Abstract: A separator (10) for separating waste (820) from product (810; 2302) in a pre-cut substrate (2600) having one or more cut lines. An inlet feeder feeds the substrate (2600) into the separator (10) along a material path. A separation edge (2500) is disposed in a location downstream of the inlet feeder and defines a line below the plane of the material path. A plurality of punch tools (30; 1800; 1900; 2000) above the plane of the material path, upstream of the separation edge (2500), each has an actuator configured to position the tool in an extended configuration with a contact end of the punch tool (30; 1800; 1900; 2000) disposed below the separation edge (2500), and a retracted configuration with the contact end disposed above the plane of the material path.

Abstract: An apparatus for singulating a layer of material on a semiconductor substrate includes a chamber. The chamber is configured for supporting a semiconductor substrate attached to a carrier substrate, the semiconductor substrate can include a plurality of die formed as part of the semiconductor substrate and separated from each other by singulation lines and a layer of material disposed over a major surface of the semiconductor substrate. In some examples, the singulation lines terminate so that the layer of material extends over the singulation lines. The apparatus includes a pressure transfer vessel inside the chamber and a compression structure movably associated with the chamber. The compression structure can be configured so that the pressure transfer vessel is interposed between the semiconductor substrate and the compression structure.

Abstract: After a glass sheet (G) having a scribe line (S) formed thereon is placed on a placement table (10) and positioned so that the scribe line (S) is positioned in a bending stress applying portion (15) of the placement table (10), when the glass sheet (G) is split along the scribe line (S) by applying a bending stress to a formation region of the scribe line (S) by the bending stress applying portion (15), the glass sheet (G) is positioned by laying a resin sheet (9) under the glass sheet (G) on the placement table (10) and aligning one side (G1) of the glass sheet (G) extending in a direction along the scribe line (S) with marks (Ma to Nd) projected onto a protruding portion (9a) of the resin sheet (9) by laser markers (16a to 16d).

Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.

Abstract: A wafer producing method for producing a wafer from a semiconductor ingot includes a thermal stress wave generating step of applying a pulsed laser beam having a wavelength that is absorbable by the semiconductor ingot to the semiconductor ingot held on the chuck table to generate a thermal stress wave and a fracture layer forming step of applying a pulsed laser beam having a wavelength that is transmittable through the semiconductor ingot to the semiconductor ingot in synchronism with a time during which the thermal stress wave reaches a position corresponding to a thickness of a wafer to be produced from the semiconductor ingot, causing the pulsed laser beam whose wavelength is transmittable through the semiconductor ingot to be absorbed in a region where a band gap is reduced by a tensile stress of the thermal stress wave.

Abstract: Sensor devices including dissolvable tissue-piercing tips are provided. Methods of using and fabricating sensor devices are also provided.

Abstract: The present invention relates to a substrate aligning device for bonding a first substrate (100) and a second substrate (200), wherein the first substrate (100) and the second substrate (200) have respective bonding surfaces via which the first substrate (100) and the second substrate (200) are bonded face-to-face with each other, and respective non-bonding surfaces which are located on the reverse sides from the bonding surfaces.

Abstract: A rectangular parallelepiped ingot defined by a height H, a width W and a length L, having longitudinal faces extending between two end faces, having a volume between 0.15 m3 and 0.80 m3 and a surface area to volume ratio between 10 m?1 and 18 m?1, made of at least one metal, including at least one notch and a notch tip along the ingot length, wherein the at least one notch is configured such that: MaxD<H/2, MaxD<W/2 and MaxD being the maximum distance between any point of the ingot and the closest surface of the ingot.

Abstract: A dispersion feeder for distributing a product stream to a plurality of receiving devices arranged about the periphery of the dispersion feeder, the dispersion feeder comprising a dispersion table; wherein the dispersion table comprises: a product receiving region at the centre of the dispersion table configured to receive a product stream comprising product and slack, and a product dispensing region surrounding the product receiving region; wherein the dispersion table is configured to transfer the product radially from the product receiving region to the product dispensing region; characterised in that the dispersion table further comprises: one or more apertures extending through the dispersion table, the one or more apertures being positioned between the product receiving region and the product dispensing region.

Abstract: A method of cutting a glass sheet comprising a transparent oxide glass includes directing a laser beam from a middle-infrared (mid-IR) laser source onto a major surface of the glass sheet. A wavelength of the laser beam is tuned thereby adjusting an absorption depth of the laser beam in the glass sheet. The glass sheet is cut using the laser beam.

Abstract: The invention relates to a method for cutting a sheet metal blank from a sheet metal strip (1) continuously conveyed in a transport direction (T), by means of at least one laser cutting device (3), having the following steps: providing a laser cutting device (3) with at least one laser cutting head (5) which has a cutting nozzle (7) and which can be moved along a cutting path (S1, S2, S1?, S2?) specified so as to correspond to the geometry of the sheet metal blank by means of a controller (6), incrementally measuring the distance between the cutting nozzle (7) and the surface of the sheet metal strip (1) at at least one radially outer position (P1, P2) relative to the cutting nozzle (7) by means of a first distance measuring device (8), controlling the movement of the laser cutting head such that the first distance measuring device (8, 9) constantly remains overlapping the sheet metal strip (1), into a second position, in which the cutting nozzle is overlapping the sheet metal strip (1), wherein the height

Abstract: The present disclosure provides a display device having a fingerprint recognition function. The display device includes: a light source; a fingerprint recognition component including a finger contact substrate, the light source and the finger contact substrate having a gap therebetween; and a light guiding layer at least partially filling the gap and configured to guide light emitted by the light source towards the finger contact substrate.

Abstract: Method and apparatus for removing a peripheral portion of a glass sheet. The glass sheet is placed in a predetermined position. A score line is formed on a major surface of the glass sheet. The score line demarcates a central region and a peripheral portion. A push bar is moved in a direction of a back-up bar assembly such to contact the major surface along the peripheral portion. The push bar is further moved in the direction to cause the peripheral portion to separate from the central region, and then become captured between the push bar and the back-up bar assembly. With some embodiments, the glass sheet is vertically oriented and the peripheral portion is not constrained during formation of the score line.

Abstract: A groove is cut along a line between adjacent solar cells of a wafer. A coating powder is processed to form a coating layer on the surface of the groove. The solar cells are thereafter physically separated from each other along the groove, with the coating layer serving as an edge coat. The solar cells are electrically connected in series and packaged in a solar module.

Abstract: A glass manufacturing apparatus can include a first elongated member, a second elongated member, and an elongated anvil member aligned with a space disposed between the first elongated member and the second elongated member. Methods can include rotating the first elongated member and the second elongated member while the elongated anvil member contacts a first major surface of the glass ribbon. In another embodiment, a glass manufacturing apparatus can include a first and second row of suction cups, and an elongated anvil member. The elongated anvil member can be engaged with a first major surface of the glass ribbon between the first and second row of suction cups that are attached to the first major surface of the glass ribbon. The glass manufacturing apparatus is configured to produce a score line on the second major surface of the glass ribbon along the elongated anvil member.

Abstract: A method of producing a laminated amorphous alloy ribbon holding spool. The method includes providing amorphous alloy ribbon holding spools, each of which is wound with a single layer amorphous alloy ribbon, unwinding the single layer amorphous alloy ribbon from each of the amorphous alloy ribbon holding spools, making the single layer amorphous alloy ribbon travel with a laser being radiated thereto, to thereby simultaneously prepare single layer amorphous alloy ribbons having laser irradiation mark formed thereon, laminating the single layer amorphous alloy ribbons having the laser irradiation mark formed thereon to, thereby prepare a laminated amorphous alloy ribbon, and winding up the laminated amorphous alloy ribbon on a spool.

Abstract: Implementations of methods of singulating a plurality of die included in a substrate may include exposing a substrate material of a substrate in a die street through removing a metal layer in the die street coupled to the substrate, wherein only a portion of the substrate material in the die street is removed, and singulating a plurality of die included in the substrate through plasma etching the exposed substrate material of the substrate in the die street.

Abstract: A device for modifying a region of a substrate includes a laser radiation source for pulsed laser radiation. A transmissive medium having a higher intensity-dependent refraction index than air is arranged between a laser machining head and the substrate such that an individual pulse of the pulsed laser radiation from the laser machining head is deflected through the transmissive medium and across a thickness of the substrate from an original focal depth to a focal depth different from the original focal depth to modify the substrate along a beam axis of the laser radiation in a region of a recess or through-opening to be formed in the substrate without removing an amount of the substrate material necessary to form the recess or through-opening. A length between the focal depths is greater than and extends across the thickness of the substrate.

Abstract: A device for press-cutting glass, a method for press-cutting glass, and a glass-cutting system having the device for press-cutting glass. The device for press-cutting glass comprises a supporting member, having a first supporting portion and a second supporting portion for supporting a glass substrate, which are arranged in a spaced apart manner in a first direction; and a press-cutting member for press-cutting an edge of the glass substrate, which is positioned between the first supporting portion and the second supporting portion in the first direction. The device for press-cutting glass has advantages including high press-cutting efficiency, simple structure, low manufacturing cost, and easy assembling with other devices.

Abstract: A method for separating a portion from a sheet glass element having a thickness of at least 2 millimeters along an intended separation line that divides the sheet glass element into the portion and a remaining main part is provided. The method includes producing filamentary damages comprising sub-micrometer hollow channels in a volume of the glass sheet element adjacently aligned along the separation line; and heating and/or cooling the glass sheet element to cause expansion and/or contraction so that the portion detaches from the main part along the separation line. The portion and the remaining main part each remain intact as a whole. The step of producing the filamentary damages includes generating a plasma within the volume with laser pulses of an ultrashort pulse laser; and displacing points of incidence of the laser pulses over a surface of the glass sheet element along the separation line.

Abstract: A method of manufacturing light emitting elements includes: providing a wafer including a substrate formed of sapphire and having a first main surface and a second main surface, and a semiconductor layered body disposed on the first main surface of the substrate; irradiating a laser beam into the substrate to form a modified region inside the substrate, the modified region having a crack reaching the first main surface and a crack reaching the second main surface; irradiating CO2 laser to a region of the substrate overlapping with a region to which the laser beam has been irradiated; and cleaving the wafer along the modified region to obtain the light emitting elements each having a hexagonal shape in a plan view.

Abstract: A glass bottle cutter based on electric heating comprises a base. A rotary bracket and a heating and cutting seat are disposed at two ends of an upper surface of the base respectively. A motor is disposed in the rotary bracket, and a rotating shaft of the motor is disposed outside the rotary bracket and is provided with a support plate. An adhesive pad allowing the bottom of a glass bottle to cling thereto is disposed on a surface of the support plate. A heating tube is disposed on an upper surface of the heating and cutting seat. The base is provided with a power access port and an internal circuit mainboard. The motor, the heating tube and the power access port are all electrically connected to the circuit mainboard.

Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

Abstract: Provided are a method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material, a unidirectionally aligned discontinuous fiber reinforcement composite material, and a sandwich structure. The method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material comprises discontinuously aligning short fibers on a polymer substrate in one direction by using an air-laid method.

Abstract: A hopper includes a receiving member having a guide surface that guides a non-flat strip-shaped sheet and a posture adjusting unit that adjusts a posture of the falling sheet and sends it to the guide surface, and a discharge unit that discharges the sheet. The posture adjusting unit may have a posture adjusting surface continuous with the guide surface and bent from the guide surface so as to form a ridge line at a boundary portion with the guide surface.

Abstract: A display assembly, an electronic device, and a method for assembling a display assembly are provided. The display assembly includes a flexible screen, a cover plate, and a capacitive fingerprint sensor film. The capacitive fingerprint sensor film is disposed between the cover plate and the flexible screen and covers a display surface of the flexible screen, to sense a fingerprint of a finger in contact with the cover plate.

Abstract: A cleaving mechanism (20) and related method is adapted to cleave an optical fiber (10) and thereby produce a cleaved end on the optical fiber. The cleaving mechanism (20) includes a fixture (40), a cleave tool (60) for cleaving the optical fiber, and a clamp assembly (80). The clamp assembly (80) may hold the optical fiber without substantial twisting of the optical fiber (10). The fixture and/or the clamp assembly (80) may include a pair of leaf springs (92) that contact and bend around the optical fiber (10) to secure the optical fiber (10) in a clamped position.

Abstract: A cutting device includes a platen, a mounting portion, a first movement mechanism, a second movement mechanism, a detector, a processor, and a memory. The memory is configured to store computer-readable instructions that, when executed by the processor, instruct the processor to perform processes. The processes include acquiring cutting data, acquiring a contact position output by the detector when the cutting blade comes into contact with the holding member, and controlling the first movement mechanism in accordance with the cutting data to move the mounting portion and the holding member to a cutting start position. The processes include controlling the second movement mechanism, at the cutting start position, to move the mounting portion in the third direction to a cutting position set on the basis of the contact position, and controlling the first movement mechanism in accordance with the acquired cutting data to perform cutting processing.

Abstract: Provided is a liquid crystal device manufacturing method capable of accurately cleaving a substrate when it is cleaved from grooves formed therein by reducing the variation in depth of the grooves. A structure is fabricated. Drive substrates having terminal portions are formed by dividing a first substrate. A protection film is attached to a second substrate side of the structure. Grooves are formed in the second substrate near the terminal portions through the protection film. Counter substrates are formed by cleaving the second substrate from the grooves, the end surface of each counter substrate on the terminal portion side including a cleaved surface. Liquid crystal devices are fabricated in each of which a drive substrate and a counter substrate are bonded to each other by a seal, and a liquid crystal is filled in a gap between the drive substrate and the counter substrate and sealed by the seal.

Abstract: Disclosed is a system for forming and cooling gum, the system including a forming system configured to size the gum to include a substantially uniform thickness, a cooling device that is disposed in-line with the forming system and configured to continuously receive the gum from the forming system at an entry point of the cooling device, and a multi-pass conveying system configured to continuously transport the gum from the entry point to an exit point of the cooling device, the forming system and the cooling device being configured to form and cool the gum to be in a condition for stacking or collecting upon exiting the exit point of the cooling device.

Abstract: A manufacturing method for a band-shaped glass film (GF) includes use of: a plurality of rollers (10) configured to change a direction of the falling band-shaped glass film (GF) to a horizontal direction; and a first horizontal-conveyance unit (4) configured to convey the band-shaped glass film (GF) in the horizontal direction after the changing of the direction of the band-shaped glass film (GF). After a lower end of the band-shaped glass film (GF) passes through a position between the plurality of rollers (10) being at a retreated position (P2) and the first horizontal-conveyance unit (4), the plurality of rollers (10) are moved from the retreated position (P2) to a regular position (P1) to apply a pressing force to the band-shaped glass film (GF), to thereby cut the band-shaped glass film (GF) along a width direction by bend-breaking.

Abstract: A rubber composition for use in a tire tread includes: per 100 parts by weight of diene rubber containing 40 wt % or greater of butadiene rubber, and a styrene butadiene rubber, from 80 to 150 parts by weight of silica having a CTAB specific surface area of 150 to 250 m2/g, and a long chain alkyl group-containing silane compound in an amount of 1 to 10 wt % of the amount of the silica. The rubber composition further includes a styrene component in the diene rubber being from 15 to 20 wt %, and a vinyl component in the diene rubber being from 18 to 28 wt %; and an average glass transition temperature of the diene rubber is ?55° C. or lower.

Abstract: A sheet processor subjecting a sheet having been conveyed forward to processing along a direction perpendicular to a conveyance direction of the sheet, includes: a processing unit performing the processing; and a receiving unit receiving the processing unit therein in a state capable of perfecting the processing on the sheet, and the processing unit includes a first processing tool 4A and a second processing tool 4B disposed to vertically oppose each other with a conveyance surface of the sheet disposed therebetween, and the receiving unit includes at least one receiver that removably receives the first processing tool 4A and the second processing tool 4B in the state capable of performing the processing on the sheet, with arbitrarily selected one of the first processing tool 4A and the second processing tool 4B disposed above the conveyance surface, and with arbitrarily selected another of the first processing tool 4A and the second processing tool 4B disposed below the conveyance surface.

Abstract: A device capable of separating a remnant from a product part irrespective of a shape of the remnant. The device includes a first attraction part which attracts a first part and is moved downward; a second attraction part provided movable relative to the first attraction part to attract a second part; a jig which comes into contact with a back surface of the second part to prevent the second part from moving downward; and further a position maintaining part which maintains a position of the second attraction part relative to the first attraction part when the first attraction part is moved downward to separate the first part from the second part.

Abstract: An automated photovoltaic (PV) subassembly manufacturing method involves in-line cutting of material strips. A tape is cut longitudinally into multiple strips. The strips are separated and guided into spaced apart positions relative to a surface of the PV cell subassembly comprising one or more PV cells. The multiple strips remain attached to the tape while the strips are guided to the spaced apart positions. The multiple strips are positioned at attachment locations on the surface of a PV cell subassembly.

Abstract: An optical fiber cutter includes: a base member; a movable member that clamps the optical fiber extending from a fiber holder and that moves with respect to the base member between an advanced position and a retracted position in an extending direction of the optical fiber; a biasing member that biases the movable member at the retracted position forward; a locking member that regulates forward movement of the movable member at the retracted position; a cutter supporter that supports a blade that forms an initial cut in the optical fiber, that moves in a direction that intersects with the extending direction of the optical fiber, and that forms the initial cut at an initial cut forming position between the fiber holder and the movable member; and an unlocking member that releases the regulation of forward movement of the movable member before the blade reaches the initial cut forming position.

Abstract: Apparatus for trimming paper rolls or logs (2) including: a section for the entry of the logs (2) to be trimmed; a section for the exit of the trimmed logs (2?); a station with cutting device (6) for trimming the logs (2); a device (3) for moving the logs (2, 2?) between the entry section, the cutting station and the exit section; a device (4), associated with the log-moving device (3), for retaining the logs when subjected to movement.

Abstract: Disclosed herein is an SiC wafer producing method for producing an SiC wafer from a single crystal SiC ingot. The SiC wafer producing method includes a wafer producing step of separating a part of the ingot along a separation layer as an interface. The wafer producing step includes the steps of immersing the ingot in a liquid and applying the ultrasonic wave from an ultrasonic vibrator through the liquid to the ingot, the ultrasonic wave having a frequency greater than or equal to a critical frequency close to the natural frequency of the ingot.

Abstract: Apparatuses and methods for heating moving continuous glass ribbons at desired lines of separation and/or for separating glass sheets from continuous glass ribbons are disclosed. An apparatus includes a translatable support portion and a heating apparatus coupled to the support portion. The heating apparatus is configured to contact the continuous glass ribbon across at least a portion of a width of the continuous glass ribbon at the desired line of separation as the support portion moves in a draw direction, thereby preferentially applying heat to a first side of the continuous glass ribbon at the desired line of separation as the continuous glass ribbon moves in the draw direction.

Abstract: A removing apparatus (2) includes a first removing section (11) and a second removing section (12). The first removing section (11) includes a rotating disk (15) and a driven roller (16). The rotating disk (15) has a pair of left and right first to fourth left and right removing blades (21) to (24) attached thereto. When the rotating disk (15) rotates in a counterclockwise direction, a coil conductive wire (3) sandwiched between the rotating disk (15) and the driven roller (16) is transferred in a transfer direction. When the rotating disk (15) rotates in a counterclockwise direction, the left and right side surface portions of the insulating coating (4) are removed by a blade portion (21b) of a pair of left and right first left and right removing blades (21).

Abstract: The present invention provides a method for micro-grinding tip-accurately induced brittle fracture forming of a curved mirror surface. The method includes the steps of: grinding a surface of an optical glass material by means of a V-shaped tip of a diamond grinding wheel to form a V-shaped microgroove having a groove micro-tip; setting two supporting points with a distance of L therebetween on one side of the optical glass material where the microgroove is machined, providing a loading pressing head having a horizontal deviation distance of l between a loading point and the groove micro-tip on the other side of the optical glass material, and allowing the loading pressing head to perpendicularly apply a loading force F onto the optical glass material with a loading speed of v, and forming a penetrated smooth curved mirror surface within 0.3 millisecond via the loading point of the loading force F and under induction of the groove micro-tip.

Abstract: Systems for holding optical fibers in a predefined orientation and cleaving the optical fibers are shown. In one embodiment, the system comprises a substrate structure with a groove along the top surface of the substrate. The groove extends from the substrate front edge in a direction that is parallel to the orientation of an optical fiber and is dimensioned to receive a portion of a bare optical fiber. The substrate structure also comprises a transverse structure on the top surface, which crosses the groove at an angle. The transverse structure receives ultraviolet light (UV) curable material, which secures the end of the bare optical fiber within the groove. Securing the bare optical fiber allows for proper tension to be applied during cleaving.

Abstract: A cell cutting device and a cell cutting method are disclosed. The cell cutting device includes a loading stage configured to load a display sheet including a plurality of display cells, a rotation driving unit connected to the loading stage and configured to rotate the loading stage and to separate the display sheet into the plurality of display cells, and a position change unit connected to the loading stage and configured to change a position of the loading stage.

Abstract: An apparatus for segmenting and feeding a fiber includes at least one capillary having a lumen therethrough configured to deliver a fiber segment. An advancing advances a fiber through the capillary. Tensioning means applies tension to the fiber to induce it to break. Damaging means locally damages the fiber.

Abstract: An optical fiber holder includes a holder main body, a V-groove which is formed on an upper surface of the holder main body and accommodates a first optical fiber, a recessed groove which is formed on a same straight line with the V-groove and accommodates a second optical fiber having a coating portion with a larger outer diameter than the first optical fiber, and an abutting portion which is provided on an end portion of the recessed groove on an opposite side to the V-groove and includes an opening portion which has a smaller width than the recessed groove. When the second optical fiber is accommodated in the recessed groove, a fiber core wire of the second optical fiber protrudes to an outside via the opening portion and an end portion of the coating portion of the second optical fiber abuts on the abutting portion.

Abstract: Methods for cleaving an optical fiber that extends from a ferrule are provided herein. The ferrule can be aligned on a first side of a scribe wire and an unconstrained end of the optical fiber on a second side of the scribe wire. Tension can be applied to the scribe wire with the optical fiber. Relative motion between the scribe wire and the optical fiber can be caused, while the tension is applied with the optical fiber. The scribe wire and the optical fiber can be separated. A fiber optic shard can be cleaved from the optical fiber. The fiber optic shard may include the unconstrained end of the optical fiber.

Abstract: A break-out process includes scoring a cutting line in the surface of the glass using a cutting tool, which cutting line delimits the outer contour of the inner shape and the inner contour of a peripheral shape; bringing the peripheral shape of the glass sheet into contact with a bearing system along the outer contour of the inner shape; the use of a deformation system for deforming one of the inner shape and of the peripheral shape by convex bending toward the side opposite the cutting line. The differential deformation between the inner shape and the peripheral shape is sufficient to break out the inner shape along the cutting line and create the distance needed for the contactless extraction of the inner shape relative to the peripheral shape. The extraction is carried out while maintaining the convex bending.

Abstract: Methods and apparatus provide for: conveying a glass web from a source toward a destination in a transport direction; scoring the glass web in a width direction thereof to produce a score line having a plurality of separated score segments, thereby defining a section of the glass web between the score line and a leading edge of the glass web; supporting the glass web such that an increasing portion of the section of the glass web becomes cantilevered as the glass web is conveyed such that the portion of the section of the glass web is sufficiently large to generate stress in the respective score segments and drive respective cracks through the thickness of the glass web; and permitting the section of the glass web to separate from the glass web along the score line.

Abstract: Systems for providing on-demand food service material printing for food service are provided herein. A food service material dispenser comprises a roll holder configured to hold a roll of food service material, one or more rollers, and a motor configured to operate to translate the food service material along a path within the dispenser. The dispenser includes a cutting arrangement configured to perform a cut of the food service material to form the sheet of food service material that defines a size associated with a food service order. The dispenser also includes a printer configured to print at least one of order information or personalization information on the food service material that is based on the associated food service order. The dispenser further includes a chute configured to dispense the sheet of food service material, which includes the at least one of order information or personalization information printed thereon.

Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.