Abstract: A liquid dosing device, comprising an open-ended vitreous capillary tube which is connected to a reservoir for liquid, heating means for heating the liquid in the reservoir to a given temperature T.sub.1, and a ceramic actuator element which is in intimate contact with a portion of the external surface of the tube. The tube and the element are mutually adhered using a solder having a melting point in excess of T.sub.1. The liquid in the reservoir may be molten solder or glue.

Abstract: An alignment apparatus is provided for ensuring proper positioning of a wire bonding capillary during installation of the wire bonding capillary onto the horn of a wire bonding machine. The apparatus ensures that the capillary is in a correct position relative to its longitudinal axis and is also in a desired rotational position with respect to the horn. The apparatus includes a first arm and a second arm which are movable toward each other to engage an outer surface of the horn thereby gripping the horn between the first and second arms. The apparatus also includes a support for holding the capillary. When the apparatus is properly positioned on the horn the support holds the capillary in a predetermined position in which the capillary is properly aligned with respect to the horn. A locking mechanism of the horn may then,be used to lock the capillary onto the horn.

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

Abstract: An alignment system is provided for aligning a wire bonding capillary. The system includes at least one indicator coupled to the capillary. The system can include a plurality of indicators on the capillary and one or more detectors spaced from the capillary. An indicator and detector cooperate to produce a signal having a strength. The strength of the signal is based on the distance between the indicator and the detector. The signal strength corresponds to a rotational alignment of the capillary. The system further includes a display for displaying the strength of the signal. The at least one indicator or the at least one detector may be coupled to a computer which controls rotation of the capillary. The various system components can be incorporated into a wire bonding machine upon which the capillary is mounted.

Abstract: A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.

Abstract: A rotation device (100) provides precise, stepwise rotation of a wire bonding capillary (10) about the longitudinal axis of the capillary. This enables the capillary (10) to be rotated to different angular alignments to perform wire bonding in different directions. The rotation device (100) can be a click ring-type device, a cam-type device or any other device to provide stepwise rotation. At least a part of the rotation device (100) is coupled to the capillary (10). Another part of the rotation device is separate from the capillary but engageable with the first part to provide rotation. Indicators may be positioned on the capillary to provide signals to detectors. The signals can be used to initially align the capillary and to realign the capillary during wire bonding. A computer may be used to provide automated control of the indicators and detectors, and automated rotation of the rotation device.

Abstract: An apparatus (304) and method is provided for bonding wire (104) to bond sites (108) of integrated circuits (110), lead frames, and packages at room temperatures. In preferred embodiments a ball end (106) of a gold wire (104) is bonded to an aluminum bond pad (108). Apparatus (304) includes a high frequency ultrasonic energy source (306) designed to provide ultrasonic energy at frequencies above 200 kHz. The ultrasonic energy is transmitted to the bonding interface via capillary (302). In this manner, a strong bond is formed between ball end (106) and bonding site (108). The apparatus and method provided enable bonds of sufficient shear strength to be fabricated in a sufficiently short bonding time even at ambient temperatures, enabling the efficient fabrication of temperature sensitive devices such as micromechanical structures.

Abstract: A bonding head is provided for a wire bonding machine which comprises a capillary connected to a transducer for applying pressure and ultrasonic energy to a wire guided into contact with a surface to which a wire bond is to be formed. The transducer is biased by a spring mounted at one end to a linear motor for adjustment of the urging force of the spring. The actual force applied to the wire is measured by detecting means. Control means are provided which are connected to the linear motor for adjusting the urging force of the spring, to thereby obtain a desired pressure to be applied to the wire.

Abstract: A non-nodal mounting system for an ultrasonic element includes a drive ring and a flexible disk. The drive ring is rotatably connected to a mounting housing. The flexible disk is fixed at a radially inner portion to the ultrasonic element and at a radially outer portion to the drive ring. The flexible disk can include flexible fingers for reducing the force transmitted to the drive ring. Also, the flexible disk can include an inner annular ring at the radially inner portion and a concentric annular ring at the radially outer portion. The rings are connected by the fingers.

Abstract: A device for ultrasonic treatment of a workpiece which at least two treatment spots has at least two resonant units which are adapted to be associated with corresponding ones of said treatment spots, each of the resonant units having a convertor and a sonotrode connected with the convertor, a joint mounting body arranged so that the resonant units are mounted on the joint mounting body in an arrangement which is dependent on a position of the treatment spots on the workpiece, and a displacement unit which is common for the resonant units and is coupled with the mounting body.

Abstract: An oven (100) for reflowing circuit board assemblies (102). Air is pumped into a heating chamber (104) from which the air is then communicated through one or more apertures (112) in a panel (114) to a reflow chamber (106). A conveyor track (108) conveys the assemblies (102) through the reflow chamber (106). In use, the oven turbulates the air sufficient to vibrate components on the assemblies (102) and, thereby, realigns components inadvertently displaced off pads of the assemblies (102).

Abstract: A method for connecting a first bonding point and a second bonding point with a wire comprising the steps of: raising a capillary through which the wire passes slightly after the second reverse operation that involves the movement of the capillary in the opposite direction from a second bonding point, moving the capillary to a position which is more or less above the first bonding pint, and then raising the capillary while delivering the wire; resulting in the formation of a kink in the inclined portion of a trapezoidal wire loop employed in the wire connection in semiconductor devices.

Abstract: In a wedge tool having a heating device, a metal rod having a heating line, a conductive wire or a thin film-type heating plate is disposed at a predetermined portion of the wedge tool, to which power is supplied through a power supply unit, respectively, in order to provide heat to the wedge tool in wire bonding process. By having such a construction, the wedge tool has the heating system for generating heat, so that a substantially preferable and remarkable bonding force can be obtained.

Abstract: A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and defined by the bore and the exterior surface, the bore terminating at an end portion (9) of said body. The wall has at one end portion thereof first (21) and second opposing sectors spaced from each other by third and fourth opposing sectors (31), the first sector having a thickness greater than the rest of the sectors and the second sector having a thickness intermediate the first sector and the third and fourth sectors. A first bond, generally a ball bond (3), is formed at a first bonding location with the capillary. The capillary is moved to a second bonding location and a stitch bond is formed at the second location while the portion of the capillary of greater thickness is downstream of the path of travel of the capillary while making the stitch bond.

Abstract: A bonding head is provided for a wire bonding machine which includes a wedge (2) connected to a transducer (3) for applying pressure and ultrasonic energy to a wire (1) guided into contact with a substrate to which a bond is to be formed. A support system (7, 8, 9) is provided for simultaneously securing the transducer (3) to the bonding head frame (12) and variably adjusting the contacting pressure of the wire to the substrate. Springs (9a, 9b), preferably leaf springs, urge the transducer (3), while a linear actuator (8) is arranged to variably tension the springs (9a, 9b) to adjust the bond force.

Abstract: An ultrasonic welding apparatus includes an exciter unit for generating ultrasonic vibration; a horn having a forward end and rotatable about a horizontal axis passing through the center of the horn; and a plurality of welding tips projecting from an outer circumferential surface of the forward end of the horn. The welding tips have different sizes and are rotated about the horizontal axis.

Abstract: The invention relates to a device for compacting and then welding electric conductors, especially for making through or terminal connections of flexes by means of ultrasound in a compression chamber adapted to the conductor and adjustable for height and width, in which the conductors to be welded are first compacted and then welded. The compression chamber is adjustable to a predetermined height-width ratio regardless of the cross section of the conductors to be welded.

Abstract: A method and apparatus is disclosed for ultrasonically welding at their edges a strip of their copper foil to a second strip of supporting metal, preferably aluminum or stainless steel having a thickness greater than the copper foil. The welded strips are subsequently sheared into panels for use in making printed circuit boards.

Abstract: A resonator for an ultrasonic bonding apparatus, which comprises an ultrasonic horn having a recessed portion in the exterior surface and a threaded hole, a bonding working portion having a chip base fitted in the recessed portion and a chip body provided on the chip base, and a screw member having a screw portion to fit into the threaded hole and a through-hole through which the chip body is put without contact with said screw member so that the screw member is screwed into the threaded hole, the bonding portion is fixed to the ultrasonic horn, with the chip body projecting through the through-hole for contact with a workpiece.

Abstract: An ultrasonic bonding method and apparatus utilizes a locking mechanism which limits motion of an ultrasonic bonding tool tip during formation of a bond. In a basic embodiment of tie invention, motion of the tool tip in the up/down, z-axis direction is inhibited during bond formation. Preferably motion in the longitudinal, in/out y-axis direction is also inhibited, and motion in the lateral, x-direction may optionally be limited. A separate locking mechanism or brake is provided for each orthogonal direction in which it is desired to inhibit motion during bond formation. Each brake is actuated in response to a bond initiation command signal, locking the tool tip against motion in particular coordinate directions prior to application of ultrasonic energy to a bond site, and maintaining the tip in that position for a period sufficient to melt wire insulation, weld the stripped wire to a bond site such as the microcircuit pad or lead, and allow the weld to cool and solidify.

Abstract: An ultrasonic welder is provided which comprises a base, a transducer, a tip, an anvil, a gathering tool, and an actuator for moving both the anvil and gathering tool. The anvil has angled sidewalls to improve weld efficiency.

Abstract: A wire guide is provided for use in a wire bonding machine. The guide can be releasably attached to a bonding wedge and a transducer of the bonding head. The wire guide comprises guide members integrally formed with the wire guide body for feeding the bonding wire to the wedge. Securement means are integrally formed with the guide body for releasably mounting the guide. The securement means are formed such that movement of the guide body with respect to the bonding head allows its release.

Abstract: An ultrasonic apparatus and method for charging a coil with a refrigerant gas is described wherein a tube used to convey the gas into the cooling coil is welded shut on both sides of a cutting line so that gas in the tube cannot escape after the charging step has been completed. Die elements to enable such severing of the tube are described with each having corresponding spaced apart welding surfaces and with one of the elements having a cutting edge between its welding surfaces to cut the tube as its internal wall is sealed with an ultrasonic welder.

Abstract: An ultrasonic horn used in, for instance, wire bonding having a structure for holding a capillary therein, the capillary holding structure including an external screw section which protrudes from the end surface of the horn and a spacer mount which is larger in diameter than the external screw section and formed on the root portion of the external screw section. A ring-form spacer is mounted on the spacer mount, and the spacer has a shape that prevents the rotation of the spacer on the spacer mount and is formed so that its vertically opposing end portions are positioned above and below the capillary attachment hole, and the length between the horizontally opposing end portions of the spacer is shorter than the length of the vertically opposing end portions.

Abstract: The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.

Abstract: A thermosonic ribbon bonding process uses a combination of a relatively low temperature and a high frequency to bond a ribbon conductor to conductive bonding sites of a system level support structure, such as a space/airborne antenna, containing circuit components whose characteristics might otherwise be degraded at an elevated temperature customarily used in device-level thermosonic bonding processes. By relatively low temperature is meant a temperature no greater than the minimum temperature that would potentially cause a modification of the circuit parameters of at least one of the system's components. Such a minimum temperature may lie in a range on the order of 25-85.degree. C., while the ultrasonic bonding frequency preferably lies in a range of from 122 KHz to 140 KHz. For gold ribbon to gold pad bonds, this high frequency range achieves the requisite atomic diffusion bonding energy, without causing fracturing or destruction of the gold ribbon or its interface with the gold pad.

Abstract: A novel low mass transducer for bonding machines comprises a transducer generator which mounts on or is coupled to a bonding tool of the type used for ball bonding, wedge bonding and TAB bonding. The preferred embodiment transducer comprises a magnetostrictive or piezoelectric element which mount on the outside surface of the bonding tools used in a bonding operation, thus eliminating convention transducers which also serve as a bonding tool holder. The present invention bonding tool serves as the base or mount for a transducer made in the form of a sleeve or tube which mounts on or couples to the bonding tool. The novel transducer/bonding tool or transducers also serve as a sensor which can monitor the quality of a bond while it is being made.

Abstract: In a capillary used in a wire bonding apparatus that has a wire threading hole through which a bonding wire of 10 to 30 .mu.m diameter passes and is provided with two chamfers, i.e., lower and upper chamfers, near the tip end of the wire threading hole, the upper chamfer has a chamfer angle of 3 to 19 degrees and a depth of 20 to 50 microns.

Abstract: A lead bonding tool for bonding leads to respective semiconductor chip contacts. The bonding tool having a substantially flat bonding surface region with a depression therein. The depression allows the tool to grasp the lead during the bonding step and further facilitate the transmission of energy from the tool to the lead/contact interface to form the bond. Certain embodiments of the lead also have grooves and/or guides which are adapted to capture and better align the elongated lead sections with their respective chip contacts during the bonding step.

Abstract: A wire bonding head supported for movement upwardly and downwardly having a wire bonding tool connected to an ultrasonic driver in order to sonically bond a wire to an underlying electrical component. The wire is fed to the bonding tool, and fed broken and clamped by a linkage connected to at least one stepper motor. A processing unit is mounted on the bonding head for controlling the clamping, feeding, and breaking of the wire.

Abstract: The present invention concerns a self locking system for holding a wire bonding tool in a wire bonding transducer and comprises an unitary cam key rotatably mounted in a cam key aperture extending through an anti-node end of an ultrasonic transducer. A cam surface on the cam key is operable to lock a bonding tool mounted in a substantially vertical bonding tool aperture when rotated less than 360.degree. in said cam key aperture.

Abstract: A ultrasonic tool horn for use in ultrasonic machining, welding, etc. has a horn main body made of a heat-treatable aluminum alloy. The aluminum alloy is heat treated so as to be as hard as 100 or more on the Vickers hardness scale. In one embodiment, a thin intermediate layer of a non-heat-treatable aluminum alloy is provided between the horn main body and a ceramic tool attached to a slender end portion of the horn main body.

Abstract: A bonding tool for use in tape automated bonding and wedge bonding of gold and gold plated leads or wires to contact pads of electronic devices is fabricated of Aluminum Oxide ceramic without electrically conductive metallic binders. The bonding tool has a microscopically rough surface that is brought into compressive contact with the gold leads or wires and manipulated ultrasonically or thermosonically in order to form a molecular bond between the gold lead or wire and the contact pad of the electronic device. The Aluminum Oxide ceramic bonding tool is sufficiently hard that it does not readily deform under normal ultrasonic bonding conditions and is not readily abraded by the gold leads.

Abstract: The power supply may be operated during a given cycle sequentially to produce high and low frequency drive signals for operating an ultrasonic transducer for sequentially producing an ultrasonic output at the two frequencies to carry out bonding operations at two different bond sites respectively.

Abstract: A single-point bonder is provided ultrasonically bonding lead fingers extending along different directions onto a semiconductor chip with satisfactory reliability. The bonder contains a first bonding tool for bonding a first set of lead fingers onto a semiconductor chip using a first ultrasonic vibration along a first direction, and a second bonding tool for bonding a second set of lead fingers onto the chip using a second ultrasonic vibration along a second direction different from the first direction. Preferably, the first bonding tool has a first ultrasonic horn for transmitting the first ultrasonic vibration. The second bonding tool has a second ultrasonic horn for transmitting the second ultrasonic vibration. The first and second horns extend along the first and second directions, respectively. The first and second ultrasonic vibrations are parallel to the longitudinal directions of the first and second horns, respectively.

Abstract: In ultrasonic wirebonding apparatus, vibrations produced using a tubular piezoelectric (piezoceramic) actuator, driven by electrical current at an ultrasonic frequency, are used to provide energy for the wirebonding process. An assembly including means for mounting the actuator at a proximal end, the actuator itself, and a bonding tip extending from a distal end of the actuator, are moved by a carrier between the various points at which wirebonding is to occur. The bonding wire is fed through a passageway in this assembly. The carrier slides on a first carriage for movement into engagement with the workpiece. The first carriage slides in a first direction on a second carriage, which in turn slides in a second direction, to move between points at which wirebonding is to occur. The workpieces, such as circuit chips being manufactured, are moved into a workspace for wirebonding, are held therein during processing, and are subsequently removed from the workspace.

Abstract: An ultrasonic welder is provided which automatically recognizes and reliably welds varying weld zone sizes of material. The welder comprises a base, a transducer, a tip, an anvil, a gathering tool, and an actuator for moving both the anvil and gathering tool to define a weld zone. An encoder reads movement of the actuator and a microprocessor determines weld zone size to control the transducer for maximizing weld efficiency. Preferably, a horn is mounted between the transducer and tip and the horn is dynamically mounted along an axis of the transducer to transmit the maximum amount of ultrasonic energy to the weld.

Abstract: An ultrasonic wirebonder has a horn and a transducer for vibrating the horn at a predetermined frequency. A magnet affixed to the horn generates a magnetic field. A coil coupled to the magnet has an output signal induced from the magnetic field moving relative to said coil. A filtering means filters the output signal from the coil to determine the reliably of the ultrasonic bond. An output device is used to monitor the output signal and determine whether the bond is reliable.

Abstract: A device for welding or cutting a workpiece via ultrasound. The device features a sonotrode and a drive unit for the sonotrode. The drive unit incorporates at least two ultrasonic oscillating units. Drive units of this type allow for vibrations to be set up in larger sonotrodes, and also allow for a more uniform amplitude distribution.

Abstract: A welder using an ultrasonic vibration includes a vibration direction converter for diversely converting the direction of vibration generated by a vibrator according to the properties of a welded material, so that welding efficiency is improved. The vibration direction converter is made to be disassembled or assembled, so that the replacement of the rod is easy when it experiences vibration fatigue. Efficiency is maximized because plural welding operations can be made simultaneously, since plural vibration-transmitting directions due to a symmetrical multiple structure are possible by means of the vibration-direction converter.

Abstract: A process for bonding a flip chip (20), of the type having an active face provided with conductive bumps, to a substrate (22) so that its active face is oriented toward the substrate (22). The flip chip (20) is coupled through a vacuum to the distended end (32) of an ultrasonic horn (30) and then lowered onto the substrate (22) so that the bumps (20b) align with a bonding pattern on the substrate (22). A bias force is applied through the ultrasonic horn (30) to the backside of the flip chip (20), in a direction normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the bias force is applied such that the ultrasonic energy is isothermally transferred in a direction normal to and across the flip chip (20) to the substrate (22) for creating a diffusion bond therebetween.

Abstract: An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.

Abstract: A method and apparatus for forming electric connections between predetermined bonding pads of semiconductor electronic devices and respective electric contact leads formed on a frame holding the devices in a tidy arrangement is available. The apparatus includes a supporting structure, a mechanism for advancing the frame along a longitudinal direction in a work plane on the supporting structure, a bonding head, and a high-precision X-Y table carrying the bonding head for accurately setting the bonding head in the work plane. The bonding apparatus further includes a carriage guided on the supporting structure for movement in a transverse direction to the longitudinal direction, the X-Y table being mounted on the carriage, The bonding head working range always spans a sufficiently large area for a single device, thereby enabling connections to be made even when the side-by-side devices are arranged in two or more rows.

Abstract: A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).

Abstract: There is provided an ultrasonic generator of the type having a power amplifier. The output of the power amplifier is connected across and through an ultrasonic transducer which holds a bonding tool to be engaged on a bonding target. A current sufficient to induce a resonant frequency is applied across the ultrasonic transducer in air and before touch down on the bonding target while continuously monitoring the current and voltage across the transducer. A touch down detector circuit is coupled to the current and voltage being monitored and initiates a touch down signal which is employed to control these Z-axis drive motor of an automatic wire bonder within several microseconds of the actual touch down time.

Abstract: In bonding machines such as a wire bonding machine, a lock which makes the changing of bonding data impossible is placed on specific data setting mode items, which are stored in a memory, via a data setting mode locking circuit. The changing of data in such locked data setting modes is made possible only if a password inputted is the same as a previously set-in password.

Abstract: An ultrasonic bonder for coupling lead frame leads to associated traces on a substrate is disclosed. In one aspect of the invention, the bonder includes an ultrasonic transducer. A base supports the transducer at one end, while a bonding tool is attached to the other end. The bonding tool is suitably sized for engaging a lead frame lead to facilitate connecting the lead frame lead to an associated trace on a substrate. A pair of force sensors are positioned on opposite sides of the transducer's longitudinal axis. Each force sensor has a sensor axis that is arranged at an acute angle relative to the longitudinal axis of the transducer for detecting the forces applied to the bonding tool and for outputting a force signal indicative of the detected forces. A controller receives the force signals and outputs a drive signal to the transducer to facilitate mechanically bonding the selected lead frame lead to its associated trace.

Abstract: To provide an ultrasonic bonding machine in which a resonator is arranged horizontally or vertically while it is supported at both ends and a resonator for use in the same. The interface Wa is placed on the mount 13 arranged in a stationary state in a lower portion of the working space 2 open in forward, right and left directions, the resonator 7 is moved down by the pressure mechanism 3 from above, and the interface Wa is pressure-held properly between the bonding working portion 11 and the mount 13 while it is in a stationary state and bonded with vibration energy of a vertical ultrasonic wave. The resonator 7 is assembled by interconnecting the ultrasonic horn having the bonding working portion 11 and two boosters having support portions by means of screws in such a manner that they are coaxial with one another, thereby facilitating exchange of each element. In addition, the resonator can be arranged vertically while it is supported at both ends in the front of the main body.

Abstract: Improved ultrasonic wire bonders, and improvements to ultrasonic wire bonding transducers that are used with such ultrasonic wire bonders. The improvements to the ultrasonic wire bonding transducer includes driver-node mounting of the transducer and a clamping arrangement for a bonding tool in the transducer. The driver-node mounting of the transducer is achieved by mounting it in the ultrasonic bonder such that a 3/4--wavelength distance is created between a mounting bracket of the transducer and a distal end of the transducer at which the bonding tool is disposed. As a result, vibrational problems caused by the transducer not being located at the node are eliminated. The driver-node mounting aspect of the present invention provides a shorter overall transducer and concentrates the mass at the driver end for less tool impact, and reduces manufacturing variables related to achieving a one-half wavelength distance between the driver node and the transducer node.

Abstract: An automatic soldering machine for soldering a rope chain comprises a pair of gears, each with a peripheral surface defining a trench which engages one of the strands of the rope chain and which is rotatable to precisely feed and place successive link junctions of the chain relative to hollow solder applying needles. The needles are reciprocally movable and serve to apply a premeasured amount of solder paste at the link junctions of the rope chain. A heater, for example, an induction heater, heats the chain, causing the solder to flow and then set and thereby secure the chain links together.