Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

Abstract: A terminal (1) comprising a connecting portion (15) to be connected to a connecting portion (5) of a mating terminal (3), wherein the connecting portion (15) includes a portion of a base material (19) including iron or an iron-based alloy and having a fine asperity (25) on a surface of the portion of the base material (19), a first layer (21) formed on a surface of at least the portion of the base material (19) included in the connecting portion (15) and having a surface formed into the fine asperity pattern, and a second layer (23) formed on the surface of the first layer (21), wherein the first layer (21) is provided for connecting the base material (19) and the second layer (23) to each other, and has higher hardness than the second layer (23), and the second layer (23) is provided for enhancing conductivity and lubrication property.

Abstract: A method for soldering a stator of an electric machine to a cooler is described. Firstly, the stator and/or the cooler is coated, at least partially, with a layer of solder. Then, the stator is brought together with the cooler such that the layer of solder is between the stator and the cooler. Finally, the cooler is heated to the melt temperature of the layer of solder in order to produce a solder connection between the stator and the cooler. The cooler can also act as support. Furthermore, a stator for an electric machine, comprising a stator support and a solder connection between the stator and the stator support is described.

Abstract: A method for fabricating a thermoplastic composite component comprises inductively heating a thermoplastic pre-form with a first induction coil by inducing current to flow in susceptor wires disposed throughout the pre-form, inductively heating smart susceptors in a molding tool to a leveling temperature with a second induction coil by applying a high-strength magnetic field having a magnetic flux that passes through surfaces of the smart susceptors, shaping the magnetic flux that passes through surfaces of the smart susceptors to flow substantially parallel to a molding surface of the smart susceptors, placing the heated pre-form between the heated smart susceptors; and applying molding pressure to the pre-form to form the composite component.

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract: A system for forming a brazed joint between a tie wire and a workpiece, and methods therefor are presented. The system includes: a braze chamber including an induction heating coil, the induction heating coil having magnetic flux concentrators thereon; and a controller receiving a temperature feedback signal from a temperature sensor on a tie wire and controlling a temperature of a section of the tie wire to be brazed by controlling an electrical current applied to the induction heating coil.

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract: A method of forming a bendable slotted liner with multiple circumferentially overlapping non-axial keystone slots comprising: transversely profiling a rod to form a profiled rod, having bending members outwardly profiled wider than intermediate and inward widths, interspersed with bases profiled to bondably mate with axially adjacent bases on a neighboring winding; forming the profiled rod into alternating port and starboard bending members and base pairs, by one of, bonding transverse spacers to the rod, transversely corrugating the rod, and forming the rod with one of transverse outdents and indents; winding the profiled rod to the outer diameter; and bonding axially paired bases together; wherein configuring the non-axial slot circumferential length greater than the circumferential base length on adjacent rod windings, forming non-axial keystone slots between bending members providing axial strain relief, with outer slot widths within a prescribed slot range and axial strain relief capacity greater than 0.

Abstract: An embodiment of the present invention is a technique to package a device. Heat is localized on a die having bumps on a package substrate using a first induction heater operating at a first frequency. Heat is localized on at least an integrated heat spreader (IHS), a thermal interface material (TIM), an underfill, and a sealant on the die using a second induction heater operating at a second frequency.

Abstract: An embodiment of the present invention is a technique to package a device. Heat is localized on a die having bumps on a package substrate using a first induction heater operating at a first frequency. Heat is localized on at least an integrated heat spreader (IHS), a thermal interface material (TIM), an underfill, and a sealant on the die using a second induction heater operating at a second frequency.

Abstract: A magnetic welding and joining device is provided. The device has a separable induction coil that can be selectively coupled to provide an induction coil to be positioned around workpieces that are to be magnetically welded or joined.

Abstract: A novel apparatus for manufacturing Solid-Solder-Deposit Printed Circuit Boards (SSD-PCBs) by melting solder powder via induction heating consequently forming relatively thick layers of solid solder over the soldering pads of a bare-PCB 230. Solid Solder Deposit (SSD) refers to a relatively thick layer of solid solder metallurgically bonded over the soldering pads of a bare-PCB 230 such as that said SSD-PCB by itself is the source for solder alloy during a subsequent soldering operation. The manufacture of SSD-PCBs provides the electronic assembly industry with ready-to-solder PCBs consequently eliminates the need to use solder paste at the assembly floor. This invention, unlike the prior art for producing SSD-PCBs, utilizes a solder powder pile 232 that is melted by localized electromagnetic induction heating.

Abstract: A wire cleaner for removing impurities from the surface of an elongated welding wire as the wire travels along a given path, the wire cleaner comprises a tunnel with a tube having a central passage surrounding the path with a gap between the tube and the wire moving through the tube, a power supply with first and second output terminals across which is generated an AC output current having a frequency in the range of about 100-300 kHz and a magnitude of at least about 1.0 amperes, a first connector attaching the first output terminal to the tube and a second terminal attaching the second output terminal to the moving wire whereby current proportional to the output current flows along the surface and across the gap to heat the wire to cause evaporation of the surface impurities. As an alternative, induction heating of the wire is used.

Abstract: A method of brazing a plurality of copper strands to a buss bar includes: a) cleaning the buss bar and the copper strands; b) positioning a filler shim on the surface of the buss bar; c) placing a copper strand on the filler shim, the filler shim and the strand having substantially equal lengths; d) stacking additional copper strands on the buss bar, with a filler shim between each adjacent pair of strands; and e) heating the filler shims utilizing an induction brazing coil to a temperature sufficient to cause melting of the shims and to thereby form a brazed lap joint between the copper strands and the buss bar.

Abstract: An increased diameter wire is formed by drawing a feed wire through a cooled nozzle located in a cooled crucible, and through a liquid metal bath contained within the crucible. Liquid metal freezes onto the feed wire as it passes through the bath, thereby increasing the diameter of the feed wire to form an increased diameter wire product. The invention is particularly suited to forming a wire from a metal composition that would undesirably react with refractory apparatus.

Abstract: Disclosed is a new process for electrically and mechanically joining arrays of conductors on flexible printed circuits and other flexible conductors including collated flat, flexible cables (FFCs). An array of flat copper conductors on a flexible dielectric sheet is electroplated with tin-lead solder. Surface insulation is locally omitted or removed from conductor surfaces. A second circuit or cable is overlapped in competent electrical communication and the solder plating fused by inductively heating the copper to join the two conductor arrays. An adhesive placed between conductors is also thermally activated to bond the film on the two cable arrays together. This insulates the electrical connections and seals them from attack by moisture and chemical pollutants.

Abstract: A new apparatus for inductively soldering surface-mount, straddle-mount and through-hole type electronic components into a self-soldering PCB (printed circuit board) in an automated fashion utilizing localized Electromagnetic Induction Heating (E.I.H.). Current manufacture technology for packaging electronic components depends on the reflow and wave soldering processes. Both processes heat up to relatively high temperatures the entire assembly, namely its PCB and all the electronic components being soldered into it. Such harsh high-temperature environment frequently causes components damage resulting in rejects and/or demanding rework. With this invention reflow oven and/or wave soldering equipment is not required. During a soldering operation only the leads and pads being soldered are heated but neither the body of said electronic components nor the dielectric material forming said self-soldering PCB and its interconnecting traces are heated.

Abstract: A new apparatus and process for soldering surface-mount and through-hole type electronic components into a printed circuit board (PCB) in an automated fashion utilizing localized electromagnetic induction heating. Current manufacture technology for packaging electronic components depends exclusively on the reflow and wave soldering processes. Both processes heat up to relatively high temperature the entire assembly, namely its PCB and all the electronic components been soldered into it. Such high temperature environment frequently causes components damage resulting in rejects and/or demanding rework. With this invention however, during a soldering operation only the leads and pads, or joints, being soldered are heated but neither the body, or casing, of said electronic components nor the dielectric material forming said PCB are heated. Because of this selectively localized heating, the invention permits to reduce cost and improve the quality and reliability of manufactured products.

Abstract: A wire bonding apparatus has a first support arrangement for supporting a first integrated circuit package component. A second support arrangement is configured to supporting a second integrated circuit package component. The second support arrangement includes at least a portion of a heating arrangement for heating certain portions of the second component. At least portions of the first support arrangement are thermally insulated from the second support arrangement such that at least certain portions of the first component may be maintained at a temperature substantially lower than the temperature of the heated portions of the second component. The apparatus may be used in method of forming a bonding wire for electrically connecting a first contact on a first integrated circuit package component to a second contact on a second integrated circuit package component. The method includes the steps of supporting and holding the first component and the second component in a desired position.

Abstract: A method of fusing and programming a fuse frame for use in a semiconductor package is disclosed. A fuse frame includes an external lead arranged for electrically connecting to a first internal element of the semiconductor package and to extend externally from the semiconductor package and an internal lead arranged to be positioned entirely within the semiconductor package is also provided for electrically connecting a second internal element of the semiconductor package to a third internal element of the semiconductor package. A fuse bar supportably connects the internal lead to the external lead. The fuse bar includes a conductive material which fuses when excess current runs through it. A semiconductor package is made of a fuse frame and a die is mounted on the fuse frame such that the die supports the internal lead of the fuse frame. A programmable fuse frame is disclosed. A programmable fuse frame includes a matrix of fuse bars and lead bars.

Abstract: An SCSI cable assembly (30) with a termination circuit included within one of the connector housings (44) is disclosed. The termination circuit is on a circuit board (52) that is retained within a cavity (68) between two solder nest halves (50). The solder nest halves (50) have a plurality of openings (70) that are in alignment with contact pads (54) on a surface of the circuit board (52). Solder segments (100) are arranged within the openings (70), and conductors (48) of a cable (32) are individually inserted into the openings in thermal engagement with the solder segments to form a solder nest assembly (40). An electrical connector having a plurality of contact leads (58) spaced similarly to the spacing of the openings (70) is assembled to the solder nest assembly so that each lead (58) is in thermal engagement with a respective conductor (48) in a respective opening (70). Each lead (58) is attached to a common carrier strip (104) which is a self regulating temperature heater.

Abstract: A method and apparatus of forming a solder connection between a plurality of elongate bodies, comprises:(i) forming an initial connection between the elongate bodies by inserting them into an induction heatable connecting element of a connector, the connector comprising a dimensionally heat-recoverable sleeve and, retained within the sleeve, the connecting element and a solder insert that is in thermal contact with the connecting element; and(ii) heating the connector (a) by subjecting the connecting element to an alternating magnetic field so that it is heated by induction thereby melting the solder insert, and (b) subjecting the sleeve to hot air and/or infrared radiation, thereby causing the sleeve to recover.The apparatus for applying heat to an elongate connector, comprises a first heat source which comprises an induction coil, and a second heat source arranged to generate hot air or infrared radiation.

Abstract: An induction heating module encapsulation apparatus and method for its use is disclosed. The apparatus comprises a substantially airtight chamber which is composed of ceramic or some other high temperature insulating material in which a cap and a ceramic substrate having semiconductor chips joined thereon are placed. A sealband of solder or other brazing material is placed at the periphery of the cap where the cap and substrate are to be joined. An RF coil, which serves as inductor in the apparatus, the energized by a high frequency generator, generating an electromagnetic field in the radio frequency spectrum. The RF coil is oriented to localize the inducted current at the periphery of the cap and the sealband. The inducted current is dissipated in the form of heat until the sealband is molten. The RF power is then turned off.

Abstract: Electrical connector components, for example, a pin terminal constructed from a solid wire pin and a formed metal body, are attached to a web carrier and fed through an inductive heating station, thereby bonding the components together. The components are pre-treated with a conductive bonding material which can be cured, flowed, or set by applying heat. The web carrier may be wound on a first spool, fed through the inductive heating station, and wound onto a second spool, for ready feed to and from successive production steps. The temperature of the heating operation may be controlled by varying the speed of the web feed and the strength of the inductive field, so as to ensure repeatable, uniform heating, at a high economical speed. In addition, the tip of the pin can be cooled during the heating operation, to prevent heat damage or contamination of the pin.

Abstract: The jumper cable assembly 10 in accordance with the invention includes at least a first layer 12 of insulating film, an array of electrical conductors 20, each having first and second connecting portions 22,24 at opposed ends thereof and a fusible electrically conductive material disposed on the connecting portions 22,24. Each conductor 20 is formed from a first conductive layer 26 having high electrical resistance and high magnetic permeability, and a second conductive layer 28 integrally joined thereto, the second layer having low electrical resistance and minimal magnetic permeability. Each of the conductors 20 defines a heater body.

Abstract: A heater employs a ferromagnetic or like material heated by a varying magnetic field to heat the ferromagnetic material wherein the ferromagnetic material has a large cross-section comprised of many members of small cross-section insulated from one another and wherein for medical applications each member may be surrounded by a heat conductive electrically conductive coating.