Abstract: Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the optical axis of the position detection camera and the reference member is measured by the position detection camera. The accurate offset amount are determined on the basis of these measured values and the amounts of movement.

Abstract: The method of controlling a linear vibration welding apparatus, in accordance with the invention, may comprise the steps of: fastening a first workpiece portion in a fixed position; fastening a second workpiece portion to a reciprocating member; energizing a first single winding magnet with direct current power to create a magnetic field; sensing a location of the reciprocating member with respect to a zero point; and energizing a second magnet when the reciprocating member has crossed the zero point when moving towards the first magnet. The linear vibration welding apparatus in accordance with the invention may comprise: a frame; a flexure array; a first magnet assembly; a second magnet assembly; a digital controller; and direct current amplifiers for powering the magnet assemblies.

Abstract: Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

Abstract: A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

Abstract: A capillary is prevented from contacting an adjacent wire when bonding a given wire to an electrode pad on a semiconductor element, and can increase a compression bonding area when bonding the given wire to a post portion. The capillary has a set load for wire bonding greater than an urging force of a spring. A small-diameter portion is accommodated in an accommodating portion of the capillary main body, and an end face of the end of the capillary main body and an end surface of the small-diameter portion substantially align when the given wire is bonded to the post portion. The compression bonding portion therefore has substantially the same area as that formed by bonding using a normal capillary. Accordingly, the bonding strength of the post portion increases. Even if a semiconductor device has a multi-pin structure and is formed as a large-sized package, the post portion can withstand stress acting thereon at the time of resin-sealing for the semiconductor element.

Abstract: An ultrasonic rotary horn has tapered input sections for the conversion of axial acoustic energy into radial acoustic energy. The preferred rotary horn includes a first half having a first radial weld section and a first axial input section for receiving a first axial acoustic energy. The rotary horn further includes a second half coupled to the first half. The second half has a second radial weld section and a second axial input section for receiving a second axial acoustic energy. Each half has a coned section defined by an inner tapered surface and an outer tapered surface such that the halves convert a portion of the first and second axial acoustic energy into radial acoustic energy. Each inner tapered surface forms an inner angle with respect to an axis of the horn and each outer tapered surface forms an outer angle with respect to the axis.

Abstract: An integrated circuit device includes a substrate with a contact unit, an integrated circuit chip with a bonding pad unit, and a bonding wire interconnecting the bonding pad unit and the contact unit. The bonding wire has a electrical bonding contact attached to the bonding pad unit, a first extension portion extending from the electrical bonding contact in a direction that inclines slightly and upwardly relative to a plane of the substrate toward the contact unit, and a second extension portion extending from the first extension portion and attached to the contact unit.

Abstract: Large vibration tool, vibrating at ultrasonic frequency, especially for applications in the welding, joining or cutting of materials, especially thermoplastics, in cleaning or emulsifying by the activation of a liquid medium, in gas spraying or in shot blasting by blasting any kind of medium, made in the form of a circular sonotrode hollowed out at its center so as to produce a cavity allowing a shape approaching that of a bell to be obtained,

Abstract: An ultrasonic rotary horn has tapered input sections for the conversion of axial acoustic energy into radial acoustic energy. The preferred rotary horn includes a first half having a first radial weld section and a first axial input section for receiving a first axial acoustic energy. The rotary horn further includes a second half coupled to the first half. The second half has a second radial weld section and a second axial input section for receiving a second axial acoustic energy. Each half has a coned section defined by an inner tapered surface and an outer tapered surface such that the halves convert a portion of the first and second axial acoustic energy into radial acoustic energy. Each inner tapered surface forms an inner angle with respect to an axis of the horn and each outer tapered surface forms an outer angle with respect to the axis.

Abstract: A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.

Abstract: When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed.

Abstract: An ultrasonic wire bonder is disclosed having a bonding head for bonding wire to an electrical or electronic component with a bonding tool. A flexible support formed from at least one arcuate arm, supports the bonding tool for flexible movement of the bonding tool in the Z axis. A pair of arms form a wire clamp supported on the flexible support and are articulated by a link connected for moving one of the arms with respect to the other by an electrical drive having a coil. A wire cutter is connected to the bonding head and a pusher pushes the wire cutter toward the bonding tool before wire is to be cut after bonding.

Abstract: An energy controller is described for a vibration welder wherein the energy imparted into work-pieces being vibration welded is derived and compared with an energy set point to control the vibration welding operation. After a vibration welding operation has encountered the energy set point the welding operation is stopped and the quality of a weld derived from a comparison with another parameter associated with the vibration welding. The other parameter can be the amount of movement of one of the work-pieces during vibration welding or the time involved to inject the energy into the work-pieces to achieve the vibration weld.

Abstract: A feed unit for moving parts over short distances has a four-bar chain forming a translating solid parallelogram having two parallel rigid opposite legs, one of which constitutes a base leg, connected to one another by elastic elements and a piezoelectric stack translator extending between and flexibly connected to the rigid legs for articulation relative to the rigid legs and oriented at an angle of incidence (&agr;) with respect to a base leg that is less than 90° and greater than 45°.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: Force sensing apparatus is provided for sensing deflection of a transducer (8) in an ultrasonic welding machine. The apparatus includes a body member (2), a transducer holder (1) and a force sensor (4). The transducer holder (1) is adapted to hold an ultrasonic transducer (8) and the transducer holder (1) is fixed to the body member (2). The force sensor (4) is located between adjacent surfaces (11, 12) of the body member (2) and the transducer holder (1) to sense a force applied between the surfaces (11, 12).

Abstract: A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire therebetween and are driven by a motor drive for rotating or torquing the rollers and tensioning the wire placed between the rollers. A linkage generally aligns the rollers in parallel with the wire therebetween. A photoelectric sensor determines a given amount of wire at a position between the bond head and the rollers and provides a signal for controlling the stepper motor driving the reel of wire.

Abstract: A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.

Abstract: An ultrasonic horn used in, for instance, a bonding apparatus, being provided with a capillary attachment hole formed so as to be smaller than the capillary and a jig insertion hole that communicates with the capillary attachment hole. By way of inserting a jig into the jig insertion hole, the jig insertion hole is pushed open that causes the capillary attachment hole to be widened, so that the capillary is inserted and received in this enlarged capillary attachment hole. The capillary is fastened in place by the elastic force that is generated when the capillary attachment hole returns to its original shape, and the capillary is held in the horn main body without using any fastening tools.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

Abstract: In a wire bonding head, a transducer block depends from a carriage block via a special link mechanism including a main link member pivotally attached to the carriage block at its one end and to the transducer block at its other end so that the bonding tool tip may move along a vertical and linear path without any lateral displacement as the transducer block moves toward and away from the carriage block. Because the carriage block essentially undergoes a pivotal motion around the pivot on the carriage block, the effective inertia of the transducer block is kept small as compared to the case where a translational motion is caused to the transducer block. The structure according to the present invention is relatively simple and low in cost, and can be made free from plays particularly when the pivots consist of spring pivots using flexures.

Abstract: Ultrasonic welding apparatus is used for making roof flashing units. The roof flashing unites typically include a generally flat aluminum plate and a cylindrical aluminum element joined to the generally flat plate. Two ultrasonic welders are used to make the roof flashing unit, including a horizontally disposed ultrasonic welder for the cylindrical element and a horizontally disposed ultrasonic welder for joining the cylindrical unit to the generally flat plate.

Abstract: A machine for automatically making ultrasonic bonds between metallic conductors using a metal bonding wire precisely positions the tip of an ultrasonic bonding tool relative to a workpiece with a positioning mechanism which includes a first, upper tool support platform rollably supported by a support structure and translatable in a first direction with respect to the support structure by a first remotely operable drive motor, at least a second tool support platform rollably supported by the first tool support platform and translatable with respect thereto in a second direction by a second drive motor, and preferably, a third, end tool support platform rollably supported by the second tool support platform and translatable with respect thereto by a third drive motor.

Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 &mgr;m.

Abstract: A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.

Abstract: Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.

Abstract: A plurality of solder bumps are arranged in a row at regular pitch in a lead wire soldering region of a solar battery. A soldering apparatus for soldering a lead wire to the lead wire soldering region via the solder bumps comprises a lead wire feeding section for feeding out the lead wire. An end of the lead wire in the lead wire feeding section is chucked and the lead wire is laid over all length of the row of solder bumps. The soldering apparatus further comprises a soldering unit for soldering the lead wire onto the solder bump. The soldering unit has a lead wire holding member for holding the lead wire on a solder bump and a soldering iron. The soldering apparatus repeats an operation for welding the lead wire to the solder bump by means of the soldering iron, while the lead wire is held by the lead wire holding member.

Abstract: The object is to provide a method of connecting covered wires mutually which can solve cost increasing.

Abstract: In diffusion bonding a metal pipe 112e and a metal pipe 114e via a bonded interface 116e formed at the end parts, a portion that is inclined with respect to the radial direction of metal pipes 112e and 114e is provided at least at part of bonded interface 116. In this case, the inclination angle &phgr; of bonded interface 116e and the tip angle 2&thgr; of a pipe expansion tool 130 are preferably in the relationship, 0<&phgr;≦&thgr;+60°. In performing pipe expansion of such a metal pipe bonded body 110e, the pipe expansion tool 130 is moved from the metal pipe 112e, at which the inclined portion of junction face 116e is formed to have a protruding shape, towards the metal pipe 114e, at which the inclined portion of junction face 116e is formed to have a recessed shape. Furthermore, the inner diameter at the vicinity of the junction face of the metal pipe junction may be made larger than the inner diameter at positions away from the junction face.

Abstract: A fused construct including a first end formed into a fused loop, a second end formed into a fused loop, and an intermediate part extending between the loops, wherein the loops and the intermediate part include at least one segment of elongated material. Each of the loops includes a joint region having overlapped portions of the elongated material, and a relatively thin layer of fused material from the overlapped portions. The fused material is characterized by a low degree of molecular orientation in the direction of a principal axis of the elongated material, and the overlapped portions are characterized by a high degree of molecular orientation in the direction of the principal axis.

Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.

Abstract: An ultrasonic welder for splicing a plurality of workpieces has four anvils, each formed with a meeting surface and displaceable to form a workpiece nest, which has a rectangular shape of a predetermined width. The width of the workpiece nest is sufficient to receive only at least one vertical column of workpieces to be welded, so as to produce a vertical splice. The ultrasonic welder further has a controller controlling a starting position of tooling, which forms the predetermined width of the workpiece nest, and displacing at least one of tools, which form side faces of the nest in reciprocal and time controlled manner. The displaceable tool is brought back to its starting position corresponding to the predetermined width of the workpiece nest before a new bundle of workpieces is loaded therein.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: A wire bonding capillary (1), which is able to decrease wire extraction resistance and suitable for a long and low loop wire bonding process, comprises a through bore (5) for feeding a bonding wire, a funnel-shaped bore (3) for guiding the wire to the through bore, and a tapered portion (11) formed at an exit of the through bore. The through bore length is between 0.2 and 1.5 times the through bore diameter. The tapered portion is tapered in two steps.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: A plurality of bonding pads formed on a slider are integrally joined to an elastic flexure for a disk drive suspension. The pads are ultrasonically bonded to the slider with leads that are held by the flexure. The bonding portions of the leads face and are pressed against the pads with ultrasonic waves. The leads are plastically deformed during these steps to prevent the flexure from being deformed after the ultrasonic bonding process.

Abstract: A bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a first diameter; a second cylindrical section coupled to an end of the first cylindrical section, the second cylindrical section having a second diameter less than the first diameter; and a tapered section coupled to an end of the second cylindrical section.

Abstract: A die set for welding a panel like heat pipe to a heat sink, by the die set used in welding, the heat pipe with extremely high heat conductivity is effectively combined with the heat sink for use. Thereby, the heat sink can have better heat-conducting efficiency and working of it is fast and convenient. The die set includes a first and a second die seat. The first die seat is placed under a heat conductive bottom plate, and the top thereof has a first frame-like stub of which the top surface has a lot of protruding granules. The second die seat is placed above a heat conductive top plate, and the bottom thereof has a second frame-like stub (opposite to the first die seat) of which the bottom surface also has a lot of protruding granules. The top plate is lapped over the bottom plate with a connecting frame therebetween in opposition to and having a shape similar to that of any of the first and second frame-like stubs.

Abstract: Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.

Abstract: An ultrasonic horn used in, for instance, a bonding apparatus, being provided with a capillary attachment hole formed so as to be smaller than the capillary and a jig insertion hole that communicates with the capillary attachment hole. Byway of inserting a jig into the jig insertion hole, the jig insertion hole is pushed open that causes the capillary attachment hole to be widened, so that the capillary is inserted and received in this enlarged capillary attachment hole. The capillary is fastened in place by the elastic force that is generated when the capillary attachment hole returns to its original shape, and the capillary is held in the horn main body without using any fastening tools.

Abstract: An ultrasonic welder for splicing a plurality of workpieces has four anvils, each formed with a meeting surface and displaceable to form a workpiece nest, which has a rectangular shape of a predetermined width. The width of the workpiece nest is sufficient to receive only at least one vertical column of workpieces to be welded, so as to produce a vertical splice. The ultrasonic welder further has a controller controlling a starting position of tooling, which forms the predetermined width of the workpiece nest, and displacing at least one of tools, which form side faces of the nest in reciprocal and time controlled manner. The displaceable tool is brought back to its starting position corresponding to the predetermined width of the workpiece nest before a new bundle of workpieces is loaded therein.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: A bonding tool has a driver of piezoelectric elements in a stack. A sensor is positioned and held in the stack and includes a piezoelectric element sandwiched between electrodes and insulating wafers. Voltage developed between the electrodes is monitored and used to determine a bonding parameter, including the amplitude and duration of each ultrasonic burst.

Abstract: An apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions according to the present invention comprises a linear guide member for guiding said bonding head in the X and Y axial directions, a XY moving means for providing a moving force in the horizontal (X and Y axial) directions to said linear guide member by causing an induced electromotive force, a Z moving means for providing a moving force in the vertical (Z axial) direction to a block of said bonding head by causing an induced electromotive force, a hinge means for converting said moving force of said Z moving means into a rotating force, and functioning as a rotation center so that the block is rotated in the direction to a wire clamp motion. Thus, the present invention is not necessary additional device, the assembly is simple and the volumn of entire apparatus is reduced. In this case, since weight to be moved is reduced due to the reduce of volumn, the position control of the bonding head is perfored accurately.

Abstract: A fused loop of an elongated material, such as a surgical suture, and apparatus for making the loop. Portions of one or more segments to be joined together are fused in a welding process to form a welded joint. The shear area of the fused portion of the joint determines the strength of the joint and is thus preferably relatively large. Various configurations for the welding apparatus facilitate the creation of relatively large fused portions of the joint by maximizing contact between at least one of the welding members of the apparatus and at least one of the segments to be joined.

Abstract: A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.

Abstract: A chip junction nozzle in that opposite slant planes 43 which come into contact with edges of 2 sides of the chip in parallel centering around a nozzle center, and a vacuum suction hole 42 opened in the nozzle center are provided, and the slant plane 43 is formed into a mirror surface having the surface hardness more than HrC40. Further, when the surface roughness of the mirror surface is expressed by the average roughness of the center line, the average roughness of the center line is not more than 1.6 &mgr;m.

Abstract: The amount of a terminal portion of bonding wire which is melted to form a free air ball for ball bonding and the temperature rise in the bonding wire adjacent the free air ball is limited by quenching of the wire and free air ball with a flow of a gas which also effectively removes heat applied to the wire. Since the amount of melting of the bonding wire can be closely regulated, reduction of size and improvement of uniformity of the free air ball can be obtained for ball bonding at pitches of less than ninety mils even when bonding wire of reduced diameter is employed. Quenching of the bonding wire adjacent to the free air ball also limits the temperature rise in the bonding wire and the extent of a heat affected zone having less tensile strength and stiffness to less than one micron and with reduced grain enlargement. Thus wire bonding is provided for electronic packaging of increased reliability, potential functionality, increased manufacturing yield and reduced process complexity.

Abstract: A method and apparatus for solid bonding without using a bonding agent are provided. A surface of metal, glass, or other bond members 16a and 16b is fluorinated by exposure to a mixture of HF gas from a HF gas supply unit 24 and water vapor from a vapor generator 26 in a fluorination process section 12. The bond members 16a and 16b are then placed in contact at the fluorinated surface on table 36 in bonding process section 14. Argon is then introduced to bonding chamber 34. Pressure is then applied to the first bond member 16a and second bond member 16b by a cylinder 46, and heated to below the melting point by a heater 48, to bond the first and second bond members together.