Abstract: The present disclosure relates to a ceramic susceptor. The ceramic susceptor of the present disclosure may include a ceramic plate having a heating element disposed thereon and at least one hole. The heating element may include a plurality of concentric circular patterns, each of the concentric circular patterns may include arc portions extending in a circumferential direction and a transverse portion interconnecting the arc portions, and among the arc portions of the plurality of concentric circular patterns, each of the arc portions, which face each other across the hole, may include, in a portion thereof, a protrusion protruding toward the hole.

Abstract: A multi-zone heater includes an outer circumferential zone heater and first and second elemental wire portions. The outer circumferential zone heater is a coil that is provided in an outer circumferential zone of a ceramic substrate in the same plane as a plane in which a central zone heater is provided and that is routed throughout the outer circumferential zone in a unicursal manner from one end portion to the other end portion in the outer circumferential portion. The first elemental wire portion extends from a first terminal, passes through a central portion, is connected to the one end portion of the outer circumferential zone heater, and has a meandering shape in plan view. The second elemental wire portion extends from a second terminal, passes through the central portion, is connected to the other end portion of the outer circumferential zone heater, and has a meandering shape in plan view.

Abstract: An electric heater includes a substrate; and a plane heating element disposed on one surface of the substrate. The plane heating element includes a pattern portion including a start point and an end point, which are located at an outermost side of the pattern portion, the pattern portion including a plurality of tracks having an arc shape, which are spaced apart from each other and are formed to have a length increasing from an innermost side to the outermost side of the pattern portion, and a plurality of bridges connecting the plurality of tracks in series. The plurality of bridges are formed on both sides of the pattern portion with respect to a reference line passing through a center of the pattern portion, and an innermost gap between the pair of bridges located at the innermost side of the pattern portion is narrower than an outermost gap between a pair of bridges located at the outermost side of the pattern portion.

Abstract: A heater for heating and vaporizing droplets in gas stream, comprising a heater housing and a heater body located inside the heater housing, wherein the heater housing is provided with an airflow inlet and an airflow outlet, the airflow enters into the heater housing via the airflow inlet, flows through the heater body, and then is discharged via the airflow outlet; the heater body comprises a stereoscopic network structure formed by interweaving one or more electrical heating wires. The use of the heater and a method for preparing isocyanate using the heater. The heater has a simple structure, a low pressure loss, uniform heating and a high heat utilization ratio during preparing isocyanate.

Abstract: A track rail heating assembly that is adapted to position a heater element in spaced relation proximate to a surface of a track rail of a railroad. The assembly includes at least one heating element, and a housing that is operable to at least partially surround the heating element while positioning the heating element near to track rail. The hood positions the heating element relative to the rail section such that a gap exists between the heating element and the rail section. As the heating element does not contact the rail, the heating element cannot form an electrical by-pass for signals passing through the rail section. The assembly further incorporates a flexible barrier that at least partially isolates a side surface of the track rail from ambient conditions to reduce heat loss.

Abstract: A heating plate includes a thermally conductive, electrically insulating main board on whose surface an electrically-conductive heat-generating circuit and an outer insulating layer are layered. The heat-generating circuit is formed by connecting one first electrically-conductive layer and one second electrically-conductive layer that are arranged in different directions. The first and second electrically-conductive layers are overlapped to form an overlapping area. The heat-generating circuit has at least two electrically-conductive segments exposed outside the outer insulating layer. Thereby, when the electrically-conductive segments receive incoming current, the electrically-conductive heat-generating circuit can generate heat rapidly, and the heat can be transmitted to the main board through the thermally-conductive insulating layer.

Abstract: A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.

Abstract: The ceramic heater 20 includes the ceramic substrate 22 and a hollow shaft 40. The ceramic substrate 22 is disk-shaped, and a resistance heating element 24 is embedded in the ceramic substrate 22. The hollow shaft 40 is attached to the center of a lower surface of the ceramic substrate 22. The ceramic substrate 22 has a rail groove 26 to which a slide lid 28 is attached and a guide groove 30 that serves as a thermocouple conduit. Moreover, a tube 32 is disposed outside the shaft 40. The tube 32 extends in the up-down direction and is connected to the guide groove 30.

Abstract: A radiant heating system includes a molded agglomeration of inert natural stone waste and a heating element embedded in the agglomeration. The agglomeration contains 45-55% by weight of stone particles having a size from 1 to 5 mm; 30-35% by weight of stone dust having a size from 0.01 mm to 0.5 mm; and 20-25% by weight of a resin having a water-based acrylic component.

Abstract: Embodiments of the present invention provide an apparatus heating and supporting a substrate in a processing chamber. One embodiment of the present invention provides a substrate support assembly. The substrate support assembly includes a heated plate having a substrate supporting surface on a front side and a cantilever arm extending from a backside of the heated plate. The heated plate is configured to support and heat a substrate on the substrate supporting surface. The cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis.

Abstract: A substrate heat treatment apparatus includes a heat-treating plate having a flat upper surface, support devices formed of a heat-resistant resin for contacting and supporting a substrate, a seal device disposed annularly for rendering gastight a space formed between the substrate and heat-treating plate, and exhaust bores for exhausting gas from the space. The support devices are formed of resin, and the upper surface of the heat-treating plate is made flat, whereby a reduced difference in the rate of heat transfer occurs between contact parts and non-contact parts on the surface of the substrate. Consequently, the substrate is heat-treated effectively while suppressing variations in heat history over the surface of the substrate.

Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

Abstract: An electrical heating device has an integrally manufactured support made from an insulating material. A depressed path is provided for the introduction of a coiled round heating element into the support. In the bottom side of the support, additional depressions are made in support and pass into the depressed path and form undercuts. In the area of the undercuts the heating element is flattened in the path and thereby pressed into the undercuts and consequently can be no longer moved out of said path.

Abstract: An electrostatic chuck system for maintaining a desired temperature profile across the surface of the substrate is disclosed. The electrostatic chuck system includes a pedestal support defining a substantially uniform temperature profile across the surface of the pedestal support and an electrostatic chuck supported by the pedestal support. The electrostatic chuck has a clamping electrode and a plurality of independently controlled heating electrodes. The independently controlled heating electrodes include an inner heating electrode defining an inner heating zone and a peripheral heating electrode defining a peripheral heating zone separated by a gap distance. The temperature profile across the surface of the substrate can be tuned by varying thermal characteristics of the pedestal thermal zone, the inner heating zone, the peripheral heating zone, or by varying the size of the gap distance between the inner heating electrode and the peripheral heating electrode.

Abstract: A far infrared ray ceramic flat plate heating module is provided. The far infrared ray ceramic flat plate heating module includes a ceramic heat-generating flat plate, an integrated terminal block for electrical distribution, a metal plate and a metal frame. The ceramic heat-generating flat plate includes a ceramic flat plate, a heat-generating film coated on a surface of the ceramic flat plate, silver paste electrodes configured on and coupled to two opposite sides of the heat-generating film, a first insulating layer coated on the heat-generating film and the silver paste electrodes, a temperature sensor configured by forming a temperature sensing paint layer on the first insulating layer, and a second insulating layer formed on the temperature sensor. The integrated terminal block is secured on the metal plate. The metal frame is disposed surrounding the periphery of the metal plate and the ceramic heat-generating flat plate.

Abstract: A resistive heating element 30 has a higher molybdenum carbide content in a central portion 35 than in a peripheral portion 34. Since molybdenum carbides have a low temperature coefficient of resistance compared to molybdenum, the amount of heat generated in the central portion 35 of the resistive heating element 30 does not increase as much as in the peripheral portion 34 even when the temperature is increased, and the increase in difference in temperature between the peripheral portion 34 and the central portion 35 can be suppressed. In other words, generation of hot spots near the center can be suppressed and a good uniform heating property in a wide range of operation temperatures can be obtained.

Abstract: A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar heater zone includes one or more heater elements made of an insulator-conductor composite. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic sheets having planar heater zones, power supply lines, power return lines and vias.

Abstract: A mobile cart for the heating or rethermalization of comestible items at two separate temperatures. A plurality of trays are disposed on a corresponding plurality of shelves within the cart. As each tray is slid onto the shelf, a thermal barrier bifurcates the space above the tray into portions. Each tray is also coupled to a socket disposed within the cart which supplies power to at least two filaments inside the tray, one filament comprising means for obtaining a higher temperature than the remaining filaments. The filaments heat one portion of each tray while the other portion, partitioned by the thermal barrier, is disposed within a portion of the cart which is maintained at or around 0° C. by a conventional refrigerator. Comestible items may then be disposed on either portion of the tray according to temperature preference, the tray and cart maintaining and rethermalizing the comestible items at the chosen temperature for an extended period of time.

Abstract: A thermal processing apparatus is disclosed which separates the load bearing components from the thermal components, improving heating time, cooling time, thermal response, and energy efficiency. The thermal processing apparatus comprises an array of cylindrical heating elements which rest on support plates of high temperature, low density material. The support plates and heating elements are then supported by a rigid skeletal structure for load bearing support.

Abstract: A cooking or food warming appliance having a heated heat sink plate situated in a vacuum environment within an outer shell. A food vessel intimately engages the heat sink plate along a food contacting surface thereof by virtue of the vacuum. The vacuum eliminates air gaps between the food contacting surface of the food vessel and the heat sink plate so as to provide instantaneous and uniform heating of the food vessel. The vacuum environment also provides thermal insulation for the heat sink plate whereby heat loss by convection is virtually eliminated.

Abstract: A substrate processing method is arranged to perform a heat process on a substrate with a coating film formed thereon to bake and cure the coating film. At first, the substrate, with the coating film formed thereon, is held at a preparatory temperature lower than a lower limit of temperature for baking and curing the coating film, to adjust distribution of a predetermined component in the coating film. Then, the substrate, with distribution of the predetermined component thus adjusted, is subjected to a heat process at a temperature not lower than the lower limit of temperature.

Abstract: A substrate holder for supporting a substrate in a processing system includes a temperature controlled support base having a first temperature, a substrate support opposing the temperature controlled support base and configured to support the substrate, and one or more heating elements coupled to the substrate support and configured to heat the substrate support to a second temperature above the first temperature. An erosion resistant thermal insulator disposed between the temperature controlled support base and the substrate support, wherein the erosion resistant thermal insulator includes a material composition configured to resist halogen-containing gas corrosion.

Abstract: A joined body includes a first ceramic member, a second ceramic member, and a joining layer which contains soft metal, and joins the first ceramic member and the second ceramic member to each other by being thermally compressed at a joining temperature lower than a solidus of the soft metal.

Abstract: A ceramic heater according to the present invention includes a heating portion made of ceramics, and a cooling plate portion. In the heating portion, a belt like printed electrode is formed continuously in a spiral shape along a circumferential direction, and in the printed electrode, slits extended in a width direction of the printed electrode are provided. In such a way, a ceramic heater in which uniform heating performance in the heating surface is high can be obtained.

Abstract: A curing device comprises a reaction chamber, a workbench provided at a bottom of the reaction chamber, an ultraviolet lamp provided at the top of the reaction chamber for irradiating the workbench, and a light shielding plate provided under the ultraviolet lamp for shielding the second area of the workbench from the light of the ultraviolet lamp. The workbench comprises a first area and a second area surrounded by the first area, the first area corresponds to a non-display area of a display panel to be produced, and the second area corresponds to the display area of the display panel to be produced. The workbench comprises a heating device.

Abstract: A cooktop includes a plurality of heaters that form a contiguous cooking zone, a power supply for the plurality of heaters with a differentiator that differentiates between a first positive heating power for a first of the plurality of heaters and a second positive heating power for a second of the plurality of heaters in a differentiated heating mode.

Abstract: The present invention relates to a glass-ceramic panel, intended for example to cover or receive at least one heating element, in particular intended to serve as a cook-top, said panel being coated, in at least one region of a face, with a coating such that the total color difference delta E*, measured on the opposite face, between said coated region and an uncoated region, is less than about 1 and/or such that this coating has a luminance L* of greater than about 70. The invention also relates to the process for manufacturing the panel and to the cooking device comprising said panel.

Abstract: The heating plate (1) has cavities (2), in which electrically heatable heating bodies (3) are disposed. A heat exchange medium circulated by a pump (4) transmits the heat emitted by the heating bodies (3). The heating plate is designed to obtain a uniform temperature distribution using as low a volume of heat exchange medium as possible. To this end, the cavities (2) are elongate and the heating bodies (3) are bar-shaped.

Abstract: There is provided a fluid controlling apparatus which can satisfactorily perform heating without enlarging an installation area. Heating means 3 comprises: a planar heater 21 interposed between a base member 2 and a lower layer 5; and heat conduction enhancing spacers 22 interposed between interrupting releasers 15 and 17 disposed on an upper layer 4 and a mass flow controller 16, and the heater 21, respectively.

Abstract: A heating unit includes: a base having an upper surface; a first heating element buried in an upper part of the base, the upper part including the upper surface, the first heating element having a flat shape almost parallel to the upper surface; and a second heating element buried in a lower part of the base and arranged in a location lower than the first heating element with respect to the upper surface, the lower part being joined to the upper part, and the second heating element having a flat shape. First and second projection patterns have an overlapping portion where the first projection pattern and the second projection pattern partially overlap each other, the first projection pattern representing the first heating element projected on the upper surface of the base, and the second projection pattern representing the second heating element projected the upper surface of the base.

Abstract: A substrate cleaning chamber comprises various components, such as for example, a consumable ceramic liner, substrate heating pedestal, and process kit. The consumable ceramic liner is provided for connecting a gas outlet channel of a remote gas energizer to a gas inlet channel of a substrate cleaning chamber. The substrate heating pedestal comprises an annular plate having a substrate receiving surface with a plurality of ceramic balls positioned in an array of recesses. A process kit comprises a top plate, top liner, gas distributor plate, bottom liner, and focus ring.

Abstract: A heater strip for use as a heating element in an electric heater is made up of a profiled strip made of a flat metallic material forming a resistor section and of mounting elements extending over one common longitudinal side and they are manufactured as one piece with the resistor section for mounting the heater strip to a support. The strip has a zigzag-shaped structure. The mounting elements are provided only on the flat leg sections of the zigzag-shaped heater strip.

Abstract: A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.

Abstract: A ceramic heater according to the present invention includes a heating portion made of ceramics, and a cooling plate portion. In the heating portion, a belt like printed electrode is formed continuously in a spiral shape along a circumferential direction, and in the printed electrode, slits extended in a width direction of the printed electrode are provided. In such a way, a ceramic heater in which uniform heating performance in the heating surface is high can be obtained.

Abstract: A ceramics heater comprises a circular heater plate formed of aluminum nitride and a metal foil heater wire formed of a high-melting metal and having a thickness of 100 ?m to 175 ?m. The heater wire is embedded in the heater plate. The heater wire has an inside portion located near the center of the heater plate and formed in zigzags at first pitches in the circumferential direction of the heater plate and an outside portion located near the outer periphery of the heater plate and formed in zigzags at second pitches in the circumferential direction of the heater plate. The second pitches are shorter than the first pitches.

Abstract: A heating resistance 1 comprises a shaped body of a band made of a conductive material obtained by bending the band in a shape of a wave. The heating resistance 1 is fixed to a substrate made of an insulating material to obtain a heater. Alternatively, the heating resistance comprises a wound body of a band made of a conductive material. According to the present invention, the heating value per a unit length can be easily designed and changed, and the reliability can be improved and abnormal heat generation can be prevented at the interface where the heating value per a unit length is changed.

Abstract: A resistive heater having a doped ceramic heating element embedded either partially or completely within a matrix of undoped ceramic material. The ceramic may be silicon carbide, and the dopant may be nitrogen. Many of the advantages of the present heater stern from the fact that the materials used for the heating elements and the matrix material surrounding those elements have substantially the same coefficient of thermal expansion. In one embodiment, the heater is a monolithic plate that is compact, strong, robust, and low in thermal mass, allowing it to respond quickly to power input variations. The resistive heater may be used in many of the reactors and processing chambers used to fabricate integrated circuits, such as those that deposit epitaxial films, and carry out rapid thermal processing.

Abstract: A ceramic substrate for semiconductor manufacture and/or inspection which is conducive to decrease in ?-rays radiated to prevent electrical errors, and to decrease an electrostatic chucking force such as heater or wafer prober, generation of particles, and circuit defects. The ceramic substrate is configured such that the level of ?-rays radiated from the surface of the ceramic substrate is not higher than 0.250 c/cm2.hr.

Abstract: An electrical heating assembly (2) comprises a glass-ceramic cooking plate (4) having an upper surface (6) for receiving a cooking vessel (8) and a lower surface (10). A radiant electric heater (12) incorporating at least one electric heating element (20) is supported in contact with the lower surface of the cooking plate. Temperature sensing means (29) is spaced above the at least one heating element (20). The temperature sensing means includes a support member (33) which has provided on an upper surface a film form temperature-sensitive electrical resistance element (30) and which is provided with electrical connecting leads (34). Thermal insulation means (40) is adapted and arranged to shield the support member (33) and a corresponding region of the lower surface (10) of the cooking plate (4) from direct thermal radiation from the at least one electric heating element (20).

Abstract: A ceramic beater for a semiconductor producing/examining device having a resistance heating element superior in adhesion to a substrate. The ceramic heater includes a ceramic substrate and a resistance heating element formed on the surface of the ceramic substrate. Further, irregularities are formed on the side face of the resistance heating element.

Abstract: An electric heating assembly comprises a plate (2) having a front face (4) and a rear face (10), and at least one electric heater unit (8) located at the rear face (10) of the plate (2). The electric heater unit (8) is secured to the rear face (10) of the plate (2) by adhesive (20), the adhesive (20) being adapted to withstand a maximum temperature to which it is subjected during operation of the heating assembly.

Abstract: An improved heating system for heating a semiconductor wafer during fabrication in a corrosive manufacturing environment is disclosed. The system includes a novel ceramic heater made of a layered ceramic substrate that has a plurality of heating elements and temperature sensor arrangement completely and directly embedded within the ceramic substrate of the ceramic heater. The heating elements and the temperature sensor arrangement are constructed of a molybdenum and aluminum nitride composite that provides a low temperature coefficient of resistance which improves the operating efficiency of the ceramic heater. In operation, the temperature sensor arrangement transmits temperature readings to a microprocessor capable of controlling the heating elements in such a manner as to provide a constant and uniform temperature distribution along the entire surface of the semiconductor wafer.

Abstract: The present invention discloses a ceramic substrate for semiconductor manufacture and/or inspection conducive to decrease radiated &agr;-rays and to minimize changes in thermal conductivity as a function of time, thereby yielding a superior temperature controllability. This invention is related to a ceramic substrate for apparatuses for use in semiconductor manufacture and/or inspection, wherein the level of &agr;-rays radiated from said ceramic substrate exceeds 0.25 c/cm2·hr and is not higher than 50 c/cm2·hr.

Abstract: The present invention provides a ceramic heater which makes it possible to make the distance between a semiconductor wafer and the heating surface of a ceramic substrate constant at any time, heat the semiconductor wafer at an even temperature and prevent contamination of the semiconductor wafer, and which does not cause dropping-out of a supporting pin. The ceramic heater of the present invention comprises a ceramic substrate on a surface of which or inside which a heating element is formed, wherein the ceramic heater is constituted to have a structure that an object to be heated can be held apart from a surface of said ceramic substrate and heated.

Abstract: A ceramic heater for a semiconductor producing/inspecting device which makes it possible to realize an even temperature distribution in a semiconductor wafer without corroding external terminals, wires and the like of the ceramic heater in the process of producing a semiconductor. The ceramic heater for a semiconductor producing/inspecting device includes a ceramic substrate and a resistance heating element formed inside the ceramic substrate, wherein a power feeding terminal is exposed and formed at the outside of a wafer-heating region in the ceramic substrate.

Abstract: An apparatus and method for processing a microelectronic workpiece at an elevated temperature. In one embodiment, the apparatus includes a workpiece support positioned to engage and support the microelectronic workpiece during operation. The apparatus can further include a heat source having a solid engaging surface positioned to engage a surface of the microelectronic workpiece with at least one of the heat source and the workpiece support being movable relative to the other between a first position with the microelectronic workpiece contacting the engaging surface of the heat source and a second position with the microelectronic workpiece spaced apart from the engaging surface. The heat source is sized to transfer heat to the microelectronic workpiece at a rate sufficient to thermally process a selected material of the microelectronic workpiece when the microelectronic workpiece is engaged with the heat source.

Abstract: A heating apparatus includes a central hot plate for heating the center portion of a substrate, a plurality of segment hot plates for heating the peripheral portion of the substrate, a hot plate support member supporting the central hot plate and the segment hot plates, support pins for supporting the substrate so as to face the central hot plate and the segment hot plates in a close proximity without being in contact with the central hot plate and the segment hot plates, and a power supply for supplying electricity to the central hot plate and the segment hot plates.

Abstract: A ceramics heater comprises a circular heater plate formed of aluminum nitride and a metal foil heater wire formed of a high-melting metal and having a thickness of 100 &mgr;m to 175 &mgr;m. The heater wire is embedded in the heater plate. The heater wire has an inside portion located near the center of the heater plate and formed in zigzags at first pitches in the circumferential direction of the heater plate and an outside portion located near the outer periphery of the heater plate and formed in zigzags at second pitches in the circumferential direction of the heater plate. The second pitches are shorter than the first pitches.

Abstract: The invention discloses a ceramic cooktop comprising a cooking plate made of a glass ceramic or glass. The ceramic cooktop also comprises an electrical heat conductor layer and an insulating layer that is located between the cooking plate and the heat conductor layer. Onto the cooking plate a thermally sprayed bonding layer is applied, before further layers are applied.

Abstract: A heater includes a plate having a heating surface for heating an object to be heated and a resistant heater element provided in the plate. This resistant heater element includes a continuous wiring pattern with a plurality of flexures and including a thermal uniform pattern part which improves thermal uniformity. If the resistant heater element includes a continuous wiring pattern with a plurality of folding parts as the flexures, a space between wirings before folding and after folding with respect to each of the folding parts is approximately the same as a width L3 in a region other than the folding part and the vicinity thereof and is made wider than the width L3 at the folding part and in the vicinity thereof.