Abstract: An apparatus for particular use in delivering leadless, tubular ceramic capacitors or like electronic components from a receptacle, containing a random pile of such components, to templates for the prearrangement of the components, preparatory to their attachment to printed circuit boards. The apparatus includes a vacuum pickup assembly for repeatedly picking up the components, at least one at a time, in the receptacle and depositing them on an entrance guide of approximately V-shaped cross section extending from an inclined, rotatable, tubular chute. The entrance guide functions to direct the components into the chute in alignment, for delivery to a desired location. After the pickup assembly deposits a component or components on the entrance guide each time, the entrance guide and the chute are bidirectionally rotated through a preassigned angle in each direction to facilitate the entrance of the component or components into the chute.