Abstract: The heater device is provided with a heater main body, and radiates radiant heat from the heater main body toward an object. The heater main body includes a sheet-like heat generating layer that generates heat and radiates the radiant heat, and a sheet-like heat insulating layer that is disposed on the side opposite to the object of the heat generating layer. The heat insulating layer has a sheet-like first layer having voids and a sheet-like second layer having voids arranged side by side in a thickness direction of the heat insulating layer with respect to the first layer. A porosity of the second layer is higher than that of the first layer.

Abstract: The present disclosure relates to a method for producing a final metal part for a nacelle of a turbojet. The method includes brazing at least two parts, one being an inner part having an inner surface and the other being an outer part having an outer surface. The method further includes a step of heating the outer surface of the outer part using an external heating means, and a step of heating the inner surface of the inner part using an internal heating means.

Abstract: A method for manufacturing an automotive interior component may include providing a cover, a substrate, a chute connected to the substrate, heating the cover, forming the cover via a negative vacuum forming tool, and supporting the substrate and chute via a buck. The method may include moving at least of the negative vacuum forming tool and the buck toward the other of the negative vacuum forming tool and the buck such that the cover and the substrate may be in contact with each other. The method may include bonding the substrate with the cover via providing pressurized fluid to a chamber of the buck to force the substrate toward the cover. The chamber may be defined by the buck and the substrate.

Abstract: The microstructure of braze joints in polycrystalline diamond compact (PDC) cutters may be tailored to increase the shear strength of the braze joint, for example, by increasing the amount of a dispersed particulate microstructure therein. A method for forming a dispersed particulate microstructure may include brazing a polycrystalline diamond table to a hard composite substrate with a braze alloy at a braze temperature between 5° C. above a solidus temperature of the braze alloy and 200° C. above a liquidus temperature of the braze alloy; and forming a braze joint between the polycrystalline diamond table and the hard composite substrate that comprises at least 40% by volume of the dispersed particulate microstructure composed of a particulate inter-metallic phase having a diameter of 0.5 ?m to 2.0 ?m and an aspect ratio of 1 to 5 dispersed in a ductile matrix.

Abstract: There are described dispensers (10; 20; 30; 40; 50; 60) of alkali or alkaline-earth metals, comprising deposits of getter materials (13; 23; 33; 43; 53; 63) and alkali or alkaline-earth metal sources (12, 22; 32; 42; 53; 63), in which the sources of alkali or alkaline-earth metal are protected from environmental gases by said deposits of getter materials.

Abstract: A method and arrangement for producing a three-dimensional material composite using an expansion body includes at least two metal bodies having surface regions resting loosely against one another. The composite is heated to a target temperature and the surface regions are pressed against one another so that an integral connection is established. At least one expansion cavity having a predefined initial volume is arranged in one of the metal bodies or in an additional expansion body resting against one of the metal bodies in such a manner that when the expansion cavity expands, the surface regions to be connected are pressed against one another. A predefined quantity of at least one substance which is gaseous at least at a target temperature is hermetically enclosed in the expansion cavity before the target temperature is reached.

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract: A gettering system for a CAB furnace includes a nitrogen gas source to supply a nitrogen gas to a controlled atmosphere brazing (CAB) furnace and an active metal getter source disposed within the CAB furnace and being a sheet to remove oxygen and water vapor in the nitrogen gas, whereby heat exchangers are brazed during a controlled atmosphere brazing (CAB) process in the CAB furnace.

Abstract: To save a space for heating remarkably than that of a conventional case, to apply main heating at a high temperature only to portions of chips to be soldered and to perform heating operation in a short period of time, a heating apparatus is composed of a preheating zone and a main heating zone. In the preheating zone, support pallets are rotated in the vertical direction within a vertical heat insulating chamber like a Ferris wheel. Also, heat at a temperature such that cream solder is not molten by heaters is applied to a printed circuit board by fans. In the main heating zone, a pattern mask is fixed within a heat insulating chamber, sleeve bodies are fitted in necessary through-holes, blind plugs are fitted in unnecessary through-holes and heat at a temperature such that the cream solder is molten by a heater is applied to portions of chips to be soldered by fans through sleeve bodies, coil springs and other sleeve bodies.