Abstract: A semiconductor package includes a substrate that includes a bonding pad, a first semiconductor chip disposed on the substrate, a second semiconductor chip disposed on a top surface of the first semiconductor chip that is opposite to the substrate, a chip pad disposed on the top surface of the first semiconductor chip, and a bonding wire that connects the chip pad to the bonding pad. The bonding wire includes a first upward protrusion and a second upward protrusion that are convexly curved in a direction away from the substrate. The second semiconductor chip has a first side surface between the first upward protrusion and the second upward protrusion.

Abstract: Methods, systems and devices are disclosed for performing a semiconductor processing operation. In some embodiments this includes configuring a wire bonding machine to perform customized movements with a capillary tool of the wire bonding machine, etching bulk contaminants over one or more locations of a semiconductor device with the capillary tool, and applying plasma to the semiconductor device to remove residual contaminants.

Abstract: A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.

Abstract: A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the a first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.

Abstract: The present disclosure provides a wire and arc additive manufacturing (WAAM) method for a titanium alloy. The method includes the following steps: step 1: performing a WAAM process assisted by cooling and rolling; step 2: milling side and top surfaces of an additive part; step 3: performing, by friction stir processing (FSP) equipment, an FSP process on the additive part, and applying cooling and rolling to a side wall of the additive part through a cooling and rolling device during the FSP process; step 4: finish-milling the top surface of the additive part for a WAAM process in the next step; and step 5: repeating the above steps cyclically until final forming of the part is finished. This WAAM method completely breaks dendritic structures and refines grains in the WAAM process of the titanium alloy, thereby effectively repairing defects such as pores and cracks.

Abstract: The present disclosure provides a wire and arc additive manufacturing (WAAM) method for a magnesium alloy. The method includes the following steps: step 1: performing a WAAM process assisted by cooling and rolling; step 2: milling side and top surfaces of an additive part; step 3: performing, by friction stir processing (FSP) equipment, an FSP process on the additive part, and applying cooling and rolling to a side wall of the additive part through a cooling and rolling device during the FSP process; step 4: finish-milling the top surface of the additive part for a WAAM process in the next step; and step 5: repeating the above steps cyclically until final forming of the part is finished. The present disclosure completely breaks dendritic structures and refines grains in the WAAM process of the magnesium alloy, thereby effectively repairing defects such as pores and cracks.

Abstract: This interconnection module (10) between a connection cord and a connection panel comprises a pair of spring-loaded conductive pins (12) and a molded body (14) in which a portion of said pair of pins (12) is embedded. At least one of the ends (121, 122) of each pin (12) projects from the body (14) and the body (14) forms a hollow volume making the module (10) clippable.

Abstract: An electrical conductor assembly includes a line section having a plurality of conductor wires formed of a first electrically conductive material, a contact section in which the conductor wires are compacted to form a contact unit, and a layer formed of a second electrically conductive material. The layer is disposed on a contact surface of the contact unit.

Abstract: A blocking diode board (“BDB”) for use with a rollable solar power module (“RSPM”) array is disclosed. The DBD includes a blocking diode, first flat electrical conductor, second flat electrical conductor, first tubular hook, and second tubular hook.

Abstract: A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 ?m to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

Abstract: A method for manufacturing a wiring system includes providing an electric cable having an electric conductor and a contact element with a termination portion, and removing a cable insulation in a first sub-portion of the electric cable. The cable insulation remains on the electric conductor in a second sub-portion of the electric cable offset from the first sub-portion. The electric conductor is welded at the first sub-portion to a termination surface of the termination portion. The first sub-portion is pressed against the termination portion and compressed during welding. A holding device encompasses the second sub-portion at least partially. The holding device supports the second sub-portion at least during the welding and compressing of the first sub-portion and maintains a position of the second sub-portion.

Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.

Abstract: A connection of a connection wire and a connection element are disclosed. In an embodiment a connection includes a connection wire having an insulation and a stud-shaped metallic connection element, wherein the connection wire is wound in a plurality of turns around the connection element, and wherein the turns include a first wire section, in which the connection wire is insulation-stripped, and a second wire section, in which the insulation is present.

Abstract: A memory card and an electronic system including the memory card. The memory card includes: a substrate having two pairs of edges, in which the edges of each pair face each other; a plurality of first row terminals that are arranged adjacent to an edge at an insertion side of the substrate and include a first voltage power terminal; a plurality of second row terminals that are spaced farther apart from the edge at the insertion side than the plurality of first row terminals and include a power terminal of a second voltage. According to the memory card, efficient use of an area may be maximized and an electrically stable power supply may be provided.

Abstract: A combination component handling and connecting device connectable to a multi-axis robot for use in moving and connecting components and subassemblies includes a housing and an actuator fixedly connected to the housing. The actuator includes an actuating link movable from a first position to a second position. Connected to the actuating link is an end effector for concurrent movement with the actuating link. The component handling and connecting device includes a clamp having a first jaw and a second jaw. The second jaw is connected to the actuating link for selectively moving the second jaw toward the first jaw operative to engage a component.

Abstract: A helical jumper connector includes a helical support member configured to support a wire. The helical support member includes a first leg having a first helical winding and a second leg having a second helical winding that defines a second axial opening. The first axial opening and the second axial opening are coaxial with the wire when the first helical winding and the second helical winding are wrapped around the wire and cooperatively engage with one another to support the wire. A jumper casting is configured to receive the helical support member. The helical support member and the jumper casting are electrically conductive such that the helical jumper connector forms an electrically conductive pathway to carry electrical current from the wire. A method of making a helical jumper connector assembly includes applying a compression force to a helical jumper connector comprising a helical support member received in a jumper casting.

Abstract: To provide a wire bonding method and a wire bonding device capable of stably forming a free air ball having a large ball diameter while suppressing oxidation of the free air ball, in addition to supply of an oxidation prevention gas from gas supply means (10) into an insertion portion (32), an oxidation prevention gas is supplied from a gas supply nozzle (40), which is arranged outside the insertion portion (32), so as to cover an inlet of the insertion portion (32). Under a state in which a leading end of a wire (74) is positioned inside the insertion portion (32), and in which a leading end of a capillary (3) is positioned outside the insertion portion (32), spark discharge is generated. With this, a free air ball (75) having a large ball diameter can be formed while suppressing oxidation of the free air ball (75) and stabilizing the free air ball (75).

Abstract: A deterioration of a gate threshold voltage, which is caused by a stress and a thermal hysteresis when wire bonding for a surface of an electrode layer of a semiconductor device is performed, can be suppressed. The semiconductor device includes a metallic film provided at a surface of a semiconductor chip, and a wire bonded to an upper surface of the metallic film. The metallic film has a plurality of grains, particle diameters of the grains are substantially equal to or more than a thickness of the metallic film.

Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.

Abstract: A connection method of a terminal includes an inserting-arranging process for inserting and arranging conductors of a plurality of wires into a connection section. The wires have the conductor sections exposed from the sheaths thereof at the end portions. The connection section has cylindrical shape with a bottom portion and an opening section. The method further includes a heating-melting process for heating the connection section in a state that the opening section of the connection section faced upwards in the vertical direction to melt the conductors within the connection section, and a molten-metal raising process for conducting an insertion of the conductors into the connection section and/or a pressurization of the connection section from outside to raise the molten metal within the connection section to a level upper.

Abstract: An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Abstract: A semiconductor device includes a bond formed on a bond pad. The bond is formed of a wire that includes a central core of conductive metal, a first coating over the central core of conductive metal that is more chemically active than the conductive metal, and a second coating over the central core of conductive metal that is less chemically active than the central core of conductive metal.

Abstract: An antioxidant gas blow-off unit includes: a base portion configured as a hollow plate having an antioxidant gas flow passage formed therein; a hole that is provided in the base portion to allow a capillary to be inserted therein or removed therefrom and that communicates with the antioxidant gas flow passage; and a heater mounted on an outer surface of the base portion. The antioxidant gas flow passage includes a first flow passage provided in the vicinity of the outer surface of the base portion on which the heater is mounted. This antioxidant gas blow-off unit to be installed in a wire bonding apparatus heats free air balls effectively with a compact structure.

Abstract: A method for connecting poles of two battery cells includes using a connecting element, which is configured as a stranded wire and connects the poles of the battery cells to one another. The stranded wire is connected directly to a pole of a battery cell in a welding area with a laser beam for forming a laser beam weld.

Abstract: A structure for joining an electric wire and a connection terminal by a resistance-welding is provided. The electric wire includes a core wire made of metal. The connection terminal is made of metal different from the metal of the core wire. The core wire includes a melt-joining portion configured to be resistance-welded with the connection terminal. The melt-joining portion has an inclined surface which is inclined so that a thickness of the core wire becomes larger toward a base-end side from a thinnest part of the melt-joining portion along an extending direction in which the core wire extends.

Abstract: Methods of making an implantable pulse generator are disclosed herein. The implantable pulse generator can include a body defining an internal volume and a plurality of wires extending from out of the internal volume of the body. Some of these wires can be connected, either directly or indirectly to a lead via a welded joint. The welded joint can be created by first resistance welding and then laser welding some of the wires to a connector.

Abstract: A microelectronic assembly includes a substrate having a first and second opposed surfaces. A microelectronic element overlies the first surface and first electrically conductive elements can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

Abstract: A direct welding process for joining a current collector to a terminal pin in the construction of electrochemical cells is described. The resistance welding process utilizes increased current combined with an applied force to bond dissimilar metals with a melting temperature differential of preferably more than 500° C. Preferably, the method is used to bond the terminal pin to the cathode current collector. This method of attachment is suitable for either primary or secondary cells, particularly those powering implantable biomedical devices.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

Abstract: A device for connecting welding wires for CO2 gas welding includes a base frame, first and second electrode plates that are disposed apart from each other on the base frame and including disposing grooves to which an old wire and a new wire are respectively disposed, and clampers that are disposed to each electrode plate and that clamp the used wire and the new wire disposed to the disposing grooves, respectively.

Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die.

Abstract: A microelectronic assembly includes a substrate having a first and second opposed surfaces. A microelectronic element overlies the first surface and first electrically conductive elements can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

Abstract: An apparatus and method of bonding refractory metal alloys together by use of a modified clamping arrangement.

Abstract: A method provides for welding a conductor to a conductive film which is suited for connection to a circuit board support in order to produce a printed circuit board. The depth or diameter of the conductor is preferably greater than the thickness of the conductive film. At least during the welding process, the conductive film is maintained in contact with a thermal isolation plate having a thermal conductivity less than that of the conductive film. After being placed on the circuit board support, the conductive film is partly etched away to electrically isolate electrical contact points.

Abstract: Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: A connection electrode that is formed of solder on an electronic component side and a tip portion of an elastic contact each other at a contact portion. Regarding the elastic contact, a resistive layer is formed in the tip portion, and the tip portion is placed in a clearance of an induction coil. When a predetermined high-frequency current is passed through the induction coil, electromagnetic induction causes the resistive layer to generate heat. Solder that forms the connection electrode is melt, and flows onto the tip portion of the elastic contact. Thus, the tip portion of the elastic contact and the connection electrode can be strongly bonded together at the contact portion that is a single point therebetween.

Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Abstract: A method is provided for producing an electrically conductive connection between a contact element interacting with a corresponding counter-contact and several electric lines, each of which consists of several wires. The method consists of placing the lines on a contact element supporting surface, controlling the lines integrity, and fixing the lines to the contact elements by resistance welding. In particular, the contact element is provided with crimping elements which surround and/or form a ground cable terminal screwed to a mass bolt.

Abstract: An improved battery pack is proposed. The battery pack includes a housing, and first and second cells disposed in the housing, the first cell having a radius and a periphery. In addition, the battery pack includes a metal strap connecting the first and second cells, the strap having an end disposed over the first cell and a portion of the periphery, and two contact protrusions contacting the first cell, wherein distance between the strap end and the overlaped periphery is greater than the radius of the first cell.

Abstract: A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component residing within a bottom layer thereof adjacent a solder interconnection. Preferably, a chip carrier is joined to a board whereby the chip carrier has an electrical mesh plane for heating adjacent the solder interconnection. Resistive heat is generated within this electrical heating component either by applying an electrical current to the electrical heating component, or by non-contact inductively heating the layer in which such electrical heating component resides to generate resistive heat within the electrical heating component. The resistive heat is transferred to the solder interconnection to allow for localized melting of the solder interconnection and removal of the electronic components from one another.

Abstract: Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: An arrangement is provided including an electrode extending to an electrode tip for contacting a workpiece. A welding configuration of the electrode tip is established by exposing the electrode tip to a selected welding environment for use in forming a weld having a target set of weld parameters. An electrode passage is defined in a biasing force arrangement supporting at least a portion of the length of an elongated, flexible electrode and to limit lateral movement sufficient to transfer at least a portion of a resilient force to the electrode tip so that the tip resiliently contacts the weld region. The electrode passage limits induced lateral flexing to an extent which transfers an amount of the resilient force to the first end portion of the electrode that is sufficient to provide for formation of a weld between the support arrangement and the workpiece.

Abstract: The invention relates to a method for electrically connecting a conductor to a contact, according to which the electrical conductor that is coated with an insulation is first inserted between two legs of the contact, whereupon a welding device is placed against both legs and the welding process is carried out by turning on the welding current. The insulation of the electrical conductor is destroyed due to the heat delivered during the welding process, resulting in a permanent mechanical and electrical connection between the conductor and the contact.

Abstract: In a resistance welding method and a resistance welding apparatus which prevent a decrease in bonding strength between a lead wire and a metal member due to a partially formed current flow path and which immediately removes a defective component from a manufacturing line, a plurality of second welding electrodes in contact with the metal member is provided so as to provide a plurality of current flow paths, and accordingly, to prevent an unevenly distributed current flow. The bonding strength is measured to determine whether it is satisfactory or not on the basis of currents flowing through the second welding electrodes. Also, the electronic component is fixed by the second welding electrodes after resistance welded.

Abstract: A film-coated wire is wound around a terminal at least one turn and pressed by an upper electrode of a resistance welding machine. A current is passed through the upper electrode when the wire is pressed, and heat is produced. The heat melts a film on the wire. The current is passed between the upper electrode and the lower electrode via the wire and the terminal to connect the wire with the terminal by resistance welding. A contact area between the wire and the terminal is increased by winding the wire around the terminal. Therefore, the wire is less likely to shift its position when a force is applied by the upper electrode. This increases reliability of the connection. Moreover, the terminal is reduced in size because it is not required to be formed in a U-shape.

Abstract: A welding construction (10) includes a weldable portion (11a) formed by bending a leading end of an electrically conductive plate (11). This weldable portion (11a) is formed with a tip (11c). Further, a slit (11d) is formed to extend from a left slanted edge (11b) toward a widthwise center of the weldable portion (11a), and a lead (12a) is accommodated in the slit (11d). A meltable portion (11e) is provided between the slit (11d) and the leading end of the weldable portion (11a) including a tip (11c). When an electrode (D) of an arc welding machine discharges arcs toward the leading end of the weldable portion (11a), these arcs are created toward the tip (11c) to melt the weldable portion (11e) and connect the lead (12a) and the weldable portion (11a).

Abstract: A wire bonder for bonding an insulated wire to a surface is disclosed. The bonder includes a bond head, having a bonding position adjacent to said surface and a wire preparation position spaced apart from the surface. There is a wire holder on the bond head, the wire holder being sized and shaped to permit a free end of the insulated wire to extend from the wire holder when the bond head is in the spaced apart position. A source of insulated wire for said bond head is provided as well as an electrical discharge wand positioned adjacent to said bond head when the bond head is in the spaced apart position. The wand directs sufficient electricity at the extending free end of the insulated wire to form a bond ball on the free end. A ground associated with the insulated wire, is provided the ground being sized and positioned to conduct electrical energy away from the insulated bond wire to prevent the insulation on the bond wire remote from the free end from being damaged.

Abstract: A process for joining a steel terminal to a copper electrode comprises applying a thin silver-copper flash to the surface of a copper electrode and bringing a steel surface into contact with the flash during high frequency welding. The weldment is improved compared to conventional welds that do not incorporate the flash layer. For example, a silver—18 wt % copper alloy having a thickness of about 180 microns produced uniform, high quality welds between nickel steel terminals and 99.999% pure copper electrodes.

Abstract: A electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.

Abstract: In a planer type semiconductor device production apparatus having an interconnector to lead out an output of a planer type semiconductor element electrically connected with an external output electrode of the planer type semiconductor element through parallel gap welding, a weld bed on which is mounted a planer type semiconductor element to be welded is formed of a material with stainless steel as the main component. As a result, a planer type semiconductor device production apparatus that can conduct favorable welding, and a method of fabricating a planer type semiconductor device using such a production apparatus are obtained.