Abstract: Positional accuracy of apertures in nonplanar electrodes is improved with a new fabrication method. This method precedes process steps which establish a photoresist pattern that defines apertures with deformation steps which produce a nonplanar electrode. Thus, the deformation steps do not have an opportunity to spatially alter the photoresist pattern. The improved positional accuracy enhances the performance and lifetime of ion thrusters which include nonplanar electrodes that are fabricated with this process.

Abstract: This invention provides a microfabricated extraction system and methods for extracting desired particles from a sample stream containing desired and undesired particles. The sample stream is placed in laminar flow contact with an extraction stream under conditions in which inertial effects are negligible. The contact between the two streams is maintained for a sufficient period of time to allow differential transport of the desired particles from the sample stream into the extraction stream. In a preferred embodiment the differential transport mechanism is diffusion. The extraction system of this invention coupled to a microfabricated diffusion-based mixing device and/or sensing device allows picoliter quantities of fluid to be processed or analyzed on devices no larger than silicon wafers.

Abstract: A process for producing lithographic features in a substrate layer is is described, comprising the steps of lowering a stamp (15) carrying an reactant (14) onto a substrate (10), confining the subsequent reaction to the desired pattern, lifting said stamp and removing the debris of the reaction from the substrate. Preferably, the stamp carries the pattern to be etched or depressions corresponding to such a pattern. Using the described methods, patterns with submicron features can be generated. The method allows a general solution to parallel handling and transfer of materials in a variety of technical fields.

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole.

Abstract: An electrochemical cell for etching a metal workpiece such as an aluminum foil, a method for etching the foil using the electrochemical cell, and foil thus produced is provided. The cell includes an etch tank having an etch electrolyte disposed therein and containing at least a first and a second compartment each containing (i)an etch electrolyte, (ii) a cathode plate, and (iii) an ion exchange membrane separator portion having an ion exchange polymeric material effective to substantially retard or prevent reduction of the oxidizing agent or agents present in the etch electrolyte, the first and second compartments being arranged in the etch tank with the ion exchange membrane separator portions in facing relationship one to the other; and a metal workpiece such as an aluminum foil anode present in the etch tank and disposed between each said first and second compartments.

Abstract: A withdrawn electrode is formed on a silicon substrate with intervention of upper and lower silicon oxide films each having circular openings corresponding to regions in which cathodes are to be formed. Tower-shaped cathodes are formed in the respective openings of the upper and lower silicon oxide films and of the withdrawn electrode. Each of the cathodes has a sharply tapered tip portion having a radius of 2 nm or less, which has been formed by crystal anisotropic etching and thermal oxidation process for silicon. The region of the silicon substrate exposed in the openings of the upper and lower silicon oxide films and the cathode have their surfaces coated with a thin surface coating film made of a material having a low work function.

Abstract: The present invention provides a capsule made of a biologically compatible material with sufficient mechanical strength to form a very thin membrane shell having at least a region with approximately uniformly sized and spaced holes or pores that are large enough to let a desired biologically active molecular product through, while blocking the passage of all larger immunological molecules. The present invention thus provides an immunological isolation of cell transplants contained therein. The present invention also provides a free standing thin film structure that may be used as a component of such a capsule and method for the fabrication of such component and capsules.

Abstract: A construction and manufacturing process for drop on demand print heads provides electrothermal heating elements which are in close proximity to the tip of the nozzle, and therefore achieve efficient thermal coupling to the ink.The construction utilizes metal layer electrodes formed as part of a CMOS drive circuit fabrication on a silicon wafer. A nozzle tip hole is then etched with an axis generally normal to the electrode layers. A heater substance and a passivation layer are deposited on the wafer. These layers are then anisotropically etched, leaving heater and passivation layers on the vertical sidewalls of the nozzle tip hole. Ink channels and nozzle barrels are then etched in the wafer, preferably using an etchant which has a high selectivity against the passivation layer and heater material, such as EDP.

Abstract: A processed Si product suitable for use as, for example, an X-ray mask, is produced by a process having the steps of preparing a non-porous Si substrate, changing by anodization at least a portion of the substrate into porous Si thereby forming at least one porous Si region penetrating the substrate from one to the other side thereof, and effecting an etching on the substrate by using an etchant containing hydrofluoric acid so as to remove the porous Si region. The substrate may be provided with an etching stop layer. In such a case, an unsupported membrane region formed by the etching stop layer is left after the removal of the porous Si region.

Abstract: A method of fabricating a microstructure is disclosed. The method includes providing a substrate for forming an interface region and an elongated portion extending away from the interface region. A patterned, non-planar etchable structure is formed on one side of the elongated portion of the substrate. An unetchable membrane layer is deposited atop the etchable structure. At least one etching hole is formed in the membrane layer. The etchable structure is etched by placing an etchant into the etching hole to form a cavity underneath the membrane layer, thereby producing a shaft.

Abstract: A cavity pattern for a laminated structure such as a substrate for integrated circuitry is formed in a sheet of unfired low temperature cofired ceramic (LTCC) material also known as "green" tape. One sheet at a time is placed in a flexible ram forming die including a resilient rubber pressure pad and a template including the pattern to be formed in the sheet. A pair of outer pressure plates hold the pressure pad and template in place. When a sheet of unfired LTCC material is placed between the pressure pad and template and pressurization is applied to the outer plates, extrusion of the rubber material through the template causes the tape to be sheared off at the edges of the holes in the template, thus effectively cutting the required pattern in the sheet. Following pressurization, the sheet now with the pattern cut therein is removed from the die and the residual tape cut-outs are subsequently removed from the template by a vacuum.

Abstract: A method for forming a tubular article having a perforated annular wall, such as a surgical stent, includes coating the exterior and interior cylindrical surfaces of a tubular member with a photoresist, exposing selected portions of the photoresist coated surfaces to light, developing the coating, and then etching the coating to remove unexposed portions of the coating and immediate underlying portions of the annular wall, thereby forming a tubular article having a wall structure defined by a skeletal framework. An apparatus for exposing a light-sensitive coating to a tubular article includes means for rotating and translating the article with respect to a light source, along a longitudinal axis and simultaneously exposing aligned portions of the interior and exterior cylindrical surfaces of the tubular member. The method and apparatus embodying the present invention are particularly suitable for forming stents that support the walls of weak human arteries.

Abstract: A top-via etch technique for forming dielectric membranes for thin film devices, the dielectric membrane being deposited on the upper planar surface of the substrate. After the thin film device is formed on the dielectric membrane, a photoresist etch mask is deposited on the entire upper planar surface of the substrate, including the thin film structure. Vias are formed through the dielectric membrane and the protective photoresist etch mask to expose the upper planar surface of the substrate along opposite first and second ends of the thin film device. The upper planar surface of the substrate is isotropically etched using a reactive ion etching technique for example, to form air gaps beneath the dielectric membrane. The etching process may be carried out in etch segments of predetermined intervals, each followed by a cool down period of a prescribed interval.

Abstract: Printing heads which operate using coincident forces, drop on demand printing principles integrate many nozzles into a single monolithic silicon structure. Semiconductor processing methods such as photolithography and chemical etching are used to simultaneously fabricate a multitude of nozzles into the monolithic head. The nozzles are etched through the silicon substrate, allowing two dimensional arrays of nozzles for color printing. The manufacturing process can be based on existing CMOS, nMOS and bipolar semiconductor manufacturing processes, allowing fabrication in existing semiconductor fabrication facilities. Drive transistors, shift registers, and fault tolerance circuitry can be fabricated on the same wafer as the nozzles. The manufacturing process uses anisotropic wet etching to etch ink channels and nozzle barrels from the back surface of the wafer to the from surface of the wafer.

Abstract: A method of manufacturing a double-sided circuit tape carrier comprising an insulating film like a polyimide tape, circuit wiring patterns on both sides thereof, and via holes through which at least a part of the circuit wiring patterns on both sides are electrically connected with each other. A copper thin film is patterned by photoetching. Via holes are formed through the insulating film by irradiating a laser beam by using the patterned copper thin film as a mask. Then, a conductive layer of a graphite conductive thin film and a copper plating layer is formed. The copper thin film is patterned by photoetching forming a chip hole and an outer lead hole through the insulating film by irradiating a laser beam. Finally, one of the copper thin films is patterned by photoetching to form circuit wiring pattern.

Abstract: A color cathode ray tube has a face panel, a phosphor screen formed on an inner surface of the face panel, an electron gun for emitting electron beams toward the phosphor screen, and a shadow mask arranged between the electron gun and the face panel to oppose the phosphor screen. The shadow mask has a large number of electron beam apertures through which the electron beams pass. Each of the electron beam apertures has a small opening open to a first surface of the shadow mask and a large opening open to a second surface of the shadow mask and communicating with the small opening. The large opening has a center axis and a diameter larger than that of the small opening. A wall surface of the shadow mask which defines the large opening of each of the electron beam apertures located at a peripheral portion of the shadow mask includes a bulged portion.

Abstract: Semiconductor component with monolithically integrated electronic circuits and monolithically integrated sensor/actuator, whereby the sensor/actuator is manufactured with methods of surface micromachining in a sensor layer (3) of polysilicon that is structured, for example, with sensor webs (6), and these sensor webs (6) are thermally insulated from a silicon substrate (1) by a cavity (4) that is produced in a sacrificial layer (2) and is closed gas-tight toward the outside with a closure layer (5).

Abstract: This process for producing a structure incorporating a substrate (2), a thin surface film (16) made from a non-conducting material joined to one face (1) of the substrate (2), said substrate (2) having cavities (10) flush with said face (1), comprises the following successive stages:etching cavities (10) in one face (1) of a substrate, the cavities having in the plane of the substrate face at least one dimension which is a function of the thickness of the surface film, in order to correctly secure the latter,joining a non-conducting material wafer (12) to the face (1) of the substrate (2),thinning the wafer (12) to obtain the thin surface film.

Abstract: Microfabricated filters utilizing a bulk substrate structure and a thin film structure and a method for constructing such filters. The pores of the filters are defined by spaces between the bulk substrate structure and the thin film structure and are of substantially uniform width, length and distribution. The width of the pores is defined by the thickness of a sacrificial layer and therefore may be smaller than the limit of resolution obtainable with photolithography. The filters provide enhanced mechanical strength, chemical inertness, biological compatibility, and throughput. The filters are constructed using relatively simple fabrication techniques. Also, microfabricated containment wells and capsules constructed with such filters for the immunological isolation of cell transplants and a method for constructing such containment wells and capsules.

Abstract: A method for microscopical observation of an amorphous specimen. The method comprises the steps of providing a substrate having at least one outer surface that defines an optically flat and predetermined geometric configuration, including at least one discontinuity; disposing an amorphous specimen in contact with the discontinuity of the substrate; and, selecting a virtual focus point which can act as a referent point on a defocus position axis, thereby maximizing the phase-contrast of the specimen.

Abstract: A process for the minute processing of diamonds which comprisespreparing a substrate;forming a first buffer layer on the substrate;forming a second buffer layer, having a higher charge transfer rate than both the substrate and the first buffer layer, on the first layer;selectively removing the first and second buffer layers to selectively expose the surface of the substrate;depositing diamonds on the whole surface of the exposed surface of the substrate and the remaining first and second buffer layer; andremoving the by-products formed on the surface of the second buffer layer and surface thereof.

Abstract: An apparatus and method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes a source of etchant solution and an etching assembly including an etch plate and a movable cover, the etch plate and cover forming an etching chamber. An etch head is supported by the etch plate and the electronic device package is mountable in the chamber on the etch head. In a first mode of operation a displacement pump pumps a first quantity of etchant solution into the etch head and in a second mode of operation the displacement pump agitates at least part of the first quantity of etchant solution repeatedly into and out of an etched cavity formed on an exterior surface of the electronic device package by reaction of the etchant solution with the resinous material. A waste reservoir and a waste outlet extending from the etch head to the reservoir is also provided. The etch head is easily removable from the etch plate by removal of an etch head retainer.

Abstract: The present invention relates to a process for metallizing features of an electronic component, where the metallized features, conductive pads, conductive traces, are coated and encapsulated with at least one metal layer and the features on the front side and the back side of the component have different thicknesses

Abstract: A metal or glass wire is etched with great precision into a very narrowly tapering cone which has the shape of the desired final capillary-optics bore. By controlling the rate of removal of the wire from an etchant bath, a carefully controlled taper is produced. A sensor measures the diameter of the wire as it leaves the surface of the etchant. This signal is used for feedback control of the withdrawal speed. The etched wire undergoes a treatment to produce an extremely low surface-roughness. The etched and smoothed wire is coated with the material of choice for optimizing the reflectivity of the radiation being focused. This could be a vacuum evaporation, sputtering, CVD or aqueous chemical process. The coated wire is either electroplated, built up with electroless plating, or encapsulated in a polymer cylinder such as epoxy to increase the diameter of the wire for easier handling and greater robustness.

Abstract: Surface micromachining and bulk micromachining are employed for realizing a porous membrane with bulk support for a microparticle fiter. The filter is sufficiently sturdy to allow for easy handling. It may be used as a diffusion barrier and under high pressures. The disclosed fabrication method is simple, reliable, and integrated-circuit compatible, and thus amenable to mass production. Electronic circuitry may be integrated on the filter surface, as may be desired for several purposes, such as fluid characterization, filter self-cleaning, or charging of the filter surfaces. Methods are shown for the realization of biological containment capsules based on this microfilter.

Abstract: An apparatus and method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes a etchant solution source and an etching assembly including an etch plate and a movable cover forming an etching chamber. An etch head is supported by the plate and the device package is mountable in the chamber on the etch head. A first syringe pump pumps a first quantity of etchant into the etch head and a second syringe pump agitates or oscillates at least part of the first quantity of etchant repeatedly into and out of an etched cavity formed on the package exterior surface by reaction of the etchant solution with the resinous material. A waste outlet and reservoir extends from the etch head. The etch head is attached to an alumina ceramic heat exchanger including a spirally grooved passageway formed by an inserted core to heat a small volume of etchant immediately prior to introduction of the etchant against the package and subsequent oscillation.

Abstract: A method for preparing a semiconductor member comprises:forming a substrate having a non-porous silicon monocrystalline layer and a porous silicon layer;bonding another substrate having a surface made of an insulating material to the surface of the monocrystalline layer; andetching to remove the porous silicon layer by immersing in an etching solution.

Abstract: A process for ablation etching through one or more layers of dielectric materials while not etching an underlying conductive material layer comprises selecting parameters whereby the ablation process automatically stops when the conductive material layer is reached, or monitoring the process for end point detection of the desired degree of ablation. Parameters selected are the absorptivity of the dielectric layer versus that of the conductive material layer. End point detection comprises monitoring radiant energy reflected from the workpiece or the content of the materials being ablated from the workpiece.

Abstract: A semiconductor device having a substrate with an insulating surface and a non-porous semiconductor region bonded to the body of the device. A porous semiconductor region on the surface of the substrate was removed by etching.

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract: A method and device for the placement of sutures and for the purpose of approximating tissue. A particular utility is effected in the approximation of the tissue separated by means of an endosurgical trocar being inserted into a body cavity. The invention provides for the loading of suture material including needles into the device, introduction and placement of the device into the body cavity, with the distal end having deployable needle guides, extending the needle guides either simultaneously or individually to the periphery of the wound, engaging the wound with the needle guides, driving the needles and suture material through the tissue to be approximated into a catch mechanism, retracting the needle guides and withdrawing the device, leaving a loop of suture material in the margin of tissue. The suture may then be tied to approximate the wound and excess suture material cut off.

Abstract: Manufacturing processes for apparatus, including slotted hypotube, for use as a catheter, a guidewire, a catheter sheath for use with catheter introducers or a drug infusion catheter/guidewire are disclosed. The manufacturing process includes creating a pattern of slots or apertures in a flexible metallic tubular member, by processes including but not limited to, electrostatic discharge machining (EDM), chemical milling, ablation and laser cutting. These slots or apertures may be cut completely or partially through the wall of the flexible metallic tubular member. These manufacturing processes may include the additional step of encasing the flexible metallic member such that a fluid tight seal is formed around the periphery of the tubular member.

Abstract: A semiconductor sensor mount is formed as follows: through holes are formed that penetrate a glass plate; and then the glass plate having the through holes is dipped into hydrofluoric acid etchant to smooth the inner peripheral surfaces of the respective through holes. By etching the inner peripheral surfaces of the respective through holes after the through hole formation, minute roughness and cracks formed on the inner peripheral surfaces are removed, and thereby the areas for adsorbing gas are substantially reduced. That is, vacuums within the through holes can be maintained at a high degree during the anodic bonding, whereby undesirable electric discharge phenomena are prevented even if a relatively high voltage is applied during the anodic bonding. Accordingly, the yield of products can be improved while improving productivity.

Abstract: A method of fabricating an ink jet recording head includes forming a photosensitive resin layer on a substrate having formed thereon an energy generation device for generating energy for ejecting recording droplets; pattern-wise exposing the photosensitive resin layer to an active radiation to a portion of the photosensitive resin layer where formation of a pattern of an ink fluid path is desired; laminating a top plate on the photosensitive resin layer; and eluting the pattern exposed portion of the photosensitive resin layer to form a pattern of an ink fluid path.

Abstract: In accordance with the present invention, a display apparatus 8 comprises a color CRT 10 having an evacuated envelope 11 with a faceplate panel 12 sealed to one end of a funnel 15 that is closed at the other end by a neck 14. The faceplate panel has a luminescent screen 22 on an interior surface thereof. A shadow mask 25 is located in proximity to the screen. The shadow mask comprises a metal sheet having a central portion and an exterior portion with a plurality of apertures 40, 43 therethrough. An electron gun 26 is disposed within the neck for generating and directing electron beams 28 toward the screen. A deflection yoke 30 is disposed around the envelope at the junction of the neck and the funnel. The yoke deflects the beams to scan a raster across the screen.

Abstract: A porous mesh structure is prepared in sheet form having a unique arrangement of main and secondary troughs on a first surface, and openings extending therethrough. The arrangement of troughs and openings creates an elaborate matrix of pores when the sheet is layer on itself in a front to back manner. This arrangement of pores and support structure emulates certain cortical bone structures and is therefore very effective as an artificial bone material. In addition, the porous structure has significant other potential uses outside the medical field and can be effectively applied accordingly, based on its fundamental. structural attributes.

Abstract: A method of fabricating ink jet printheads from channel plates with a low stress integral ink inlet filters and heater plates. The channel plates are obtained from p-type (100) silicon wafers, one surface of which has a lightly doped n-type patterned layer in the form of a screen. In the preferred embodiment, a first etch resistant material is deposited on both surfaces of the wafer and patterned on the surface of wafer opposite the one containing the n-type layer. The patterned first etch resistant material provides a first etch mask with channel and reservoir vias. A second etch resistant material is deposited over the first etch resistant material and patterned on the same wafer surface as the first etch resistant material in order to provide a second etch mask having reservoir vias smaller than the reservoir vias in the first etch mask, but aligned therewithin.

Abstract: An edge-shooter ink-jet print head has a row of nozzles extending in the z-direction on the edge of a head module. The print head includes members into which chambers are formed which, in turn, are equipped with devices for ejecting ink from each chamber to respectively assigned ink nozzles. The ink jets are expelled in the x-direction. The print head comprises a plurality of plates stacked in the y-direction. The ink paths are of equal length at least within each module. In a prefered embodiment, the row of nozzles is formed in an additional part which is also a chamber carrying part. After the production of various module plates by parallel processing of a glass plate, including the formation of cavities of a defined depth by etching and fine grinding, the parts are separated and then joined to form a module. Conductor tracks and PZT elements are provided. The modules can be interconnected with an adhesive layer as part of an assembly process.

Abstract: An electrochemical cell for etching a metal workpiece such as an aluminum foil, a method for etching the foil using the electrochemical cell, and foil thus produced is provided. The cell includes an etch tank having an etch electrolyte disposed therein and containing at least a first and a second compartment each containing (i)an etch electrolyte, (ii) a cathode plate, and (iii) an ion exchange membrane separator portion comprising an ion exchange polymeric material effective to substantially retard or prevent reduction of the oxidizing agent or agents present in the etch electrolyte, the first and second compartments being arranged in the etch tank with the ion exchange membrane separator portions in facing relationship one to the other; and a metal workpiece such asan aluminum foil anode present in the etch tank and disposed between each said first and second compartments.

Abstract: An aperture grill for a cathode ray tube is formed with parallel slits by etching a cold-rolled low-carbon steel plate from the opposite sides thereof. Before carrying out the etching, the steel plate is subjected to an annealing step whereby the residual stress is reduced to 7.0 Kg/mm.sup.2 or less. The steel plate is also subjected to a tensile force for imparting a tension in the direction of the rolling of a hoop steel from which the steel plate is produced. Furthermore, the steel plate is so oriented that the direction of tapes of the aperture grill to be produced will coincide with the rolling direction. The above process makes it possible to prevent occurrence of "streaks" and improves the quality of images generated on the cathode ray tube.

Abstract: The supporting plate and the bulk removal, transport and storage fixture for small batch-fabricated devices (1) have openings (2) penetrating from the top side (3) to the bottom side (4) of the plate and raised retaining means (5) on the bottom side (4). The raised retaining means (5) are provided in sufficient number and are arranged according to the shape of the devices (1) for retaining the devices. Flange means (7) which are designed for providing vacuum or agents to the devices (1) on the supporting plate are connected to the supporting plate thus forming a fixture. By changing the arrangement of the raised retaining means (5) and/or the openings (2) the supporting plate and the fixture may easily be adapted to different sizes and kinds of devices.

Abstract: A method for insulating semiconductor elements is disclosed. The method includes steps of: forming a 3-layer semiconductor substrate consisting of an upper conductive layer, a high concentration impurity layer, and a lower conductive layer; carrying out a photo etching to remove the upper conductive layer, thereby opening the high concentration impurity layer; dipping the semiconductor substrate into an aqueous HF solution of a certain ratio, and carrying out an anodizing reaction to convert the high concentration impurity layer into a porous silicon layer; and carrying out a wet oxidation to convert the porous silicon layer into a buried oxide layer.

Abstract: A system for processing a plurality of tests or syntheses in parallel comprising a sample channel for moving samples into a microlaboratory array of a plurality of wells connected by one or more channels for the testing-or synthesis of samples, a station for housing the array and an optical system comprising at least one light source and at least one light detector for measuring the samples in the array, and a means of electrically connecting said array to an apparatus capable of monitoring and controlling the flow of fluids into the array. Samples are loaded from a common loading channel into the array, processed in the wells and measurements taken by the optical system. The array can process many samples, or synthesize many compounds in parallel, reducing the time required for such processes. Etching from both sides of a substrate using patterned photoresist and metal layers to form a network of capillary channels for separately transporting a plurality of different liquids.

Abstract: A native oxide film is formed on the surface of a silicon substrate. The native oxide film has at least island-shaped imperfect SiO.sub.2 regions not formed with a perfect SiO.sub.2 film. Before the native oxide film is formed, a mask layer having a necessary opening is formed over the silicon substrate, according to necessity. The silicon substrate is etched in a vapor phase via the imperfect SiO.sub.2 regions of the native oxide film to form a hollow under the native oxide film at least at a partial region thereof. An upper film is formed on the native oxide film to cover and close the imperfect SiO.sub.2 regions. In this manner, a minute hollow can be formed in the silicon substrate with good controllability.

Abstract: Improved methods for fabricating the ink feed slots in silicon substrate for use in thermal ink-jet print heads is disclosed. One method involves the partial anisotropic etching of an ink feed slot in a silicon substrate for use in aligning the electrical resistive elements on one surface of the substrate. Another embodiment involves laser drilling alignment holes and anisotropically etching the substrate. In both methods, at least one photoresist masking and development step is eliminated thereby reducing fabrication time and alignment difficulties for locating the feed slots relative to the electrical resistance elements and increasing product yield.

Abstract: A method of producing a semiconductor device with a convex heat sink that disposes a semiconductor element within a space formed by leads of a lead frame. Bonding pads of the semiconductor element are connected to the leads through wires. The convex heat sink is made from a high heat-conductive material and formed so as to have an outer periphery of a size sufficiently large to overlap the leads. The semiconductor element is disposed at a center portion of the heat sink. An insulator is disposed on the leads. The insulator bonds and fixes the semiconductor element to the heat sink. Resin seals the semiconductor device except for a part of the leads and a top surface of a projecting portion of the heat sink. The insulator has a shape like a tape so as to cover part of the leads and extend along a bottom surface near a circumferential edge of the convex heat sink. The side surface of the projecting portion of the heat sink is scraped out into a curved surface.

Abstract: A thin film filter fabricated using surface micromachining. The width of the filter pores is determined by the thickness of a sacrificial thin-film layer. This dimension can be precisely controlled, and may be as small as about 50 angstroms. The pore length may also be determined by the thickness of thin film layers and can therefore be smaller than the limit of resolution obtainable with photolithography. The filters are suitable for use at high temperatures and with many harsh solvents.

Abstract: A process and a monitor structure to measure semiconductor device dimensions, especially contact and via hole dimensions, and proximity effects. The monitor has structures and layers which match the thickness and configuration of the product devices and allow measurement of step heights and proximity measurements. The monitor pattern includes an alignment region for use with automeasurement equipment. Measurements of openings are performed on the monitor at various points during the fabrication process.

Abstract: A pressure sensor (11) and its method of fabrication include etching a V-groove (19) in a first surface (16) of a first substrate (12), bonding a second substrate (24) to the first substrate (12), thinning the second substrate (24) to form a diaphragm (32) overlying the V-groove (19), and etching a port (38) from the second surface (18) of the first substrate (12) to the V-groove (19). Tetra-methyl-ammonium-hydroxide is preferably used to anisotropically etch the V-groove (19), and an anisotropic plasma reactive ion etch is preferably used to etch the port (38).

Abstract: A thermal detector with a monolithic structure comprises a layer of material sensitive to infrared radiation and an insulating layer constituted by a thermostable polymer that can be deposited as a thin layer and has a microporous structure. This insulating layer enables the thermal decoupling of the sensitive layer from the substrate comprising reading circuits with which the detector is provided. The performance characteristics of currently used monolithic infrared detectors can thus be substantially improved through the notable reduction of the thermal losses in the sensitive layer. This is achieved through the greatly reduced thermal conductivity of the layer of dielectric polymer. Application to infrared imaging devices.