Abstract: A collet apparatus is provided including a body. A first adsorption unit is connected to the body. A second adsorption unit is connected to the first adsorption unit. The second adsorption unit adsorbs a semiconductor chip. An illumination unit is disposed inside the body, and provides a light to the semiconductor chip adsorbed onto the second adsorption unit to examine the semiconductor chip.

Abstract: A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device.

Abstract: The apparatus serves for inhomogeneous cooling of a flat object with a first main face and a second main face opposite the first main face. The flat object is cooled by a cooling device from the direction of the first main face. On the second main face, a heating device locally acts upon a first partial face in such a way that the flat object is subjected to heat at said first partial face relative to a second partial face adjoining said first partial face in such a way that said first partial face is cooled more slowly in comparison with the second partial face and, during the cooling process, the second main face of the flat object therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling.

Abstract: An apparatus for heating a substrate during die bonding is disclosed. The apparatus comprises: a substrate carrier configured to hold the substrate; a heating device configured to heat the substrate; a first actuator for effecting relative motion between the substrate carrier and the heating device such that the substrate is relatively indexed with respect to the heating device; a second actuator for effecting relative motion between the substrate carrier and the heating device such that the heating device contacts the substrate to heat different portions of the substrate. In particular, the second actuator is operative to separate the heating device from the substrate in order for the first actuator to relatively index the substrate across the heating device. A method of heating a substrate during die bonding is also disclosed.

Abstract: A method and apparatus for transporting a payload carrying device is disclosed. The method comprises providing at least one payload carrying device, a vehicle for transporting the at least one payload carrying device, a connection device for connecting the vehicle and the at least one payload carrying device, at least one sensor device for capturing information regarding the vehicle's surrounding environment, and a control unit for operating the connection device autonomously to connect the vehicle and the at least one payload carrying device where, once connected, the weight of the at least one payload carrying device rests directly on the floor and the vehicle autonomously transports the at least one payload carrying device to a desired location, and operating the connection device autonomously to disconnect the vehicle and the at least one payload carrying device at the desired location where the at least one payload carrying device is immobilized.

Abstract: A display device includes a substrate including a display region, and a peripheral region that is outside of the display region, a plurality of dummy pads at the peripheral region, an insulating layer covering the plurality of dummy pads, wherein top surfaces of first portions of the insulating layer above the plurality of dummy pads are higher than top surfaces of second portions of the insulating layer between the plurality of dummy pads, and a plurality of pads over the second portions of the insulating layer at the peripheral region.

Abstract: Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application.

Abstract: A circuit assembly (1800) includes a first circuit substrate (1200) defining a first major face (1201) and a second circuit substrate (1500) defining a second major face (1502). A plurality of electrical components (1203,1204,1205) can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members (1301,1302,1303,1304) are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate.

Abstract: A method and apparatus for transporting a payload carrying device is disclosed. The method comprises providing at least one payload carrying device, a vehicle for transporting the at least one payload carrying device, a connection device for connecting the vehicle and the at least one payload carrying device, at least one sensor device for capturing information regarding the vehicle's surrounding environment, and a control unit for operating the connection device autonomously to connect the vehicle and the at least one payload carrying device where, once connected, the weight of the at least one payload carrying device rests directly on the floor and the vehicle autonomously transports the at least one payload carrying device to a desired location, and operating the connection device autonomously to disconnect the vehicle and the at least one payload carrying device at the desired location where the at least one payload carrying device is immobilized.

Abstract: A method and apparatus for self-assembling a part on a substrate are disclosed herein. In some embodiments, a method includes placing a substrate having a first binding site capable of generating a first magnetic field and having a first shaped surface with a first droplet conformably disposed thereon into a first fluid; placing a part having a second binding site capable of generating a second magnetic field and having a second shaped surface with a second droplet conformably disposed on the second shaped surface into the first fluid; and attracting the part towards the first binding site such that an equilibrium is formed between an attractive force and a repulsive force such that the part is free to rotate about the first binding site to minimize the repulsive force when the first and second shaped surfaces rotate into an alignment causing the part to aligned with the first binding site.

Abstract: A method of forming a solder joint includes the steps of providing a heat shield member formed as an arcuate preferably metallic shell attached to a spring-clamp by means of an obedient shaft; attaching the spring clamp to a structure adjacent the solder joint; moving the heat shield member by bending the obedient shaft so that the heat shield member is positioned in a location spaced-apart from the solder joint with the concave surface of the heat shield member facing the solder joint; and applying heat from a torch to the solder joint from the side opposite the heat shield so that the heat shield reflects the heat back onto the solder joint.

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract: Disclosed is a cooled welding electrode with a plurality of fins in the water well, where the fins are tapered between approximately 10 degrees and 45 degrees.

Abstract: A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.

Abstract: An electric soldering iron comprises a power unit connecting the electric soldering iron to an external power source, an electric soldering iron body comprising an iron head and a motion sensor for detecting motion of the electric soldering iron body, and a control system connected to the power unit and the electric soldering iron body, which comprises a switch, a control unit and a timer. The control unit directs the switch to maintain or terminate connection between the power unit and the iron head based on motion detected by the motion sensor and duration measured by the timer. When the duration exceeds a predetermined value, the control system enables the switch to terminate connection of the iron head and the power unit to achieve automatic cutoff of power.

Abstract: A method for quick temperature compensation for an electric soldering iron is provided. The electric soldering iron includes a static temperature control circuit and a dynamic temperature control circuit. Amount of the static temperature control mainly depends on a temperature setting signal, a real-time temperature detecting signal and a temperature additional signal, while the dynamic temperature control is made on the basis of Kalman digital filter principle. During the dynamic temperature control, a differentially amplified temperature regulation and control signal is identified by a heat transfer function of the soldering iron head, and an temperature additional compensation amount is calculated and output, only when the heat transfer function of the soldering iron head is conformed.

Abstract: A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal end of the wire.

Abstract: An electrical soldering iron is provided. The soldering iron comprises a heating element, a constant temperature heating circuit, a motion sensor, and a processor. The constant temperature heating circuit is configured for heating the heating element. The motion sensor is configured for detecting motion of the electrical soldering iron. The processor is configured for determining motion state of the electrical soldering iron according to signals from the motion sensor and directing the constant temperature heating circuit to bring the heating element to a temperature of a predetermined value corresponding to the motion state.

Abstract: The present invention provides quick temperature compensation method for an electric soldering iron and a quick temperature compensable electric soldering iron which includes a static temperature control circuit and a dynamic temperature control circuit, wherein the amount of the static temperature control is mainly depending on the temperature setting signal, real-time temperature detecting signal and the temperature additional signal, while the dynamic temperature control is made on the basis of Kalman digital filter principle. During the dynamic temperature control, the temperature regulation and control signal that has amplified through difference is identified by the function of the heat conduction transmission of the soldering iron head, and the temperature additional compensation is exported, when the temperature regulation and control signal accords with the function of the heat conduction transmission of the soldering iron head.

Abstract: A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.

Abstract: A processing head is supported for pivotal movement around a pivot point in a processing apparatus. An urging member applies an urging force to the processing head at the pivot point. The processing apparatus allows establishment of point contact between the urging member and the processing head. When the surface of an object inclines from a predetermined attitude, the processing head is allowed to follow the inclination of the surface. The processing head is allowed to establish a predetermined attitude relative to the surface of the object. The processing head thus reliably enables a predetermined action to the object as desired.

Abstract: A method for providing an electric connection between a wire (12) and a metal surface (10) by pressing a curved and stripped section (11) of the wire towards the metal surface and arranging a brazing pin (14) in close proximity to a concave side of the curved section. Electric power is supplied to the brazing pin in a pinbrazing process until a fluxing agent and a solder material carried by the brazing pin has been released and melted. A brazing gun (18) is electrically connected to a power supply (19), the brazing gun having an opening for holding a brazing pin, and the brazing pin having a circular cross section. A bending tool is used for bending a stripped section of an electric wire to a circular shape, wherein the diameter of the bent wire is adapted to the diameter of the brazing pin, and means are provide for pressing the bent wire against the metal surface while generating an arc between the brazing pin and the metal surface.

Abstract: An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure control unit which controls pressure, a heating unit which heats the compression bonding unit, a temperature control unit, and a thermocompression bonding control unit which controls the pressure control unit and the heating unit based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts. In the thermocompression bonding condition data, the pressure is set to a first pressure in a first stage in a process of the thermocompression bonding operation and a second pressure, which is lower than the first pressure, in a second stage that follows the first stage.

Abstract: The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device 21 provided with recognition device is characterized in that insulation treatment is applied to a part 231 of a cover 23 positioned at the periphery of a working hole 24. The interior of a working region is kept, for example, at 230° C. by a heater 30 inside a setting base 22, and by being placed under high temperature constantly, a part 471 of cover 23 warps upwards. However, since insulation treatment is applied to part 231 of cover 23, a bonding device can be realized with which inadvertent sparking between a torch electrode 28 will not occur.

Abstract: An automatic soldering machine utilizing many design features which substantially reduces maintenance, simplifies the soldering operation, improves the process reliability, reduces the cycle time, and reduces the cost to fabricate such a machine.

Abstract: A soldering station with a control unit and a soldering iron having a replaceable soldering tip, the soldering iron being connected to the control unit by a power cord for receiving electrical power from said control unit is provided with an automatic calibration feature. The control unit has circuitry for controlling the temperature of the soldering iron at the tip by adjusting the supply of power to the tip heater of the soldering iron, a temperature selector for enabling selection of a temperature to which the soldering iron is to be heated by a user, a calibration temperature sensor connected to said circuitry and exposed for enabling it to be engaged by the tip of the soldering iron.

Abstract: In each odd-numbered unit current-supplying period of a plurality of unit current-supplying periods making up a set current-supplying time, a control unit subjects only positive switching elements to continuous switching operations at an inverter frequency while keeping negative switching elements in an OFF state, whereas in each even-numbered unit current-supplying period, the control unit subjects only the negative switching elements to continuous switching operations while keeping the positive switching elements in an OFF state. This allows a secondary current having a substantially trapezoidal current waveform to flow through a secondary circuit of a power supply apparatus in the positive direction in each odd-numbered unit current-supplying period but in the negative direction in each even-numbered unit current-supplying period.

Abstract: A thermosonic bonding apparatus including an ultrasonic transducer; a bonding tool including a high resistivity tip, and a low resistivity shaft extending from the tip; a tool support arm interconnecting the bonding tool and the ultrasonic transducer to vibrate the high resistivity bonding tool tip; and a voltage source connected to the bonding tool to locally heat the high resistivity bonding tool tip in a pulsed fashion.

Abstract: A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.