Abstract: A method for fusing an electrical conductor to a film pad circuit including the steps of: providing an electrically inert substrate having a first surface and an opposing second surface; applying an electrically conductive film to the second surface of the electrically inert substrate; applying an electrically conductive member to the electrically conductive film; placing an electrical conductor on the first surface of the electrically inert substrate; and fusing the electrical conductor to the conductive member.

Abstract: A system includes an inert gas supply, a soak chamber, a test chamber, a transfer zone, and a heater. The soak chamber soaks an integrated circuit (IC) device in the inert gas prior to testing. The test chamber includes contact pins for testing the IC device in the inert gas by contacting the contact pins to leads of the IC device. The transfer zone is to transfer the IC device from the soak chamber to the test chamber. The heater heats the inert gas supplied to the soak chamber and the test chamber.

Abstract: Examples of techniques for an integrated wafer-level processing system are disclosed. In one example implementation according to aspects of the present disclosure, an integrated wafer-level processing system includes a memory wafer and a processing element connected to the memory wafer via a data connection.

Abstract: A method and a test fixture for evaluating a battery cell are described, wherein the battery cell is composed of a cell body having a plurality of electrode foils that are joined to both a positive terminal and a negative terminal at weld junctions. The method includes retaining the cell body of the battery cell in a first clamping device and gripping one of the positive and negative terminals in a terminal gripper. A dynamic stress end effector coupled to the terminal gripper is employed to apply a vibrational excitation load to the one of the positive and negative terminals. Impedance between the positive terminal and the negative terminal is monitored via a controller, and integrity of the weld junction of the one of the positive and negative terminals is evaluated based upon the impedance.

Abstract: A wire bonding apparatus includes: a bonding tool 40 into and through a wire 42 passes; a control unit 80 that performs a movement process of the bonding tool 40 for cutting the wire 42 after forming a wire loop 90 between first and second bonding points of a bonding target 100; and a monitoring unit 70 that supplies a predetermined electric signal between the wire 42 through the bonding tool 40 and the bonding target 100, and monitors whether the wire 42 is cut or not based on an output of the supplied electric signal. The control unit 80 continues the movement process of the bonding tool 40 while the wire 42 is determined not to be cut, and stops the movement process of the bonding tool 40 when the wire 42 is determined to be cut, based on a monitoring result from the monitoring unit 70. This can shorten the operation time of the wire bonding, and improve the process efficiency of the wire bonding.

Abstract: A chip package includes at least one integrated circuit die. The integrated circuit die includes a substrate portion having an internal plane between a front side and a back side, an electrical interconnect portion on the front side, a plurality of first connection terminals on an upper surface of the electrical interconnect portion, a plurality of second connection terminals on the back side of the substrate portion, a plurality of connection wirings electrically connecting the first connection terminals and the second connection terminals, a chip selection terminal between the internal plane of the substrate portion and the upper surface of the electrical interconnect portion, and a chip selection wiring connected to the chip selection terminal and one of the second connection terminals and the first connection terminals. At least one of the chip selection wiring and the plurality of connection wirings includes a tilted portion with respect to the back side of the substrate portion.

Abstract: A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.

Abstract: An antioxidant gas blow-off unit comprises a plate-shaped hollow base portion with an antioxidant gas flow passage formed therein, a hole provided in the base portion so as to allow a capillary to be inserted thereinto or removed therefrom and configured to communicate with the antioxidant gas flow passage, and a plurality of electrodes embedded in a wall of the base portion in the vicinity of the hole and configured to generate plasma from an antioxidant gas. With the antioxidant gas blow-off unit, the bonding quality of a wire bonding apparatus can be improved.

Abstract: A microelectronic assembly (10) includes a substrate (12) having a first and second opposed surfaces. A microelectronic element (22) overlies the first surface and first electrically conductive elements (28) can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements (28) are electrically connected to the microelectronic element (22). Wire bonds (32) have bases (34) joined to the conductive elements (28) and end surfaces (38) remote from the substrate and the bases, each wire bond defining an edge surface (37) extending between the base and the end surface. An encapsulation layer (42) can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds (32) are defined by at least portions of the end surfaces (38) of the wire bonds that are uncovered by the encapsulation layer (42).

Abstract: A method of attaching a bond wire to first and second electrical contact pads includes holding the bond wire in a capillary, wherein a first end of the bond wire extends out of an opening in the capillary, attaching the first end of the bond wire to the first electrical contact pad using a ball bonding technique, moving a second end of the bond wire toward the second electrical contact pad after the attachment of the first end of the bond wire, performing an electric flame off on the second end of the bond wire without forming a free air ball, and attaching the second end of the bond wire to the second electrical contact pad after the EFO on the second end of the bond wire.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die.

Abstract: A wire bonding apparatus for manufacturing, for instance, semiconductor devices, including a cleaning case in which a microplasma generating section comprised of a plasma torch, which has a plasma nozzle 38 at the end, and capacitive coupling electrodes composed of an outer electrode and an inner electrode is fixed to the bottom of the cleaning case. The plasma nozzle is provided such that its center line is in alignment with the longitudinal center line of the capillary. Microplasma is ejected from below the capillary to clean its tip within the cleaning case. A shutter is provided on the top of the cleaning case and the wasted gas produced as a result of cleaning is exhausted out of the cleaning case through an exhaustion port of the cleaning case.

Abstract: A wire bonding apparatus including a joining machine unit for joining a wire to a subject device, a measurement unit for measuring the connection state between the subject device and the wire, and a control unit for controlling the operation of the entire apparatus. An AC-C measurement circuit of the measurement unit includes an AC power supply, an equivalent capacitance circuit that creates an essentially the same capacitance as the capacitance component of the joining machine unit before bonding, a differential circuit that finds the difference between the capacitance of the joining machine unit after bonding and the capacitance of the equivalent capacitance circuit, an amplification circuit, a rectification circuit, an AID conversion circuit, a judgment unit that judges the connection state, and an output unit.

Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Abstract: An arrangement is provided including an electrode extending to an electrode tip for contacting a workpiece. A welding configuration of the electrode tip is established by exposing the electrode tip to a selected welding environment for use in forming a weld having a target set of weld parameters. An electrode passage is defined in a biasing force arrangement supporting at least a portion of the length of an elongated, flexible electrode and to limit lateral movement sufficient to transfer at least a portion of a resilient force to the electrode tip so that the tip resiliently contacts the weld region. The electrode passage limits induced lateral flexing to an extent which transfers an amount of the resilient force to the first end portion of the electrode that is sufficient to provide for formation of a weld between the support arrangement and the workpiece.

Abstract: A welding construction (10) includes a weldable portion (11a) formed by bending a leading end of an electrically conductive plate (11). This weldable portion (11a) is formed with a tip (11c). Further, a slit (11d) is formed to extend from a left slanted edge (11b) toward a widthwise center of the weldable portion (11a), and a lead (12a) is accommodated in the slit (11d). A meltable portion (11e) is provided between the slit (11d) and the leading end of the weldable portion (11a) including a tip (11c). When an electrode (D) of an arc welding machine discharges arcs toward the leading end of the weldable portion (11a), these arcs are created toward the tip (11c) to melt the weldable portion (11e) and connect the lead (12a) and the weldable portion (11a).

Abstract: A method for forming a substantially spherical free air ball on a fine non-oxidizable wire in a computerized bonder, which has a computerized flame-off (EFO) apparatus operable to generate pulses of different heights and widths. A train of EFO current pulses is applied between electrode and wire; examples are shown in FIGS. 8 and 9. The pulse heights are controlled to melt a predetermined volume of wire while minimizing the heat-affected zone of the wire as well as the wire necking, thus creating free air balls of small diameters and high ball/wire strength. The pulse widths are controlled to create a substantially spherical ball shape. The pulse train of various heights and widths is minimized in order to minimize the time needed for one bond and to maximize the number of bonds provided per second.

Abstract: A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced apart from the surface. There is a wire holder on the bond head, the wire holder being sized and shaped to permit a free end of the insulated wire to extend from the wire holder when the bond head is in the spaced apart position. A source of insulated wire for said bond head is provided as well as an electrical discharge wand positioned adjacent to said bond head when the bond head is in the spaced apart position. The wand directs sufficient electricity at the extending free end of the insulated wire to form a bond ball on the free end. A ground associated with the insulated wire, is provided the ground being sized and positioned to conduct electrical energy away from the insulated bond wire to prevent the insulation on the bond wire remote from the free end from being damaged.

Abstract: A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal opening with melted solder retained therein. The solder pre-coated terminal ends are maintained in a secured contact with the terminal contacts of the IC module by heating coils mounted at a free front end of two pivotal elongated cantilever arms. A piece of predetermined amount of solder is dropped into the cavity of each heating coil, and the heating coils are actuated with a low electrical current to generate a concentrated intense heat to melt the piece of solder to form secure permanent solder joints between the terminal ends of the antenna to the contact terminals of the IC module.

Abstract: A straight rod form discharge electrode used in a wire bonding apparatus. The electrode core material is covered, except for its tip end, by an alumina film that has been subjected to a pore sealing treatment. The alumina film subjected to the pore sealing treatment is formed by a two-stage process. In the first-stage, an alumina film having a porous structure is formed on the surface of the electrode core material for the thickness of approximately 6 &mgr;m by plasma flame coating method or anodic oxidation method; and in the second-stage, the porous structure is subjected to a pore sealing treatment in which an alumina film is caused to adhere to the porous structure by laser PVD or a pore sealing treatment is performed with a resin.

Abstract: A ball forming method and device used in a wire bonding apparatus in which a discharge is caused to occur by applying a high voltage between an electric torch and a tip end of a wire that extends out of a lower end of a capillary so as to form a ball at a tip end of the wire, and an insulating member is provided so as to cover the electric torch with a space between the vicinity of a discharge portion of the electric torch and the insulating member, a heater being further provided on the insulating member so as to heat such a space.

Abstract: A micro-welding electrode which is installed in a welding machine and applied to the electronics industry and spot electric welding industry. The micro-welding electrode includes two integrated electrodes which are made from high-temperature-resistant materials and has a placed insulation between the two electrodes. The insulation between the two parallel electrodes is an insulative chipbonder with the function of agglutination, fixation, insulation and separation, and allows for dispensing with an insulative rivet. Simultaneously, the tip of the two parallel electrodes is positioned into mutual Ohm contact. Not only can the electrode directly weld enameled wires but also has the quality of effectively welding bare wires, sheet metal and metal tapes. The electrode has a simple and reliable construction, is low in production cost, has a good quality of welding and allows for high work efficiency.

Abstract: This invention deals with a spot electrical welding machine which is technically applied to the electronics industry and micro-electronic industry. A spot electrical welder optimally directly welds enameled wires, fine wires or relevant thin sheets of metal, and metal tapes with &PHgr; 0.02 mm-&PHgr; 0.80 mm. This spot electrical welder comprises of an electrode, a main processor which functions as a power supply control, and a weld head which is composed of an electrode clamp and an adjusting device of electrode force. Due to the special structure of the electrode's tip which has a certain resistance Ohm contact, the main processor circuits provide for a proper work current while wedding enameled wires and further eliminates the need for insulation by hand. In addition, the spot electrical welder makes weld points even and steady, allows for simple and convenient operation and lowers welding time.

Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cylindrical section, ii) a working face with a first annular chamfer formed at an outside portion of an end of the working tip and, iii) a second annular chamfer formed at an inside portion of the end of the working tip. The first and second annular chamfer adjacent one another and a substantially cylindrical axial passage coupled to an upper portion of the second annular chamfer. The bonding tool is formed from a material containing at least 80% ZrO2 by weight.

Abstract: A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member against the upper surface of the land portion by a first electrode tool, heating the first electrode tool to expose a part of the lead wire, and applying an electric current between the first electrode and a second electrode tool so that resistance welding is effected between the cover member and the lead wire and between the lead wire and the land portion.

Abstract: This invention deals with a spot electrical welding machine which is technically applied to the electronics industry and micro-electronic industry. A spot electrical welder optimally directly welds enameled wires, fine wires or relevant thin sheets of metal, and metal tapes with &PHgr; 0.02 mm-&PHgr; 0.80 mm. This spot electrical welder comprises of an electrode, a main processor which functions as a power supply control, and a weld head which is composed of an electrode clamp and an adjusting device of electrode force. Due to the special structure of the electrode's tip which has a certain resistance Ohm contact, the main processor circuits provide for a proper work current while wedding enameled wires and further eliminates the need for insulation by hand. In addition, the spot electrical welder makes weld points even and steady, allows for simple and convenient operation and lowers welding time.

Abstract: A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is compared with a reference value to determine whether the ball formed is satisfactory.

Abstract: In each odd-numbered unit current-supplying period of a plurality of unit current-supplying periods making up a set current-supplying time, a control unit subjects only positive switching elements to continuous switching operations at an inverter frequency while keeping negative switching elements in an OFF state, whereas in each even-numbered unit current-supplying period, the control unit subjects only the negative switching elements to continuous switching operations while keeping the positive switching elements in an OFF state. This allows a secondary current having a substantially trapezoidal current waveform to flow through a secondary circuit of a power supply apparatus in the positive direction in each odd-numbered unit current-supplying period but in the negative direction in each even-numbered unit current-supplying period.

Abstract: A thermosonic bonding apparatus including an ultrasonic transducer; a bonding tool including a high resistivity tip, and a low resistivity shaft extending from the tip; a tool support arm interconnecting the bonding tool and the ultrasonic transducer to vibrate the high resistivity bonding tool tip; and a voltage source connected to the bonding tool to locally heat the high resistivity bonding tool tip in a pulsed fashion.

Abstract: An electrical connection system between an electrochemical cell and a printed circuit having a copper layer, the system comprising at least one connection piece welded to the cell, wherein the layer of copper is of a thickness greater than 70 &mgr;m and wherein a metal piece electrically connected to the connection piece is fixed to the layer of copper by welding without any filler metal.

Abstract: This invention deals with a kind micro-welding electrode which is installed in a welding machine and applied to the electronics industry and spot electric welding industry. The micro-welding electrode comprises two integrated electrodes which are made from high-temperature-resistant materials and has an placed insulation between the two electrodes. The insulation between the two parallel electrodes is an insulative chipbonder with the function of agglutination, fixation, insulction and separation, and allows for dispensing with an insulative rivet. Simultaneously, the tip of the two parallel electrodes is positioned into mutual Ohm contact. Not only can the electrode directly weld enameled wires but also has the quality of effectively welding bare wires, sheets metal and metal tapes. The electrode has a simple and reliable construction, is low in production cost, has a good quality of welding and allows for high work efficiency.

Abstract: A wire bonding apparatus equipped with a capillary through which a wire is passed, a torch electrode which is installed in a substantially horizontally movable manner so as to be positioned beneath the capillary, and a torch electrode driver which drives the torch electrode, in which the torch electrode is directly coupled to an output shaft of a pulse motor which is driven by a high-resolution angle control circuit, so that a resolution of the pulse motor obtained by the high-resolution angle control circuit is 30,000 parts per revolution or greater.

Abstract: Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×104 or 105 to 1012 ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.

Abstract: Dissipative ceramic bonding tips for wire bonding electrical connections to bonding pads on integrated circuits chips and packages are disclosed. In accordance with the principles of the present invention, to avoid damaging delicate electronic devices by any electrostatic discharge, an ultrasonic bonding wedge tool tip must conduct electricity at a rate sufficient to prevent charge buildup, but not at so high a rate as to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 105 to 1012 ohms. In addition, the wedges must also have specific mechanical properties to function satisfactorily.

Abstract: An improved apparatus and method for forming a fusion ball at the end of a wire protruding from an ultrasonic bonding tool preparatory to making a ball bond to a workpiece includes shielding means for attenuating electromagnetic interference (EMI) emissions from an electrical arc discharge used to form the ball, which EMI emissions may damage sensitive electronic circuitry on a workpiece. In a preferred embodiment, a ball-forming arc discharge to a wire end occurs with a spark chamber in an electrically conductive electrostatic shield and preferably includes a ferromagnetic shield cup surrounding the chamber. According to the method of the present invention, a capillary ultrasonic bonding tool having a severed end of a gold bonding wire protruding from a capillary bore through the tool is moved away from a vertical line of action between the tool and a workpiece.

Abstract: A welded wire termination for use in thermally and mechanically stressful environments is provided by forming a wire termination tab on a conductive pad to define a tubule for receiving a wire, either stranded or solid. The tubule is tweezer welded to form a welded termination joint between the wire and the conductive tab. The tubule easily captures all of the stranded wires and increases the surface area of the weld to a solid lead. A tweezer weld exerts pressure laterally on the tubule, and thus does not exert a force on the underlying substrate that could damage the substrate. This approach creates only a single electro-mechanical connection from the wire to the conductive pad, which is inherently more reliable than multiple connections such as those that are crimped first then welded.

Abstract: A pad piece is unitedly formed on a wrapping terminal to be contacted by an electrode probe and positioned to be opposed to a welding torch, and the electrode probe is held by the welding torch to approach a wrapping terminal, whereby the electrode probe held by the welding torch is automatically brought into contact with the pad piece of the wrapping terminal as the welding torch approaches the wrapping terminal to complete potential fixing.

Abstract: A base mainly includes a heating plate and a probe. The probe is attached to the surface of a heating plate which serves to place a substrate having an ball pad on a lower surface facing the probe of the heating plate. The probe contacts the ball pad of the lower surface of the substrate to form a closed loop for wire bond checking while the substrate is placed on the heating plate. When processing the wire bond, the wire connecting the chip and the ball pad of the substrate and the probe connecting to the wire bond checking system form a loop. Then a current is sent to the substrate from the wire bond checking system to check for wire lift bond or missed wire. When the wire bond checking system finds an occurrence of lift bond or missing wire, the wire bonding process stops immediately to avoid unnecessary wire bonding.