Abstract: A system and method for heating steam sample and chemical sample and feed tubes/lines in a natural gas fired heat recovery steam generator (HRSG) power plant including a tube impedance heater (IH) control system and at least one impedance heated tube having an outer insulation and an electrically conducting inner tube member, the impedance heated tube having an input IH feed power electrical connector and electrically connected at a first connection to the inner tube member, and a return IH power electrical connector electrically connected at a second connection by a first end of a return electrical cable and a first connector and second connector each mechanically and fluidly coupling the first and second connections respectively to the inner tube member to the steam sample or chemical sample or feed tube/line and electrically isolating the first end and second ends.

Abstract: Embodiments include a reflowable grid array (RGA) interposer, a semiconductor packaged system, and a method of forming the semiconductor packaged system. The RGA interposer includes a substrate having vias and zones, where the zones have embedded heaters. The heaters may include first traces, second traces, and via filament interconnects. The vias may have a z-height greater than a z-height of the heaters, and each of the zones may have a grid pattern. The RGA interposer may include first and second layers in the substrate, where the first layer includes the first traces, the second layer includes the second traces, and the second layer is over the first layer. The grid pattern may have parallel first traces orthogonal to parallel second traces to form a pattern of squares, where the pattern of squares has the first traces intersect the second traces substantially at right angles.

Abstract: In a method for producing a subassembly for a household appliance, at least one of a first rail and a separate second rail is cleaned by a mechanical and/or chemical cleaning operation. Subsequently the first and second rails are connected to one another so as to be able to slide relative to one another and thereby form a rail withdrawal device of the subassembly.

Abstract: A method of assembling and disassembling a gas turbine, and a gas turbine assembled thereby, improves work efficiency and reduces time and cost by carrying out various disassembly and reassembly processes depending on circumstances. In one process, a turbine section is disassembled from a gas turbine by sequential steps of disassembling an upper turbine case; disassembling a rear diffuser assembly and a rear bearing assembly; disassembling a combustor assembly; disassembling a vane assembly; and disassembling a blade assembly. In another process, first-stage to fourth-stage blade assemblies and first-stage to fourth-stage vane assemblies in a turbine section are disassembled from the gas turbine by sequential steps of disassembling an upper turbine case; disassembling a combustor assembly; disassembling a vane assembly; and disassembling a blade assembly.

Abstract: A method of assembling and disassembling a gas turbine carries out various disassembly and reassembly processes depending on circumstances. In one process, a first-stage blade assembly and a first-stage vane assembly of a turbine section are disassembled from a gas turbine by sequential steps of disassembling a combustor assembly; disassembling a first-stage vane assembly; and disassembling a first-stage blade assembly. In another process, a fourth-stage blade assembly of a turbine section is disassembled from a gas turbine by sequential steps of disassembling a diffuser loading slot from a rear diffuser; and disassembling a fourth-stage blade assembly from a turbine disk. In another process, a rear bearing assembly of a turbine section is disassembled from a gas turbine by sequential steps of disassembling a rear diffuser cover from a rear diffuser; and supporting one end of a rotor shaft and disassembling a rear bearing from a rotor shaft support.

Abstract: A metal-resin joining device joins a thermoplastic resin plate (12) to a metal plate (13) by melting the resin plate (12) in contact with the metal plate (13) through heating an exposed face of the metal plate (13) by one-sided resistive heating. The metal-resin joining device has a center electrode (24a) that is brought in contact with the metal plate (13) and a peripheral electrode (24b) that is brought in contact with the metal plate (13) to annularly surround the center electrode (24a) and to which a current flows from the center electrode (24a) via the metal plate (13), wherein the peripheral electrode (24b) is made of a metal material having a higher electrical resistance than the center electrode (24a).

Abstract: A current measurement connector may include a first part and a second part. Each part may include a mount and a joint. The first and second part may be joined via the respective joints through a current transformer interposed between the first and second parts. The respective mounts may be configured to receive a current from a current source and pass the received current through the current transformer via the first and second parts inducing a current in the current transformer. The induced current may be useable to measure the current from the current source. Methods for fabricating the current measurement connector may include die casting the first and second parts and press fitting the first and second parts at the respective joints through the current transformer. Methods for use may include withstanding a fault current pulse and dissipating heat associated with the pulse via the first and second parts.

Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.

Abstract: Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front surface of the heating section, the non-heating section not heating the substrate (200) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.

Abstract: A soldering iron includes a soldering tip which is adapted to be heated by means of a laser beam traveling at least partially along a laser path in the soldering iron. The soldering iron further includes an energy converter provided for absorbing the laser beam and coupled to the soldering tip for heating the same.

Abstract: Apparatus and methods for heating of one or more substrates with a plurality of independently controllable heating zones. Pressurized air is provided to each of a plurality of independently controlled heater blocks each including a heating element. The pressurized air is heated in the heater blocks and discharged towards one or more regions of the one or more substrates. The amount of power provided to the heating element in one of the heating blocks may be adjusted relative to the amount of power provided to the heating element in another of the heating blocks. The temperature of one heating zone may thereby be adjusted relative to other heating zones so that the temperature of different heating zones for the one or more substrates may be independently controlled. Heated air may be recovered from the heating zones and recycled. The pressurized air may be preheated by passing through a lift plate.

Abstract: A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering partner, a second soldering partner, and a solder. During the soldering process, the individual temperatures of each one of the sets are transmitted by a radio frequency transmitter to a receiving and control unit. The control unit controls the heating of the sets depending on the transmitted individual temperatures.

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract: A thermode device for connecting and/or electrically contacting a plurality of first semiconductor components to at least one support element and/or to a plurality of second semiconductor components by heating an adhesive under the application of pressure. An example thermode device includes a basic body and a heating element which can be extended out of the basic body and which, under the application of pressure, acts on at least one of the first semiconductor components, wherein the basic body has on its underside a plurality of heating plates which are oriented vertically and are arranged next to one another. Each heating plate has on its end and underside a plurality of the extendable heating elements, to the underside of each of which there is assigned a first semiconductor component.

Abstract: This invention introduces the welding technology of an electrical connector and its welding device. The welding device comprises of a base frame, IR lamp that can emit infrared rays, and convex lens used to collect infrared rays. The lamp and lens are set in the base frame, with the convex lens in front, which collects all infrared rays from the lamp and irradiates them to the solder paste, allowing for fast heating. The melted solder paste forms defect-free welding spots with sound electrics performance and low energy consumption, thus saving energy. This invention of welding device is used for the welding when electrical connector is assembled, solder paste is put and the connector is fixed in the conveying belt. The electrical connector goes through the heating zone in welding device, which enables the automatic welding of each cored wire in the electrical connector and wire connecting terminal. The welding is fast and the production can be continuous free of any tack welding.

Abstract: A method of forming a solder joint includes the steps of providing a heat shield member formed as an arcuate preferably metallic shell attached to a spring-clamp by means of an obedient shaft; attaching the spring clamp to a structure adjacent the solder joint; moving the heat shield member by bending the obedient shaft so that the heat shield member is positioned in a location spaced-apart from the solder joint with the concave surface of the heat shield member facing the solder joint; and applying heat from a torch to the solder joint from the side opposite the heat shield so that the heat shield reflects the heat back onto the solder joint.

Abstract: A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.

Abstract: A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil.

Abstract: An electric soldering iron head includes a heat-conducting pipe, a connecting member mounted to the heat-conducting pipe, a first heating block extending down from the connecting member, a second heating block slidably attached to the connecting member, and an operation member rotatably installed in the connecting member. The operation member includes a gear. The first heating block includes a first clamping portion. The second heating block includes a gear rack meshing with the gear and a second clamping portion facing the first clamping portion. When the operation member is operated to rotate, the gear drives the gear rack to slide, the second clamping portion slides toward or away from the first clamping portion.

Abstract: A method of providing boiler tubes with a variably ribbed interior surface. A suitably dimensioned spindle with a channel having a desired pattern on the exterior surface of the spindle is wrapped by a wire-like member in the channel so as to form thereon a reverse image of the desired, patterned tube ribbing. A brazing metal paste is applied on the exterior surface of the wire-like member and the spindle is inserted into a tube to be ribbed. The wire-like member is released from the spindle to allow the wire-like member to conform to the inner surface of the tube, and the tube is heated to the melting temperature of the brazing metal paste so that the wire-like member bonds to the inner surface of the tube, and the metal tube is then cooled.

Abstract: A method for controlling a brazing process, including the steps of applying a welding current through an electrode (52) pressed to a metal surface (83) of a workpiece to form a welding arc. Further steps are continuously measuring the welding current and the welding time, continuously determining supplied energy on the basis of the welding current and the welding time, digitally switching current supplied from batteries of a DC source (10) and to maintain a substantially constant welding current, interrupting the supply of welding current when a predetermined amount of energy has been supplied and supplying heat to batteries when a temperature of the batteries is below a predetermined value.

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract: A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.

Abstract: An automatic soldering machine includes a frame assembly, an electric iron and a movable module fixed on the frame assembly. The movable module is used for making the electric iron connected with the movable module randomly move to a specified position at a predetermined area. The movable module includes a first driving unit having a first leading element movable along a first axis, a second driving unit having a second leading element movable along a second axis perpendicular to the first axis, a third driving unit having a third leading element movable along a third axis perpendicular to the first and second axis and a rotating unit capable of rotating around an axis thereof. The third driving unit is connected with the first leading element. The second driving unit is connected with the third leading element. The rotating unit is connected with the second leading element.

Abstract: Clamping means which may be used with soldering pliers, having a first element (18) and a second element (20) relatively displaceable by the action of a screw (10) that can be rotated about an axis (XX) by the action of a motor (M); a nut (12) cooperating with the screw (10) and which can be driven in the direction of the screw axis (XX), the screw being coupled to the first element (18); first guiding means (34L) defining linear guidance parallel to the axis (XX) of the screw to prevent rotation of the nut (12) in a first phase of displacement of the nut; and second helicoidal guiding means (34H) extending with the axis (XX) of the screw (12) and which has an thread inverted in relation to the screw thread to allow the nut (12) to rotate in the same direction of rotation as the screw (10) in a second nut displacement phase; in addition to a compensation system (46) arranged between the first element (18) and a mobile support (14) coupled to the nut (12) in order to reinitialize the position of the first elem

Abstract: The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

Abstract: An electric soldering iron comprises a power unit connecting the electric soldering iron to an external power source, an electric soldering iron body comprising an iron head and a motion sensor for detecting motion of the electric soldering iron body, and a control system connected to the power unit and the electric soldering iron body, which comprises a switch, a control unit and a timer. The control unit directs the switch to maintain or terminate connection between the power unit and the iron head based on motion detected by the motion sensor and duration measured by the timer. When the duration exceeds a predetermined value, the control system enables the switch to terminate connection of the iron head and the power unit to achieve automatic cutoff of power.

Abstract: The present invention provides a method for laser brazing a first member to a second member using a laser brazing head. The laser brazing head has means for generating a first laser beam and a second laser beam. The method comprises the steps of: arranging the first member in contact with the second member such that a junction is formed there-between; providing a filler material in the vicinity of said junction, and passing the laser brazing head along the junction such that the first laser beam melts the filler material to at least partially fill said junction to form a brazed joint. The second laser beam then effects a post heat treatment of the brazed joint.

Abstract: A method of assembling aluminum alloy products, such as sheets, strips or tubes, by means of fluxless brazing, where the absence of flux is made possible by using a prior treatment resulting in formation of a conversion layer on the surface of the products. The treatment involves using a solution containing K+ and F? ions and at least one acid in a quantity such that the pH of the solution is less than 3. The inventive method enables effective flux was brazing in industrial conditions, such as a for the production of heat exchangers used in motor vehicles.

Abstract: The invention relates to a method and device for producing an electric machine, an electric machine with a commutator, having commutator hooks for fixing electric wire windings with solder arranged between the commutator hooks and the wire winding and two electrodes arranged adjacent to each other which are pressed against the commutator hooks. An electric current is passed through the commutator hooks by means of electrodes such that the solder melts and forms a connection to the wire winding.

Abstract: Device for vacuum tight soldering together a perimeter metal coating (5) of a transparent wall (4) to a perimeter metal frame (3) of a holding structure (2) of an evacuated solar collector (1), in particular a flat solar collector, said collector comprising a joining ribbon (6), preferably a soft metal strip or ribbon, in particular a lead and/or copper strip or ribbon, which is adapted to vacuum tight seal the gap (7) between said transparent wall (4) and said metal frame (3) and which is adapted to be soldered, in particular soft soldered, to said perimeter metal frame (3) and said perimeter metal coating (5) of the transparent wall (4), said joining ribbon comprising a soldering alloy, said device comprising heating means (24) for heating: a first part (5A) of said transparent wall (4) comprising at least a portion of said perimeter metal coating (5), a second part (3A) of said holding structure (2) comprising at least a portion of said perimeter metal frame (3), and said joining ribbon (6) to at least the

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract: A heat transferring member comprises a heat transfer body for melting solder, and a pipe inserted into a hole formed in the heat transfer body, wherein heat from a heating member is conducted to the heat transfer body. The pipe includes a tubular-shaped substrate made of copper or copper alloy, and an aluminum oxide film formed at least on a peripheral surface of the tubular-shaped substrate. The pipe may be press-fitted in the hole.

Abstract: A thermode device for connecting and/or electrically contacting a plurality of first semiconductor components to at least one support element and/or to a plurality of second semiconductor components by heating an adhesive under the application of pressure. An example thermode device includes a basic body and a heating element which can be extended out of the basic body and which, under the application of pressure, acts on at least one of the first semiconductor components, wherein the basic body has on its underside a plurality of heating plates which are oriented vertically and are arranged next to one another. Each heating plate has on its end and underside a plurality of the extendable heating elements, to the underside of each of which there is assigned a first semiconductor component.

Abstract: The purpose of the present invention is provide a method of forming a flux layer on an aluminum plate member, wherein a heating step for drying after a spray-coating of a flux composition can be omitted. The invention relates to a flux layer 2 composed of solid constituents of 5-25 g/m2 formed on a surface of an aluminum plate member 1, by spray-coating a flux composition from a nozzle 20 to the plate member 1 with a thickness of 0.2-1.6 mm, which was press-molded and heated for degreasing in a heat-degreasing oven 10, while a temperature of the plate member 1 is kept from 120 to 180° C. under the remaining heat after completing a heating step for degreasing, and naturally drying for volatilizing volatile constituents of the flux composition utilizing the remaining heat.

Abstract: An apparatus for control of resistance brazing is provided in a resistance brazing apparatus which grips parts of a weld object between which a brazing material is interposed between a pair of electrodes, applies pressure to the parts of the weld object, and feeds power to said electrodes in that state for resistance brazing, including a power feed time measurement unit measuring a power feed time to said electrodes required from when an amount of displacement of a distance between the pair of electrodes reaches a first amount of displacement to when it reaches a second amount of displacement and a control unit decreasing the amount of power feed to the pair of electrodes when the power feed time is a lower limit threshold value or less and increasing the amount of power feed to the electrodes when the power feed time is the upper limit threshold value or more.

Abstract: A method to heat a stator bar and clip assembly in a brazing chamber including: placing the stator bar and clip assembly in the brazing chamber, wherein the assembly is seated in a heating coil; positioning a conductive mass between a press and the stator bar and clip; applying the press to the assembly while the assembly is seated in the coil; heating the stator bar and clip by applying energy to the coil; brazing the stator bar to the clip with the heat from the coil, and removing the press and cooling the brazed clip.

Abstract: An exhaust gas filter for cleaning an exhaust gas of an internal combustion engine includes at least one strip-shaped filter layer made of a material through which a fluid can at least partly flow. The filter layer has a length in a longitudinal direction and a width in a transverse direction. The filter layer has a metallic reinforcing region at least in a partial region. The metallic reinforcing region has a width and a length. The width of the reinforcing region is less than the width of the filter layer and/or the length of the reinforcing region is less than the length of the filter layer. A method for producing a filter layer for an exhaust gas filter is also provided.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: A system (100), method (200, 400, 600), or computer program product (300, 500, 700) is used to develop a set of weld procedures for welding first and second parts is provided. A desired weld associated with the first and second parts is established. A set of weld parameters is established as a function of the desired weld and the set of weld procedures are established as a function of the weld parameters.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: A honeycomb cell structure has a plurality of first strips each formed into a generally zig-zag configuration and placed side by side to form a plurality of rows of cells in a generally honeycomb configuration with nodes between adjacent cells in each row, and a plurality of second strips of brazing foil. Each second strip is positioned between a respective pair of adjacent first strips and the first and second strips are secured together at each node such that a brazing foil strip extends across each cell in each row of the honeycomb. The second strips have a series of spaced slits extending transversely from at least one side edge across at least a distance equal to greater than half of the width of the second strip, with at least some of the slits being located within the cells.

Abstract: A method for regulating a coupling formation includes sensing a temperature of a coupling with a non-contact sensor and sending the temperature to a control unit that regulates the temperature of the coupling formation. In addition, a system for regulating a temperature of a coupling formation includes a temperature control unit and a non-contact sensor in flow communication with the temperature control unit.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: The invention concerns a method for assembling electroconductive pass by electric current heating. Said method is characterised in that it consists in moving forward electrodes (10, 20) with different polanties, towards the parts (30, 40) to be assembled, and in contacting said electrodes with at least one of the pans (30) to be assembled, current being applied to said electrodes (10, 20). Thus, the electroconductive pants (30, 40) are locally heated and assembled by the current flowing through them to pass from one electrode to the other.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: In each odd-numbered unit current-supplying period of a plurality of unit current-supplying periods making up a set current-supplying time, a control unit subjects only positive switching elements to continuous switching operations at an inverter frequency while keeping negative switching elements in an OFF state, whereas in each even-numbered unit current-supplying period, the control unit subjects only the negative switching elements to continuous switching operations while keeping the positive switching elements in an OFF state. This allows a secondary current having substantially a trapezoidal current waveform to flow through a secondary circuit of a power supply apparatus in the positive direction in each odd-numbered unit current-supplying period but in the negative direction in each even-numbered unit current-supplying period.

Abstract: A method for bonding a gyroscope component to a gyroscope body using the solid liquid Inter Diffusion (SLID) process. The resulting bond structure has a larger operating range than the bonding-materials used to create to bond. Mating material layers may be added to the bond to improve bonding between the bonding materials and the component and between the bonding materials and the gyroscope body.