form a main input terminal that receives the input voltage signal. A second nFET source/drain is connected to the output pFET to form a main output terminal that outputs an output voltage based on the operating mode.

Abstract: A lens assembly method for assembling a plurality of lenses into a plurality of lens tubes is disclosed. The method includes providing a lens assembly tool comprising a lens receiving frame, a positioning plate, and a pressing plate forming a plurality of pressing punches; positioning a plurality of lens tubes in a plurality of receiving holes of the lens receiving frame; positioning one lens in each of the lens tubes; positioning the positioning plate on the lens receiving frame with the lens tubes extending through a plurality of through holes of the positioning plate; and positioning the pressing plate on the positioning plate with the pressing punches entering into the lens tubes to push the lenses into the lens tubes.

Abstract: The present invention provides a packaging carton for fragile, apparatus for making cartoon bottom, and method for making the carton bottom. The packaging carton includes a bottom and peripheral wall which jointly define a receiving space for storing fragile glass substrate with the bottom. The bottom has a skeleton configuration and is made from plastic blowing technology. By the forgoing, the present invention can effectively reduce the packaging cost, and which in turn reducing the cost of the product.

Abstract: A novel PV module carrier and methods of use provide protection for PV modules during transportation, field handling, and assembly with racking systems. The carrier contains elements of a racking system to allow for quicker installation in the field. The PV module carrier reduces manufacturing costs by eliminating the need for frame elements, while reducing field installation time and labor cost for system installation.

Abstract: A blank of material for use in assembling a container is provided. The blank includes four side panels each including a top edge and a bottom edge, and four bottom panels each extending from a respective one of the side panel bottom edges, such that in the assembled container, the bottom and side panels are oriented to at least partially define a compartment configured to store at least one meter therein. The blank further includes at least one securing assembly including a plurality of cutouts shaped and oriented to secure the at least one meter within the compartment in the assembled container, the securing assembly extending from the top edge of one of the side panels.

Abstract: The present disclosure is directed to a packaging construction for columnar batteries. The packaging construction includes an accommodation case including a bottom plate, and side plates located on outer edges of the bottom plate; a first tray having first recesses into which one end portions of the batteries are fitted, placed immediately above the bottom plate, and fixed to the accommodation case; and a second tray having second recesses into which the other end portions of the batteries are fitted, and placed above the first tray. The batteries are held so as to be fitted to the first and second trays and such that each adjacent pair of the batteries are apart from each other. A portion of a bottom of each first recess facing a corner portion of the one end portion of a corresponding one of the fitted batteries protrudes outward to be apart from the corner portion.

Abstract: Embodiments disclosed herein are directed towards a compartmentalized housing configured to house components of an electronic device. The compartmentalized housing may include a pictorial parts map disposed on an inner surface of a cover of the compartmentalized housing, the pictorial parts map including an image associated with each type of component of the electronic device. Each image on the pictorial parts map is positioned at a location corresponding to where the type of component should be placed.

Abstract: The invention relates to a lead frame magazine cover for closing of an opening of a lead frame magazine by insertion of a magazine cover into the lead frame magazine in a closing direction. The lead frame magazine cover includes a recess. The recess is constructed in the region of a front edge of the magazine cover in the closing direction of the magazine cover.

Abstract: The present invention provides a liquid crystal display module package box, which includes a box body, a retention frame arranged in the box body, and a cushioning device arranged in the box body. The retention frame forms therein a plurality of receiving channels corresponding to liquid crystal display modules. The cushioning device includes a first cushioning unit arranged between the retention frame and the box body and a plurality of second cushioning units arranged between the liquid crystal display modules and between the liquid crystal display modules and the box body. The first cushioning unit is formed by connecting a plurality of first air columns. The second cushioning unit is formed by connecting a plurality of second air columns. The liquid crystal display module package box provides a fully covered protection to the liquid crystal display modules received in the box body.

Abstract: A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

Abstract: The present invention provides a liquid crystal display module package box, which includes a box body and a positioning and cushioning device positioned in the box body. The positioning and cushioning device includes a plurality of positioning sections and a plurality of supporting sections spaced from the positioning sections. The positioning sections and the supporting sections are both of air pocket structures. The positioning sections have a size greater than size of the supporting sections. Liquid crystal display modules are each interposed and retained between two adjacent ones of the positioning sections and born by the supporting sections. The liquid crystal display module package box uses the positioning and cushioning device positioned inside the box body to provide an effect of retaining and protecting the liquid crystal display modules for protecting the liquid crystal display modules from damage caused by external forces occurring in the process of shipping.

Abstract: The present invention provides a package cushioning structure for liquid crystal display module, which includes two opposite cushioning side boards, a plurality of cushioning position-limiting boards arranged between the two cushioning side boards, and a plurality of connection plates connecting the cushioning side boards and the cushioning position-limiting boards. The cushioning side boards form first retention slots corresponding to the connection plates. The cushioning position-limiting boards form second retention slots corresponding to the connection plates. The connection plates form first and second coupling sections respectively corresponding to the first and second retention slots, whereby the first and second coupling sections are respectively received in and retained by the first and second retention slots to couple the cushioning side boards and the cushioning position-limiting boards together in a releasable manner.

Abstract: Provided is a flat carrier provided with holders for separated electronic components, comprising: a flat metal platform with a space recessed therein and an epoxy carrier structure which is arranged form-fittingly in this space and which is provided with holders for the separated electronic components. Also provided is a method for visual inspection of separated electronic components located on such a flat carrier.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: A probe card container having a main case consisting of upper and lower case portions for storing therein a prove card, a handle provided on one side surface of the main case, one or more members for preventing the movement of the main case provided on a mounting surface of the main case, and one or more rollers for assisting the movement of the main case provided on the mounting surface or a corner formed between the mounting surface and the other side surface of the main case so as to project obliquely downward from the corner.

Abstract: A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.

Abstract: The present invention discloses a liquid crystal display (LCD) panel module packaging box and a packaging method of LCD panel module, wherein the LCD panel module packaging box comprises a buffer structure; the buffer structure is provided with multiple slot groups which are used to insert LCD panel modules, and the slot group comprises a pair of slots adjacent to each other. The distance between two adjacent slots of the slot groups is smaller than the distance between two slot groups; the distance between the slot groups corresponds to the total height on backplanes of the two backlight modules. When packaging the LCD panel modules, the relatively more fragile display panel of LCD panel module is inserted in opposite pairs into two slots of a slot group of the packaging box of the present invention.

Abstract: A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2?t?0.

Abstract: A substrate storage container includes: a container body of a front open box type for holding a multiple number of semiconductor wafers supported in alignment by supporting ribs; a bottom plate removably attached to the bottom of the container body; and a pair of conveyor contact rails integrally formed along both the left and right sides of this bottom plate. These conveyor contact rails inhibit vibrations and impacts acting on the semiconductor wafers when the sealed container body is conveyed by a conveyor.

Abstract: A semiconductor package holder includes two plates, and each plate defining a through-hole. Each of the plates has a set of first members along a periphery of the through-hole and extending into the through-hole. The first members of one of the plates are positioned to overlie the first members of the other of the plates. One of the at least two plates further has a set of second members along a periphery of the through-hole and extending into the through-hole.

Abstract: A lower cushioning structure and a package cushioning structure for a display panel are disclosed. The lower cushioning structure comprises: a supporting frame, comprising a baseplate as well as a first side plate and a second side plate extending upwards from two opposite sides of the baseplate respectively; two first cushions, being disposed at a location where the first side plate of the supporting frame borders the baseplate and a location where the second side plate of the supporting frame borders the baseplate respectively; and two second cushions, being disposed on an inner wall of the first side plate and an inner wall of the second side plate of the supporting frame respectively, wherein the second cushions are located above the first cushions. The present invention has a low cost and can provide satisfactory cushioning for the display panel.

Abstract: A package for delivery of a tacky product includes a carrier tape with a plurality of cavities separately disposed along a length thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier tape may be configured for use in tape and reel packaging systems.

Abstract: A collapsible container system comprises first and second opposed trays capable of nesting when unopposed, each tray has a tray lip disposed along the perimeter thereof and a plurality of lip slots therein. A wall element has a plurality of sides when unfolded that engage the tray lip of said first and second opposed trays to form a rigid container. A plurality of straps capable of being inserted through the plurality of lip slots in the tray lip whereby the straps are arranged to secure the first and second opposed trays and wall element to each other. Advantageously, the lip slots are vertically positioned at or below an inner supporting surface of a lower tray providing a liquid drainage system. Optionally, the container system may have an inner and outer wall element providing additional strength and rigidity and may also have a liquid container stored therein.

Abstract: The present invention relates to the packaging of static sensitive, electro-mechanical and passive electronic components, and in particular to the packing of electronic components. An electronics packaging system (1) for electronic components, comprises a tray (2) formed of plastic sheet material, said sheet having opposite first and second surfaces (4, 5) and having a plurality of individual recesses (6) formed in the first surface (4) thereof, each recess (6) having a rim (8) that extends around the recess, and a coversheet (12) of antistatic fabric which extends over said first surface (4) of the tray (2) and across the rims (8) around said recesses (8). The coversheet (12) is bonded to the tray (2) to provide an individual packaging volume for an electronic device (16) between each recess (6) and the coversheet (12).

Abstract: A workpiece carrier for supporting a plurality of workpieces, the workpiece carrier comprising: a plurality of support elements, each for supporting a workpiece; and a plurality of positioning elements, each associated with a respective one of the support elements and being operative to position a workpiece at a predetermined position in the respective support element, wherein the positioning elements each comprise a plurality of biasing elements which are disposed in opposed relation and configured laterally to bias the workpiece and position the workpiece at the predetermined position.

Abstract: A heat radiating plate storage tray has a plate main body, and a plurality of first projection portions provided on a first surface of the plate main body. A heat radiating plate having a rectangular recessed portion on a surface thereof is capable of being mounted on the first surface of the plate main body, a top face of the first projection portion supports a bottom face of the recessed portion of the heat radiating plate, and a height of the first projection portion is larger than a depth of the recessed portion of the heat radiating plate.

Abstract: Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.

Abstract: An LED indicator casing (1R) has: a casing (1a) including a bottom face (S1), a front face (S2) having an aperture (2a) for light emission, and paired side faces (S3 and S4) adjoining the front face (S2); and paired lead terminals (11 and 12), one of which has a light-emitting element (LED)(21) fitted thereto. The paired lead terminals (11 and 12) are led out to the bottom face (S1) via the paired side faces (S3 and S4) of the casing (1a) respectively.

Abstract: A transport package (1) for the transportation of a plurality of electronic components (9), said trans-port package (1) comprising a carrying pallet portion (2), a circumambient side cover (3) and a lid (4). Said electronic components (9) are supported by a partition array (5), wherein said partition array (5) is arranged to form a plurality of pockets (51) having upper edges (52) and optionally a closed base (53). Said electronic components (9) are arranged standing on edge in said pockets (51). A plurality of said partition arrays (5) containing said electronic components (9) are arranged inside the transport package (1) and that said partition arrays (5) can be folded to reduce volume during empty transport.

Abstract: A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates.

Abstract: An objective of the present invention is to provide a shipping tray for optical elements that prevents toppling of optical elements during transportation and optimally maintains the optical characteristics of the optical elements. In a shipping tray for optical elements, single edges of a plurality of optical elements, each having two main surfaces formed as horizontal flat surfaces, are sequentially disposed upright in the lateral and longitudinal directions on an adhesive tape provided on a base surface of a main container; and the plurality of optical elements is covered with a cover in which is formed a plurality of concavities for individually accommodating the plurality of optical elements. Each concavity in the cover has an aperture portion provided in a plateau portion thereof, into which is inserted one of the optical elements upright with the free edge side protruding therefrom, and the shape of the aperture portion is oval.

Abstract: An object of the present invention is to provide a storing tray and a storing device whereby an object such as an electronic component to be stored can be picked up in a preferred manner and a plurality of stored objects can be flipped and transferred at once. Another object is to form the storing tray as a soft tray. The storing tray includes a storing part on its main surface, the storing part including a storing base for placing therein an object such as an electronic component, a plurality of convex portions formed along the outer periphery of the storing base to protrude upward more than the storing base, and concave portions formed along the outer periphery of the storing base between the plurality of convex portions to be recessed downward more than the storing base. The storing tray has an uneven back surface opposite in shape to the main surface.

Abstract: A carrier tray as described herein includes a container having pockets for holding electrical components such as integrated circuits during manufacturing, and a device coupled to the container for tracking usage of the carrier tray into and out of process chambers used for performing particular processes on the electrical components carried therein. Stations and methods of using the carrier tray are also described herein.

Abstract: A substrate carrying tray capable of horizontally placing a substrate thereon and enabling a plurality of trays to be stacked on each other, comprising an upper contact part coming into contact with one tray disposed on the upper side of the tray when the plurality of the substrates are stacked on each other and a lower contact part coming into contact with the other tray disposed on the lower side. The shapes of the upper contact part and the lower contact part are formed such that, when one tray is placed on the upper side of the tray, the one tray can be moved in the direction that the gravity center of the one tray is disposed just above the gravity center of the tray.

Abstract: A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.

Abstract: Vias 7 penetrating a circuit substrate 2 or a seal ring 8 are provided on a part or the entire outer periphery of a molding semiconductor device 1 or in the cut region of the circuit substrate 2, so that adhesion between a substrate and a core 2C in the circuit substrate 2 is improved. Therefore, it is possible to suppress the exfoliation of the circuit substrate 2, improving the yields.

Abstract: A semiconductor chip housing tray that is used in a state of being stacked in a plurality of stages and houses a plurality of semiconductor chips, includes: a base plate; a plurality of upper surface protruding parts provided to an upper surface of the base plate and dividing the upper surface of the base plate into a plurality of first semiconductor chip housing areas; and a plurality of under surface protruding parts provided to an under surface of the base plate and dividing the under surface of the base plate into a plurality of second semiconductor chip housing areas. In the semiconductor chip housing tray, a margin width of the first semiconductor chip housing areas with respect to the semiconductor chips is smaller than a margin width of the second semiconductor chip housing areas with respect to the semiconductor chips.

Abstract: A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom portion of the housing is concaved to form a space, in which a thermal interface material bonded on the LED module is accommodated. An end of the housing is closed to abut against an end of the cover, and an opposite end of the housing is partially opened to receive an opposite end of the cover. The protective packaging is made from an antistatic plastic and has a wall thickness larger than 0.5 mm.

Abstract: The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.

Abstract: A protective case or mounting device for a portable digital media device includes a first and a second snap fit cavity adapted to receive and selectively retain a first and a second protrusion element, respectively, associated with any of various accessory mounting or position retention elements. Connection between respective protrusions and snap fit cavities is made by depressible insertion. A portable digital media device may thus be removably engaged to various positioning elements without requiring the device to be removed from a protective case.

Abstract: To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.

Abstract: A stack processing tray for use with tray-based integrated circuit device handling systems is disclosed. The stack processing tray has a plurality of cells, each cell being configured to receive at least two integrated circuit devices in a vertically superimposed, stacked relationship. Increased efficiency in the handling and processing of integrated circuit devices is realized as the tray-based integrated circuit device handling system performs fewer tray movements, and therefore less work, to handle a given number of integrated circuit devices.

Abstract: A gap set device for an electronic component handler is provided. The electronic component handler includes a test module operative to load, test and unload electronic components. The electronic components are received in test pockets provided on a test plate. The test pockets include at least one corner relief to improve loading efficiency.

Abstract: A stacking tray for electrical components, such as integrated circuits, particularly those of the ball grid array (BGA) type. The tray is stackable and includes an upper side and a lower side. Both upper and lower sides of the trays include support elements forming ledges and ridges to support the integrated circuit element and stabilize the integrated circuit element in the X-Y directions. In the unstacked configuration, whether the tray is presented in the right side up or upside down configuration, the integrated circuit elements are stabilized in the X-Y directions at two diagonally opposed corners, and hence all four sides of the chip. In a stacked configuration, the laterally inwardly offset ridges of a tray immediately downwardly adjacent from the integrated circuit restrain and stabilize the integrated circuit in the X-Y directions by engaging a first pair of diagonally opposed corners of the integrated circuit.

Abstract: A stacking tray for electrical components, such as integrated circuit chips, particularly those of the ball grid array (BGA) type is disclosed. The tray is stackable and includes an upper side and a lower side. An array of storage pockets is formed between the upper side of a lower tray and the lower side of an upper tray. The storage pockets are separated by complementary support elements and further include a segmented pedestal arising from the center of the storage pocket, on the upper side of the trays. The segmented pedestal supports the integrated circuit chip, without interfering with the spherical balls. Moreover, the tray allows for variation of the dimensions of the integrated circuit chip while adequately stabilizing the chip.

Abstract: A protective enclosure for a portable electronic data storage device includes an outer shell having a base and a lid movable between open and closed conditions relative to the base. An insert is receivable within the shell. The insert has an interior compartment for accommodating the electronic data storage device and an opening formed through an upper end of the insert in communication with the compartment for extending the storage device therethrough.

Abstract: A carrier for articles has a main body (10) with one or more engagement means (28) for receiving one or more indicators (40, 60). The indicators (40, 60) have one or more contrasting colors compared to the color of the main body (10). The color or shape or both of the indicator provides the user with information regarding the articles, carrier or characteristics of the articles or carrier.