Using Bond Inhibiting Separating Material Patents (Class 228/118)
  • Patent number: 4743137
    Abstract: This invention relates to a tool with at least one wear-resistant hard metal part which serves to process production pieces, stones, or the like, wherein the hard metal part is firmly connected with a metallic carrier by solder located in at least one solder aperture. In order to reduce the danger of formation of tension cracks in the hard metal part, the invention provides that at least one predetermined weak point is created in the solder aperture.
    Type: Grant
    Filed: September 29, 1986
    Date of Patent: May 10, 1988
    Assignee: Siku GmbH
    Inventors: Anton Bucher, Peter Simon, Wilhelm King
  • Patent number: 4740099
    Abstract: A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element reserve areas without any adherence to the soldering material, and preferably at the limits of said reserved areas a recess for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element. A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.
    Type: Grant
    Filed: May 2, 1986
    Date of Patent: April 26, 1988
    Assignee: Societe Nationale Industrielle Aerospatiale
    Inventor: Jean-Pierre Philipoussi
  • Patent number: 4726104
    Abstract: A mask particularly useful in the weld repair of air cooled gas turbine blades and vanes contains a mixture of ceramic particles in a liquid carrier. The mask is applied onto the surface of the blade or vane, and into the cooling holes. Following a sintering treatment, an inert, thermally stable, electrically nonconductive ceramic mask is produced, which is easily removed after welding.
    Type: Grant
    Filed: November 20, 1986
    Date of Patent: February 23, 1988
    Assignee: United Technologies Corporation
    Inventors: Michael F. Foster, Thomas A. Ferguson
  • Patent number: 4722125
    Abstract: A method for producing a tungsten carbide tip punch includes:(1) preparing a punch rod including a top surface having a cylindrical protrusion;(2) placing on the top surface of the punch rod a tungsten carbide piece having a hardness greater than that of the punch rod and including a bottom surface having a crown-like indentation which opens at the bottom surface and which is capable of being well matched with said cylindrical protrusion at the lowermost portion of the crown-like indentation.
    Type: Grant
    Filed: September 12, 1986
    Date of Patent: February 2, 1988
    Inventor: Da H. Peng
  • Patent number: 4662558
    Abstract: In welding of metals, spatter preventing effect can be enhanced by spreading on the metal surface a halogen-containing duodimensional polymer having a proper degree of affinity for metals and other materials, being thermoplastic and also having a restoring force and flame resistance as a pretreatment.
    Type: Grant
    Filed: October 7, 1985
    Date of Patent: May 5, 1987
    Inventor: Hiroyoshi Hamanaka
  • Patent number: 4642863
    Abstract: A process is set forth for making a structure formed of at least two metallic workpiece sections each formed of a reactive metal. A mandrel having a nonreactive surface is sandwiched between the workpiece sections thereby preventing them from being in contact over a first selected area and allowing them to be in facing relation over a second selected area. A reactive metal contact is formed of the workpiece sections over the second selected area. The workpiece sections are maintained under coordinated temperature-pressure-time duration conditions to diffusion bond them at the second selected area. A gas pressure differential is applied between intermediate the workpiece sections and external of the workpiece sections to cause breakthrough at the first selected area and superplastic forming of at least one of the workpiece sections causing it to stretch in excess of its original surface area. The mandrel is removed from between the workpiece sections.
    Type: Grant
    Filed: April 15, 1985
    Date of Patent: February 17, 1987
    Assignee: Ontario Technologies Corporation
    Inventor: David W. Schulz
  • Patent number: 4634039
    Abstract: A solder resist paste having the feature that it is relatively easily removed is disclosed. The paste is comprised of a liquid polyglycol (e.g. Pluronic 25R2 by BASF) and either Kaoline or talc powder. In operation, the paste is selectively applied to holes in the PCB which it is desired to keep open during a soldering process. The paste is then washed out of the holes, additional components mounted via those holes, and soldered into place.
    Type: Grant
    Filed: October 19, 1984
    Date of Patent: January 6, 1987
    Assignee: Northern Telecom Limited
    Inventor: Hari N. Banerjee
  • Patent number: 4607780
    Abstract: A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element reserved areas without any adherence to the soldering material, and preferably at the limits of said reserved areas, a recess for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element. A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.
    Type: Grant
    Filed: November 8, 1984
    Date of Patent: August 26, 1986
    Assignee: Societe Nationale Industrielle Aerospatiale
    Inventor: Jean-Pierre Philipoussi
  • Patent number: 4603089
    Abstract: A process is disclosed for bonding multi-layer sheet structure by using controlled depth laser welding. The laser energy may be applied in stages, whereby the inner sheets are first welded together and, the outer sheets are then joined thereto. The sheets are thereafter expanded to form the desired structure. Although the laser energy may be varied to control the depth of penetration, one embodiment utilizes a shield material to be applied between two sheets to prevent the laser energy from penetrating and joining the two sheets together. Similarly, shields may be used to control the width of the laser weld.
    Type: Grant
    Filed: November 21, 1983
    Date of Patent: July 29, 1986
    Assignee: Rockwell International Corporation
    Inventor: Clifford C. Bampton
  • Patent number: 4601089
    Abstract: In a finned heat exchanger, preferably of aluminum, the feed of the fins (1) are secured to tubular passages (3, 3a, 3b) formed from plates (2) that have been rolled together and then expanded. The bond between the fins (1) and the plates (2) may be an adhesive bond, as by welding or a cohesive bond, as by tight pressing together.
    Type: Grant
    Filed: December 31, 1984
    Date of Patent: July 22, 1986
    Inventor: Pal Gal
  • Patent number: 4593848
    Abstract: A portable apparatus for friction joining metal pieces to an electrical conductor while the conductor is carrying electrical current. The apparatus comprises a spindle adapted to receive and to hold a metal piece in a forward end thereof for rotation against the conductor, and structure is provided for translating the spindle toward and away from the conductor. An air operated motor and flywheel are provided for rotating the spindle, and structure is provided for supporting the apparatus on the conductor.
    Type: Grant
    Filed: January 28, 1985
    Date of Patent: June 10, 1986
    Assignee: Aluminum Company of America
    Inventor: David E. Hochbein
  • Patent number: 4582244
    Abstract: The invention involves a novel method for forming sine wave I-beams, and other sandwich structures having a curved core. The core pieces are flat prior to forming. The sandwich structure consists of two face pieces and two core pieces, wherein the core pieces are similar in shape to each other. The pieces are placed in a stack. Each core piece has two lip portions. The lip portions are extensions of the core pieces, and have a curved shape prior to forming that does not change during forming. The core pieces are joined to each other along one lip portion, and each core piece is joined to one face piece along the other lip portion. The shape of the curved core sheets and the shape of the lip portions determine the curvature of the formed core. The core pieces are unfolded and expanded in forming dies at elevated temperatures and pressures to form the desired structure.
    Type: Grant
    Filed: May 3, 1984
    Date of Patent: April 15, 1986
    Assignee: Rockwell International Corporation
    Inventor: Gilles Rainville
  • Patent number: 4577797
    Abstract: An improved apparatus and forming method is disclosed for making laminate structures from a stack of worksheets using superplastic forming and diffusion bonding. A fluid line is inserted into the forming die which is connected to the stack by a slot in one sheet. A sheet is coated with a stopoff material to prevent bonding of selected areas of the sheets. The slot is positioned adjacent to the stopoff path and an inflation tube having an internal bore is inserted into the slot. The tube material is noncontaminating relative to the worksheet materials, and the tube material has a high compressive strength sufficient to form a groove in one worksheet without diminishing the bore area. When the tube is thicker than the sheet having the slot in it and the tube is subjected to compressive forces by the forming die, the tube acts as a male die and pushes out a groove in a surrounding worksheet without substantially changing the structure of the tube.
    Type: Grant
    Filed: March 21, 1984
    Date of Patent: March 25, 1986
    Assignee: Rockwell International Corporation
    Inventor: Roger S. Raymond
  • Patent number: 4560584
    Abstract: In accordance with one embodiment of the invention, solder masking material is pressurized by means of a fluid pump to approximately 250 psi and a high speed valve is used to turn the flow on and off rapidly in order that small "shots" of fluid are propelled from a tip, through the air, to selected portions of a circuit board. The selected areas of the circuit board to be masked are situated oppositely from the tip, as by a XY positioning system for the tip and/or the circuit board. The drops of masking material, which form upon impinging of the shots onto the circuit board, may be varied in volume and diameter. Where needed, a continuous bead of masking material may be formed on the circuit board by spacing the dots sufficiently close together.
    Type: Grant
    Filed: December 23, 1983
    Date of Patent: December 24, 1985
    Assignee: Universal Instruments Corporation
    Inventor: Albert S. Henninger
  • Patent number: 4549685
    Abstract: A method of forming Y shaped support structures by diffusion bonding and/or superplastic forming wherein layers of metal capable of diffusion bonding and/or superplastic forming are placed in a sandwich-like assembly having a top, bottom and intermediate layers, the layers having been selectively coated with stop-off. The sandwich assembly is subjected to sufficient pressure and heat to diffusion bond and superplastically form the sandwich assembly into a Y shaped stringer or support structure. The layers and/or a reinforcing member are selectively coated with stop-off so as to form at least two Y shaped support structures.
    Type: Grant
    Filed: February 10, 1984
    Date of Patent: October 29, 1985
    Assignee: Grumman Aerospace Corporation
    Inventor: Carlos A. Paez
  • Patent number: 4538756
    Abstract: Reinforced structural elements are produced by taking two or more sheets of the same or different malleable metal and applying a pattern of thermally decomposable stop-off material on an interfacial surface, solid phase green bonding the sheets one to another by squeezing them through squeezing rollers and sintering the sheets to improve the metallurgical bond therebetween. The composite can be formed into complex configurations having compound reentrant surfaces and then raised above a predetermined temperature to decompose the stop-off material to generate gas and inflate the sheets contiguous to the pattern. The stop-off material can be chosen to decompose essentially completely at a temperature above the predetermined temperature which facilitates forming prior to inflation or the material can include a portion which decomposes at the sintering temperature of the metallic sheets employed giving a two stage inflation.
    Type: Grant
    Filed: June 10, 1983
    Date of Patent: September 3, 1985
    Assignee: Texas Instruments Incorporated
    Inventors: George Trenkler, Richard G. Delagi
  • Patent number: 4494287
    Abstract: The disclosure relates to a process for the fabrication of low cost dual property turbine rotors having blades that are mechanically retained and a blade ring that is permanently bonded to a central hub.
    Type: Grant
    Filed: February 14, 1983
    Date of Patent: January 22, 1985
    Assignee: Williams International Corporation
    Inventors: Gerald S. Cruzen, Said Izadi, Peter Nagy
  • Patent number: 4486466
    Abstract: A resinous protective coating useful in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating upon being subjected to heat goes from a high viscosity solution to a gel and then to a solid or from a soft "gel-like" state into a solid. The protective coating is resistant to copper electroplating baths, adheres to insulating substrates, adhesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.
    Type: Grant
    Filed: July 29, 1982
    Date of Patent: December 4, 1984
    Assignee: Kollmorgen Technologies Corporation
    Inventors: Edward J. Leech, Frank D. Russo
  • Patent number: 4434930
    Abstract: Reinforced structural elements are produced by taking two or more sheets of the same or different malleable metal and applying a pattern of thermally decomposable stop-off material on an interfacial surface, solid phase green bonding the sheets one to another by squeezing them through squeezing rollers and sintering the sheets to improve the metallurgical bond therebetween.The composite can be formed into complex configurations having compound reentrant surfaces and then raised above a predetermined temperature to decompose the stop-off material to generate gas and inflate the sheets contiguous to the pattern.The stop-off material can be chosen to decompose essentially completely at a temperature above the predetermined temperature which facilitates forming prior to inflation or the material can include a portion which decomposes at the sintering temperature of the metallic sheets employed giving a two stage inflation.
    Type: Grant
    Filed: October 15, 1981
    Date of Patent: March 6, 1984
    Assignee: Texas Instruments Incorporated
    Inventors: George Trenkler, Richard G. Delagi
  • Patent number: 4392602
    Abstract: An improvement is disclosed to the method of forming sandwich structures wherein a plurality of workpieces having opposed principal surfaces are placed in a stack contacting facing principal surfaces and thereafter diffusion bonding portions of said facing principal surfaces of said workpieces together and superplastic forming at least a portion of at least one of said workpieces. The improvement comprises coating at least one of the facing principal surfaces with a maskant. The maskant is then removed from the portions not to be diffusion bonded of the at least one coated facing principal surface. A stopoff material is applied to the portions where the maskant has been removed and thereafter the remaining maskant is removed. The preferred method of removing the maskant from the portion of the at least one coated principal surface comprises placing a template on the surface and thereafter cutting out the maskant.
    Type: Grant
    Filed: November 24, 1980
    Date of Patent: July 12, 1983
    Assignee: Rockwell International Corporation
    Inventor: Vene L. Darby
  • Patent number: 4390615
    Abstract: A coating composition, which is suitable for the production of photopolymerizable coatings on circuit boards for the production of solder resists, comprises:(a) an ethylenically unsaturated polymerizable reaction product of a polyepoxide and an ethylenically unsaturated carboxylic acid, which product is solid or semisolid in nature;(b) an inert inorganic filler, the filler and reaction product (a) having present in a weight ratio of from 20 to 65 parts of filler to from 80 to 35 parts of reaction product;(c) a photopolymerization initiator for the polymerizable reaction product; and(d) a volatile organic solvent for the polymerizable reaction product.The compositions are applied to substrates, such as circuit boards, and allowed to dry by evaporation of organic solvent to produce a photopolymerizable coating on the substrate which coating may be cured by exposure to actinic radiation, for example through a patterned mask.
    Type: Grant
    Filed: December 9, 1981
    Date of Patent: June 28, 1983
    Inventors: Robert W. Courtney, Stephen J. Parker, Alan C. Threadgold
  • Patent number: 4361262
    Abstract: A method of making sandwich structures from a plurality of workpieces is disclosed. The method comprises providing a plurality of workpieces, each having principal opposed surfaces. The workpieces comprise first and second outer workpieces and at least two core workpieces. Each of the core workpieces have cutout portions defining at least one strip. The workpieces are treated at selected locations to inhibit joining at said locations. The treated workpieces are positioned in a stack contacting at their principal surfaces. The workpieces are joined, preferably by diffusion bonding, at their untreated contacting surfaces such that alternate longitudinal edges of superimposed strips are joined together and to the outer workpieces. Preferably, at least one chamber is enclosed by positioning the stacked workpieces relative to a plurality of shaping members.
    Type: Grant
    Filed: June 12, 1980
    Date of Patent: November 30, 1982
    Assignee: Rockwell International Corporation
    Inventor: Leonardo Israeli
  • Patent number: 4347661
    Abstract: Metallic anode holders are suspended by a conveyor, and moved in succession above a table supporting induction-heating coils. The coils can be raised to surround lower depending parts of the holders which may be optionally previously coated with a separating agent to prevent direct contact with the grouting subsequently applied. The associated anode carbon blocks with recesses are conveyed successively beneath a beam supporting induction-heating coils which can be lowered into the recesses which subsequently receive the parts of the holders for grouting therein. It is possible to heat the recesses and the parts of the holders in situ and simultaneously, in which case the grouting operation can be performed without letting the components cool down. Metallic cathode busbars previously installed in a recess of a carbon block are likewise conveyed beneath a beam supporting an induction-heating coil, which serves to heat the busbars and the recess prior to grouting the busbars in the recess.
    Type: Grant
    Filed: October 10, 1979
    Date of Patent: September 7, 1982
    Assignee: Gewerkschaft Eisenhutte Westfalia
    Inventor: Franz Golla
  • Patent number: 4331284
    Abstract: An improvement is disclosed to the method of making metallic structures from a plurality of stacked workpieces or blanks by joining first portions, preferably by diffusion bonding, of the stack and by clamping the joined stack at its periphery between forming members and superplastically forming second portions of said plurality of stacked blanks by the selective application of fluid under pressure. The improvement is a method of coupling the fluid to the second portions of the stack which comprises providing a first port through one of the outer blanks at the periphery of the stack. At least one stopoff path is provided for coupling the first port to the second portions of the stacked blanks, which are to be superplastically formed. A second port is provided in one of the forming members, which couples the first port to a source of pressurized fluid.
    Type: Grant
    Filed: March 14, 1980
    Date of Patent: May 25, 1982
    Assignee: Rockwell International Corporation
    Inventors: David W. Schulz, Vene L. Darby
  • Patent number: 4312906
    Abstract: A filler of polyisobutylene dissolved in a solvent is combined with boron nitride to form a stop-off compound used as a parting agent when diffusion bonding metals. A uniform coating of the compound is applied with screen printing methods prior to bonding.
    Type: Grant
    Filed: June 16, 1980
    Date of Patent: January 26, 1982
    Assignee: The Boeing Company
    Inventors: Charles R. Arnold, Donald A. Pennington
  • Patent number: 4304350
    Abstract: A system for superplastic forming and diffusion bonding of a metal workpiece sandwich between an upper and lower die to form a structural shape wherein a hollow stainless steel pin is in sealed relationship with a hole in the surface of one metal layer and communicates with the interior of the sandwich. The hollow pin extends into a recess in one of the dies and is in sealing relationship with the recess.
    Type: Grant
    Filed: January 7, 1980
    Date of Patent: December 8, 1981
    Assignee: Grumman Aerospace Corporation
    Inventors: Carlos A. Paez, Salvatore Stracquadaini, Lino L. Olivier
  • Patent number: 4293089
    Abstract: There is disclosed a positive cathode electrode structure formed by brazing a thin porous membrane to a backing material by preselecting a predetermined area of the thin porous membrane and thereafter providing a braze flow barrier throughout the remainder of the membrane and electrolessly plating a nickel-phosphide alloy on the backing material, or in this case the honeycomb structure. The preselected area of the thin porous membrane is placed in intimate contact with the electrolessly plated portion of the backing material and heated to elevated temperatures in the absence of oxygen to form a brazed joint limited to a preselected area. If the braze flow barrier is provided by application of a liquid organic solvent, then the organic solvent is driven off by maintaining the thin porous membrane at elevated temperatures for an extended period of time prior to the brazing operation.
    Type: Grant
    Filed: May 8, 1979
    Date of Patent: October 6, 1981
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: James T. McCormick, Paul B. Ferry, John C. Hall
  • Patent number: 4267953
    Abstract: A method is provided for alleviating the stress damage in metallic matrix composites, such as laminated sheet or foil composites, wherein non-intersecting discrete discontinuities are positively introduced into the interface between the layers so as to reduce the thermal stress produced by unequal expansion of the materials making up the composite. The discontinuities are preferably produced by drilling holes in the metallic matrix layer. However, a plurality of discrete elements may be used between the layers to carry out this purpose.
    Type: Grant
    Filed: February 20, 1980
    Date of Patent: May 19, 1981
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Charles A. Hoffman, John W. Weeton, Norman W. Orth
  • Patent number: 4254163
    Abstract: A printed circuit board is formed from a metal-clad substrate by applying a solvent-free, non-dryable ink in a predetermined pattern on the substrate, dusting powdered resin over the surface, removing any resin powder not retained by the ink from the surface, heating the substrate having the ink powder thereon to a temperature so as to fuse the powdered resin to form a strippable resist, etching the uncoated portion of the metal laminate and stripping the resist subsequent to etching.
    Type: Grant
    Filed: April 13, 1979
    Date of Patent: March 3, 1981
    Assignee: Western Electric Company, Inc.
    Inventor: John R. Piazza
  • Patent number: 4220276
    Abstract: A method for fabricating superplastically formed/diffusion bonded structures wherein metal blanks of a titanium alloy are joined at selected areas by diffusion bonding and expanded superplastically to form a desired sandwich or integrally stiffened structure. In such method, the metal blanks are treated in selected areas with a "stopoff" material to prevent bonding at those areas during diffusion bonding and to permit forming or shaping at the same areas during superplastic forming. An improved stopoff compound is provided for this purpose, in the form of yttria of relatively coarse particle size, coarser than 5 microns, in a suitable volatilizable vehicle. Such stopoff compound is inert to reactive metals such as titanium at the high diffusion bonding temperatures, and permits relatively low breakthrough pressure-time product during superplastic forming, thereby preventing excessive strain or rupture of the metal through non-superplastic deformation.
    Type: Grant
    Filed: August 25, 1978
    Date of Patent: September 2, 1980
    Assignee: Rockwell International Corporation
    Inventors: Edward D. Weisert, Suphal P. Agrawal
  • Patent number: 4211354
    Abstract: A method is provided for alleviating the stress damage in metallic matrix composites, such as laminated sheet or foil composites, wherein discontinuities are positively introduced into the interface between the layers so as to reduce the thermal stress produced by unequal expansion of the materials making up the composite. Although a plurality of discrete elements could be used to form one of the layers and thus carry out this purpose, the discontinuities are preferably produced by simply drilling holes in the metallic matrix layer or by forming grooves in a grid pattern in this layer.
    Type: Grant
    Filed: April 6, 1978
    Date of Patent: July 8, 1980
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Charles A. Hoffman, John W. Weeton, Norman W. Orth
  • Patent number: 4197977
    Abstract: A composite titanium or titanium alloy structure is made by diffusion bonding upper and lower face sheet components onto opposite sides of a honeycomb core component at an elevated temperature within a furnace under a high vacuum. The components are supported in the furnace upon a slip sheet carried by a glass pad which is, in turn, supported by a lower platen. The weight of an upper platen is transmitted through a slip sheet to the upper face sheet component. The upper face sheet component includes an internal passageway which is coupled to an inert gas supply to expand the passageway by superplastic forming. The upper wall surface of the passageway is restrained by the upper platen so that only the lower wall surface of the passageway is displaced and received in underlying recesses in the honeycomb core component. After expansion, the displaced wall surface is diffusion bonded to the honeycomb core component.
    Type: Grant
    Filed: April 20, 1978
    Date of Patent: April 15, 1980
    Assignee: The Boeing Company
    Inventor: Czeslaw Deminet
  • Patent number: 4120843
    Abstract: A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.
    Type: Grant
    Filed: April 10, 1978
    Date of Patent: October 17, 1978
    Assignee: International Business Machines Corporation
    Inventors: Joseph G. Ameen, Glenn V. Elmore, Anthony E. Peter
  • Patent number: 4081026
    Abstract: A method for the manufacture of hollow articles comprising providing a first sheet of metal, placing on said first sheet a weld-inhibiting material in a pattern corresponding to a predetermined configuration of fluid passageways, forming an assembly by superimposing a second sheet of metal upon the surface of said first sheet bearing said pattern, pressure welding said assembly in the areas thereof not separated by weld-inhibiting material, and expanding the areas separated by said weld-inhibiting material, wherein the weld-inhibiting pattern provided is so configured that when said assembly is expanded, a marker structure is formed which is situated so as to guide the determination of the final linear dimensions of said article. The foregoing marker enables the rapid, automated sizing of articles such as heat exchange panels produced by the above process.
    Type: Grant
    Filed: August 3, 1976
    Date of Patent: March 28, 1978
    Assignee: Olin Corporation
    Inventors: Charles A. Kleine, Verne L. Middleton
  • Patent number: 4040159
    Abstract: A method of forming an airfoil-shaped body is described which includes providing a core with cooling channels recessed into the surface thereof, affixing a calendered multilayer flexible mesh screen substrate to the surface of the core, applying braze alloy and brazing the assembly thereby filling completely the mesh screen pores and bonding further the mesh member substrate to the core, and applying an erosion-corrosion resistant layer over the brazed mesh member substrate completing the airfoil-shaped body.
    Type: Grant
    Filed: October 29, 1975
    Date of Patent: August 9, 1977
    Assignee: General Electric Company
    Inventors: Kenneth A. Darrow, Paul H. Kydd, John W. Daly
  • Patent number: 4026455
    Abstract: A rotatable drum type regenerator for an automobile gas turbine engine is manufactured from a steel matrix and rim of thin stock connected in radial sliding and sealing relationship at the hot axis end region to accommodate thermal cycling and to prevent rupture between the rim and matrix, and positively connected by brazing at the cooler axial end region to withstand the various forces therebetween.
    Type: Grant
    Filed: February 10, 1975
    Date of Patent: May 31, 1977
    Assignee: Chrysler Corporation
    Inventors: George J. Huebner, James H. Whitfield
  • Patent number: 4023251
    Abstract: Before skins are brazed on airfoil cores having cooling channels recessed into the surfaces thereof, the surfaces of the cooling channel walls are covered with a layer of oxide material. The oxide formation selected is one that is not reducible in dry hydrogen. Thereafter, when the normally employed hydrogen or vacuum brazing operation is conducted to apply the airfoil skin, the oxide-covered sides of the cooling channels will not be wet by the molten braze alloy. Plugging of the covered cooling channels during manufacture is thereby greatly reduced.
    Type: Grant
    Filed: July 30, 1975
    Date of Patent: May 17, 1977
    Assignee: General Electric Company
    Inventor: Kenneth A. Darrow
  • Patent number: 4021901
    Abstract: A method for the manufacture of hollow articles comprising providing a first sheet of metal, placing on said first sheet a weld-inhibiting material in a pattern corresponding to a predetermined configuration of fluid passageways, forming an assembly by superimposing a second sheet of metal upon the surface of said first sheet bearing said pattern, pressure welding said assembly in the areas thereof not separated by weld-inhibiting material, and expanding the areas separated by said weld-inhibiting material, wherein the weld-inhibiting pattern provided is so configured that when said assembly is expanded, a marker structure is formed which is situated so as to guide the determination of the final linear dimensions of said article. The foregoing marker enables the rapid, automated sizing of articles such as heat exchange panels produced by the above process.
    Type: Grant
    Filed: November 17, 1975
    Date of Patent: May 10, 1977
    Assignee: Olin Corporation
    Inventors: Charles A. Kleine, Verne L. Middleton
  • Patent number: 3981426
    Abstract: A corrosion-resistant structural shape, clad by rolling and welding, has a base material consisting of an austenitic manganese steel and a cladding material containing alloy elements tending to phase precipitations. In a method of producing a structural shape of the above described type from a cladding pile composed sandwich-like of two base material plates and two smaller cladding sheet bars, a separating layer is inserted between the cladding sheet bars and the gap surrounding the cladding sheet bars is closed all around by means of weld strips fused with the base material plates. First the edges of the base material plates are ground beveled and then the ground-off material is replaced by building-up welding layers of carbon steel. The pile is composed and the weld strips are inserted and connected with the claddings by means of root seams along the circumference of the pile.
    Type: Grant
    Filed: December 4, 1974
    Date of Patent: September 21, 1976
    Assignee: Vereinigte Osterreichische Eisen- und Stahlwerke-Alpine Montan Aktiengesellschaft
    Inventor: Giswalt Veitl
  • Patent number: 3973716
    Abstract: A process for producing hollow gold jewelry. A temporary substrate of soft iron is plated with precious metal leaf. A strip cut form a bimetallic plate thus plated is drawn, with incorporation of a temporary soft-iron core, to a precious metal covered wire, which can be fabricated into hollow pieces of jewelry, the soft iron being eliminated by an aqueous solution of H.sub.2 SO.sub.4.
    Type: Grant
    Filed: December 31, 1974
    Date of Patent: August 10, 1976
    Assignee: Flamor S.A.
    Inventor: Paul Flamand