Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: This substrate storage container comprises: a lid body-side substrate support part which is capable of supporting an edge part of a substrate when the substrate storage container is closed; a depth-side substrate support part which is disposed so as to form a pair with the lid body-side substrate support part and is capable of supporting the edge part of the substrate; and a substrate edge part auxiliary part which is disposed at a portion opposing a substrate storage space when the substrate storage container is closed, and in which are formed a plurality of auxiliary grooves having an opening that is wider than the thickness of the edge part of the substrate so that the edge part of the substrate can be inserted therein. The auxiliary grooves each have opposing groove forming surfaces, and an edge part of one of a plurality of the substrates is inserted into each auxiliary groove when the container is closed.

Abstract: Exemplary methods of semiconductor processing may include coupling a fluid conduit within a substrate support in a semiconductor processing chamber to a system foreline. The coupling may vacuum chuck a substrate with the substrate support. The methods may include flowing a gas into the fluid conduit. The methods may include maintaining a pressure between the substrate and the substrate support at a pressure higher than the pressure at the system foreline.

Abstract: A wafer boat for supporting a plurality of semiconductor wafers in a furnace is disclosed. The wafer boat includes a set of fingers each having a contact protuberance which contacts and supports a semiconducting wafer. The contact protuberances may be arranged in a rotationally symmetric pattern about the wafer boat.

Abstract: A method of performing a substrate detection process is provided. The method includes emitting a signal to a surface of a substrate from an emitter disposed in a substrate storage container. The method also includes collecting the signal reflected from the surface of the substrate by a receiver disposed in the substrate storage container. The method further includes transmitting data corresponding to the collected signal to a signal processor. In addition, the method includes analyzing the data, and determining whether an action is to be performed on the substrate based on the analyzing.

Abstract: There is provided a technique that includes a substrate support including a support column made of metal and a plurality of supports installed at the support column and configured to support a plurality of substrates in multiple stages; a process chamber configured to accommodate the plurality of substrates supported by the substrate support; and a heater configured to heat the plurality of substrates accommodated in the process chamber, wherein the plurality of supports includes at least a contact portion configured to make contact with the plurality of substrates and made of at least one selected from the group of a metal oxide and a non-metal material.

Abstract: A wafer jig according to one or more embodiments may be used for a robot having a hand and a state detector. The hand can transport a wafer. The state detector detects a state of a member holding the wafer at the hand or a state of a negative pressure adsorbing the wafer at the hand. The wafer jig includes an information output part. The information output part outputs information to a hand side via the state detector by changing a detection result of the state detector.

Abstract: A tray module capable of discharging static electricity to safely transfer display device members (e.g., components) includes: a tray configured to accommodate at least two members of a display device, at least two conductive protection films alternatingly stacked with the members of the display device, and a conductive pattern on the tray to provide a discharge path with the conductive protection films to ground.

Abstract: A container for consumables includes multiple holding portions, a partition plate and a fixer. The multiple holding portions are configured to respectively accommodate the consumables, each of which is loaded into and unloaded from one direction. The partition plate includes a first portion formed to be disposed between a light emitting part and a light receiving part of a detector, and the partition plate is accommodated in one of the multiple holding portions. The fixer is configured to fix the container so that the consumables are arranged on a transfer path to be loaded into and unloaded from the multiple holding portions.

Abstract: The present disclosure provides a device for conveying and dispersing a silicon wafer (100). The device for conveying and dispersing a silicon wafer (100) includes: a conveying component (20) configured for conveying a plurality of silicon wafers (200); a clamping component (10) disposed at two sides of the conveying component (20), the clamping component (10) being capable of clamping and conveying the plurality of silicon wafers (200); and a spraying component (30) disposed on the clamping component (10), wherein after the plurality of silicon wafers (200) are conveyed to an end of the conveying component (20) proximal to the spraying component (30) via the conveying component (20) and the clamping component (10), the spraying component (30) is capable of spraying water on the plurality of silicon wafers (200) to separate adjacent two of the plurality of silicon wafers (200).

Abstract: The present application relates to a base frame of a substrate carrier, including a first vertical rod and a second vertical rod; a plurality of cross rods, being arranged along the lengthwise direction of the first vertical rod and the second vertical rod, and being connected between the first vertical rod and the second vertical rod; a first vertical rod extension, being connected to an end of the first vertical rod from which a substrate enters; and a second vertical rod extension, being connected to an end of the second vertical rod from which the substrate enters; and the first vertical rod extension and the second vertical rod extension are configured to accommodate at least one set of rollers for conveying the substrate therebetween.

Abstract: A cassette for receiving at least one substrate for a display device includes a base; and a first wall extending in a direction generally perpendicular to an upper surface of the base and a plurality of first projections extending from the first wall in a first direction and arranged in a second direction generally perpendicular to the first direction at substantially regular intervals. A first opening is defined between adjacent first projections to receive one end of a first substrate, the first opening includes a first portion having a first width in the second direction and a second portion having a second width greater than the first width, and the first portion is disposed closer to the first wall than the second portion.

Abstract: A semiconductor wafer includes a wafer body including an active layer having a first crystal orientation and having first and second surfaces opposing each other, and a support layer having a second crystal orientation different from the first crystal orientation and having third and fourth surfaces opposing each other, a bevel portion that extends along an outer periphery of the wafer body to connect the first surface to the fourth surface, and a notch portion formed at a predetermined depth in a direction from the outer periphery of the wafer body toward a center portion of the wafer body. The bevel portion includes a first beveled surface connected to the first surface and a second beveled surface connected to the fourth surface. The first beveled surface has a width in a radial direction of the wafer body that is 300 ?m or less.

Abstract: A maintenance access system for a storage and retrieval system having a storage and retrieval space and automated transport vehicles disposed in the space. The system includes at least one maintenance access control unit associated with a portion of the space, at least one barrier in the space and defining a boundary of the portion of the space and configured to substantially prevent the passage of the vehicles past the at least one barrier, and a controller connected to the control unit, the controller being configured to receive a signal from the at least one control unit for isolating the portion of the space associated with the at least one control unit, where the controller in response to the signal closes the at least one barrier isolating the portion of the space and effects the removal from or shutting down of vehicles within the portion of the space.

Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack and have openings that permit exhaust air to flow from the computing devices through the air barrier into a hot aisle. The rack may be configured to be connected to other similar racks to form a vertical annular cylinder, which may be tapered, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular cylinder to improve airflow.

Abstract: A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.

Abstract: Provided are an edge ring and a heat treatment apparatus having the same. The edge ring includes a main body having a ring shape. The main body includes a substrate support part configured to support an edge of a bottom surface of a substrate, an outer band provided outside the substrate support part and having a top surface that is higher than a top surface of the substrate support part and is parallel to a top surface of the substrate supported by the substrate support part, an outer sidewall provided outside the outer band, and a groove part provided between the substrate support part and the outer band.

Abstract: A wafer storage device includes a wafer cassette and a carrier plate. The wafer cassette includes a housing and a plurality pairs of retaining members disposed on lateral walls of the housing. The carrier plate is placed into the housing, is supported by one pair of the retaining members, and includes a plate body carrying the wafer thereon, and having a periphery formed with two slots extending respectively in two different radial directions of the wafer. Two positioning members respectively and radially correspond in position to the slots, and abut against an outer rim of the wafer.

Abstract: This board storing container is provided with a container body, a lid 3, and a lid-side board support unit 7 which, when the lid 3 closes a container body opening, is arranged in the part of the lid 3 opposite of the board storage space and which can support the edge of multiple boards. The lid-side board support unit 7 is provided with a lid-side board receiving unit which receives the edge of a board when supporting the board, and a frame part 71 held on the inner surface of the lid 3 and having a first surface 711 facing the inner surface of the lid 3 and a second surface 712 opposite of the first surface 711. The lid 3 is provided with a frame holding unit 35 for holding the frame 71 in an inserted state, and comprises a third surface 353 opposite of the first surface 711 and a fourth surface 354 opposite of the second surface 712.

Abstract: There is provided a substrate processing apparatus including a process chamber in which a substrate is accommodated, a processing gas supply system configured to introduce a processing gas containing hydrogen peroxide into the process chamber and an exhaust system configured to exhaust an interior of the process chamber, wherein at least one selected from the group of the process chamber, the processing gas supply system, and the exhaust system includes a metal member, the metal member exposed to the processing gas or a liquid generated by liquefying the processing gas is made of a material containing an iron element, and a surface of a plane of the metal members, which is exposed to the processing gas or the liquid, is formed of a layer containing iron oxide which is formed by performing a baking process on the metal member.

Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.

Abstract: Apparatus to store singulated wafers for transport, including multiple wafer assemblies stacked in the interior of a container housing, the individual wafer assemblies including an expanded laser diced wafer singulated into dies, a first frame spaced outward from the wafer on a carrier structure, a second frame spaced outward from the wafer and inward from the first frame on the carrier structure, and a foam structure that supports the second frame and the carrier structure.

Abstract: The present invention refers to a flame retardant comprising a complex formed by phosphine oxide and transition metal salt, wherein has good flame retardant property. The present invention also refers to a composite flame retardant and flame retardant antistatic composition. The present invention also further refers to a flame resistant method, which adds the abovementioned flame retardant, composite flame retardant or flame retardant antistatic composition into the material, so that said material has flame retardance or flame retardance and antistatic, and has excellent mechanical properties.

Abstract: Provided is a substrate processing apparatus, and more particularly, a batch-type substrate processing apparatus where processes can be performed independently on a plurality of substrates. The substrate processing apparatus includes a substrate boat including a plurality of partition plates and a plurality of connection rods, an internal reaction tube, a gas supply unit, and an exhaust unit, and a plurality of substrates are loaded to be separated from the partition plates.

Abstract: Semiconductor substrate adaptor configured to adapt a substrate of a first dimension to a second dimension, such that the substrate can be properly supported by a supporting mechanism (e.g., a wafer cassette) customized for substrates of the second dimension. The substrate adaptor may be made of quartz. The combination of the substrate adaptor and a substrate fitting therein causes no perturbation in various aspects of a semiconductor process. Therefore, the substrate adaptor conveniently enables a substrate of the first dimension to be processed in the same processing equipment and conditions as a substrate of the second dimension. A vertical substrate adaptor may have a semicircular body with a semicircular cutout for accommodating a wafer and can support a wafer vertically. A horizontal substrate adaptor may have a circular body with a circular cutout for accommodating an entire wafer and supporting the wafer horizontally.

Abstract: A cassette and a substrate transfer device are disclosed. The cassette includes a first frame and at least one movable face. The first frame includes at least one set of first guide rails; and the movable face is disposed in the first frame. The movable face is configured to be capable of being driven to slide along the first guide rails, and is configured to be capable of being fixed on the first frame. The substrate transfer device includes the cassette provided by one of the embodiments of the disclosure and a bearing device configured to bear the cassette, the bearing device comprises a second frame and a rotating unit mounted in the second frame. The movable face of the cassette can be firmly fixed on the first frame and can move freely to change size of sub-cassettes.

Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.

Abstract: The present invention discloses a cartridge for glass substrate and which includes a top wall, a bottom wall, at least a pair of sidewalls, a plurality of supporting rods, and an adjusting device. The plurality of supporting rods are arranged on the pair of sidewalls along a first horizontal direction across the pair of sidewalls such that a plurality of supporting surfaces configured by at least a pair of supporting rods facing each other from the paid of sidewalls are defined. The adjusting device is used to move one of the sidewall toward the other sidewall with respect to the top and bottom walls so as to change a span between the pair of sidewalls. As a result, the cartridge can be used to accommodate glass substrates with different dimensions.

Abstract: Embodiments of mechanisms of a furnace apparatus having a wafer boat are provided. The wafer boat includes a base plate and a support rod extended from the base plate. The wafer boat also includes a support finger including a finger body extended from the support rod and a curved end portion extended from the finger body. The wafer boat further includes a top plate supported on the support rod. A width of the support rod exceeds that of the support finger.

Abstract: A clean stocker includes: a reticle rotatable rack separately storing reticles and a pod; an empty pod rotatable rack; a manual load port supplying to an operator a pod including a reticle; a pod-with-reticle rotatable rack temporarily storing the pod including the reticle; a detecting unit detecting an instruction sent from the operator; a pod opener for, when a first instruction is detected, obtaining (i) a reticle from the reticle rotatable rack and (ii) an empty pod from the empty pod rotatable rack, and placing the obtained reticle into the empty pod; and a pod transporting apparatus (i) putting on the pod-with-reticle rotatable rack the pod including the reticle, and (ii) when a second instruction is detected, transporting the pod including the reticle from the pod-with-reticle rotatable rack to the manual load port.

Abstract: Methods, apparatus, and assemblies are provided for an adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

Abstract: A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates.

Abstract: The invention relates to a holding system (1) for mounting a photovoltaic module (6) to a base (8) by means of ground supports (2, 2a, 44, 44a) which comprise a bearing head (4, 4a, 50, 50a), a ground support body (22) and a bearing surface (28, 48) on the bottom side which counteracts a penetration of the ground supports into the base (8), wherein the ground supports (2, 2a, 46, 46a) comprise on their head side a bearing plate (14, 14?, 14a, 14a?, 54, 54?, 54a, 54?) that is disposed at a slanted angle (?) in relation to the base (8), and wherein the ground supports (2, 2a, 46, 46a) are provided and prepared such that, in the mounted state, the bearing plates (14, 14?, 14a, 14a?, 54, 54?, 54a, 54?) of a ground support pair (2, 2a, 46, 46a) are spaced apart from each other vertically in relation to the base (8) and from each other horizontally in adjustment to the photovoltaic module (6) and that they are aligned with each other at least in essence.

Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Abstract: The present invention provides a package cushioning structure for module, which includes a cushioning bottom board and a cushioning band extending through and interlaced with the cushioning bottom board. The cushioning bottom board forms a plurality of spaced hollow sections. A bar is arranged between every two of the hollow sections. The cushioning band includes a plurality of cushioning air columns mounted thereto at interval. The cushioning air columns are arranged alternately on the bars. To package, modules are each positioned on and born by each of the bars between two of the cushioning air columns. An alternate package cushioning structure includes a cushioning bottom board having a surface forming slots and a cushioning band arranged in the cushioning bottom board through a mounting channel extending through the bottom board from a side surface thereof. Air columns of the cushioning band are located in the slots to support modules.

Abstract: A wafer handling station includes a housing defining a chamber, and a wafer cassette assembly positionable in the chamber. The wafer cassette assembly includes a vertical support, and cassette members carried by the vertical support in spaced relation. Each cassette member includes a base coupled to the vertical support, wafer contact pads on an upper surface of the base and configured to support a wafer thereon, and a pair of wafer brackets carried by the base and configured to engage respective edges of the wafer to laterally confine the wafer.

Abstract: A substrate storage tray that can be decreased in size for transportation. A substrate storage tray (1) for storing a large size substrate (20) includes a frame member (2) that includes a pair of first frame portions (5) opposed to each other and a pair of second frame portions (6) opposed to each other and has a frame shape, a substrate supporting member (3, 4) that has a plate shape, is disposed inside a region enclosed by the frame member (2), and is arranged to support one surface of the substrate (20), and extending portions (7) that are provided to middle portions in a long direction of the pair of first frame portions (5) and are arranged to widen a space between the pair of second frame portions (6).

Abstract: A wafer boat for accommodating semiconductor wafers comprises two side rods and at least one back rod, the rods being vertically oriented and extending between a top member and a bottom member. The rods comprise vertically spaced recesses formed at corresponding heights, recesses at the same height defining a wafer accommodation for receiving and supporting a wafer in a substantially horizontal orientation, the recesses having an improved shape. The upwardly facing surfaces of the recesses comprise a first flat surface in an inward region of the recess which is horizontal or inclined upward in an outward direction of the recess and a second flat surface in an outer region of the recess which is inclined downward in an outward direction of the recess. The intersection of the first and second surface forming an edge for supporting the wafer. The recesses are easy to machine and prevent damage to the wafer.

Abstract: The invention relates to a device for storing platelike substrates, particularly wafers or test wafers, like those, in particular, used for manufacturing electronic components. The aim of the invention is to make a reliable access to the substrates possible even when storage elements, which can be separated from one another, of the device are affected by manufacturing mistakes. For such a device that, for each substrate, has a number of storage elements, which follow one another in a direction of stacking and which can move relative to one another, in which the storage elements have a stacking area, which is provided for placing the respective storage element inside a stack of storage elements, compensating means are therefore provided in order to compensate for stacking errors in the direction of stacking.

Abstract: Systems and methods for processing a substrate include supplying steam in a chamber, arranging a substrate with a deposited layer that includes silicon in the chamber, and directing UV light onto the deposited layer in the presence of the steam for a predetermined conversion period to at least partially convert the deposited layer. Systems and methods for densifying a deposited layer of a substrate include supplying ammonia in a chamber, arranging the substrate that includes the deposited layer in the chamber, and directing UV light onto the deposited layer in the presence of the ammonia for a predetermined conversion period to at least partially densify the deposited layer.

Abstract: Disclosed is a cassette for loading a substrate, which includes a cassette main body which includes upper and lower frames spaced apart at upper and lower sides, a plurality of internal support bars for supporting the substrate, side frames provided at opposite sides of the upper and lower frames and forms a box shape to internally receive the substrate; a center frame which includes a plurality of internal support bars for supporting the substrate and is vertically disposed in a back of the upper and lower frames; and a connecting member which is provided between the center frame and the cassette main body and detachably connects the center frame to the cassette main body, wherein the connecting member comprises a first fixing unit fixed to the cassette main body, and a second fixing unit fixed to the center frame and detachably coupled to the first fixing unit, the first fixing unit being installed at each of a front and a back of the cassette main body.

Abstract: Provided is a boat for loading semiconductor substrates that includes a top plate and a bottom plate separated from each other, a rod extending from the bottom plate to the top plate and disposed between the top plate and the bottom plate, a plurality of buffer plates disposed between the top plate and the bottom plate and separated from each other by a first distance along a lengthwise direction of the rod, and a support provided between a first buffer plate and a second buffer plate which neighbor each other and supporting a loaded semiconductor substrate.

Abstract: A light weight ballasted solar racking system has light ballasted weight loads and is easy and fast to install. The racking system may be used in roof or ground mount applications to mount thin film and frameless solar modules. The racking system physically attaches to the solar panel at the manufactured mounting holes with a set of struts that then attach to a ballast tray that holds the system in place. A set of struts may determine the degree of angle from about 5 to about 35 degrees, for example. The front of the ballast tray has an air pass way of about 3-5 inches, while the back of the system has about 8-12 inches of space for an air pass way. Multiple racking systems may be linked together, resulting in the need for less ballast weight for each racking system.

Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.

Abstract: Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.

Abstract: An elastic retention wheel and a wafer adapter containing this wheel are disclosed. The elastic retention wheel comprises: a rim; a retention main body positioned within the rim; and a plurality of spokes. Each spoke is positioned in a space between the rim and the retention main body. One end of each spoke is coupled to the retention main body, and the other end is coupled to the rim. A sliding rail can be provided on an inner side of the rim, and the spoke's other end can slide with the sliding rail. When the elastic retention wheel is stressed by a non-uniform or excessive external force, these spokes provide enhanced support from the rim's inner side, or at least partially disperse the non-uniform external force applied to the elastic retention wheel. Thereby, the elastic retention wheel is largely kept from over-deformation or cracking.

Abstract: A wafer-retaining unit has a plurality of vertically superimposed single-wafer retaining sections, each having a wafer-retaining frame abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer, a wafer-securing frame disposed vertically movably relative to the wafer-retaining frame to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer, and wafer lift members that lift the semiconductor wafer to a position where it is upwardly separate from the wafer-retaining frame and keeps the semiconductor wafer in this position. Consequently, a plurality of semiconductor wafers can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers. At the same time, the semiconductor wafers can be loaded and unloaded satisfactorily.

Abstract: A method and an inspection system that includes: a multi wafer support device arranged to concurrently support multiple wafers; optics arranged to acquire images of the multiple wafers supported by the multi wafer support element; a mechanical stage arranged to introduce movement between the multi wafer support element and the optics; and a processor arranged to process the images acquired by the optics.

Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.

Abstract: A cassette for receiving substrates includes a frame, and a plurality of support plates protruding from both lateral sides of the frame, wherein the support plates have a width and length large enough to support the substrates without a bending and an access space for a robot arm to transport the substrates, an area of the access space corresponding to an area of the robot arm.