Etching To Produce Porous Or Perforated Article Patents (Class 216/56)
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Patent number: 7597815Abstract: Porous track membranes are produced by exposing a polymeric film to a bombardment of heavy ions to provide the film with a track density, and etching pores into the resulting tracked film with an etching solution to provide the film with a density of the pores corresponding to the track density under conditions to maintain turbulent flow. An alkaline etching solution is used that contains salts of alkali metals in sufficient concentration to increase the boiling point of the resulting alkali-metal-containing solution to temperatures in excess of about 100 up to about 150° C.Type: GrantFiled: July 26, 2005Date of Patent: October 6, 2009Assignee: Dressel Pte. Ltd.Inventors: Andrey Viktorovich Desyatov, Alexei Valerievich Egorov
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Patent number: 7591955Abstract: A metal processing method includes etching to remove material from a thin metal part. A pattern of etch resistant material is used to prevent etching of the metal in desired locations. The etch resistant material is intentionally applied to unclean surfaces so that an adhesion between the etch resistant material and the metal will fail during the etching process. An edge is formed during etching at the boundaries of the pattern of the etch resistant material. These edges are rounded where the adhesion fails. A shaver foil is produced using the described metal processing method including a face side, a cutter side and a plurality of whisker holes. A face edge is formed where an etched profile of the whisker hole meets the face side and a cutter edge is formed where the etched profile of the whisker hole meets the cutter side. The face edge is rounded using the aforementioned process and the cutter edge is sharp using a conventional etch resistant material application method.Type: GrantFiled: July 13, 2006Date of Patent: September 22, 2009Assignee: Interplex NAS, Inc.Inventors: Raymond A. Frechette, David W. West, Christopher Machado, Christopher M. Sullivan
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Publication number: 20090223925Abstract: A method for forming a chemical microreactor includes forming at least one capillary microchannel in a substrate having at least one inlet and at least one outlet, integrating at least one heater into the chemical microreactor, interfacing the capillary microchannel with a liquid chemical reservoir at the inlet of the capillary microchannel, and interfacing the capillary microchannel with a porous membrane near the outlet of the capillary microchannel, the porous membrane being positioned beyond the outlet of the capillary microchannel, wherein the porous membrane has at least one catalyst material imbedded therein.Type: ApplicationFiled: March 27, 2009Publication date: September 10, 2009Inventors: Jeffrey D. Morse, Alan Jankowski
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Patent number: 7586047Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric.Type: GrantFiled: January 13, 2005Date of Patent: September 8, 2009Assignee: Sumitomo Electric Industries, Ltd.Inventors: Fumihiro Hayashi, Yasuhito Masuda, Yasuhiro Okuda
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Patent number: 7585423Abstract: A liquid discharge head includes, on a same substrate, pressure generating chambers, nozzle apertures communicating with the pressure generating chambers through nozzle communicating pans, and a reservoir, wherein a cross-section area of the nozzle communicating part is larger, along a direction parallel to a nozzle aperture face of the substrate, than a cross-section area of the nozzle aperture, and the cross-section area of the nozzle aperture in such direction remains constant over the entire length of the nozzle aperture.Type: GrantFiled: May 19, 2006Date of Patent: September 8, 2009Assignee: Canon Kabushiki KaishaInventor: Koichiro Nakanishi
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Publication number: 20090212013Abstract: A method of manufacturing a electrode foil composed of a valve metal layer of a first valve metal and a metal foil of a second valve metal supporting the valve metal layer, the method includes coating fine particles of the first valve metal with a resin to form composite fine particles, forming the composite fine particles into an aerosol, jetting the aerosol to the metal foil in an atmosphere under a reduced pressure, depositing the composite fine particles onto the metal foil to form a aerosol deposition layer, and removing selectively the resin from the aerosol deposition layer to form the valve metal layer.Type: ApplicationFiled: February 6, 2009Publication date: August 27, 2009Applicant: FUJITSU LIMITEDInventors: Yoshihiko Imanaka, Hitoshi Yamada, Hideyuki Amada
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Publication number: 20090186190Abstract: The invention provides a filter device comprising a first member wherein at least a portion of the first member is foraminous, a second member wherein at least a portion of the second member is foraminous, wherein there is a fixed gap space between the members and wherein the holes of the first and second members are offset.Type: ApplicationFiled: January 17, 2008Publication date: July 23, 2009Inventors: Shan Guan, Michael F. Baumer, James A. Katerberg
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Publication number: 20090183501Abstract: A diesel particulate filter assembly comprises a diesel particulate filter (DPF) and a heater assembly. The DPF filters a particulate from exhaust produced by an engine. The heater assembly has a first metallic layer that is applied to the DPF, a resistive layer that is applied to the first metallic layer, and a second metallic layer that is applied to the resistive layer. The second metallic layer is etched to form a plurality of zones.Type: ApplicationFiled: March 20, 2008Publication date: July 23, 2009Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: Eugene V. Gonze, Michael J. Paratore, JR.
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Patent number: 7560039Abstract: A method of substantially simultaneously forming at least two fluid supply slots through a thickness of semiconductor substrate from a first surface to a second surface thereof. The method includes the steps of applying a photoresist layer to the first surface of the semiconductor substrate. The photoresist layer is patterned and developed using a gray scale mask for a first fluid supply slot. The semiconductor substrate is then reactive ion etched, to form the at least two fluid supply slots through the thickness of the substrate. The first fluid supply slot is substantially wider than the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.Type: GrantFiled: September 10, 2004Date of Patent: July 14, 2009Assignee: Lexmark International, Inc.Inventors: John W. Krawczyk, Andrew L. McNees, James M. Mrvos
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Publication number: 20090117335Abstract: Nanoporous substrate with fine pores having a diameter from 3 to 40 nm arranged with less than 60 nm periodicity is prepared by a method comprising the steps of coating amphipathic block copolymer on a substrate, forming a film containing hydrophilic cylinders aligned perpendicularly to the surface of the film on a substrate, and immersing the substrate into a solution containing an etchant.Type: ApplicationFiled: November 14, 2006Publication date: May 7, 2009Inventors: Tomokazu Iyoda, Kaori Kamata, Ryoko Watanabe
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Patent number: 7524427Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.Type: GrantFiled: January 3, 2005Date of Patent: April 28, 2009Assignee: Microfabrica Inc.Inventors: Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang, Uri Frodis, Dale S. McPherson, Dennis R. Smalley
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Patent number: 7517466Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc?No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.Type: GrantFiled: June 20, 2006Date of Patent: April 14, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Koji Asakawa, Toshiro Hiraoka, Yoshihiro Akasaka, Yasuyuki Hotta
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Patent number: 7517462Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.Type: GrantFiled: January 3, 2005Date of Patent: April 14, 2009Assignee: Microfabrica Inc.Inventors: Adam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang, Uri Frodis, Dale S. McPherson, Dennis R. Smalley
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Patent number: 7501070Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.Type: GrantFiled: August 18, 2003Date of Patent: March 10, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
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Patent number: 7487588Abstract: In a process for producing leaves (20, 20?) for a leaf seal, in particular as a seal for a gas turbine, which leaves (20, 20?) are laterally delimited by a peripheral edge contour and have regions of different thicknesses (d1, d2), a simplification, without sacrificing precision, is achieved by virtue of the edge contour of the leaves (20, 20?) being cut out of a metal sheet (28) by an etching process and the regions of different thicknesses (d1, d2) also being produced simultaneously as part of the etching process.Type: GrantFiled: October 3, 2006Date of Patent: February 10, 2009Assignee: ALSTOM Technology Ltd.Inventors: Simon Ian Hogg, Nigel Anthony Rhodes, Erwin Schoenfeld
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Patent number: 7485239Abstract: Disclosed herein is an inner tube of glass-like carbon for CVD apparatus and a process for production thereof. The inner tube has its surface roughened without increase in metal impurities which cause particles. It has improved adhesion to CVD deposit film and also has a high degree of roundness. The surface roughness (on both the inner and outer surfaces) is 0.1-10 ?m measured according to JIS B0601. The concentration of metal impurities (iron, copper, chromium, sodium, potassium, calcium, magnesium, and aluminum) in the surface is less than 50×1010 atoms/cm2.Type: GrantFiled: July 27, 2006Date of Patent: February 3, 2009Assignee: Kobe Steel, LtdInventor: Maki Hamaguchi
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Patent number: 7482587Abstract: The present invention disclosure relates to the use of a silicon substrate with a thin film membrane as a transparent substrate for the imaging of biological- and material-related specimens using a microscope such as a transmission electron microscope (TEM). More specifically, the present invention relates to an improved substrate design that incorporates the fabrication of a circular shape that allows easier insertion into traditional specimen holders used in TEMs. In addition to an improved shape, the present invention incorporates microscopic surface texture on the gripping surface that assists in handling. The invention also encompasses surface modification techniques for enhanced biocompatibility of the thin film membrane for biomedical applications.Type: GrantFiled: November 15, 2006Date of Patent: January 27, 2009Inventor: Dudley Sean Finch
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Patent number: 7479232Abstract: A method is for producing a semiconductor component, e.g., a multilayer semiconductor element, e.g., a micromechanical component, e.g., a pressure sensor, having a semiconductor substrate, e.g., made of silicon, and a semiconductor component produced according to the method. To reduce the production cost of such a semiconductor component, in a first step a first porous layer is produced in the semiconductor component, and in a second step a hollow or cavity is produced under or from the first porous layer in the semiconductor component, with the hollow or cavity capable of being provided with an external access opening.Type: GrantFiled: September 6, 2005Date of Patent: January 20, 2009Assignee: Robert Bosch GmbHInventors: Hubert Benzel, Heribert Weber, Hans Artmann, Frank Schaefer
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Patent number: 7466022Abstract: One embodiment disclosed relates to a method for sealing an active area of a non-silicon-based device on a wafer. The method includes providing a sacrificial material over at least the active area of the non-silicon-based device, depositing a seal coating over the wafer so that the seal coating covers the sacrificial material, and replacing the sacrificial material with a target atmosphere. Another embodiment disclosed relates to a non-silicon-based device sealed at the wafer level (i.e. prior to separation of the die from the wafer). The device includes an active area to be protected, a contact area, and a lithographically-formed structure sealing at least the active area and leaving at least a portion of the contact area exposed.Type: GrantFiled: January 24, 2005Date of Patent: December 16, 2008Assignee: Silicon Light Machines CorporationInventors: Gregory D. Miller, Mike Bruner
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Patent number: 7462500Abstract: A manufacturing method of an ink jet recording head including a discharge port for discharging ink includes the step of forming the discharge port by performing dry etching of a discharge port forming member for forming the discharge port, wherein the discharge port forming member is formed of a Si including resin, and the step of dry etching is performed by using an etching gas including oxygen and chlorine as necessary components.Type: GrantFiled: December 9, 2004Date of Patent: December 9, 2008Assignee: Canon Kabushiki KaishaInventor: Makoto Terui
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Publication number: 20080286556Abstract: A composition of matter is a plurality of solid particles of at least 100 nm to about 10 ?m in size having a plurality of nanopores where at least some of the nanopores provide flow through porosity, and the surface of the particles displays a plurality of spaced apart nanostructured features with a contiguous material protruding at the surface and optionally at least one interpenetrating recessing contiguous material. The particles are superhydrophobic when the protruding material is hydrophobic or a hydrophobic coating conforms to the surface of the particle. Articles with superhydrophobic surfaces can be formed by the coating of the particles on a solid substrate.Type: ApplicationFiled: May 17, 2007Publication date: November 20, 2008Inventors: Brian R. D'urso, John T. Simpson
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Publication number: 20080286554Abstract: A method for producing a ceramic substrate material having a first layer and possibly a further layer is specified. The first layer comprises at least one first component made of a crystalline ceramic material and/or a glass material as a matrix and a second component made of a further crystalline ceramic material, which is provided in the matrix. An etching step is performed, mantle areas of the crystals and/or crystal agglomerates of the second component being etched selectively in the first layer to generate a cavity structure in the first layer. The present invention also relates to a corresponding ceramic substrate material, an antenna or an antenna array, and the use of the ceramic substrate material for an antenna or an antenna array.Type: ApplicationFiled: March 10, 2008Publication date: November 20, 2008Inventors: Dieter SCHWANKE, Achim Bittner, Ulrich Schmid, Mirco Harnack
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Publication number: 20080283497Abstract: A target layer comprising at least one degradable material is deposited on a support. Nanotubes are then formed on the degradable material of the target layer before deposition of an insulating layer is performed. Degradation of the degradable material and elimination of degradation sub-products are then performed by means of the nanotubes passing through the insulating layer thus forming air gaps in the target layer.Type: ApplicationFiled: May 9, 2008Publication date: November 20, 2008Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUEInventors: Frederic-Xavier Gaillard, Jean-Christophe Coiffic
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Publication number: 20080277380Abstract: Processes and apparatuses for producing a porous material, such as nano-porous silicon (npSi) media suitable for storage and retrieval of elemental hydrogen. Processes of this invention generally entail applying a magnetic field to a substrate that contains charge carriers and is in contact with an etchant, and then etching the substrate with the etchant while relative movement occurs between the substrate and the magnetic field. During etching, the charge carriers move relative to the substrate and the magnetic field, and porosity forms at surfaces of the substrate contacting the etchant.Type: ApplicationFiled: June 18, 2007Publication date: November 13, 2008Applicant: PACKER ENGINEERING, INC.Inventors: John C. Christenson, Peter J. Schubert
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Patent number: 7449122Abstract: An electrokinetic pump for pumping a liquid includes a pumping body having a plurality of narrow, short and straight pore apertures for channeling the liquid through the body. A pair of electrodes for applying a voltage differential are formed on opposing surfaces of the pumping body at opposite ends of the pore apertures. The pumping body is formed on a support structure to maintain a mechanical integrity of the pumping body. The pump can be fabricated using conventional semiconductor processing steps. The pores are preferably formed using plasma etching. The structure is oxidized to insulate the structure and also narrow the pores. A support structure is formed by etching a substrate and removing an interface oxide layer. Electrodes are formed to apply a voltage potential across the pumping body. Another method of fabricating an electrokinetic pump includes providing etch stop alignment marks so that the etch step self-terminates.Type: GrantFiled: October 18, 2004Date of Patent: November 11, 2008Assignee: Cooligy Inc.Inventors: David Corbin, Kenneth Goodson, Thomas Kenny, Juan Santiago, Shulin Zeng
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Patent number: 7442274Abstract: A fluorine-containing compound gas, e.g., SF6 gas, is converted into a plasma and a silicon portion of an object to be processed is etched by the plasma. At the same time, using a light source having a peak intensity of light in a wavelength range of light absorption of a reaction product, e.g., SiF4, for which, to be more precise, ranges from 9 ?m to 10 ?m, the light is irradiated onto a surface of an object to be processed from the light source. The SiF4 molecules absorb the light, become activated and gain kinetic energy to be used in gaining an easy escape from a hole. As a consequence, an amount (a partial pressure) of fluorine radicals (F*) used as an etchant is increased and an etching rate of a silicon is increased.Type: GrantFiled: March 28, 2006Date of Patent: October 28, 2008Assignee: Tokyo Electron LimitedInventor: Koji Maruyama
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Patent number: 7442303Abstract: A filter membrane, methods of making such filter membrane and apparatus employing such filter membrane are disclosed, in which the filter membrane is a monolithic polymeric membrane that includes a polymeric filter layer including a micron-scale precision-shaped pores and a polymeric support layer that has a precision-shaped porous support structure for the filter layer. Several methods are disclosed for making such a membrane using micromachining techniques, including lithographic, laser ablation and x-ray treatment techniques. Several filter apparatus employing such a membrane are also disclosed.Type: GrantFiled: August 2, 2005Date of Patent: October 28, 2008Assignee: Baxter International Inc.Inventor: James D. Jacobson
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Patent number: 7438193Abstract: Provided are a nanoporous membrane and a method of fabricating the same. The nanoporous membrane includes a support, and a separation layer including a plurality of nano-sized pores at a density of 1010/cm2 or greater and a matrix. The nanoporous membrane has a high flux and a high selectivity.Type: GrantFiled: April 14, 2006Date of Patent: October 21, 2008Assignees: Postech Foundation, Postech Academy-Industry FoundationInventors: Seung Yun Yang, Jin Kon Kim, Min Soo Park, Incheol Ryu, Sung Key Jang, Hwang Yong Kim, Thomas P. Russell
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Publication number: 20080230517Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer a fuel cell so as to be capable of stably producing high purity hydrogen gas.Type: ApplicationFiled: May 21, 2008Publication date: September 25, 2008Applicant: DAI NIPPON INSATSU KABUSHIKI KAISHAInventors: Hiroshi YAGI, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
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Publication number: 20080233439Abstract: A method of adjusting a fuel distribution includes: adjusting a distribution of a fuel supply amount to a membrane electrode assembly so that a temperature distribution in the membrane electrode assembly becomes substantially uniform by a membrane provided in a fuel supply side of the membrane electrode assembly of a fuel cell. A membrane adjusts a fuel distribution, which is provided in a fuel supply side of a membrane electrode assembly of a fuel cell. The membrane is provided with openings so that a temperature distribution in the membrane electrode assembly becomes substantially uniform.Type: ApplicationFiled: September 21, 2007Publication date: September 25, 2008Applicant: Kabushiki Kaisha ToshibaInventors: Takahiro TERADA, Yasutada Nakagawa, Yuji Sasaki, Yuichi Yoshida
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Patent number: 7422696Abstract: Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of the components-making up the segments of the nanorods. Macrostructural composites of these nanorods also are disclosed.Type: GrantFiled: June 30, 2005Date of Patent: September 9, 2008Assignee: Northwestern UniversityInventors: Chad A. Mirkin, Lidong Qin, Sungho Park, Ling Huang, Sung-Wook Chung
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Publication number: 20080215132Abstract: Textured coatings for implantable medical devices can be provided in metallic or polymer surface layers having surface texture factors down to nanometer and sub-nanometer levels. Implantable devices having such textured surfaces and methods of coating such devices comprises providing a substrate surface of an implantable device and forming a coating layer of the substrate surface by directing a mixture of atoms of a first type of material and a second type of material toward the substrate surface while simultaneously and collinearly bombarding the substrate surface with ions, wherein the first type of material is substantially resistant to a removal process and the second type of material is substantially susceptible to a removal process.Type: ApplicationFiled: August 22, 2007Publication date: September 4, 2008Applicant: CORNOVA, INC.Inventors: S. Eric Ryan, Richard Sahagian
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Patent number: 7419612Abstract: The invention concerns a method which consists in first subjecting the polyimide sheet to ionic bombardment, followed by an irradiation in the visible domain and finally a relatively brief chemical etching. Said method enables a thin polyimide sheet comprising pores, of nanometric to micrometric size, having a substantially cylindrical shape and substantially equal diameters to be obtained.Type: GrantFiled: May 18, 2005Date of Patent: September 2, 2008Assignee: Universite Catholique De LouvainInventors: Roger Legras, Etienne Ferain
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Publication number: 20080203055Abstract: A technique is provided for forming a molecule or an array of molecules having a defined orientation relative to the substrate or for forming a mold for deposition of a material therein. The array of molecules is formed by dispersing them in an array of small, aligned holes (nanopores), or mold, in a substrate. Typically, the material in which the nanopores are formed is insulating. The underlying substrate may be either conducting or insulating. For electronic device applications, the substrate is, in general, electrically conducting and may be exposed at the bottom of the pores so that one end of the molecule in the nanopore makes electrical contact to the substrate. A substrate such as a single-crystal silicon wafer is especially convenient because many of the process steps to form the molecular array can use techniques well developed for semiconductor device and integrated-circuit fabrication.Type: ApplicationFiled: October 3, 2007Publication date: August 28, 2008Inventors: Theodore I. Kamins, Yong Chen, Patricia A. Beck
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Patent number: 7416675Abstract: A method of fabricating inkjet print heads usable in an ink jet printer. The method of fabricating ink jet print heads includes preparing a plurality of ink jet print heads on a wafer while forming sub sidewalls around the ink jet print heads when the ink jet print heads are being prepared, attaching protection films onto the sub sidewalls of the wafer and the ink jet print heads, and dicing the ink jet print heads and detaching the individual ink jet print heads from the wafer. In the method, the ink jet print heads are diced in a wafer unit. Particularly, connect pads of the ink jet print heads can be prevented from being contaminated by the protection films.Type: GrantFiled: June 15, 2006Date of Patent: August 26, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-sik Shim, Hyung Choi, Yong-seop Yoon
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Publication number: 20080193739Abstract: Methods of constructing composite films including particles embedded in a filler matrix involve preparing a collection of stacked particles, then depositing a matrix material throughout the particle collection using an atomic layer deposition (ALD) method so as to substantially completely fill the spaces between the particles with the matrix material. During matrix deposition, a vapor phase etch cycle may be periodically employed to avoid clogging of small pores in the particle collection. New composite materials formed by such methods are also disclosed.Type: ApplicationFiled: February 12, 2008Publication date: August 14, 2008Inventors: Eric R. Dickey, William A. Barrow
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Publication number: 20080190887Abstract: Selective etching techniques are used to manufacture a basic filtration element, which can then be used as a basis for constructing various devices for different applications. In this process, sheets of etchable material are etched from one or both sides of that sheet to form channels in a premasked pattern, which controls the minimum opening of the filtration element. The desired channel opening is only limited by the capability of the photochemical etching system being used. Alternatively, a filter element may be made by rolling or extruding a first sheet to form a plurality of recessed areas bordered by lands, selectively etching or punching through the recessed pattern areas, and bonding a second sheet having a plurality of etched or punched through areas to the first sheet, and, aligning the etched through areas to the second sheet with the recessed areas of the first sheet.Type: ApplicationFiled: February 1, 2008Publication date: August 14, 2008Inventor: Kleo Kwok
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Publication number: 20080174775Abstract: Methods of analysis, and compositions relating to such, to determine the presence or absence of an analyte in a sample utilizing a composite substrate which facilitates surface enhanced Raman spectroscopy through the use of ‘hot spots’ of the form ‘metal/analyte/metal’ are presented. Additionally, substrates which contain ‘hot spots’ of the form ‘metal/analyte/metal’ and substrates which facilitate the formation of ‘hot spots’ of the form ‘metal/analyte/metal’ are presented as well as methods for making these substrates.Type: ApplicationFiled: January 23, 2008Publication date: July 24, 2008Inventors: Martin Moskovits, Seung Joon Lee, Ioana Pavel
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Publication number: 20080175524Abstract: A bearing (100) has a contact surface (110) for mating with a rotatable member. The contact surface has a plurality of crystalline grains (120) distributed at random; a plurality of micro-grooves (130) are formed among the crystalline grains; the micro-grooves communicate with each other thereby forming a net. The micro-grooves accommodate lubricant therein so that when the rotatable member rotates, a sufficient lubrication can be obtained between the bearing and the rotatable member. The bearing is formed by machining and then thermally etching a preform which is formed by powder metallurgy.Type: ApplicationFiled: April 13, 2007Publication date: July 24, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventor: CHUEN-SHU HOU
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Patent number: 7399423Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.Type: GrantFiled: December 16, 2005Date of Patent: July 15, 2008Assignee: Dai Nippon Insatsu Kabushiki KaishaInventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
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Publication number: 20080167601Abstract: An array for placement on the skin of a human or animal patient for the purpose of the transdermal application of pharmaceuticals, toxins or active agents, having microneedles that are situated on a carrier substrate, the microneedles having a preset breaking point in the area of the transition to the carrier substrate.Type: ApplicationFiled: August 29, 2007Publication date: July 10, 2008Inventors: Franz Laermer, Michael Stumber, Dick Scholten, Christian Maeurer
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Patent number: 7396479Abstract: A method for preparing porous silicon in which an oxidized single crystal silicon wafer is first bonded to a polycrystalline wafer. The oxidized high quality wafer is then thinned to the desired thickness by grinding and polishing. An oxide may then be deposited on the wafer and patterned to expose regions were the porous silicon will be formed. The single crystal silicon wafer may then etched in the unmasked areas of the pattern to thin the single crystal silicon wafer to the desired thickness in the range of 0.1 microns to 1.0 microns. Next, the porous silicon may be formed using standard techniques. Once the porous silicon is formed the polycrystalline silicon wafer may be ground away and the oxide layer may be undercut to expose the porous silicon. Finally, an appropriate liner material may be applied to the porous silicon.Type: GrantFiled: June 30, 2004Date of Patent: July 8, 2008Assignee: Intel CorporationInventors: Kramadhati Ravi, Alan M. Myers
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Publication number: 20080156768Abstract: An internal filter includes a lower substrate and an upper substrate. Fluid passages are formed by etching grooves into the surface(s) of the upper and/or lower substrates, and/or in one or more intermediate layers. The filter pores extending between the fluid passages are formed by etching second grooves that fluidly connect the fluid passages. Two or more sets of the one or two intermediate layers can be implemented to provide additional filter passages and/or pores. Each set can be connected to a separate fluid source and/or a separate microfluidic device. In another internal filter, the inlet and outlet passages and the filter pores are formed on the same upper or lower substrate. The inlet and outlet passages are partially formed in a first step. In a second step, the inlet and outlet passages are completed at the same time that the filter pores are formed.Type: ApplicationFiled: November 30, 2007Publication date: July 3, 2008Applicant: Xerox CorporationInventor: Gary A. Kneezel
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Patent number: 7393458Abstract: There are provided a porous material and a process for producing the same. The porous material has a plurality of columnar pores and an area surrounding the pores, and the area is an amorphous area containing C, Si, Ge or a combination thereof.Type: GrantFiled: November 2, 2005Date of Patent: July 1, 2008Assignee: Canon Kabushiki KaishaInventors: Kazuhiko Fukutani, Tohru Den
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Publication number: 20080149594Abstract: An apparatus and process for producing a porous particulate media, such as nano-porous silicon (npSi). The apparatus has a rigid etching chamber configured to contain an etching reagent, an inlet for introducing the etching reagent into the etching chamber, and an outlet for outflow of the etching reagent from the etching chamber. One or more porous filter bags contain powders of a starting material for the porous particulate media, and are secured apart from each other within the etching chamber to enable contact between the etching reagent and the powders within the filter bags. Each filter bag is characterized by a pore size sufficiently small to confine the powders within the filter bag but sufficiently large to enable the etching reagent to flow through the filter bag. The etching reagent is flowed through the filter bags to etch the powders within each bag and produce the porous particulate media.Type: ApplicationFiled: June 18, 2007Publication date: June 26, 2008Applicant: PACKER ENGINEERING, INC.Inventors: David W. Yen, JingYing Zhang, John C. Christenson, Peter J. Schubert
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Patent number: 7389014Abstract: An integrated semiconductor circuit includes a substrate having a surface of a first semiconductor material, at least one separating material formed on the surface and defining a through hole, and a guide region formed in the hole. The guide region comprises at least one second semiconductor material. The guide region comprises at least a first region and a second region having a larger cross-section than the first region. The first region contacts the surface of the substrate over a small contact region. Methods of making the integrated semiconductor circuit are also disclosed.Type: GrantFiled: March 31, 2006Date of Patent: June 17, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Theodore I Kamins
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Patent number: 7387740Abstract: An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; step (64), forming holes in the protective film according to an intended pattern of the blind holes in the metal cover, thus exposing the metal surface through the holes; step (66), etching the metal substrate in the exposed areas to form the blind holes; and step (68), removing a remainder of the protective film from the metal substrate, thereby obtaining the finished metal cover. The method involving etching is relatively low-cost. Additionally, because electrophoretic deposition is used to cover the metal substrate with the protective film, the protective film can be formed on all surfaces of the metal substrate. Thus the method is especially advantageous for manufacturing a metal cover having a three-dimensional shape.Type: GrantFiled: November 7, 2005Date of Patent: June 17, 2008Assignee: Sutech Trading LimitedInventor: Wen-Te Lai
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Publication number: 20080135086Abstract: A photovoltaic cell has electrodes, p- and n-junctions, and a heat sink. The heat sink is on a side of the cell opposite to the light-receiving side of the photovoltaic cell. The photovoltaic cell may also have heat-conducting channels within an interior of the photovoltaic cell that conduct heat from the interior of the photovoltaic cell to the heat sink. The heat sink can remove heat caused by light absorbed by the photovoltaic cell but not converted to electricity as well as heat generated by resistance to high current passing through electrodes of the photovoltaic cell. A module formed of such cells can exhibit greater energy conversion efficiency as a result of the ability to dissipate the heat. A method of making a solar cell or module involves e.g. laminating a heat sink to a photovoltaic cell as described above.Type: ApplicationFiled: April 20, 2007Publication date: June 12, 2008Applicant: Sunmodular, Inc.Inventor: Eugenia M. Corrales
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Patent number: 7385183Abstract: In a substrate processing apparatus using a neutralized beam and a method thereof, the substrate processing apparatus includes: an ion source for emitting an ion beam at an emitting angle; reflectors at which the ion beam emitted by the ion source is incident and subject to 2n collisions (where n is a positive integer) in first and second opposite directions to neutralize the ion beam as a neutralized beam and to restore a direction of propagation of the neutralized beam to the emitting angle of the ion beam; and a substrate at which the neutralized beam generated by the reflectors is incident on to perform a process. Accordingly, an incident angle of the resultant neutralized beam is perpendicular to a substrate, while the direction of propagation of the originating ion source and the surface of the substrate are maintained to be perpendicular to each other.Type: GrantFiled: January 19, 2006Date of Patent: June 10, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Sung-Chan Park, Sung-Wook Hwang
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Patent number: 7361278Abstract: A process for producing a mass transfer device is provided which enables packing of a packing material uniformly in a flow channel, and transfers a specified substance by flowing a fluid containing the specified substance through a flow channel on a substrate. A mass transfer device produced by the process is also provided. The process for producing a mass transfer device comprises steps of preparing a substrate, forming a flow channel on the surface of the substrate, applying a liquid drop composed of a packing material and a liquid medium, and packing the packing material in the flow channel by removing the liquid medium.Type: GrantFiled: January 7, 2005Date of Patent: April 22, 2008Assignee: Canon Kabushiki KaishaInventors: Takeo Yamazaki, Naoto Mihashi, Takeshi Imamura, Satoko Omizu