Abstract: A catheter is disclosed comprising: a connector including a plurality of first contacts and one or more second contacts; a shaft including a plurality of electrodes, each electrode being coupled to a different one of the plurality of first contacts; a memory coupled to at least one of the second contacts, wherein the memory is configured to: store a pinout map identifying an order in which the plurality of electrodes is coupled to the plurality of first contacts; and provide the pinout map to an external device via one or more of the second contacts after the connector is coupled to the external device.

Abstract: A welding wire light is shown and described. The welding wire light can be used to align the welding tip and the wire in automated welding processes. This welding wire light can allow more accurate and precise alignment of these elements resulting in better welded results. Several embodiments are disclosed for illuminating these elements which are especially helpful on automated welding process lines when components need to be replaced or adjusted quickly and accurately.

Abstract: A conductive member production method is performed with use of a die that includes a first die and a second die. The first die includes a protruding portion having a recession-shaped depression formed in a leading end surface, the depression including a molding surface that is inclined so as to gradually extend toward the leading end surface side while extending laterally from the depression. The second die includes a recessed portion into which the protruding portion can be inserted. The method includes a heating step of heating a weld portion formation region that is a portion, with respect to an extending direction, of a conductive member constituted by multiple metal strands, and a pressing step in which the heated weld portion formation region is sandwiched between and pressed by the protruding portion of the first die and the recessed portion of the second die.

Abstract: The ground terminal is wound around an outer periphery of the coaxial cable. A portion of the ground terminal wound around the coaxial cable is clipped between the pair of electrodes. While the pair of electrodes is pressed in a direction close to each other, a current is applied to the pair of electrodes. The current of a predetermined current value is applied for a predetermined time so that the insulating outer coat 34 is heated more than the melting point of the insulating outer coat, the braided wire 33 and the ground terminal are connected to each other, and the insulating inner coat is heated less than the melting point of the insulating inner coat.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

Abstract: Disclosed are devices for making a bond between a wire and a substrate at a point, and to methods of making the bond. The device includes in particular a pressure foot, a base for supporting the substrate, a delivery source for delivering the wire, the pressure foot being suitable for occupying at least two positions that are respectively closer to and further from the base, the wire delivered by the source being suitable for passing between the pressure foot and the base, a presser finger suitable for occupying two positions respectively closer to and further from the base, an element for mounting the pressure foot and the presser finger to co-operate with the base in such a manner that they define between them a bonding space containing the point, and spot-bonding element suitable for acting at the point.

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract: An apparatus and method of bonding refractory metal alloys together by use of a modified clamping arrangement.

Abstract: A method of making a guide wire involves butting a connection end face at a proximal end of a first wire against a connection end face at a distal end of a second wire while applying voltage and a pressing force to weld together the first and second wires at a welded portion. The welded portion forms a projection that projects outwardly in an outer peripheral direction relative to portions of the first and second wire adjacent the projection. The outer dimension of the projection at the welded portion is adjusted so that upon completing adjusting the outer dimension of the projection the projection still projects outwardly in the outer peripheral direction relative to the portions of the first and second wire adjacent the projection.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method provides for welding a conductor to a conductive film which is suited for connection to a circuit board support in order to produce a printed circuit board. The depth or diameter of the conductor is preferably greater than the thickness of the conductive film. At least during the welding process, the conductive film is maintained in contact with a thermal isolation plate having a thermal conductivity less than that of the conductive film. After being placed on the circuit board support, the conductive film is partly etched away to electrically isolate electrical contact points.

Abstract: A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity.

Abstract: A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal end of the wire.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A wire bonding apparatus for manufacturing, for instance, semiconductor devices, including a cleaning case in which a microplasma generating section comprised of a plasma torch, which has a plasma nozzle 38 at the end, and capacitive coupling electrodes composed of an outer electrode and an inner electrode is fixed to the bottom of the cleaning case. The plasma nozzle is provided such that its center line is in alignment with the longitudinal center line of the capillary. Microplasma is ejected from below the capillary to clean its tip within the cleaning case. A shutter is provided on the top of the cleaning case and the wasted gas produced as a result of cleaning is exhausted out of the cleaning case through an exhaustion port of the cleaning case.

Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Abstract: A welding machine, operating by the electric resistance welding method, for producing wire grid mat of longitudinal and transverse wires (L, Q) crossing one another and welded together at the crossing points, having a plurality of welding units (1, 1?), located transversely to the production direction, which at least for each longitudinal wire have one upper welding head (2) with an upper electrode, located above the grid production plane (X-X), and one lower welding head (5) along with a lower electrode movable counter to the upper electrode, the lower welding head being located below the grid production plane (X-X), having a common rail system (26, 28, 31) with at least two common rails extending along the welding line (S-S), for delivering the welding current to the welding electrodes, in which for continuously variable positioning of all the welding units transversely to the production direction (P1) along the welding line, adjusting devices (56, 57) and clamping devices (64, 65, 66; 64?, 65?, 66?) as wel

Abstract: In a resistance welding method and a resistance welding apparatus which prevent a decrease in bonding strength between a lead wire and a metal member due to a partially formed current flow path and which immediately removes a defective component from a manufacturing line, a plurality of second welding electrodes in contact with the metal member is provided so as to provide a plurality of current flow paths, and accordingly, to prevent an unevenly distributed current flow. The bonding strength is measured to determine whether it is satisfactory or not on the basis of currents flowing through the second welding electrodes. Also, the electronic component is fixed by the second welding electrodes after resistance welded.

Abstract: In a resistance welding method and a resistance welding apparatus which prevent a decrease in bonding strength between a lead wire and a metal member due to a partially formed current flow path and which immediately removes a defective component from a manufacturing line, a plurality of second welding electrodes in contact with the metal member is provided so as to provide a plurality of current flow paths, and accordingly, to prevent an unevenly distributed current flow. The bonding strength is measured to determine whether it is satisfactory or not on the basis of currents flowing through the second welding electrodes. Also, the electronic component is fixed by the second welding electrodes after resistance welded.

Abstract: A device with electrodes for the formation of a ball at the end of a wire protruding out of a capillary comprises a first electrode which has a tip and at least one further electrode. The first electrode and the at least one further electrode are electrically connected. The distance between the tip of the first electrode and the end of the wire is smaller than the distance between any point on the at least one further electrode and the end of the wire.

Abstract: With a device for the formation of a wire ball at the end of a wire an in and out swivelling electrode with an oblong shape is connected to the shaft of a motor directly or indirectly via a connecting piece so that the electrode is essentially rotated on its longitudinal axis when swivelling in and out. The mass inertia of the electrode is low as regards the rotational axis which is why it can be turned with negligible expenditure of energy. On swivelling in and out, the electrode is turned back and forth between a lower limit position in which a surface necessary for creating the spark, the so-called firing lug is located underneath the capillary of the Wire Bonder and an upper limit position in which the firing lug is located laterally elevated next to the capillary.

Abstract: A welding terminal for electrically connecting a conductor portion of a wire includes a terminal base plate portion, on which the conductor portion is placed for welding and a pair of side walls, formed on opposite side edges of the terminal base plate portion so as to stand perpendicularly. The wire has a plurality of conductors covered with a insulating sheath. Each corner portion formed by the each side wall and terminal base plate portion has a rounded shape in cross section.

Abstract: A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is compared with a reference value to determine whether the ball formed is satisfactory.

Abstract: In a shield terminal joining structure for joining a shield terminal to a prescribed grounding position along a shielded cable that is formed by an inner core wire made of a conductor, an inner insulation covering that covers the inner core wire, a braid that is provided around the outside periphery of the inner insulation covering, an outer insulation covering that covers the braid, resistive welding is performed while crimping parts of the shield terminal to the outer covering of the shielded cable at the grounding position, so as to melt away part of the outer insulation covering, enabling a weld to be made between the crimping parts and the braid of the shielded cable.

Abstract: A combined system and method for computer-controlled bonding and testing of wire connections between integrated circuit chips and substrates, and for automatically adjusting the bonding parameters in response to said testing, comprising the steps of forming a wire connection between said chip and said substrate under computer control to create wire attachments and a wire span; testing said wire connection automatically under computer control to generate test data; and automatically adjusting the bonding parameters of subsequent wire connections responsive to said test data, whereby the number of faulty bonds is reduced to near zero and bonding production downtime is substantially eliminated.

Abstract: The method of the present invention involves setting a penetration threshold as well as a maximum weld time when hot staking armature conductors to the slots of a commutator. To perform each weld, an electrode is forcibly contacted with the top conductor in one of the slots of the commutator. Next, electric current is delivered to the electrode, causing the conductor to heat and begin to deform within the slot. During this time, the electrode moves further into the slot. If the electrode reaches the penetration threshold in the commutator slot before the maximum weld time is reached, current to the electrode is terminated. After terminating current to the electrode, the electrode remains in contact with and applies force to the conductor until the maximum weld time is reached. After the maximum weld time is reached, the electrode is removed from contact with welded conductor.

Abstract: A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor device, and a cooling pipe which is installed in the heater block so as to cool the heater block. The temperature of the bonding surface of the device is maintained by the chip heating assembly at a temperature that allows bonding to be executed while the heater block is cooled by cooling water or a cooling air draft that flows through the cooling pipe so that the temperature of the heater block is maintained at a low temperature that cause no softening of the resin substrate of the device.

Abstract: A welded wire termination for use in thermally and mechanically stressful environments is provided by forming a wire termination tab on a conductive pad to define a tubule for receiving a wire, either stranded or solid. The tubule is tweezer welded to form a welded termination joint between the wire and the conductive tab. The tubule easily captures all of the stranded wires and increases the surface area of the weld to a solid lead. A tweezer weld exerts pressure laterally on the tubule, and thus does not exert a force on the underlying substrate that could damage the substrate. This approach creates only a single electro-mechanical connection from the wire to the conductive pad, which is inherently more reliable than multiple connections such as those that are crimped first then welded.