Etching To Produce Porous Or Perforated Article Patents (Class 216/56)
  • Patent number: 7357877
    Abstract: A method of manufacturing nanowires (104) is provided, according to which method the nanowires are prepared by anodic etching a semiconductor substrate (10) with an alternating current density, so as to create first regions (4) and second regions (5) with different diameters. Thereafter, the diameters are reduced by preferably repeated oxidation and etching. Finally, the nanowires (104) are dispersed in a dispersion by ultrasonic vibration, through which the coupled nanowires split into individual nanowires of substantially uniform length. The nanowires may then be provided with a surface layer of a suitable material, for instance a luminescent material.
    Type: Grant
    Filed: November 6, 2003
    Date of Patent: April 15, 2008
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Johannes Engelbertus Adrianus Maria Van Den Meerakker, Alfons Blaaderen, Carlos Maria Van Kats
  • Publication number: 20080041714
    Abstract: A device and method for producing a “biochip base module” for detecting biochemical reactions for the study of enzymatic reactions, nucleic acid hybridizations, protein-protein interactions and other binding reactions in the field of genome, proteome, or active-agent research. A flat macroporous support material having a multiplicity of 500 nm to 100 ?m diameter pores distributed over at least one surface region and extending from one surface through to the opposite surface of the support material. The device has two or more regions having pores with SiO2 pore walls. These regions are each surrounded by a frame or box of walls with a silicon core arranged parallel to the longitudinal axes of the pores and is open towards the surfaces. The silicon core merges into silicon dioxide over the cross section towards the outer side of the walls forming the frame, and each individual frame is spatially isolated from the frames surrounding it.
    Type: Application
    Filed: March 7, 2005
    Publication date: February 21, 2008
    Applicant: Qimonda AG
    Inventors: Stephan Dertinger, Marco Kluehr
  • Publication number: 20080000875
    Abstract: A porous dielectric layer is formed on a substrate. Aluminum is incorporated in the porous dielectric layer with a pattern process using an Aluminum gas precursor. The incorporated Aluminum improves the mechanical properties of the porous dielectric layer.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Vijayakumar Ramachandrarao, Grant Kloster
  • Patent number: 7309446
    Abstract: Capsules and similar objects are made from materials having diamond (sp3) lattice structures, including diamond materials in synthetic crystalline, polycrystalline (ordered or disordered), nanocrystalline and amorphous forms. The capsules generally include a hollow shell made of a diamond material that defines an interior region that may be empty or that may contain a fluid or solid material. Some of the capsules include access ports that can be used to fill the capsule with a fluid. Capsules and similar structures can be manufactured by growing diamond on suitably shaped substrates. In some of these methods, diamond shell sections are grown on substrates, then joined together. In other methods, a nearly complete diamond shell is grown around a form substrate, and the substrate can be removed through a relatively small opening in the shell.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: December 18, 2007
    Assignee: Metadigm LLC
    Inventor: Victor B. Kley
  • Patent number: 7306744
    Abstract: A method of manufacturing a nozzle plate 2 is disclosed. The nozzle plate 2 has a plurality of nozzle openings 22 through each of which a droplet is adapted to be ejected. The method includes the steps of: preparing a processing substrate (silicon substrate 10) constituted from silicon as a main material, the processing substrate having two major surfaces; providing a supporting substrate 50 for supporting the processing substrate onto one major surface of the processing substrate 50; and forming the plurality of nozzle openings 22 on the other major surface of the processing substrate by subjecting the other major surface of the processing substrate to an etching process while the processing substrate is supported by the supporting substrate 50.
    Type: Grant
    Filed: April 27, 2005
    Date of Patent: December 11, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Yoshihide Matsuo, Katsuji Arakawa
  • Patent number: 7306742
    Abstract: A template 1 is brought close to or in contact with a surface to be patterned 111 and patterns are formed with liquid 62 on the surface 111. This method comprises the steps of: bringing the template 1 close to or essentially in contact with the surface 111, supplying liquid 62 to a plurality of through holes 12 established in the pattern transfer region 10 of the template 1 for supplying the liquid 62, and separating the template 1 from the surface 111 after the liquid 62 is adhered to the surface 111 via the through holes 12.
    Type: Grant
    Filed: April 29, 2003
    Date of Patent: December 11, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Satoshi Nebashi, Takao Nishikawa, Tatsuya Shimoda
  • Patent number: 7297288
    Abstract: The present invention discloses a method and apparatus for the directed formation of a re-entrant micro-jet formed upon the collapse of a working cavitation bubble formed proximate to a work surface. A target bubble, formed between the work surface and the working cavitation bubble, is utilized to direct the re-entrant micro-jet to the work surface.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: November 20, 2007
    Inventor: Mark L. LeClair
  • Patent number: 7291281
    Abstract: Disclosed are a head member having an ink-repellent film high in ink repellency, a method of ink-repellent treatment for the head member and an apparatus for the same. A head member (15) including a plurality of ejection ports (14) to eject ink comprises an ink-repellent film (25) on a surface having the ejection ports (14) open thereon, the ink-repellent film made of fluorocarbon resin subjected to plasma polymerization on the surface. An ink-repellent treatment method includes the steps of: disposing the head member (15) in a chamber (31) maintained in a vacuum state; introducing gaseous linear perfluorocarbon as a material of an ink-repellent film into the chamber (31); and depositing an ink-repellent film (14) made of fluorocarbon resin obtained by subjecting the perfluorocarbon to plasma polymerization on the surface of the head member (15) to perform the ink-repellent treatment.
    Type: Grant
    Filed: March 2, 2005
    Date of Patent: November 6, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Takuya Miyakawa, Yoshiyuki Isobe, Takeshi Yasoshima
  • Patent number: 7279134
    Abstract: Microfluidic devices with porous membranes for molecular sieving, metering, and separation of analyte fluids. In one aspect, a microfluidic device includes a substrate having input and output microfluidic channel sections separated by a porous membrane formed integral to the substrate. In another aspect, the porous membrane may comprise a thin membrane that is sandwiched between upper and lower substrate members. The microfluidic device may include one or a plurality of porous membranes. In one embodiment, a plurality of porous membranes having increasingly smaller pores are disposed along portions of a microfluidic channel. In another embodiment, a cascading series of upper and lower channels are employed, wherein each upper/lower channel interface is separated by a respective porous membrane. In another aspect, a porous membrane is rotatably coupled to a substrate within a microfluidic channel via a MEMS actuator to enable the porous membrane to be positioned in filtering and pass-through positions.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: October 9, 2007
    Assignee: Intel Corporation
    Inventors: Selena Chan, Narayan Sundararajan, Andrew A. Berlin, Mineo Yamakawa
  • Patent number: 7264740
    Abstract: A method is described for the surface treatment of metals to improve the strength, flexibility and fatigue life of the metal, which in a preferred embodiment includes the steps of thoroughly cleaning and drying the metal surface, etching the surface of the metal to remove sharp apexes and ends of cracks in the metal surface, water rinsing and drying the metal surface, and coating the surface with a low water miscible, water displacing, low surface tension corrosion preventive compound.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: September 4, 2007
    Inventor: David Hughes Horne
  • Patent number: 7262068
    Abstract: A microneedle array module is disclosed comprising a multiplicity of microneedles affixed to and protruding outwardly from a front surface of a substrate to form the array, each microneedle of the array having a hollow section which extends through its center to an opening in the tip thereof. A method of fabricating the microneedle array module is also disclosed comprising the steps of: providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses; patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of the array; patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of the array; etching unmasked portions of the substrate from one and the other surfaces to first and second predetermined depths, respectively; and removing the mask layers from the one and the other surfaces.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: August 28, 2007
    Assignee: The Cleveland Clinic Foundation
    Inventors: Shuvo Roy, Aaron J. Fleischman
  • Patent number: 7258805
    Abstract: A micro-needle protrudes from a support member. The needle has a needle body portion, a closed pointed tip portion, and an inner lumen extending through the support member and into the protruding needle. The needle body portion has at least one side opening communicating with the inner lumen. The method of making the needle comprises providing a mask on the front side of an etchable wafer such that the vertical projection of the mask at least partially covers the extension of a hole made in the back side. The mask is isotropically underetched to remove wafer material. An anisotropic etch forms a protruding structure. Optionally a second isotropic etch on the protruding structure exposes the blind hole. Optionally a final anisotropic etch extends the needle without forming side openings.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: August 21, 2007
    Inventors: Göran Stemme, Patrick Griss
  • Patent number: 7255800
    Abstract: The present invention illustrates a bulk silicon etching technique that yields straight sidewalls, through wafer structures in very short times using standard silicon wet etching techniques. The method of the present invention employs selective porous silicon formation and dissolution to create high aspect ratio structures with straight sidewalls for through wafer MEMS processing.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: August 14, 2007
    Assignee: University of South Florida
    Inventors: Shekhar Bhansali, Abdu Rub Abdur, Sunny Kedia
  • Patent number: 7256131
    Abstract: The present invention provides a method of patterning a substrate, the method including, inter alia, forming a multi-layered structure on the substrate formed from first, second and third materials. The first, second and third materials are exposed to an etch chemistry, with the first and second materials having a common etch rate along a first direction, defining a first etch rate, and the first and third materials having a similar etch rate along a second direction, transversely extending to the first direction, defining a second etch rate. Typically, the etch rate is selected to be different in furtherance of facilitating control of the dimensions of features formed during the etching process.
    Type: Grant
    Filed: July 19, 2005
    Date of Patent: August 14, 2007
    Assignee: Molecular Imprints, Inc.
    Inventor: Dwayne L. LaBrake
  • Patent number: 7255804
    Abstract: A process for making photonic crystal circuit and a photonic crystal circuit consisting of regularly-distributed holes in a high index dielectric material, and controllably-placed defects within this lattice, creating waveguides, cavities, etc. for photonic devices. The process is based upon the discovery that some positive ultraviolet (UV) photoresists are electron beam sensitive and behave like negative electron beam photoresists. This permits creation of photonic crystal circuits using a combination of electron beam and UV exposures. As a result, the process combines the best features of the two exposure methods: the high speed of UV exposure and the high resolution and control of the electron beam exposure. The process also eliminates the need for expensive photomasks.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: August 14, 2007
    Assignee: University of Delaware
    Inventors: Dennis W. Prather, Janusz Murakowski
  • Patent number: 7250115
    Abstract: The present invention provides an apparatus and method for making an apparatus for sensing and/or characterizing a biopolymer translocating a nanopore. The apparatus of the present invention provides a first electrode, a first insulator, a second electrode, a optional insulator, a voltage source for applying a time varying potential difference between the electrodes, and a means of measuring the resulting current between the two electrodes. A method for making the apparatus is also disclosed.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: July 31, 2007
    Assignee: Agilent Technologies, Inc
    Inventor: Phillip W Barth
  • Patent number: 7247247
    Abstract: A selective etching method with lateral protection function is provided. The steps includes: (a) providing a substrate; (b) forming a plurality of tunnels; (c) forming a lateral strengthening structure at a peripheral wall of the tunnels; (d) removing a bottom portion of the lateral strengthening structure, and a part of the substrate by an etching process so as to form a lower structure and expose an unstrengthened structure; and (f) etching the unstrengthened structure laterally so as to form an upper structure.
    Type: Grant
    Filed: May 6, 2004
    Date of Patent: July 24, 2007
    Assignee: Walsin Lihwa Corporation
    Inventors: Jerwei Hsieh, Huai-Yuan Chu, Julius Ming-Lin Tsai, Weileun Fang
  • Patent number: 7241396
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: April 12, 2006
    Date of Patent: July 10, 2007
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Patent number: 7235184
    Abstract: A solid state device is formed through thin film deposition techniques which results in a self-supporting thin film layer that can have a precisely defined channel bored therethrough. The device is useful in the chacterization of polymer molecules by measuring changes in various electrical characteristics as molecules pass through the channel. To form the device, a thin film layer having various patterns of electrically conductive leads are formed on a silicon substrate. Using standard lithography techniques, a relatively large or micro-scale aperture is bored through the silicon substrate which in turn exposes a portion of the thin film layer. This process does not affect the thin film. Subsequently, a high precision material removal process is used (such as a focused ion beam) to bore a precise nano-scale aperture through the thin film layer that coincides with the removed section of the silicon substrate.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: June 26, 2007
    Assignee: Advanced Research Corporation
    Inventors: Matthew P. Dugas, Gregory L. Wagner
  • Patent number: 7229564
    Abstract: A DMFC (direct methanol fuel cell) includes two bipolar plates, a membrane electrode assembly, a bonding layer, and a fuel container base. The bipolar plate is a releasable substrate that includes a releasable copper carrier, a release layer, and a metal foil. The bipolar/MEA assembly is formed by laminating the releasable bipolar, the MEA, and the bonding sheet, peeling off the release carrier, and printing a carbon ink or plating Au.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: June 12, 2007
    Assignee: Nan Ya Printed Circuit Board Corporation
    Inventors: Yung-Yi Liu, James Shang
  • Patent number: 7200908
    Abstract: A method of making a variable capacitor by forming a grove portion in an insulating substrate, two upper portions of the substrate located on either side of the groove portion forming two lateral edges, a conductive layer covering the inside of the groove portion, a flexible conductive membrane, placed above the groove portion by bearing on the edges, a dielectric layer covering the conductive layer or the membrane to insulate the conductive layer and the membrane, and terminals of application of a voltage between the conductive layer and the membrane, and such that the depth of the groove portion continuously increases from one of the edges to the bottom of the groove portion, and that the conductive layer covers the inside of the groove portion at least to reach one of the two edges, that it may cover.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: April 10, 2007
    Assignees: STMicroelectronics S.A., Commissariat a l'Energie Atomique
    Inventors: Fabrice Cassett, Guillaume Bouche, Maurice Rivoire
  • Patent number: 7201846
    Abstract: An anti-microbial filter (105) for a micro-fluidic system (100) includes a silicon-based filter membrane (213) having holes (218) formed therein. The membrane (213) is formed on a substrate (211). One side of the filter membrane (213) has an anti-microbial coating (216) between the holes (218) on the filter membrane (213) and the other side can include filter supports formed from a silicon substrate. A method for making the anti-microbial filter (105) includes forming a filter membrane (213) on a substrate (211), forming holes (218) in the membrane (213) by providing a filter mask (215) and etching holes (218) through holes (222) in the mask (215). Then portions of the substrate (211) are removed from the filter membrane (213) using a masking and etching process to expose the holes (218). An anti-microbial coating is applied to the membrane (213) adjacent the holes (218).
    Type: Grant
    Filed: January 23, 2004
    Date of Patent: April 10, 2007
    Assignee: Hospira, Inc.
    Inventors: Steven T. Cho, Harlow B. Christianson
  • Patent number: 7198726
    Abstract: Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a method forms a plurality of slots in a substrate. The method also etches a trench in the substrate contiguous with the plurality of slots to form a compound slot.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: April 3, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeremy Donaldson, Eric L. Nikkel, Jeffrey S. Obert, Jeffrey R. Pollard, Jeff Hess
  • Patent number: 7195715
    Abstract: A method for manufacturing quartz oscillators is provided which permits quartz oscillators having an oscillation frequency, as designed, to be obtained with small variation of individual oscillation frequency and with high reliability. The method for manufacturing quartz oscillators according to the present invention comprises the steps of forming a first resist layer (300) on one surface of a quartz substrate (100), exposing said first resist layer to light of a first amount of exposure to form a patterned first masking layer (210), forming a second resist layer (400) on the other surface of said quartz substrate, exposing said second resist layer to light of a second amount of exposure via said quartz substrate to form a patterned second masking layer (410) by using said first masking layer, and etching said quartz substrate to form quartz pieces (150) by using said patterned first masking layer and said patterned second masking layer.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: March 27, 2007
    Assignee: Citizen Watch Co., Ltd.
    Inventor: Tomoo Ikeda
  • Patent number: 7189435
    Abstract: Pathways to rapid and reliable fabrication of three-dimensional nanostructures are provided. Simple methods are described for the production of well-ordered, multilevel nanostructures. This is accomplished by patterning block copolymer templates with selective exposure to a radiation source. The resulting multi-scale lithographic template can be treated with post-fabrication steps to produce multilevel, three-dimensional, integrated nanoscale media, devices, and systems.
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: March 13, 2007
    Assignee: University of Massachusetts
    Inventors: Mark Tuominen, Mustafa Bal, Thomas P. Russell, Andrei Ursache
  • Patent number: 7186349
    Abstract: A fluid ejection device includes a first substrate having a first crystal orientation, a second substrate having a second crystal orientation, bound to the first substrate, a manifold through the first and second substrates, a chamber formed in the second substrate, connected with the manifold, and a plurality of nozzles connecting to the chamber, wherein the first crystal orientation is different from the second crystal orientation. A method of fabricating the same is also disclosed.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: March 6, 2007
    Assignee: Benq Corporation
    Inventors: Hung-Sheng Hu, Wei-Lin Chen
  • Patent number: 7186351
    Abstract: A method for producing a filter element includes forming longitudinal ducts extending between upstream and downstream surfaces of the filter element, and installing a heating element for heating regions of walls of the ducts along longitudinal extent of the walls. The filter element is arranged inside an injection valve of an internal combustion engine.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: March 6, 2007
    Assignee: DaimlerChrysler AG
    Inventors: Herbert Guettler, Eberhard Holder, Gerhard Kroetz, Martin Matt, Viktor Pfeffer
  • Patent number: 7175774
    Abstract: A method of fabricating inkjet nozzles on a substrate is provided. Each nozzle comprises a nozzle chamber and an actuator positioned in the nozzle chamber. Each nozzle chamber comprises a roof having a nozzle aperture defined therein and sidewalls extending from the roof to the substrate.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: February 13, 2007
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook
  • Patent number: 7172076
    Abstract: An internal filter includes a lower substrate and an upper substrate. Fluid passages are formed by etching grooves into the surfaces(s) of the upper and/or lower substrates and/or in one or more intermediate layers. The filter pores extending between the fluid passages are formed by etching second grooves that fluidly connect the fluid passages. Two or more sets of the one or two intermediate layers can be implemented to provide additional filter passages and/or pores. Each set can be connected to a separate fluid source and/or a separate microfluidic device. In another internal filter, the inlet and outlet passages and the filter pores are formed on the same upper or lower substrate. The inlet and outlet passages are partially formed in a first step. In a second step, the inlet and outlet passages are completed at the same time that the filter pores are formed.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: February 6, 2007
    Assignee: Xerox Corporation
    Inventor: Gary A. Kneezel
  • Patent number: 7144479
    Abstract: A method whereby a water permeable press fabric is given greater dewatering and drainage capacity by providing voids which are reservoirs of minimum pressure available to accept water.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: December 5, 2006
    Assignee: Albany International Corp.
    Inventors: Trent W. Davis, James G. Donovan
  • Patent number: 7135122
    Abstract: Composites of polytetrafluoroethylene and a structural material (polymer, metal, ceramic, leather, or wood) are bonded with a cured admixture of tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride terpolymer, polyethylene-oxide-modified silicone polymer coupling agent, and oxygen-radical-containing copolymer (epoxy polymer, phenoxy polymer, or hydroxylated diamine-diepoxide derivative copolymer). The bonded surface of the polytetrafluoroethylene portion of the composite is etched (chemical etching, electron-beam etching, laser etching, or plasma etching) prior to application of uncured admixture. The composites are useful in making items such as seals, gaskets, chemically-resistant hoses, o-rings, and pump diaphragms.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: November 14, 2006
    Assignee: Freudenberg-NOK General Partnership
    Inventor: Edward Hosung Park
  • Patent number: 7135120
    Abstract: The UV, deep UV and/or far UV (ultraviolet) filter transmission spectrum of an MPSi spectral filter is optimized by introducing at least one layer of substantially transparent dielectric material on the pore walls. Such a layer will modify strongly the spectral dependences of the leaky waveguide loss coefficients through constructive and/or destructive interference of the leaky waveguide mode inside the layer. Increased blocking of unwanted wavelengths is obtained by applying a metal layer to one or both of the principal surfaces of the filter normal to the pore directions. The resulting filters are stable, do not degrade over time and exposure to UV irradiation, and offer superior transmittance for use as bandpass filters. Such filters are useful for a wide variety of applications including but not limited to spectroscopy and biomedical analysis systems.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: November 14, 2006
    Assignee: Lake Shore Cryotronics, Inc.
    Inventors: Vladimir Kochergin, Philip Swinehart
  • Patent number: 7132056
    Abstract: A method of fabricating a fluid ejection device includes the step of forming a plurality of micro-electromechanical fluid ejection devices on a substrate that incorporates drive circuitry such that each device includes a micro-electromechanical actuator that is in electrical contact with the drive circuitry and a fluid ejection member that is positioned on the actuator. A plurality of nozzle chamber walls are formed on the substrate to define nozzle chambers such that each fluid ejection member is operatively positioned with respect to a respective nozzle chamber to eject fluid from the nozzle chamber on receipt of an electrical signal from the drive circuitry by the micro-electromechanical actuator to displace the fluid ejection member. A layer of sacrificial material is deposited on the substrate to cover the nozzle chamber walls.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: November 7, 2006
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook
  • Patent number: 7132054
    Abstract: An inexpensive and rapid method for fabricating arrays of hollow microneedles uses a photoetchable glass. Furthermore, the glass hollow microneedle array can be used to form a negative mold for replicating microneedles in biocompatible polymers or metals. These microneedle arrays can be used to extract fluids from plants or animals. Glucose transport through these hollow microneedles arrays has been found to be orders of magnitude more rapid than natural diffusion.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: November 7, 2006
    Assignee: Sandia Corporation
    Inventors: Stanley H. Kravitz, David Ingersoll, Carrie Schmidt, Jeb Flemming
  • Patent number: 7114238
    Abstract: A multi-layer suspension comprised of a rectangular base plate section, a load beam and a flexure, said load beam can be further divided into a bending area adjacent to the base plate and a rigid area contiguous to said bending section, said suspension assembly is made up of three layers, wherein an adhesive layer is sandwiched between two stainless steel layers with parts of one of said stainless steel layers being etched off. The method for making such suspension including the steps of making three layer raw material, etching off parts of the stainless steel, etching off parts of the polyimide, and the forming and de-tab. The structure of multi-layer suspension of the present invention overcomes the problems of etching variations and misalignment exist in the traditional production of the suspension.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: October 3, 2006
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventor: Masashi Shiraishi
  • Patent number: 7112287
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: September 26, 2006
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Patent number: 7097781
    Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc?No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: August 29, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koji Asakawa, Toshiro Hiraoka, Yoshihiro Akasaka, Yasuyuki Hotta
  • Patent number: 7090784
    Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc-No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: August 15, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koji Asakawa, Toshiro Hiraoka, Yoshihiro Akasaka, Yasuyuki Hotta
  • Patent number: 7081208
    Abstract: Methods are provided for making microfilters by subtractive techniques which remove a component or part of a filter material to form pores in the filter material and additive techniques which deposit a filter material onto a porous underlying substrate. All the methods employ a supercritical fluid or mixture which have very high solvency properties and low viscosity and CO2 is the preferred supercritical fluid.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: July 25, 2006
    Assignee: International Business Machines Corporation
    Inventors: Kenneth J McCullough, Wayne M Moreau, Keith R Pope, Robert J Purtell, John P Simons, William A Syverson, Charles J Taft
  • Patent number: 7070472
    Abstract: A field emission device and method of forming a field emission device are provided in accordance with the present invention. The field emission device is comprised of a substrate (12) having a deformation temperature that is less than about six hundred and fifty degrees Celsius and a nano-supported catalyst (22) formed on the substrate (12) that has active catalytic particles that are less than about five hundred nanometers. The field emission device is also comprised of a nanotube (24) that is catalytically formed in situ on the nano-supported catalyst (22), which has a diameter that is less than about twenty nanometers.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: July 4, 2006
    Assignee: Motorola, Inc.
    Inventors: Kenneth Andrew Dean, Bernard F. Coll, Albert Alec Talin, Paul A. Von Allmen, Yi Wei, Adam Madison Rawlett, Matthew Stainer
  • Patent number: 7056649
    Abstract: A process for producing microstructured tool insert for injection molding a part, the part being fabricated of a synthetic material, a metal or a ceramic material and including an arrangement of microstructures which are formed on an outer surface of the part and have two different predetermined depths.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: June 6, 2006
    Assignee: Weidmann Plastics Technology AG
    Inventor: Max Gmür
  • Patent number: 7051418
    Abstract: Firstly, a supporting frame is produced, whose opening is spanned by an auxiliary layer flush on one side. Following the production of microstructures, flat parts or membranes on the common plane defined by the auxiliary layer and the supporting frame, the auxiliary layer is removed, preferably by etching. In a preferred application, the self-supporting microstructures produced in accordance with the method of the invention are used as electrically heatable resistance grids in a device for measuring weak gas flows.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: May 30, 2006
    Assignee: Siemens Aktiengesellschaft
    Inventor: Günter Trausch
  • Patent number: 7045052
    Abstract: A method of manufacture for optical spectral filters with omnidirectional properties in the visible, near IR, mid IR and/or far IR (infrared) spectral ranges is based on the formation of large arrays of coherently modulated waveguides by electrochemical etching of a semiconductor wafer to form a pore array. Further processing of said porous semiconductor wafer optimizes the filtering properties of such a material. The method of filter manufacturing is large scale compatible and economically favorable. The resulting exemplary non-limiting illustrative filters are stable, do not degrade over time, do not exhibit material delamination problems and offer superior transmittance for use as bandpass, band blocking and narrow-bandpass filters. Such filters are useful for a wide variety of applications including but not limited to spectroscopy, optical communications, astronomy and sensing.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: May 16, 2006
    Assignee: Lake Shore Cryotronics, Inc.
    Inventors: Vladimir Kochergin, Philip Swinehart
  • Patent number: 7037438
    Abstract: A method is for producing a semiconductor component, e.g., a multilayer semiconductor element, e.g., a micromechanical component, e.g., a pressure sensor, having a semiconductor substrate, e.g., made of silicon, and a semiconductor component produced according to the method. To reduce the production cost of such a semiconductor component, in a first step a first porous layer is produced in the semiconductor component, and in a second step a hollow or cavity is produced under or from the first porous layer in the semiconductor component, with the hollow or cavity capable of being provided with an external access opening.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: May 2, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Heribert Weber, Hans Artmann, Frank Schaefer
  • Patent number: 7037594
    Abstract: There is provided an electromagnetic wave shielding member which has see-through properties and electromagnetic wave shielding properties, is free from a change in color of an adhesive at the time of the formation of a mesh by etching, is improved in etchability, and can withstand etching at the time of the formation of the mesh. The electromagnetic wave shielding member according to the present invention comprises: a transparent film substrate; and a mesh consisting of a metal foil provided on the surface of the substrate through an adhesive, the adhesive comprising a styrene-maleic acid copolymer-modified polyesterpolyurethane and an aliphatic polyisocyanate.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: May 2, 2006
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroshi Kojima, Fumihiro Arakawa
  • Patent number: 7037179
    Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, and the base section is composed of a first material. The embedded sections are arranged in a desired pattern of voids, and each embedded section has a top surface below the planarizing surface to define a plurality of voids in the base section. The embedded sections are composed of a second material that is selectively removable from the first material. A planarizing pad in accordance with an embodiment of the invention can be made by constructing the embedded sections in the base section and then removing a portion of the embedded sections from the base section. By removing only a portion of the embedded sections, this procedure creates the plurality of voids in the base section and leaves the remaining portions of the embedded sections.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: May 2, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Guy T. Blalock
  • Patent number: 7008547
    Abstract: Provided is a solid phase array of electrical sensors, each comprising a channel and electrical leads for attaching to a voltage, current or resistivity meter for measuring the voltage, current or resistivity through the pore, wherein the channels are formed of a single substrate.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: March 7, 2006
    Assignee: Sarnoff Corporation
    Inventors: Jia Ming Chen, Yongchi Tian, Zilan Shen, Pradyumna Swain
  • Patent number: 6998063
    Abstract: A method of forming a microporous fluoropolymer membrane, comprising the steps of: irradiating a sheet of fluoropolymer at a dosage level below the rupture energy of the carbon-to-fluorine (C—F) bonds of the fluoropolymer, but sufficient to rupture carbon-to-carbon (C—C) bonds; and exposing the sheet of fluoropolymer to an etchant for a period of time sufficient to etch away disrupted atoms and molecules, wherein continuous micropassages are formed through the sheet.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: February 14, 2006
    Assignee: STERIS Inc.
    Inventors: Sergey Alexandrovich Korenev, Ivan Sergeevich Korenev
  • Patent number: 6991847
    Abstract: The invention relates to processes for the synthesis of 2-D and 3-D periodic porous silicon structures and composites with improved properties having the advantages of porous silicon and photonic bandgap materials. Photonic crystals comprise a two dimensionally periodic or three dimensionally periodic microporous structural matrix of interconnecting, crystallographically oriented, monodispersed members having voids between adjacent members, and said members additionally having randomly nanoporous surface porosity. The silicon nanofoam material shows enhanced and spectrally controlled/tunable photoluminescence and electroluminesce and finds use as transparent electrodes, high-lumonosity light emitting diodes (LEDs), wavelength division multiplexors, high-active-area catalyst supports, photonic bandgap lasers, silicon-based UV detectors, displays, gas sensors, and the like.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: January 31, 2006
    Assignee: Honeywell International Inc.
    Inventors: Aravind Padmanabhan, Ray H. Baughman, Anvar A. Zakhidov, Guenadiy Lazarov
  • Patent number: RE39143
    Abstract: A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: June 27, 2006
    Assignee: Honeywell International Inc.
    Inventors: R. Andrew Wood, Jeffrey A. Ridley, Robert E. Higashi