Combined With Pressure Application Means Patents (Class 219/243)
  • Publication number: 20040074889
    Abstract: There are provided an apparatus and an associated method for manufacturing superplastically formed structural assemblies from preforms. The apparatus includes first and second co-operable dies structured to define a die cavity therebetween for at least partially receiving the preform, at least one heater in thermal communication with the die cavity for heating the preform to a forming temperature, and at least one injector in fluid communication with the die cavity. The injector is structured for injecting pressurized gas into the die cavity to urge the preform against one of the dies to form the preform into the structural assembly. Further, at least one of the injectors is structured for injecting a quenchant into the die cavity to thereby heat treat the structural assembly while distortion of the structural assembly is being at least partially restrained by at least one of the dies.
    Type: Application
    Filed: October 22, 2002
    Publication date: April 22, 2004
    Applicant: The Boeing Company
    Inventors: Gary W. Coleman, John R. Fischer, Marc R. Matsen, Elizabeth M. Mull, David S. Nansen
  • Patent number: 6694712
    Abstract: A film treatment device has a cutting device (2) for cutting a plastic film web (F). The cutting device (2) has an elongated electric resistor (5) fastened by both ends with fastening elements (3, 4), against which resistor the film web can be pressed and cut via heating of the electric resistor. The cutting device (2) also has a supporting element (6) arranged to support the electric resistor laterally substantially over the entire length of the electric resistor between the fastening elements (3, 4).
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: February 24, 2004
    Assignee: Oy M. Haloila Ab
    Inventor: Yrjo Suolahti
  • Publication number: 20040020913
    Abstract: A portable heat sealer for sealing heavy grade thermoplastic films comprises a plurality of adjacent, segmented heating elements positioned along the underside of a heated sealing bar. The segmented heating elements are under the control of a microprocessor for controlling the energy applied to the heated sealing bar to avoid the formation of hot spots and to obtain a strong seal. Each heating element is maintained in firm contact with the heated sealing bar by means of a tension spring. A thermoplastic film bag is placed on the heated sealing bar and a movable sealer jaw is lowered on top of the bag. A jaw switch is activated by the sealer jaw which turns-on power to the heat sealer. A latch 32 attaches to a clip on the end of the sealer jaws and secures the sealer jaw in place. Pilot lights are provided to indicate to an operator the cycles of “ready”, “heat” and “cool”.
    Type: Application
    Filed: April 23, 2003
    Publication date: February 5, 2004
    Inventor: George B. Hovorka
  • Patent number: 6630647
    Abstract: A hand-held electric sealer used for sealing a plastic bag or the like, including a casing, a sealing mechanism, a press bar, and a safety device. The sealing mechanism has a heating wire, which produces heat for sealing the plastic bag or the like when turned on. The safety device controls the heating of the sealing mechanism, and stops the sealing mechanism from being triggered accidentally.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: October 7, 2003
    Assignee: Welcome Co., Ltd.
    Inventors: Richard Chang, Ammy Chou
  • Patent number: 6627853
    Abstract: An electric heat sealer for sealing workpieces such as plastic bags or the like includes a casing defining a battery chamber, a press bar pivotally connected to the casing, a sealing mechanism supported on a compression spring in a spring holder inside the casing, and a safety device. The sealing mechanism is electrically connected to produce heat for sealing the workpiece being put thereon when the press bar pressed against the sealing mechanism. The safety device breaks the electrical circuit when the apparatus is not in use.
    Type: Grant
    Filed: December 12, 2000
    Date of Patent: September 30, 2003
    Assignee: Welcome Company, Ltd.
    Inventors: Shu Hui Chou, Richard Chang
  • Patent number: 6614003
    Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: September 2, 2003
    Assignee: Micron Technology, Inc.
    Inventors: David R. Hembree, Warren M. Farnworth
  • Publication number: 20030155341
    Abstract: Two profile sections (5,6), such as two sealing, trimming or finishing strips for use in motor vehicle body construction, are joined together end to end by use of a heat-sensitive foil (24) such as made of thermoplastics material. The profile sections (5, 6) are clamped in respective retaining devices (18, 20) and the foil (24) is unwound from a roll (22) into position between the facing ends of the profile sections. Heaters (26, 28) are moved into position for heating the foil (24) and the ends of the profile sections and are then withdrawn. The two retaining devices (18, 20) are then moved towards each other so as to move the ends of the two profile sections into contact with opposite sides of the heated foil (24) which thus heat-bonds the end of the profile sections together.
    Type: Application
    Filed: April 22, 2003
    Publication date: August 21, 2003
    Inventors: Dragon Horst, Hubert Wittig
  • Publication number: 20030155340
    Abstract: A method and apparatus for joining the ends of two profile sections (5, 6) such as two sealing, trimming or finishing strips for use in motor vehicle body construction, is shown. The two profile sections (5, 6) are clamped in respective retaining devices (18, 20) and a length of heat-responsive foil-like material (24) is unwound from a roll (22) into a position between the facing ends of the profile sections. Heaters (26-32) carried by a heater unit (34) are then moved into position between the ends of the profile sections (5, 6) and the foil (24). The outermost heaters (26, 30) heat the ends of the profile sections, and the intermost heaters (28, 32) heat the foil. The heaters (26 to 32) are then withdrawn, and the two retaining devices (18, 20) are then moved towards each other so as to move the ends of the two profile sections into contact with opposite sides of the heated foil (24) which thus heat-bonds the ends of the profile sections together.
    Type: Application
    Filed: April 10, 2003
    Publication date: August 21, 2003
    Inventor: Horst Dragon
  • Patent number: 6573477
    Abstract: A safety electric sealer is disclosed for sealing polybags and the like, which includes a first arm body, an electric heating mechanism, a second arm body, and a safety gate. The electric heating mechanism is mounted in a receiving chamber within the first arm body. The safety gate is adapted for closing/opening the receiving chamber of the first arm body, keeping the electric heating mechanism blocked when the safety electric sealer not in action.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: June 3, 2003
    Assignee: Welcome Company Ltd.
    Inventor: Richard Chang
  • Publication number: 20030085213
    Abstract: An apparatus according to the invention comprises a needle roll (1) and a perforated roll (2), between which a sheet-like structure (3) can be perforated and deformed. The needle roll (1) has a large number of needles (11), while the perforated roll (2) is provided with a large number of holes (21) to accommodate needles (11) of the needle roll (1). The needle roll (1) and the perforated roll (2) are formed and arranged such that during the perforating and deforming operations, each needle (11) in the perforating and deforming area penetrates into a hole (21) in the perforated roll (2). In this way, the sheet-like structure (3) located between them is not only perforated, but the edges of the holes in the sheet-like structure (3) are also shaped three-dimensionally in a controlled way between the needles (11) and the edges of the holes in the perforated roll (2).
    Type: Application
    Filed: October 9, 2002
    Publication date: May 8, 2003
    Inventors: Christoph Burckhardt, Christoph Ulmer, Markus Pluss, Bruno Johl, Francis Wisson
  • Publication number: 20030046906
    Abstract: An ultrasonic sealing apparatus is provided for transversely ultrasonically sealing a packing material comprised of a laminated body including at least a thermoplastic resin layer having a tubular form and containing a fluid. The apparatus includes a horn having an elongated and flat sealing face and an opposing jaw with an action face including a pressing portion for pressing the packing material in cooperation with the sealing face of the horn to a define at least one transverse sealing zone of the tubular packing material. At least one groove is disposed on the action face of the opposing jaw for forming a molten thermoplastic resin bulge in a vicinal area of the at least one sealing zone on a side in contact with the fluid in the tubular packing material.
    Type: Application
    Filed: October 11, 2002
    Publication date: March 13, 2003
    Applicant: SHIKOKU KAKOKI CO., LTD.
    Inventors: Satoshi Kume, Mitsuhiko Shinohara, Takeshi Iseki, Michio Ueda
  • Publication number: 20030019861
    Abstract: An electric heat sealer for sealing workpieces such as plastic bags or the like includes a casing defining a battery chamber, a press bar pivotally connected to the casing, a sealing mechanism supported on a compression spring in a spring holder inside the casing, and a safety device. The sealing mechanism is electrically connected to produce heat for sealing the workpiece being put thereon when the press bar pressed against the sealing mechanism. The safety device breaks the electrical circuit when the apparatus is not in use.
    Type: Application
    Filed: December 12, 2000
    Publication date: January 30, 2003
    Applicant: Welcome Co., Ltd.
    Inventors: Shu Hui Chou, Richard Chang
  • Publication number: 20020185484
    Abstract: A hand-held electric sealer used for sealing a plastic bag or the like, including a casing, a sealing mechanism, a press bar, and a safety device. The sealing mechanism has a heating wire, which produces heat for sealing the plastic bag or the like when turned on. The safety device controls the heating of the sealing mechanism, and stops the sealing mechanism from being triggered accidentally.
    Type: Application
    Filed: July 24, 2002
    Publication date: December 12, 2002
    Applicant: Welcome Co., Ltd.
    Inventors: Richard Chang, Ammy Chou
  • Publication number: 20020179584
    Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.
    Type: Application
    Filed: July 15, 2002
    Publication date: December 5, 2002
    Inventors: David R. Hembree, Warren M. Farnworth
  • Patent number: 6486442
    Abstract: A heating device comprises an thermally conductive tubular body with a thermally conductive end closure disposed at an axial end of the tubular body, an electrical resistance heating coil disposed in the tubular body and having an end spaced axially from the end closure, and a thermocouple disposed between the end of the heating element and the end closure. An outer tubular casing is disposed about the tubular body with an outer end cap disposed at an axial end of the tubular casing in contact with the end closure to receive heat therefrom by thermal conduction.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: November 26, 2002
    Assignee: Hotset Corporation
    Inventor: Jeffrey V. Wheeler
  • Patent number: 6472638
    Abstract: A bag forming apparatus and method that features a single drive unit for operating both a drive roller and cross-cut mechanism with the drive motor assembly being internalized within the drive roller. The bag forming apparatus and method also features a easy slide in, slide out edge sealer and vent hole former inserts that are held by, and move with, the bag width adjustable driven rollers. The edge seal inserts feature a heating element that is compressed against the film material by an internal bias in the edge sealer insert. A heating element can also be used for the vent hole inserts. The heating element can be a plug-in heating unit easily inserted and removed from the remainder of the insert.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: October 29, 2002
    Assignee: Sealed Air Corporation
    Inventors: Charles R. Sperry, Vincent A. Piucci, Jr.
  • Publication number: 20020130118
    Abstract: A heating element of a thermal bonding system has a body and an insert which includes the working surface of the heating element. The body is formed from a thermally and electrically conductive material and the insert is formed from a thermally conductive, but electrically insulative material. A channel runs along the exterior side of the body in alignment with the longitudinal axis of the body and the insert is press fitted into the channel to maintain a fixed interference fit between the insert and body. A heat transfer interface may also be provided between the insert and body to facilitate heat transfer therebetween.
    Type: Application
    Filed: January 18, 2002
    Publication date: September 19, 2002
    Inventors: Thomas W. Todd, Jack A. Rubin, Raymond J. Kusmer, James M. Rudden
  • Patent number: 6450088
    Abstract: An improved plastic bag sealing apparatus comprised of an improved resilient planar heater formed of a heating wire embedded in a resilient silicon rubber material. The heater is shaped to conform to the flat planar surface of a T-bar shaped heating element, and clamped in place with insulators to provide maximum transfer of heat to a heating edge formed by the web portion of the T-bar. In an optional configuration the heater is in the form of a tubular rod seated in a channel in the T-bar directly above the heating edge for transferring maximum heat to the heating edge. In another optional embodiment, the tubular rod heater is a brass rod covered with intermediate insulating sleeves and spirally wound heating wire. In the latter embodiment the tubular rod heater is inserted in a passageway through T-bar shaped heating element and sealed with a potting compound.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: September 17, 2002
    Assignee: Harwil Corporation
    Inventor: Harold D. Hutchinson
  • Patent number: 6423943
    Abstract: A connecting clamp includes a heating member which surrounds a portion to be connected of a steel pipe and heats the portion to be connected, and a first clamp section and second clamp section positioned on opposite sides of the portion to be connected and clamping the steel pipe, whereby the portion to be connected is connected by heating the portion to be connected by the heating member while applying pressure to the portion to be connected by the first and second clamp sections. The first and second clamp sections and the heating member are so arranged as to be slid around the outer surface of the steel pipe from one side of the steel pipe to the other side thereof.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: July 23, 2002
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Masaru Kodama, Kiyotaka Iwatsubo, Nobuhiko Nishimura, Toshihiko Imamoto, Masaaki Fujita
  • Patent number: 6420681
    Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: July 16, 2002
    Assignee: Micron Technology, Inc.
    Inventors: David R. Hembree, Warren M. Farnworth
  • Patent number: 6414271
    Abstract: There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: July 2, 2002
    Assignee: Kyocera Corporation
    Inventors: Kiyoshi Yokoyama, Takafumi Turumaru, Hiroyuki Arima, Hideaki Shimozuru
  • Publication number: 20020070206
    Abstract: An electric heat sealer comprising a casing including a first pair of extensions extending outwardly therefrom, a press bar pivotally connected to said casing, the press bar including a second pair of extensions extending outwardly therefrom, at least one sealing mechanism mounted in the press bar or the casing and a source of current for energizing the heating wire. The press bar is normally biased above the casing and the at least one sealing mechanism includes a heating wire.
    Type: Application
    Filed: February 6, 2002
    Publication date: June 13, 2002
    Applicant: Welcome Company Ltd.
    Inventors: Shu-Hui Chou, Richard Chang
  • Patent number: 6399918
    Abstract: A thermal bonding method wherein at least two members are thermally bonded to each other with an adhesive by pressing and heating a laminate formed by laminating at least two members on each other with the adhesive interposed therebetween, comprising placing at least one member of the laminate close to a heated radiation heater and pressing the laminate in a radiation heat-applied state; and an apparatus comprising a radiation heater, a supporting member for supporting the laminate with at least one member of the laminate placed close to the radiation heater, and a pressing unit adapted to approach, contact and press the laminate supported by the supporting member and then move away from the laminate to stop applying a pressure to the same.
    Type: Grant
    Filed: March 3, 2000
    Date of Patent: June 4, 2002
    Assignee: Japan Brake Industrial Co., Ltd.
    Inventors: Haruo Komine, Akira Nishimura
  • Patent number: 6392198
    Abstract: A sealing machine is comprised of a trough, a press plate, a pressure device, a heater element and a circuit board, wherein, the heater element is in the trough, an extension on one side at the middle section of the trough to accommodate the circuit board, a pivot on top of the extension to connect a handle of the press plate, a stick made of silicon rubber beneath the press plate to contact the heater element in the trough, the pressure device between the trough and the press plate to always hold the press plate against the heater element, the heater element having a semi-circular cross section and connected vertically a cooling electrode at its end, and the circuit board connected to the heater element including at least a surge absorption capacitor, a tantalum capacitor, diodes, a gate transistor, and a transistor to introduce a lower voltage for the use of the heater element.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: May 21, 2002
    Inventor: San-Ho Yao
  • Patent number: 6380516
    Abstract: A connecting clamp includes a heating member which surrounds a portion to be connected of a steel pipe and heats the portion to be connected, and a first clamp section and a second clamp section positioned on opposite sides of the portion to be connected and clamping the steel pipe, whereby the portion to be connected is connected by heating the portion to be connected by the heating member while applying pressure to the portion to be connected by the first and second clamp sections. The first and second clamp sections and the heating member are so arranged as to be slidable around the outer surface of the steel pipe from one side of the steel pipe to the other side thereof.
    Type: Grant
    Filed: August 7, 2000
    Date of Patent: April 30, 2002
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Masaru Kodama, Kiyotaka Iwatsubo, Nobuhiko Nishimura, Toshihiko Imamoto, Masaaki Fujita
  • Publication number: 20020047002
    Abstract: A heating device comprises an thermally conductive tubular body with a thermally conductive end closure disposed at an axial end of the tubular body, an electrical resistance heating coil disposed in the tubular body and having an end spaced axially from the end closure, and a thermocouple disposed between the end of the heating element and the end closure. An outer tubular casing is disposed about the tubular body with an outer end cap disposed at an axial end of the tubular casing in contact with the end closure to receive heat therefrom by thermal conduction.
    Type: Application
    Filed: October 4, 2001
    Publication date: April 25, 2002
    Inventor: Jeffrey V. Wheeler
  • Publication number: 20020038798
    Abstract: The invention relates to a device for forming points on the ends of wires having receiving means for receiving a wire, a heating device, as well as means for stretching the wire, in addition to a procedure for forming points on the ends of wires.
    Type: Application
    Filed: March 28, 2001
    Publication date: April 4, 2002
    Inventor: Josef Leipold
  • Patent number: 6348674
    Abstract: A method and apparatus for securing prestressed or pressure-containing connections, such as in a pipe clamp, in remote or hazardous locations. A connection, having bolts that are heated and pretensioned, can easily be uniformly tightened with a robotic device.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: February 19, 2002
    Inventor: Larry R. Russell
  • Patent number: 6347201
    Abstract: An image heating apparatus has a first member; a second member slidable relative to the first member; a third member for forming a nip with the first member with the second member disposed therebetween, wherein a recording material carrying an image is nipped and red by the nip between the second member and the third member, a pressure control unit for controlling a pressure at the nip to set the pressure to a first pressure and a second pressure which is higher than the first pressure, wherein when the second member starts moving upon start of image heating operation, the control unit sets the pressure to the first pressure and then to the second pressure.
    Type: Grant
    Filed: July 21, 2000
    Date of Patent: February 12, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tetsuya Sano, Masao Umezawa, Hideo Nanataki, Takao Kume, Takashi Nomura
  • Publication number: 20020005399
    Abstract: A connecting clamp (4) comprises a heating member (9) which surrounds a portion to be connected of a steel pipe (1) and heats the portion to be connected, and a first clamp section (6) and a second clamp section (7) positioned on opposite sides of the portion to be connected and clamping the steel pipe, whereby the portion to be connected is connected by heating the portion to be connected by the heating member while applying pressure to the portion to be connected by the first and second clamp sections. The first and second clamp sections and the heating member are so arranged as to be slid around the outer surface of the steel pipe from one side of the steel pipe to the other side thereof.
    Type: Application
    Filed: August 22, 2001
    Publication date: January 17, 2002
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masaru Kodama, Kiyotaka Iwatsubo, Nobuhiko Nishimura, Toshihiko Imamoto, Masaaki Fujita
  • Publication number: 20020003137
    Abstract: There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.
    Type: Application
    Filed: May 22, 2001
    Publication date: January 10, 2002
    Applicant: KYOCERA CORPORATION
    Inventors: Kiyoshi Yokoyama, Takafumi Turumaru, Hiroyuki Arima, Hideaki Shimozuru
  • Patent number: 6335515
    Abstract: An electric heat sealer that has a main body having a longitudinal axis, and a sealing mechanism having a center point. The center point of the sealing mechanism is offset from the longitudinal axis. The electric heat sealer is used for sealing workpieces such as plastic bags or the like and also includes a casing defining a battery chamber and a press bar pivotally connected to the casing. The sealing mechanism is supported on a compression spring in a spring holder inside the casing, and a safety device. The sealing mechanism is electrically connected to produce heat for sealing the workpiece being put thereon when the press bar pressed against the sealing mechanism. The safety device breaks the electrical circuit when the apparatus is not in use.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: January 1, 2002
    Assignee: Welcome Company, Ltd.
    Inventors: Shu Hui Chou, Richard Chang
  • Patent number: 6329637
    Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.
    Type: Grant
    Filed: July 18, 2000
    Date of Patent: December 11, 2001
    Assignee: Micron Technology, Inc.
    Inventors: David R. Hembree, Warren M. Farnworth
  • Patent number: 6326594
    Abstract: A handy electric sealer used for sealing a plastic bag or the like, including a casing, a sealing mechanism, a press bar, and safety device. The sealing mechanism has a heating wire, which produces heat for sealing the plastic bag or the like when turned on. The safety device controls the heating of the sealing mechanism, and stops the sealing mechanism from being triggered by an erroneous action.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: December 4, 2001
    Assignee: Welcome Company, Ltd.
    Inventors: Richard Chang, Ammy Chou
  • Patent number: 6313440
    Abstract: The invention disclosed hereunder is a process and a device for the preparation and formation of a plastic weld connection between a workpiece (13) and a second component to be attached thereto by heating by means of a heating device (12). If force is applied, the heating element (12) tends to deform the contact surface especially in the case of hollow, thin-walled workpieces such as plastic containers. So far, methods were disclosed for the measuring of the degree of deformation by means of a sensor, subsequently readjusting the position of the heating device according to the determined deformation. The invention disclosed here under dispenses with any measurement of deformation, instead using an elastic element which automatically readjusts the position of the heating element (12) in the case of deformation of the workpiece (13) to effect a pre-load between the heating device (12) positioned at the contact surface of the work-piece (13) and the workpiece (13).
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: November 6, 2001
    Assignee: KVT Technologies Inc.
    Inventors: Wolfgang Weber, Hans-Josef Oxenfarth
  • Patent number: 6297478
    Abstract: A heating unit includes a pair of heating bodies for heating a band film conveyed along a predetermined film feeding path defined by a film guide. An embossing unit includes a punch and a die for forming a predetermined raised pattern on a heated surface of the band film. A shifting mechanism locates the heating unit and the embossing unit closely by a first distance during a thermal processing of the band film and separates at least one of the heating unit and the band film far away from the other by a second distance larger than the first distance when the thermal processing is interrupted or stopped.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: October 2, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshinobu Kano, Tetsuya Tsumura, Kazuhiro Murakami, Osamu Miyazaki, Kiyoshi Hino
  • Patent number: 6269998
    Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: August 7, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
  • Patent number: 6246027
    Abstract: A tool for cutting synthetic hair that is for sealing synthetic hair when synthetic hair is braided and cut to length. The tool for cutting synthetic hair includes a top portion containing a cutting blade and a bottom portion containing an electric heating element. An electrical cord extends into the bottom portion connecting a switch to the heating element. A hinge connects the top and bottom portions. The top portion is urged away from the bottom portion by a spring. Synthetic hair is placed between the top and bottom portions. When the cutting blade is brought in contact with the heating element, the synthetic hair is cut and sealed.
    Type: Grant
    Filed: October 28, 1999
    Date of Patent: June 12, 2001
    Inventor: Vivette Griffiths
  • Patent number: 6239412
    Abstract: A heater for use in fusing the end of a branch polyolefin pipe to the side wall of a main polyolefin pipe of specified radius has a first plate with a convex outer surface definable as a surface generated by rotating a first straight line about a first parallel line of origin at a radius equal to the specified radius of the main pipe and a concave inner surface, a second plate with a concave outer surface definable as a surface generated by rotating a second straight line about a second parallel line of origin at a radius equal to the specified radius of the main pipe and a convex inner surface and a heating element of substantially constant thickness disposed in laminar relationship between the first and second plates, the inner surfaces of the plates being contoured so that, with the heating element in laminar relationship therebetween, the lines of origin of the outer surfaces of the plates lie a common plane.
    Type: Grant
    Filed: January 5, 1999
    Date of Patent: May 29, 2001
    Assignee: McElroy Manufacturing, Inc.
    Inventors: Timothy M. Thoman, James R. Perrault
  • Patent number: 6232579
    Abstract: An electric heat sealer for sealing workpieces such as plastic bags or the like includes a casing defining a battery chamber, a press bar pivotally connected to the casing, a sealing mechanism supported on a compression spring in a spring holder inside the casing, and a safety device. The sealing mechanism is electrically connected to produce heat for sealing the workpiece being put thereon when the press bar pressed against the sealing mechanism. The safety device breaks the electrical circuit when the apparatus is not in use.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: May 15, 2001
    Assignee: Welcome Co., Ltd.
    Inventors: Shu Hui Chou, Richard Chang
  • Publication number: 20010000608
    Abstract: A handy electric sealer used for sealing a plastic bag or the like, including a casing, a sealing mechanism, a press bar, and safety means. The sealing mechanism has a heating wire, which produces heat for sealing the plastic bag or the like when turned on. The safety means controls the heating of the sealing mechanism, and stops the sealing mechanism from being triggered by an erroneous action.
    Type: Application
    Filed: December 18, 2000
    Publication date: May 3, 2001
    Applicant: Welcome Co., Ltd.
    Inventors: Richard Chang, Ammy Chou
  • Patent number: 6147326
    Abstract: A soldering device includes an elongated hot bar and a plurality of spaced soldering tips supported along the hot bar for soldering multiple connections. A method of using the soldering device is also described.
    Type: Grant
    Filed: June 10, 1999
    Date of Patent: November 14, 2000
    Assignee: Seagate Technology, Inc.
    Inventor: David D. Backlund
  • Patent number: 6121576
    Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting "softening" temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus, are disclosed.
    Type: Grant
    Filed: September 2, 1998
    Date of Patent: September 19, 2000
    Assignee: Micron Technology, Inc.
    Inventors: David R. Hembree, Warren M. Farnworth
  • Patent number: 6031216
    Abstract: A wire bonding apparatus has a first support arrangement for supporting a first integrated circuit package component. A second support arrangement is configured to supporting a second integrated circuit package component. The second support arrangement includes at least a portion of a heating arrangement for heating certain portions of the second component. At least portions of the first support arrangement are thermally insulated from the second support arrangement such that at least certain portions of the first component may be maintained at a temperature substantially lower than the temperature of the heated portions of the second component. The apparatus may be used in method of forming a bonding wire for electrically connecting a first contact on a first integrated circuit package component to a second contact on a second integrated circuit package component. The method includes the steps of supporting and holding the first component and the second component in a desired position.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: February 29, 2000
    Assignee: National Semiconductor Corporation
    Inventors: Inderjit Singh, Seshadri Vikram
  • Patent number: 5958270
    Abstract: In a wedge tool having a heating device, a metal rod having a heating line, a conductive wire or a thin film-type heating plate is disposed at a predetermined portion of the wedge tool, to which power is supplied through a power supply unit, respectively, in order to provide heat to the wedge tool in wire bonding process. By having such a construction, the wedge tool has the heating system for generating heat, so that a substantially preferable and remarkable bonding force can be obtained.
    Type: Grant
    Filed: January 22, 1996
    Date of Patent: September 28, 1999
    Assignee: LG Semicon Co., Ltd.
    Inventor: Jae Weon Cho
  • Patent number: 5894982
    Abstract: A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP to compression-bond the outer leads to the electrodes of the array substrate, and a waiting position wherein the distal end portion is spaced apart from the TCP. A pressing mechanism having a pressing member is mounted on the support block and movable in interlock with the movement of the heater tool. The pressing member presses the TCP to press the outer leads against the array substrate when the heater tool moves from the waiting position toward the compression bonding position.
    Type: Grant
    Filed: September 27, 1996
    Date of Patent: April 20, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tatsuya Hasegawa, Satoshi Yoshimura, Toshiaki Miyoshi, Yasunori Fukumoto, Yoshikazu Yomogihara
  • Patent number: 5855323
    Abstract: An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid.
    Type: Grant
    Filed: November 13, 1996
    Date of Patent: January 5, 1999
    Assignee: Sandia Corporation
    Inventors: Frederick G. Yost, Darrel R. Frear, David T. Schmale
  • Patent number: 5854466
    Abstract: A hand-held electric heat sealing apparatus including a casing, a heat sealing unit and a press handle, wherein a safety switch is mounted in the casing and shifted to stop metal contact plates of the heat sealing unit from contacting the two terminals of a power supply circuit in the casing; the heat sealing unit includes a heat insulative base having a projecting block, an electric heating wire fastened to the projecting block and connected to two opposite metal contact plates of the heat sealing unit, a cover shell covered on the casing over the heat insulative base and having a center opening through which the projecting block of the heat insulative base projects out of the cover shell, a heat insulative sheet covered over the electric heating wire, and a cover frame fastened to the cover shell to hold the heat insulative sheet in place; the casing has a rear chamber, an electric socket in the rear chamber for receiving an electric plug, and an upright stop rod disposed in the rear chamber adapted for hol
    Type: Grant
    Filed: August 26, 1997
    Date of Patent: December 29, 1998
    Assignee: Welcome Company, Ltd.
    Inventor: Ammy Chou
  • Patent number: 5844467
    Abstract: Electrical devices based on current limiting PTC polymer devices, and in particular, electrical circuit protection devices containing a current limiting PTC polymer device composed of a current limiting polymer composition in combination with suitable electrodes and a low inductance shunt to protect the current limiting polymer composition from exceeding its breakdown field strength. Specifically, electrical devices containing a current limiting polymer composition in combination with suitable electrodes and a low inductance shunt in the form of a ribbon shunt, i.e. a flat sheet of conductive material folded over on itself.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: December 1, 1998
    Assignee: Eaton Corporation
    Inventor: John Joseph Shea
  • Patent number: 5841107
    Abstract: An apparatus for shaping perforations of sheet material which comprises a first mold structure at one side of the sheet material and a complementary mold structure at the other side of the sheet material to cooperate with the first mold structure wherein the structures are arranged to be reciprocated and are capable of meeting approximately half way through the sheet material whereby to shape the perforations between them. The apparatus can include a needle so that perforations are simultaneously formed and shaped, or it may be used to shape pre-formed perforations. If a needle is included it may be of the ultrasonic type or it may be heated, e.g. electrically heated. If a needle is used, one of the mold structures may be defined by an appropriate formation on the needle, or the structure may be separate.
    Type: Grant
    Filed: February 23, 1995
    Date of Patent: November 24, 1998
    Inventor: Franca Riva