Abstract: A bonding apparatus such as an ultrasonic transducer is provided that comprises an oscillation amplification device having a longitudinal axis and a substantially triangular cross-sectional area on a plane that is orthogonal to the longitudinal axis. An ultrasonic driver is coupled to the oscillation amplification device at a first position along the longitudinal axis and a bonding tool is mounted to the oscillation amplification device at a second position along the longitudinal axis spaced from the first position.

Abstract: A ribbon bond head capable of deep access bonding is configured to pass the bonding ribbon outside the transducer, e.g., in front of the transducer, instead of through the transducer. A clamping mechanism includes a stationary flat clamp base and a movable clamp arm with an opening, where the bonding ribbon passes through, not around, the clamp arm. The ribbon is clamped between the movable clamp and the stationary clamp and held securely during looping.

Abstract: A bonding device and method for producing a bonding connection is disclosed. One embodiment provides a bonding stamp and an ultrasonic generator coupled thereto. The ultrasonic frequency and an effective length, which is given by the distance between the lower end of the bonding stamp and the coupling location of the ultrasonic generator at the bonding stamp in the vertical direction, are coordinated with one another in such a way that the following holds true: 0.9 · n · c 2 · l ? f ? 1.1 · n · c 2 · l where c is the speed of the ultrasound in the bonding stamp at the frequency f, and n=1 or 2 or 3 or 4.

Abstract: An arrangement for the welding of cables by means of an ultrasonic welding device with a compression chamber for housing the cables defined by at least sections of a sonotrode transmitting ultrasonic vibrations, a counter electrode and lateral defining elements. In order to guarantee a desired layout for the cables, the components are installed in an insertion space, before closing the compression chamber, the width of which is less than that of the open compression chamber.

Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: An automatic chamber evacuating method, system, and apparatus are disclosed, which include a nest, wherein a region or chamber, such as for example the reference chamber of an absolute pressure sensor, may be placed. A switch is used to initiate an automatic process whereby an air operated chuck seals to a tubular region protruding from the chamber via compressed air. An evacuating device connected to the tubular region by the chuck then applies a vacuum which evacuates the chamber. When the chamber has been sufficiently evacuated a message is sent to a programmable logic controller which then outputs a signal to an ultrasonic welding apparatus. The ultrasonic welder crimps and seals the tubular region thereby quickly and efficiently creating a permanent vacuum in the chamber.

Abstract: An auxiliary control apparatus mechanically couples forces exerted on a manually operable auxiliary hand control knob to an input member of a micro-manipulator of the type used to move a point of an object such as an ultrasonic bonding tool tip relative to a workpiece in scaled ratios of motions at an end of the micro-manipulator input member. The apparatus includes a 4-bar parallelogram linkage which is mounted to a structural support member of a micro-manipulator, and which includes a rear laterally disposed lateral linkage bar pivotably connected to inner and outer parallel longitudinally disposed linkage bars which are pivotably coupled at front ends thereof to a front laterally disposed linkage bar.

Abstract: The invention relates to a laying device which is used to lay wire windings on transponder units, wherein the wire is guided in an axial manner in the laying device, a contacting device is used place the wires in contact with an automatic thermal clamping arrangement, an advancing system is used to advance machining devices by means of a piezo-leg-motor, a production system is used to produce transponder units in a console structural manner. The invention also relates to a method for the production of transponder units with horizontal ultrasonic introduction and a transponder unit wherein the wire ends engage directly on the ends of the connection surfaces of the chip.

Abstract: An ultrasonic sealer comprising a hollow shaft (1) having a longitudinal axis (2) and being rotatably arranged in a housing (3) for driven rotation about its longitudinal axis (2). The rotary sealer further comprises a sealing horn (8) arranged coaxially in the hollow shaft (1) and connected to a converter (6) and preferably also a booster (7). The horn (8) is provided with a peripheral sealing area (13) outside an axial end (13) of the hollow shaft (1). The horn (8) is connected to the hollow shaft (1) by means of at least one annular, metallic support (11) extending between an outer face (14) of the horn (8) and an inner face (10) of the hollow shaft (1). The at least one annular support (11) is corrugated in cross section such that at least two grooves and one ridge arranged there between are provided between the inner face (10) of the hollow shaft (1) and the outer face (14) of the horn (8).

Abstract: A sonotrode (33) for machining workpieces and a method for the operation of the sontotode. The sonotrode enables workpieces to be cut (1) and welded (5) simultaneously in a single work process. This results in substantially higher quality machined workpieces in comparison with the prior art. Cutting and welding occur in parallel in a single process.

Abstract: The semiconductor device bonding apparatus 1 of the present invention includes: a pressing member 15 that presses the semiconductor device 10 toward the substrate 11 side in a state where a bump 14 is provided between the semiconductor device 10 and the substrate 11; an ultrasonic vibration applying member 16 that vibrates the semiconductor device 10 and the substrate 11 relatively by applying an ultrasonic vibration to at least one of the semiconductor device 10 and the substrate 11; a time measuring member 17 that measures a required time period from a time when starting to apply the ultrasonic vibration to a time when the semiconductor device 10 is pressed a predetermined distance; and a controlling member 18 that controls an output of an ultrasonic vibration during subsequent bonding, based on the time period measured by the time measuring member 17.

Abstract: The invention relates to a method for measuring and/or regulating the oscillation amplitude of an ultrasound oscillator of an ultrasound device. In order to be able to measure or regulate the oscillation amplitude of the ultrasound oscillator in a simple manner, it is proposed that a sensor capturing the oscillation amplitude be associated with at least one component element of the ultrasound oscillator.

Abstract: A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.

Abstract: An ultrasonic generator comprising an input module for receiving a power signal. An output module for outputting an ultrasonic signal is also included in the generator. A motherboard is coupled to both the input module and the output module. The motherboard includes a digital controller adapted to control the input module and the output module.

Abstract: A semiconductor manufacturing apparatus operable to simultaneously apply supersonic vibration to two bonding sites located at different heights to simultaneously perform bonding of the two bonding sites, the apparatus includes: a cylindrical body; a first protrusion provided on an outer peripheral surface of the cylindrical body and receiving supersonic vibration propagated through the cylindrical body; and a second protrusion provided on the outer peripheral surface of the cylindrical body and receiving supersonic vibration propagated through the cylindrical body. A distance between an axial center of the cylindrical body and the tip of the first protrusion is generally equal to the distance between the axial center of the cylindrical body and the tip of the second protrusion. A tip surface of the first protrusion and a tip surface of the second protrusion are on different planes, respectively.

Abstract: A bond head for a wire bonding comprises a platform which is movable in a horizontal plane and on which a rocker is arranged which is rotatable about a first horizontal axis. An ultrasonic transducer which is rotatably held about a second horizontal axis is fastened to the rocker. A linear motor is arranged close to the first horizontal axis, with which the rotational position of the ultrasonic transducer is adjustable relative to the rocker. A sensor supplies an output signal from which the rotational position of the ultrasonic transducer can be derived. A controller regulates the position of the linear motor and thus rotational position of the ultrasonic transducer. The controller is also configured to supply a predetermined current to the linear motor in order to generate the required bonding force during the bonding.

Abstract: The invention relates to a method which is used to carry out adjusting operations on a bond head, wherein a bond head element is positioned in relation to a reference element, especially an ultrasonic tool. According to the invention, at least the surrounding area of the reference element, especially the tip of the ultrasonic tool, is optically detected by means of a camera and is displayed in an image on a display device. A marking is superimposed in the display in order to facilitate positioning. The invention also relates to an ultrasonic bonder comprising a camera which is used to support the positioning of a bond head element. Said camera can optically detect at least the area surrounding the reference element, especially the tip of the ultrasonic tool.

Abstract: A metal member is treated and vibrated with a number of vibrating particles to have the particles to strike and act onto an outer peripheral portion of the metal member in order to smooth the outer peripheral portion of the metal member, the particles are immersed with an additive for allowing the additive to be transmitted from the particles to the metal member and for allowing the outer peripheral portion of the metal member to be polished with the particles, the metal member may have dirt or impurities removed with a sand blasting method. The metal member may be tempered to form an oxidized membrane on the outer peripheral portion of the metal member, and may be immersed with in a rust preventive.

Abstract: A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.

Abstract: This invention is for a wedge for bonding an elongated conductor, such as a wire, to a bond pad on a microelectronic device. A wire passes through an aperture in the wedge into a pocket or an open notch. A sidewall on each side of the pocket or open notch prevents the wire from moving sideways. The wire passes over a foot that extends below the sidewalls by an amount sufficient to prevent the sidewalls from contacting the surface of the microelectronic device during bonding. The wire is bonded to a bond pad on a microelectronic device by feeding the wire through the aperture of the wedge and over the foot, pressing said wire between the foot and the bond pad, and applying bonding energy, such as ultrasonic energy, to the wire.

Abstract: In the manufacture of electronic devices (22, 22?), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for bonding wires (21), the tip (1) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool (10) in accordance with the invention is then reversed to use the wedge-tip (2) at the opposite end (12) for bonding further wires (20?). Thus, a cost saving is achieved with regard to tool material.

Abstract: When a weld area of weld surface between a flange portion 3a of a pipe 3 and a flange portion 4a of a pipe connection member 4 is S and total energy consumed on the weld surface is Et, ultrasonic welding is carried out to produce said ultrasonic weld assembly in such a manner that an energy density E defined as the quotient obtained by dividing the total energy Et by the weld area S satisfies the relation 26.69e?0.3708P<E<240.9e?0.1445P with a surface pressure P on the weld surfaces of the flange portion 3a and the flange portion 4a. Preferably, ultrasonic welding is carried out in such a manner that the energy density E satisfies the relation 133.45e?0.3708P<E<240.9e?0.1445P.

Abstract: A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

Abstract: The invention relates to an orbital friction welding method and a friction welding device for welding workpieces by means of friction welding units, wherein the workpieces are pressed against each other in the contact plane during the application of the oscillation energy. To this effect, n>1 friction welding heads are mounted, in a stationary manner, at least on one side of the contact plane in an orbital plane, in the area of the workpieces so that the n>1 friction welding heads, respectively facing one side, are oscillated with the same friction frequency, the same amplitude and the same preset phase position.

Abstract: An ultrasonic welder includes a housing having an ultrasonic transducer, a horn mounted to one end of the housing, a motor having a shaft, and a mounting assembly having a fastener such as a threaded screw. One screw end is coupled to the motor shaft to rotate as the motor shaft is being driven. The other screw end extends into a threaded screw receiver running within the housing. Upon rotating in one direction, the screw engages more threads of the screw receiver such that the housing with the horn move upward. Upon rotating in the other direction, the screw engages less threads of the screw receiver such that the housing with the horn moves downward. A linear transducer extends from the mounting assembly into the housing to monitor the horn position. A pair of guide shafts extend from the mounting assembly into the housing to stabilize the horn positioning.

Abstract: The present disclosure relates to a device for the ultrasonic processing of a workpiece using an ultrasonic resonator and optionally a counter-die, the workpiece lying against the ultrasonic resonator and the ultrasonic resonator having a converter, a booster and a sonotrode. According to the disclosure, an additional booster is provided between the converter and the sonotrode and both boosters carry a holder for the ultrasonic resonator.

Abstract: A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.

Abstract: A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip 52 to a substrate 50 using an ultrasonic mounting apparatus including a horn 15 that propagates ultrasonic vibration of an ultrasonic vibrator, the horn 15 being made of a ceramic that has a higher vibration propagation speed than metal. The method includes steps of disposing the substrate 50 on a stage 13, disposing the semiconductor chip 52 on the substrate 50, and placing the semiconductor chip 52 in contact with a convex part 15a provided on the horn 15 and applying ultrasonic vibration to bond the semiconductor chip 52 to the substrate 50.

Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Abstract: In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.

Abstract: A horn attachment arm for a bonding apparatus that performs high speed bonding with high accuracy to a large sized workpiece is provided. The horn attachment arm includes a fixing bracket fixed to a moveable member of a driving motor and a ultrasonic horn attaching bracket for attaching an ultrasonic horn on a tip end side to be fixed by being sandwiched between flat plates made of carbon fiber reinforced plastic. A flat plate space keeping member is attached between the flat plates so as to extend between the brackets. Flanges of the brackets and the longitudinal structure member are fixed to respective flat plates using a screw and an adhesive agent. The carbon fiber reinforced plastic that constitutes the flat plates has a greater number of reinforced fibers in a longitudinal direction than in a width direction, and is high in strength and rigidity in the longitudinal direction.

Abstract: In the manufacture of electronic devices (22, 22?), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for bonding wires (21), the tip (1) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool (10) in accordance with the invention is then reversed to use the wedge-tip (2) at the opposite end (12) for bonding further wires (20?). Thus, a cost saving is achieved with regard to tool material.

Abstract: An ultrasonic welding system is provided for creating an ultrasonically welded seam in a plurality of layers of a material, for example a foil bag having a plurality of foil layers. The system preferably includes a sonotrode and an anvil constructed and arranged to apply a welding force at an angle of less than 90° with respect to the downward force of gravity. Accordingly, a vertical welding force can be provided on the foil layers to weld the foil layers together from the bottom upward.

Abstract: A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.

Abstract: An ultrasonic welding machine having a tool in the form of, for example, a sonotrode. In order to allow for an optimal utilization of the working surfaces of the sonotrode, it is proposed to move or mount the sonotrode in a desired position with respect to the element that connects the ultrasonic welding machine to the sonotrode by rotating the sonotrode around its longitudinal axis as well as a transverse axis running perpendicular thereto.

Abstract: An ultrasound welding device for welding metallic conductors for producing a junction point includes two welding surfaces, which are located on opposite sides, and two lateral delimiting surfaces, which extend transverse to the working surfaces and which, together, define a compression space. In order to eliminate longitudinal movement of the conductors during welding, at least one of the lateral delimitation surfaces is additionally structured next to the structured welding surfaces.

Abstract: A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding tool is coupled to an opposite end of the horn for performing bonding operations. A first flange structure is located along the length of the horn at a first vibration nodal point for mounting the transducer, and a second flange structure is located along the length of the horn at a second vibration nodal point for mounting the transducer, such that the second flange structure is separated from the first flange structure by a distance of at least two consecutive vibration nodal points.

Abstract: In ultrasonic welding of a seam, such as for creation of an imaging belt, an ultrasonic welding horn is applied to an overlap area. The welding horn has a contact surface within a certain set of dimensions comparable to the overlap area. The welding horn defines a conical main body that tapers to the dimensions of the contact area through a short length.

Abstract: A wire bonding apparatus comprising: a capillary configured to have inserted therethrough a wire; a damper provided above the capillary and able to clamp hold the wire; and a load sensor configured to measure load incurred on the wire.

Abstract: An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical connection with the uninsulated end-portion of said insulated wire. A stationary electrical contact is provided for connecting to a ground. The stationary electrical contact is further configured to be placed about the shaft. A conductive bearing is also provided. The conductive bearing is configured to be placed about the shaft and between the electrical connector and the electrical contact. The conductive bearing electrically couples the electrical connector to said stationary electrical contact, thereby providing said ground to said uninsulated end-portion of said insulated bond wire. A wire-bonder including such a contact device and a method for making such a wire-bonder are also provided.

Abstract: The present invention provides an improved method and apparatus for manufacturing communication devices. A cover is attached to a surface of a faceplate that includes at least one opening, to provide enhanced device protection and sound quality. In one embodiment of the present invention, ultrasonic energy is used to cleanly and efficiently attach a cover to an inner surface of the faceplate. Advantageously, the present invention provides for improved manufacturing consistency and efficiency while also improving product quality.

Abstract: A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least a portion of a bonding tool. The transducer also includes a first tightening mechanism for securing a ball bonding tool in the bonding tool aperture, and a second tightening mechanism for securing a wedge bonding tool in the bonding tool aperture. The first tightening mechanism is distinct from the second tightening mechanism.

Abstract: The method is capable of securely mounting an electronic component on a circuit board by applying ultrasonic vibration. The method comprises the step of applying ultrasonic vibrations to the electronic component so as to flip-chip-bond the electronic component to the circuit board having electrodes. Portions of the circuit board, which correspond to peaks of amplitude of vibrations transmitted to the circuit board, are pressed when the ultrasonic vibrations are applied to the electronic component.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: An ultrasonic bonding hone is provided with a bonding pressing surface which extends in one direction and on which ultrasonic wave energy is concentrated. The bonding pressing surface is provided with a pair of protrusions extending in parallel to the direction in which the bonding pressing surface extends on opposite sides of the bonding pressing surface spaced from each other in the direction of width of the bonding pressing surface.

Abstract: A transducer assembly and wire bonding method has a vibration unit for generating an ultrasonic wave. A body section is coupled to the vibration unit for transferring the ultrasonic wave. A tapered horn is coupled to the body section for transferring and concentrating the ultrasonic wave. A capillary is coupled to a front section of the horn. The capillary has a channel running the length thereof. A wire is inserted through the channel. A discharge device is coupled to the capillary for forming a ball on the wire for wire bonding.

Abstract: A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

Abstract: A wire bonding apparatus including a bonding arm provided at a tip end thereof with an ultrasonic horn that has a capillary at its tip end, wherein the bonding arm is provided therein with a pressure sensor that detects the pressing load applied by the capillary on a workpiece when bonding is executed. The bonding arm has a supporting point which is a thin-connecting portion and located at a height which is the same as the height of the center of gravity of a part formed by the capillary, ultrasonic horn body portion, ultrasonic vibrator, ultrasonic horn connecting portion, etc., and at a point where a balance between inertial mass including the capillary, ultrasonic horn body part, ultrasonic horn connecting portion, horn securing screws and pressure screws and inertial mass of the ultrasonic vibrator is maintained, when the bonding arm is turned about a bonding arm supporting shaft.

Abstract: An apparatus and method for detecting the oscillation amplitude of a bonding tool includes a sensing unit disposed adjacent to and at a distance from the bonding tool. The sensing unit includes a pair of electrodes, a piezoelectric sensing layer located between the pair of electrodes, and a membrane associated with the piezoelectric sensing layer. The piezoelectric sensing layer becomes sensitive to ultrasonic vibrations and generates electrical voltage signals after being activated by a poling process. An optional pre-amplifier is used to amplify the signals generated from the sensing unit, and an oscilloscope is used to further process the signals.

Abstract: An ultrasonic welder includes a housing having an ultrasonic transducer, a horn mounted to one end of the housing, a motor having a shaft, and a mounting assembly having a fastener such as a threaded screw. One screw end is coupled to the motor shaft to rotate as the motor shaft is being driven. The other screw end extends into a threaded screw receiver running within the housing. Upon rotating in one direction, the screw engages more threads of the screw receiver such that the housing with the horn move upward. Upon rotating in the other direction, the screw engages less threads of the screw receiver such that the housing with the horn mover downward. A linear transducer extends from the mounting assembly into the housing to monitor the horn position. A pair of guide shafts extend from the mounting assembly into the housing to stabilize the horn positioning.