Abstract: Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area.

Abstract: A method for the connection of two wafers (11, 12), in which a contact area (15) is formed between the wafers (11, 12) by placing the two wafers one on top of the other, and in which the contact area (15) is heated locally and for a limited time. A wafer arrangement is also described in which two wafers (11, 12) which have been placed one on top of the other and between whose opposite surfaces a contact area (15) is located. The wafers are connected to one another at selected areas (21) of their contact area.

Abstract: Two general effects of laser radiation interaction with balloon surface material or with gases surrounding or filling balloons are used for the play: the destruction and the shift of the inflated balloons. The kind of the laser-material interaction is selected depending on the game structure so that the desirable effect is produced by the minimal laser energy. The energy minimization is provided by the selection of the surface properties, the laser radiation parameters, the characteristics of the gases surrounding and inflating balloons, and the creation of the gas pressure inside the balloons. The desirable effects are generated by absorption of the used laser radiation or by laser-induced breakdown.

Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.

Abstract: A connecting piece for a tool of a multi-axis machining center has a support on the machining center side, a holder at the tool side and a pushing device which elastically pushes the holder into a defined position against the support. The pushing force of the pushing device can be varied during the operation of the machining center.

Abstract: System and method of photoaltering a material. The system includes a laser source operable to produce a primary pulsed beam, a holographic optical element configured to receive the primary pulsed beam and transmit a plurality of secondary beams, and a scanner operable to direct the secondary beams to the material. The secondary beams are based on the primary pulsed beam. The method includes phase shifting a pulsed laser beam to produce an input beam, holographically altering the input beam to produce a plurality of transmission beams, and scanning a portion of the material with the transmission beams.

Abstract: An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When a cylindrical tubular body (2) is improved in its residual stress by locally irradiating an outer-circumferential surface of a welded portion (C) of the tubular body (2) with laser beams (5a) and by moving an irradiation area (s) in an circumferential direction, a plurality thermocouples (9) are installed on the tubular body (2) to be improved, a temperature history of the outer surface of the tubular body (2) by the irradiation of the laser beam (5a) is managed by measuring the temperature history itself.

Abstract: The present invention concerns itself with a dry, free of toxic chemicals, and thus, environmentally safe, mineral processing technique. It uses ore elements' specific heat differences as the basis for separating valuable minerals from ores. No EPA approval, no environmental pit and no expensive monitoring are required in order to practice the teachings of the present invention. Furthermore, the technique described herein is economically attractive since it is a low cost approach to mineral processing.

Abstract: Laser-assisted apparatus and methods for performing nanoscale material processing, including nanodeposition of materials, can be controlled very precisely to yield both simple and complex structures with sizes less than 100 nm. Optical or thermal energy in the near field of a photon (laser) pulse is used to fabricate submicron and nanometer structures on a substrate. A wide variety of laser material processing techniques can be adapted for use including, subtractive (e.g., ablation, machining or chemical etching), additive (e.g., chemical vapor deposition, selective self-assembly), and modification (e.g., phase transformation, doping) processes. Additionally, the apparatus can be integrated into imaging instruments, such as SEM and TEM, to allow for real-time imaging of the material processing.

Abstract: Disclosed is a driver circuit structure integrated in a display panel. The driver circuit structure includes a plurality of transistors and a backup transistor. After completing the driver circuit structure, the disclosure inspects it to find an inactive transistor. The inspection process first, isolates the electrical connection between the inactive transistor and the first electrode line and/or the electrical connection between the inactive transistor and the second electrode line. Next, the source electrode of the backup transistor and the first electrode line and/or electrically connecting the drain electrode of the backup transistor and the second electrode line are electrical connected.

Abstract: A method and device capable of properly selecting light radiating conditions in soldering work where components are soldered onto a board with light radiation applied to a solder joint. The device for selecting the light radiation conditions may contain a) an input device for entering information on; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; and d) an output device for outputting the light radiating conditions determined by the calculator. The input device may further comprise i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component.

Abstract: A method and apparatus is presented for obtaining high resolution positional feedback from motion stages 52 in indexing systems 10 without incurring the costs associated with providing high resolution positional feedback from the entire range of motion by combining low resolution/low cost feedback devices 72 with high resolution/high cost feedback devices 74, 76, 78, 80, 82, 84, 86, 88.

Abstract: A process for joining a first metal component to a second metal component at a joining region including the steps of: projecting a laser beam onto one or the components for providing a melt pool on the joining region; providing a metal filler wire into the melt pool while substantially simultaneously providing a substantially laminar flow of a substantially inert process shielding gas to the location of the melt pool wherein the process shielding gas flows substantially coaxially around the filler wire; and solidifying the melt pool thereby forming a joint at the joining.

Abstract: The present technology relates to the problem that during diverse machining steps of application to the production or reconditioning of internally cooled gas turbine blades, an undesired effect may be had on sections of the gas turbine blades and proposes, as an improvement, to inject the cavity of the gas turbine blades before the machining steps with a plastic material which can be removed without trace, such as polystyrene, which can be subsequently removed again, in particular by heat.

Abstract: A configuration and method for bonding a thin metal layer to two workpieces, e.g. solar cells and film-backed/reinforced small contact strips including: (i) the backing film is removed from the solar cell; (ii) the two films/layers are pressed together; and (iii) the two parts are irradiated from the side of the rear contact of the thin-film solar cell. Preferably two or three laser treatment steps are used for removing the backing film of the thin-film solar cell in an ablation process by means of a short-pulse laser and riveting the first metal layer to the second metal layer by irradiating the same by means of a long-pulse laser.

Abstract: The invention relates to a method for heating a wafer (1) comprising at least one layer to be heated (2) and a sub-layer (4), under the effect of at least one light flux pulse, comprising the following steps: selecting a light flux (7), a layer to be heated (2) such that the absorption coefficient of said flux by the layer to be heated (2) is low as long as the temperature of said layer to be heated is in the low temperature range (PBT) and said absorption coefficient increases significantly when the temperature of the layer to be heated enters a high temperature range (PHT); and selecting a sub-layer (4) such that the absorption coefficient of said light flux at said selected wavelength is high in said low temperature range (PBT) and the temperature enters the high temperature range (PHT) when said sub-layer is subject to the light flux; and applying said light flux (7) to said wafer (1).

Abstract: A laser irradiation apparatus for bonding a first substrate and a second substrate of a display device by melting a plurality of bonding members disposed between the first and second substrates to define cells when the display device is manufactured, the display device including light emitting elements disposed on a surface of the first substrate such that the bonding members respectively encompass lateral regions of the light emitting elements, the laser irradiation apparatus including a stage on which the first substrate is mounted, a laser oscillation member configured to irradiate a laser beam that melts the bonding members disposed between the first substrate and the second substrate, and a scanner configured to irradiate the laser beam incident from the laser oscillation member onto the bonding members, the scanner being configured to sequentially irradiate the laser beam on portions of the bonding members.

Abstract: A metallic fuel system component includes an internal surface and an external surface. The metallic fuel system component is made by inducing compressive residual stress in only a portion of the internal surface of the metallic fuel system component by transmitting a laser shock wave through the metallic fuel system component from the external surface to the internal surface.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: An automatic leveling fixture includes a base, at least one jaw slidably connected to the base, a base plate slidable relative to the base. The at least one jaw has a base plate camming surface engaging the base plate and causing the at least one jaw to move a preselected distance relative to a distance moved by the base plate.

Abstract: A laser shock peening system including a workpiece is provided. The laser shock peening system includes a workholding fixture configured to hold the workpiece. The laser shock peening system also includes a laser source configured to emit multiple laser beam pulses on the workpiece. The laser shock peening system further includes an absorptive layer disposed on the workpiece, the absorptive layer configured to absorb the laser beam pulses from the laser source into the workpiece. The laser shock peening system also includes a transparent constraining layer disposed between the laser source and the absorptive layer. The transparent constraining layer is also configured to provide a pressure medium configured to direct multiple reflected laser generated shock waves from the workpiece back into the workpiece. The laser shock peening system also includes a transducer disposed on the workholding fixture and configured to detect multiple acoustic signals emitted from the workpiece.

Abstract: An improved method of cutting a helical gear sector onto a pivoting arm of a casement window is disclosed. The method includes beginning with a pre-hardened flat sheet of steel stock and cutting the arm and the helical gear sector of the arm in two steps. The non-toothed portions of the arm are cut with a laser and nitrogen assist or shielding gas to prevent any oxidation to the non-toothed portions of the structure. The helical gear sector is also cut with a laser, but using oxygen assist gas. Use of the oxygen prevents recasts slag from accumulating in the gear sector. Thus, a finished part is completed with two laser cutting operations thereby eliminating the need for separate stamping, shaping, deburring and subsequent heat treatment processes used in conventional manufacturing methods. The subsequent heat treating is eliminated because a pre-hardened steel stock may be utilized.

Abstract: A medical or orthopedic implant, system and method for making the implant having areas that are designed to optimize compressive stress processing by, for example, laser shock peening. The implant is designed by identifying stress areas as processing zones. The processing zones are machined, processed or adapted to have a desired shape or configuration to optimize compression. The processed zones or areas are compressive stressed processed to have a higher density at zones or areas compared to areas that are not compressive stress processed. The implant is finished processed and sterilized and ready for use in the patient.

Abstract: For patterning a front electrode layer (3) made of zinc oxide deposited on a transparent, electrically insulating substrate (2) in the production of a photovoltaic module (1) there is used a pulsed solid-state laser (13) with a short pulse width which emits infrared radiation.

Abstract: An inkjet print head is fabricated by, fist, forming an electrode and two layers of a protection film composed of an inorganic insulating film and an organic insulating film over the electrode within a groove of a piezoelectric member, adhering a top board to the piezoelectric member covering the groove to form a pressure chamber, adhering a polyimide plate so as to cover the groove, and then forming a nozzle in the polyimide plate by the excimer laser processing aligning to the pressure chamber. Herein, the excimer laser light penetrates the polyimide plate to form a nozzle, and further proceeds to be emitted on the organic insulating film. Consequently, the part of the organic insulating film irradiated by the laser light is damaged. To prevent the damage of the organic insulating film, the thickness of the inorganic insulating film in the part to which the excimer laser light is emitted is prepared to be 0.5 ?m or more.

Abstract: There is provided a method for manufacturing a grain-oriented electromagnetic steel sheet whose iron losses are reduced by laser beam irradiation, capable of improving the iron losses in both the L-direction and the C-direction while easily ensuring high productivity. The method for manufacturing a grain-oriented electromagnetic steel sheet reduces iron losses by scanning and irradiating a grain-oriented electromagnetic steel sheet with a continuous-wave laser beam condensed into a circular or elliptical shape at constant intervals in a direction substantially perpendicular to a rolling direction of the grain-oriented electromagnetic steel sheet, wherein when an average irradiation energy density Ua is defined as Ua=P/(Vc×PL) (mJ/mm2), where P (W) is average power of the laser beam, Vc (m/s) is a beam scanning velocity, and PL (mm) is an irradiation interval in a rolling direction, PL and Ua are in the following ranges: 1.0 mm?PL?3.0 mm, 0.8 mJ/mm2?Ua?2.0 mJ/mm2.

Abstract: In general, the disclosure is directed toward transmitting radiant energy across a boundary of a medical device via an optical feedthrough. A system for transmitting radiant energy across a boundary of a medical device includes a first functional module of a medical device, a second functional module of the medical device, an optical feedthrough assembly coupled to the first functional module, and a radiant energy source that emits a beam through the optical feedthrough assembly to perform a manufacturing process on the first functional module and the second functional module.

Abstract: A method and system for removing a thermal barrier coating on a turbine component is provided. The method includes the steps of selecting at least one turbine component having a thermal barrier coating, and subjecting at least a portion of the thermal barrier coating to a shockwave. The shockwave forms cracks in the thermal barrier coating, such that the substrate of the turbine component is not substantially deformed.

Abstract: A method for simultaneously laser shock peening opposite laser shock peening surfaces on opposite sides of an article, such as a gas turbine engine airfoil, with varying thickness using oppositely aimed laser beams and varying surface fluence of the laser beams over the laser shock peening surfaces as a function of the thickness of the article beneath each one of a plurality of laser shock peened spots formed by the beams on the surfaces. The fluence may be equal to the thickness multiplied by a volumetric fluence factor, the volumetric fluence factor being held constant over the laser shock peening surface. The volumetric fluence factor may be in a range of about 1200 J/cm3 to 1800 J/cm3 and more particularly about 1500 J/cm3. Laser beam energy may be varied with a computer program controlling firing of the laser beam.

Abstract: It is desirable for the production of workpieces, which are sometimes produced by a rapid prototyping method, to be further automatable. To this end a device is provided having a laser for generating a laser beam in order to set a material, and a workpiece support which can be exposed directly to the laser. There is also provided an optical instrument for redirecting and deviating the laser beam so that the workpiece support can also be exposed indirectly to the laser. Material can therefore also be cured more easily in undercuts of workpiece blanks.

Abstract: A plurality of stretches of laser weld are executed on a structure to be welded by means of a device for focusing and orientation of the laser beam, which is associated to a component element of a manipulator robot. The focusing head is kept in the proximity of, but not closely adjacent to, the different areas to be welded and can consequently follow a simplified path, whilst the device for orientation of the laser beam aims the latter on the different areas of the structure to be welded, so that the speed of travel of the laser beam spot along the longitudinal direction of the weld stretch is independent from the speed of travel of the robot end element.

Abstract: Methods and systems are provided for the soft desorption of analyte from a sample, in which an optical beam absorbed within an irradiate zone of the sample causes vibrational excitations of a component within the sample. The optical beam, providing sufficient energy to superheat the component, is provided for a time interval that is less than the time duration required for the loss of energy out of the irradiated zone due to thermal diffusion and acoustic expansion. The superheated component thus drives ablation within the irradiated zone, resulting in the soft desorption of analyte without ionization and fragmentation. The ejected ablation plume may be directed towards the inlet of a mass analysis device for detection of the desorbed analyte, which is preferably ionized by a linear resonant photo-ionization step.

Abstract: The invention relates to a process for the production of a dental prosthetic item (10) by means of local sintering, in which the dental prosthetic item (10) is produced layer-wise by energy input, by means of an energy transferring beam (7), into a layer of powder (6) of a sinterable material. One or more parameters of the sintering process are modified during production such that the material (6) is regionally sintered to various degrees to produce denser material in the marginal region (14) of a sintered layer of said dental prosthetic item (10) than is produced in the inner region (15) of said sintered layer. The invention furthermore relates to a dental prosthetic item (10) of a material subjected to local sintering, which material is sintered in a marginal region (14) of the dental prosthetic item (10) to a greater density than in an inner region (15).

Abstract: A method of forming one or more micro-displays includes forming a first portion of a seal ring overlying a device substrate and surrounding one or more device chips formed on the device substrate, forming a second portion of the seal ring overlying a transparent cover, forming a first layer overlying the transparent cover, plasma bonding the first layer to a second layer formed overlying the device substrate and the one or more device chips, and fusing the first and second portions of the seal ring together using a beam of electromagnetic radiation.

Abstract: The present invention aims to provide a transparent electromagnetic wave shield member, which is free from a moirè phenomenon which could not be solved by the prior art, and in which an excellent electromagnetic wave shielding properties and a sufficient total light transmittance based on an appropriate network structure are compatible, and a method for manufacturing the same. The transparent electromagnetic wave shield member of the present invention is a transparent electromagnetic wave shield member in which a metal layer of an electroconductive metal network structure having a geometrical shape is formed on a transparent substrate, and which is characterized in that a spacing of said network structure is 200 ?m or less, an opening ratio of the network structure is 84% or more, and in addition, a thickness of the electroconductive metal layer is 2 ?m or less.

Abstract: To further automate the manufacture of hearing aid component parts that are in part produced with a rapid prototyping method, a laser beam for curing material is generated by a laser, and a workpiece support that can be directly exposed by the laser is provided. The laser beam is deflected by an optic device so that the workpiece support can be indirectly exposed with the laser. Material can thereby be more easily applied in undercuts of workpiece blanks that form the basis of the hearing aid component parts.

Abstract: A method to manufacture a divided waveplate filter by laser irradiation. A material layer is formed on the surface of a substrate material. A laser oscillator programmed to form a predetermined pattern scans light to form the divided waveplates. In some embodiments, the divided waveplate material layer may be selectively removed by laser ablation. In some embodiments, the material layer has a phase-difference characteristic and the divided waveplates may be formed by removing the phase-difference characteristic of the material layer using laser light without removing the material layer itself. The material layer may be covered by a laser absorbing layer such as titanium oxide. The divided waveplate may be protected by covering the entire surface with a protective layer 6.

Abstract: A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece.

Abstract: It is to provide a method for removing a tin defect present on the surface of a glass substrate produced by a float process in a short time without the glass substrate surface being damaged regardless of the glass temperature. A method for removing a tin-containing foreign matter from the surface of glass, which comprises applying to the surface of a glass substrate produced by a float process a pulse laser beam having a transmittance of at least 70% through the glass substrate and having a pulse width, a wavelength and an energy density per unit area on the glass substrate surface which satisfy specific relations, to remove a tin-containing foreign matter present on the rear face opposite to the face irradiated with the pulse laser beam.

Abstract: A wafer laser processing method for forming a groove in a wafer having a plurality of areas which are sectioned by streets formed in a lattice pattern on the front surface of a substrate, a device being formed in each of the plurality of areas, and an insulating film being formed on the surfaces of the devices, by applying a pulse laser beam along the streets, the method comprising a heating step for applying a first pulse laser beam set to an output for preheating the insulating film so as to soften it to the insulating film and a processing step for applying a second pulse laser beam set to an output for processing the insulating film and the substrate to the spot position of the first pulse laser beam applied in the heating step, the heating step and the processing step being carried out along the streets alternately.

Abstract: A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.

Abstract: Methods and systems for laser welding using a galvanometer to deliver laser energy in a multiple point sequence for high-speed and low-temperature welding of batteries, capacitors, medical devices, and related medical device components or the like.

Abstract: The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

Abstract: A method for forming a micro- or nano-pattern of a material on a substrate is presented. The method utilizes a buffer layer assisted laser patterning (BLALP). A layered structure is formed on the substrate, this layered structure being in the form of spaced-apart regions of the substrate defined by the pattern to be formed, each region including a weakly physisorbed buffer layer and a layer of the material to be patterned on top of the buffer layer. A thermal process is then applied to the layered structure to remove the remaining buffer layer in said regions, and thus form a stable pattern of said material on the substrate resulting from the buffer layer assisted laser patterning. The method may utilize either positive or negative lithography. The patterning may be implemented using irradiation with a single uniform laser pulse via a standard mask used for optical lithography.

Abstract: A new technique and Method of Direct Coulomb Explosion in Laser Ablation of Semiconductor Structures in semiconductor materials is disclosed. The Method of Direct Coulomb Explosion in Laser Ablation of Semiconductor Structures provides activation of the “Coulomb explosion” mechanism in a manner which does not invoke or require the conventional avalanche photoionization mechanism, but rather utilizes direct interband absorption to generate the Coulomb explosion threshold charge densities. This approach minimizes the laser intensity necessary for material removal and provides optimal machining quality. The technique generally comprises use of a femtosecond pulsed laser to rapidly evacuate electrons from a near surface region of a semiconductor or dielectric structure, and wherein the wavelength of the laser beam is chosen such that interband optical absorption dominates the carrier production throughout the laser pulse.

Abstract: The invention relates to a method for high-precision fixing of a miniaturized component (1), in particular having a microoptical element (2), on a predetermined fixing section (3) of a support plate (4) by a solder joint. The support plate is formed throughout from a metallic material and has a cut-out region (10) which encloses the fixing section (3), is bridged by at least one connecting web (9) of the support plate (4), keeps the heat transfer from the fixing section (3) to the remaining support plate low and compensates lateral thermal expansions of the fixing section (3). Solder material (8) is applied on the top of the fixing section (3). The method comprises in particular the steps: arrangement of the component (1) above the fixing section (3), the solder material (8) and the base (7) of the component (1) being present in opposite positions without contact and forming a space.

Abstract: A laser peening method and system allows the work piece to be fixed, while moving and directing the laser beam. A laser energy delivery system includes a relay imaging system. Input optics arranged to receive the laser energy, a transmitting mirror having adjustable angle of incidence relative to the input optics, and a robot mounted processing head including an optical assembly are configured to direct laser energy toward the movable target image plane. The laser energy follows an optical path including an essentially straight segment from the transmitting mirror to the receiving mirror, having a variable length and a variable angle relative to the input optics. Diagnostics on the processing head facilitate operation.

Abstract: A method for machining a transparent material by the non-linear absorption of pulsed laser radiation, in the region of a laser focus, includes the following steps: a laser wavelength of between 300 and 1000 ?m is selected; and laser impulses having a temporally flat beam profile are applied. The method is characterized in that the irradiation intensity is selected from an interval predetermined for the material to be machined, in which plasma is formed without plasma luminescence. An apparatus for laser treating a transparent material includes structure to set an irradiance and inspect the treatment as being within a defined interval.

Abstract: A surface machining method to be adopted when machining a valve mechanism component member is provided so as to manufacture a product assuring a specific pulsation-reducing effect over an extended period of time with a high level of reliability. A plurality of recesses 60 are formed through laser machining over an area (seat surface 51) at a valve plate 2 around an suction port 24, which comes into contact with an suction valve 30, or an area of the suction valve 30 that comes into contact with the valve plate 2. Projections 61 may also be formed through laser machining around the recesses 60. Such projections 61 should be formed so as to assure hardness greater than the hardness of the other areas through radiation of laser light.

Abstract: The present invention involves annealing methods for doped gallium nitride (GaN). In one embodiment, one method includes placing, within a heating unit, a silicon carbide (SiC) wafer as a susceptor in close proximity with a doped GaN epilayer, wherein the doped GaN epilayer is either a GaN layer grown on a substrate or a GaN layer that is free standing; and heating, at a heating rate of at least about 100° C./s, the wafer and the doped GaN epilayer to at least about 1200° C. In another embodiment, another method includes placing, within a heating unit, a doped GaN epilayer, wherein the doped GaN epilayer is either a GaN layer grown on a conducting substrate or a GaN layer that is free standing; and heating, at a heating rate of at least about 100° C./s, the doped GaN epilayer to at least about 1200° C.