Abstract: A sensor unit includes a sensor device, a holder that holds the sensor device and includes a surface maintained at a reference potential, and a case that houses the holder, in which the case includes a mounting surface in contact with a mounting object, and the mounting surface is provided with a communication portion that causes an inside and an outside of the case to communicate with each other, and the holder includes a protrusion that protrudes from the communication portion and comes in contact with the mounting object.

Abstract: Disclosed herein is an X-ray detector comprises: an X-ray absorption layer configured to absorb X-ray photons; an electronics layer comprising an electronics system configured to process or interpret signals generated by the X-ray photons incident on the X-ray absorption layer; and a temperature driver in the X-ray absorption layer or the electronics layer.

Abstract: A drive control apparatus and method for a yaw motor of a wind turbine is provided. The drive control apparatus includes a frequency converter, a fault cut-out contactor, and a contactor. The frequency converter is configured to perform drive control on the yaw motor. The fault cut-out contactor is connected in series between the frequency converter and the yaw motor, and configured to be switched off in a case of a fault in the frequency converter, to isolate the failed frequency converter. The contactor is connected in parallel with the frequency converter and the fault cut-out contactor, connected to the yaw motor, and configured to continue to drive the yaw motor in a case that the fault cut-out contactor is switched off. The drive control apparatus and method can solve problem of low reliability of drive control of the yaw motor.

Abstract: Apparatus and methods for heating of one or more substrates with a plurality of independently controllable heating zones. Pressurized air is provided to each of a plurality of independently controlled heater blocks each including a heating element. The pressurized air is heated in the heater blocks and discharged towards one or more regions of the one or more substrates. The amount of power provided to the heating element in one of the heating blocks may be adjusted relative to the amount of power provided to the heating element in another of the heating blocks. The temperature of one heating zone may thereby be adjusted relative to other heating zones so that the temperature of different heating zones for the one or more substrates may be independently controlled. Heated air may be recovered from the heating zones and recycled. The pressurized air may be preheated by passing through a lift plate.

Abstract: A soldering fixture is disclosed having a unitary base member configured to maintain a printed circuit board and an electrical connector in a particular orientation during soldering. The unitary base member includes a lateral channel dimensioned to maintain a plurality of wire leads associated with the electrical connector in a spaced relationship with the printed circuit board. The unitary base member further includes a wire alignment tool configured to align the plurality of wire leads in the particular orientation such that the plurality of wire leads are in juxtaposition with a plurality of solder pads affixed to one or more surfaces of the printed circuit board.

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract: A soldering fixture is disclosed having a unitary base member configured to maintain a printed circuit board and an electrical connector in a particular orientation during soldering. The unitary base member includes a lateral channel dimensioned to maintain a plurality of wire leads associated with the electrical connector in a spaced relationship with the printed circuit board. The unitary base member further includes a wire alignment tool configured to align the plurality of wire leads in the particular orientation such that the plurality of wire leads are in juxtaposition with a plurality of solder pads affixed to one or more surfaces of the printed circuit board.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A wire bonder has a capillary through which a wire passes. A discharge tip is positioned near a bottom section of the capillary and provides a flame to a distal end of the wire. A gas diffuser is positioned beside the capillary to diffuse a heated gas to the distal end of the wire.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method of sealing a generator stator bar and a stator bar end fitting receiving the end including the steps of: brazing the fitting to the end of the stator bar with a braze material; applying a metallic barrier coating material to the end of the stator bar in the fitting; heating the fitting at a temperature at least as hot as a liquidus temperature of the metallic coating material and cooler than a solids temperature of the braze material; coating the end of the stator bar in the fitting with liquid metallic barrier coating material, and solidifying the liquefied metallic coating material to form a metallic barrier coating on the end of the stator bar in the fitting.

Abstract: A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered horn is coupled to the body section for transferring and concentrating the ultrasonic wave. A capillary is coupled to a front section of the horn. The capillary has a channel running the length thereof. A wire is inserted through the channel. A discharge device is coupled to the capillary for forming a ball on the wire for wire bonding.

Abstract: The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device 21 provided with recognition device is characterized in that insulation treatment is applied to a part 231 of a cover 23 positioned at the periphery of a working hole 24. The interior of a working region is kept, for example, at 230° C. by a heater 30 inside a setting base 22, and by being placed under high temperature constantly, a part 471 of cover 23 warps upwards. However, since insulation treatment is applied to part 231 of cover 23, a bonding device can be realized with which inadvertent sparking between a torch electrode 28 will not occur.

Abstract: An object of the invention is to join a minute joint metal to a base metal in such a manner that the minute joint metal does not break in the joining, that the strength is not weakened in the base metal and the minute joint metal, and that the strength of the joining is increased. The invention comprises the steps of: contacting a minute joint metal, a base metal, and a brazing filler material to each other; pressing an electrically conductive tape toward these materials by means of a heating head; heating the electrically conductive tape; fusing the brazing filler material by means of the heat conducted from the electrically conductive tape which is heated; and joining the minute joint metal to the base metal with said fused brazing filler material.

Abstract: A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding of the wire to the bump are disclosed. When a first conductor and a second conductor are wire bonded, a bump is previously formed on the second conductor by ball bonding. An inclined surface is formed on an upper end of the bump by moving a capillary along a predetermined path to operate the capillary. First bonding of a wire to the first conductor is carried out, then the wire is looped from the first conductor to the bump, and second bonding of the wire onto the inclined surface of the bump is carried out.

Abstract: A method and apparatus for simultaneously cleaning and bonding a wire to a bonding surface is presented. In accordance with the invention, a gas is energized to form a plasma, which is then directed in a directional pressurized flow at the wire and bonding surface to form a dynamic plasma cleaning chamber bubble around the portion of the wire and bonding surface that are to be bonded together, and then the respective portions of the wire and bonding surface are bonded together within the plasma cleaning chamber bubble.

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract: A process and a device for bonding two millimeter elements. The process makes, at determined locations of each of the two millimeter elements, bonding zones set to the potential of a second plane. Then, the process makes the bond by determined connections between the bonding zones and between conducting lines of the two millimeter elements. The device includes a coplanar line. Such a process and device may find particular application to millimeter circuits implementing conducting lines of the microstrip type.

Abstract: A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface.