Bonding Nonmetals With Metallic Filler Patents (Class 228/121)
  • Patent number: 10384283
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with a silicon and an alloying element under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: August 20, 2019
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Brent Elliot, Alfred Grant Elliott
  • Patent number: 10375825
    Abstract: This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 ?m or less that is formed between the nitride layer and the copper plate.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu
  • Patent number: 10373928
    Abstract: A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive from the inter-contact region, and provide electrical communication between the respective sets of electrical contacts. The liquid curable adhesive is then cured to form a solid matrix which maintains a relative compression between the respective sets of electrical contacts. One embodiment of the module comprises a high-speed superconducting circuit which operates at cryogenic temperatures.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: August 6, 2019
    Assignee: Hypres, inc.
    Inventor: Vladimir V. Dotsenko
  • Patent number: 10364190
    Abstract: A method of producing a component of a composite of diamond and a binder, wherein a Hot Isostatic gas Pressure process (HIP) is used, includes the step of enclosing a de-bound green body having compacted diamond particles in an infiltrant. The method includes the further steps of enclosing the de-bound green body and the infiltrant in a Zr-capsule that has Zirconium as a main constituent and sealing the Zr-capsule, and applying a predetermined pressure-temperature cycle on the unit formed by the de-bound green body, infiltrant and capsule in which the infiltrant infiltrates the de-bound green body and the de-bound green body is further densified in the sense that the volume thereof is decreased.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: July 30, 2019
    Assignee: SANDVIK INTELLECTUAL PROPERTY AB
    Inventors: Susanne Norgren, Johan Sundstrom, Malin Martensson, Anna Ekmarker
  • Patent number: 10357840
    Abstract: The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: July 23, 2019
    Assignee: FEW Fahrzeugelektrik Werk GmbH & Co. KG
    Inventors: Roy Gleisberg, Björn Schneider, André Jenrich
  • Patent number: 10319426
    Abstract: A semiconductor structure includes an electrode, a ferroelectric material adjacent the electrode, the ferroelectric material comprising an oxide of at least one of hafnium and zirconium, the ferroelectric material doped with bismuth, and another electrode adjacent the ferroelectric material on an opposite side thereof from the first electrode. Related semiconductor structures, memory cells, semiconductor devices, electronic systems, and related methods are disclosed.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: June 11, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Albert Liao, Wayne I. Kinney, Yi Fang Lee, Manzar Siddik
  • Patent number: 10319664
    Abstract: A bonded body is provided in which an aluminum alloy member formed from an aluminum alloy, and a metal member formed from copper, nickel, or silver are bonded to each other. The aluminum alloy member is constituted by an aluminum alloy in which a concentration of Si is in a range of 1 mass % to 25 mass %. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A compound layer, which is formed through diffusion of Al of the aluminum alloy member and a metal element of the metal member, is provided at a bonding interface between the aluminum alloy member and the metal member. A Mg-concentrated layer, in which a concentration of Mg is to 3 mass % or greater, is formed at the inside of the compound layer, and the thickness of the Mg-concentrated layer is in a range of 1 ?m to 30 ?m.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: June 11, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo
  • Patent number: 10160066
    Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: December 25, 2018
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Xin Yang, Blair E. Carlson, Yongbing Li
  • Patent number: 10155301
    Abstract: Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) comprising a polycrystalline diamond (“PCD”) table including at least a portion having aluminum carbide disposed interstitially between bonded-together diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a PCD table bonded to the substrate. The PCD table includes a plurality of bonded-together diamond grains defining a plurality of interstitial regions. The PCD table further includes aluminum carbide disposed in at least a portion of the plurality of interstitial regions.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: December 18, 2018
    Assignee: US SYNTHETIC CORPORATION
    Inventors: Paul Douglas Jones, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess
  • Patent number: 10153183
    Abstract: A method for the joining of ceramic pieces into an assembly adapted to be used in semiconductor processing. The joined pieces are adapted to withstand the environments within a process chamber during substrate processing, chamber cleaning processes, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The ceramic pieces may be aluminum nitride and the pieces may be brazed with aluminum. The joint material is adapted to withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The joint is adapted to provide a hermetic seal across the joint. The joined pieces are adapted to be separated at a later time should rework or replacement of one of the pieces be desired.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: December 11, 2018
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Patent number: 10071543
    Abstract: A precipitation-hardened partial transient liquid phase bond and method of making same is provided. The bond is created at a bonding temperature and then, based on the phase diagrams corresponding to the materials in the interlayer between the bonded materials, the bond is held at a lower heat-treatment temperature to achieve a precipitation-hardened structure.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: September 11, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventor: Grant O. Cook, III
  • Patent number: 10014273
    Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: July 3, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas E. Lombardi, Donald Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran
  • Patent number: 10000422
    Abstract: The present invention provides a ceramic to ceramic joint and methods for making such a joint. Generally, the joint includes a first ceramic part and a second ceramic part, wherein the first and second ceramic parts each include a ceramic-carbide or a ceramic-nitride material. In some cases, an aluminum-initiated joint region joins the first and second ceramic parts. This joint region typically includes chemical species from the first and second ceramic parts that have diffused into the joint region. Additionally, the first and second ceramic parts each typically include a joint diffusion zone that is disposed adjacent to the joint region and which includes aluminum species from the joint region that have diffused into the joint diffusion zone. Other implementations are also described.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: June 19, 2018
    Assignee: CoorsTek, Inc.
    Inventors: Joseph R Fellows, Merrill Wilson
  • Patent number: 9969654
    Abstract: A means for attaching a metallic component to a non-metallic component using a compliant material having thermal properties intermediate those of the metallic component to a non-metallic component is provided. The method can accommodate CTE mismatches and wear-type problems common to many assemblies of dissimilar materials. In particular, the method provides a sufficient wear surface to accommodate relative motion and provide a durable wear surface that does not excessively wear/gall/mico-weld itself together and provides the necessary damping and motion for proper operation in aeronautical applications.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: May 15, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Benjamin T. Fisk, Grant O. Cook, III
  • Patent number: 9968012
    Abstract: A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: May 8, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo, Yoshirou Kuromitsu
  • Patent number: 9947560
    Abstract: An integrated circuit (IC) package, assembly tool and method for assembling an IC package are described herein. In a first example, an IC package is provided that includes a package substrate, at least a first integrated circuit (IC) die and a cover. The first integrated circuit (IC) die is mechanically and electrically coupled to the package substrate via solder connections. The cover is bonded to the package substrate. The cover encloses the first IC die and is laterally offset from a peripheral edge of the package substrate.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: April 17, 2018
    Assignee: XILINX, INC.
    Inventors: Mohsen H. Mardi, David Tan, Gamal Refai-Ahmed
  • Patent number: 9931717
    Abstract: An assembly comprising: two ceramic bodies, which are joined by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced, in each case, from the ceramic bodies by at least 1 ?m, and an average composition CK with a liquidus temperature Tl(CK), wherein the composition CK has a coefficient of thermal expansion ?(CK), wherein ?(CK)=m·?(K), wherein m?1.5, especially m?1.3 and preferably m?1.2, wherein ?(K) is the average coefficient of thermal expansion of the ceramic material of the ceramic bodies, wherein the joint has boundary layers, which border on the ceramic body, wherein at least one of the boundary layers, which lies outside of the core volume, has an average composition CB with a liquidus temperature Tl(CB), which lies not less than 50 K, preferably not less than 100 K, and especially preferably not less than 200 K, under the liquidus temperature Tl(CK) of the average composition CK of the core volume.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: April 3, 2018
    Assignee: ENDRESS + HAUSER GMBH + CO. KG
    Inventors: Andreas Rossberg, Elke Schmidt, Markus Rettenmayr, Peter Siegmund
  • Patent number: 9831211
    Abstract: Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15° C. and less than or equal to about 110° C. or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: November 28, 2017
    Assignees: Samsung Electronics Co., Ltd., Yonsei University Wonju Industry-Academic Cooperation Foundation
    Inventors: Kunmo Chu, Wonsuk Chang, Chanmoon Chung
  • Patent number: 9769963
    Abstract: A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: September 19, 2017
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo, Yoshirou Kuromitsu
  • Patent number: 9764387
    Abstract: A polycrystalline diamond (PCD) with diamond grains includes a first zone of the diamond grains and a second zone of the diamond grains. The first zone forms a working surface and a first catalyzing material is disposed within voids of the diamond grains in the first zone. A second catalyzing material is bonded to the diamond grains disposed in the second zone. The first catalyzing material in the first zone is connected to the diamond grains disposed in the first zone less intimately than the second catalyzing material is bonded to the diamond grains in the second zone.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: September 19, 2017
    Inventor: Rusty Petree
  • Patent number: 9698078
    Abstract: A semiconductor module of the present invention includes: a semiconductor element having a first main surface and a second main surface facing the first main surface, the semiconductor element including a front surface electrode and a back surface electrode on the first main surface and the second main surface, respectively; a metal plate electrically connected to the back surface electrode of the semiconductor element through a sintered bonding material including metal nanoparticles; and a plate-shaped conductor electrically connected to the front surface electrode of the semiconductor element through the sintered bonding material including the metal nanoparticles. The metal plate and the conductor include grooves communicating between a bonding region bonded to the semiconductor element and the outside of the bonding region.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: July 4, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yasunari Hino
  • Patent number: 9662729
    Abstract: A laser guided nano-brazing method for a reinforced aluminum composite material having high volume fraction silicon carbide particles, comprising 4 steps: nanocrystallizing the surface of the reinforced aluminum composite material having high volume fraction silicon carbide particles, preparing solder material, assembling pieces to be soldered, and dual-beam laser brazing. The use of nano-technology for the brazing of reinforced aluminum composite material having high volume fraction silicon carbide particles, and the use of dual-beam laser technology for brazing temperature field control enhance the humidity during the brazing process of said material and filling ability of the solder material, and satisfy the strict requirements of electronic packaging.
    Type: Grant
    Filed: April 27, 2013
    Date of Patent: May 30, 2017
    Assignee: Henan Jingtai Aerospace High-Novel Materials Technology Co., Ltd.
    Inventors: Jitai Niu, Dongfeng Cheng, Zeng Gao, Peng Wang, Qiang Li, Baoqing Zhang, Erzhen Mu, Sijie Chen, Hengze Xian, Gang Zeng, Xitao Wang
  • Patent number: 9610451
    Abstract: One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes providing the housing with a flange forming a recess about an opening through the housing, the opening disposed within the recess. A feedthrough is positioned within the recess so as to form a gap between the flange and an insulator of the feedthrough. A braze preform is then positioned within the recess about the insulator, the braze preform comprising a biocompatible braze material having a melting point less than a ?-transus temperature of the titanium of the housing. The preform is melted at a temperature less than the ?-transus temperature of the titanium of the housing such that the melted braze material fills at least the gap, and then cooled to form a braze joint which bonds the insulator to the housing and hermetically seals the opening.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: April 4, 2017
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Patent number: 9598321
    Abstract: A method and apparatus for providing molten metal infiltration into a component is provided.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: March 21, 2017
    Assignee: Rolls-Royce Corporation
    Inventor: Andrew J. Lazur
  • Patent number: 9556074
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: January 31, 2017
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Patent number: 9370795
    Abstract: A method for applying a wear protection layer to a continuous flow machine component which has a base material comprising titanium is provided. The method includes the following steps: mixing a solder which comprises an alloy comprising titanium and particles which are distributed in the alloy and have a reaction agent; applying the solder to predetermined points of the continuous flow machine component; introducing a heat volume into the solder and the continuous flow machine component so that the alloy becomes liquid and the reaction agent changes through diffusion processes with the solder and undergoes a chemical reaction with the alloy, forming a hard aggregate; and cooling the solder so that the alloy becomes solid.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: June 21, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jochen Barnikel, Susanne Gollerthan, Harald Krappitz, Ingo Reinkensmeier
  • Patent number: 9374893
    Abstract: A production method for a metallized substrate to produce a metallized substrate which comprises: a sintered nitride ceramic substrate; a titanium nitride layer formed on the sintered substrate; and a metal layer containing copper, silver and titanium formed on the titanium nitride layer. The method comprises: a step of layering a first paste layer containing copper powder and titanium hydride powder on the sintered nitride ceramic substrate, to produce a first layered body; a step of layering a second paste layer containing silver-copper alloy powder on the first paste layer of the first layered body, to produce a second layered body; and a step of firing the second layered body, to thereby form the titanium nitride layer and the metal layer on the sintered nitride ceramic substrate.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: June 21, 2016
    Assignee: TOKUYAMA CORPORATION
    Inventor: Naoto Takahashi
  • Patent number: 9358765
    Abstract: A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 ?m. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: June 7, 2016
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Markus Wimplinger, Bernhard Rebhan
  • Patent number: 9355984
    Abstract: An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and connecting the metal layers such that a single metal layer is formed.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: May 31, 2016
    Assignee: Infineon Technologies AG
    Inventors: Irmgard Escher-Poeppel, Eduard Knauer, Thomas Kunstmann, Peter Scherl, Raimund Foerg
  • Patent number: 9333578
    Abstract: Methods of providing a fiber reinforced braze include providing a substrate, disposing at least a first fiber reinforcement layer on the substrate, wherein the at least first fiber reinforcement layer comprises a fiber material, disposing at least a first braze layer on the at least first fiber reinforcement layer, wherein a melt temperature of the braze layer is lower than a melt temperature of the fiber material, and heating the at least first fiber reinforcement layer and the at least first braze layer to bond the fiber reinforced braze to the substrate.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: May 10, 2016
    Assignee: General Electric Company
    Inventors: Yan Cui, Srikanth Chandrudu Kottilingam, Jason Robert Parolini, Dechao Lin
  • Patent number: 9293764
    Abstract: A negative electrode active material for an electric device includes an alloy containing Si in a range from greater than or equal to 17% by mass to less than 90% by mass, Ti in a range from 10% by mass to 83% by mass exclusive, Ge in a range from 0% by mass to 73% by mass exclusive, and inevitable impurities as a residue. The negative electrode active material can be obtained with a multi DC magnetron sputtering apparatus by use of, for example, Si, Ti and Ge as targets. An electric device employing the negative electrode active material can achieve long cycle life, and ensure a high capacity and improved cycle durability.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: March 22, 2016
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Manabu Watanabe, Masao Yoshida
  • Patent number: 9293683
    Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: March 22, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazunobu Irie, Futoshi Ohtsuka, Takeshi Kita, Motoi Hatanaka
  • Patent number: 9263375
    Abstract: A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: February 16, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Lakshminarayan Viswanathan, Lakshmi N. Ramanathan, Audel A. Sanchez, Fernando A. Santos
  • Patent number: 9193632
    Abstract: The invention relates to a method for producing a ceramic-metal connection that is repeatedly subjected to great changes in temperature during use, in which the metal and ceramic are brazed to one another two-dimensionally.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: November 24, 2015
    Assignee: SURFACE IGNITER LLC
    Inventor: Martin Heuberger
  • Patent number: 9146540
    Abstract: A method of fabricating vapor cells comprises forming a plurality of vapor cell dies in a first wafer having an interior surface region and a perimeter, and forming a plurality of interconnected vent channels in the first wafer. The vent channels provide at least one pathway for gas from each vapor cell die to travel outside of the perimeter of the first wafer. The method further comprises anodically bonding a second wafer to one side of the first wafer, and anodically bonding a third wafer to an opposing side of the first wafer. The vent channels allow gas toward the interior surface region of the first wafer to be in substantially continuous pressure-equilibrium with gas outside of the perimeter of the first wafer during the anodic bonding of the second and third wafers to the first wafer.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: September 29, 2015
    Assignee: Honeywell International Inc.
    Inventors: Daniel W. Youngner, Jeff A. Ridley, Son T. Lu
  • Publication number: 20150135844
    Abstract: An assembly, comprising two ceramic bodies, which are connected by means of a joint, which contains an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced from the ceramic bodies, in each case, by at least 1 ?m, especially at least 2 ?m, and wherein the joint has bounding layers, which border on the ceramic body. The the core volume, which includes at least 50% of the volume of the joint, is free of crystalline phases of size greater than 6 ?m, especially greater than 4 ?m, preferably greater than 2 ?m.
    Type: Application
    Filed: June 7, 2013
    Publication date: May 21, 2015
    Inventors: Nils Ponath, Andreas Rossberg, Elke Schmidt
  • Patent number: 9027821
    Abstract: A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: May 12, 2015
    Assignee: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Lea Di Cioccio, Pierric Gueguen
  • Publication number: 20150122875
    Abstract: One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.
    Type: Application
    Filed: January 9, 2015
    Publication date: May 7, 2015
    Applicant: HERAEUS PRECIOUS METALS GMBH & CO. KG
    Inventors: Goran Pavlovic, Jeremy Glynn
  • Publication number: 20150118514
    Abstract: A method of thermal interface material (TIM) assembly includes plating a seed layer on each of a plurality of graphite film layers, each of the graphite film layers comprising parallel-oriented graphite nanoplates, stacking the plurality of graphite film layers, each of the plurality of graphite film layers separated by at least one solder layer, pressing together the stacked graphite film layers, and applying heat to the plurality of graphite film layers and respective at least one solder layer in a vacuumed furnace to form a graphite laminate.
    Type: Application
    Filed: October 30, 2013
    Publication date: April 30, 2015
    Inventors: Yuan Zhao, Dennis R. Strauss, Ten-Luen T. Liao, Vivek Mehrotra, Chung-Lung Chen
  • Publication number: 20150108203
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
    Type: Application
    Filed: May 30, 2014
    Publication date: April 23, 2015
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Publication number: 20150104656
    Abstract: The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.
    Type: Application
    Filed: April 9, 2013
    Publication date: April 16, 2015
    Applicant: LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo Suga, Yoshiie Matsumoto
  • Patent number: 9005799
    Abstract: A battery module and methods for bonding cell terminals of battery cells together are provided. The battery module includes a first battery cell having a first cell terminal, and a second battery cell having a second cell terminal. The battery module further includes an exothermal reactive layer having first and second sides. The first and second sides are disposed adjacent to the first and second cell terminals, respectively. The exothermal reactive layer is configured to ignite to form a bonding joint between the first and second cell terminals in response to a laser beam contacting at least a portion of the exothermal reactive layer.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: April 14, 2015
    Assignee: LG Chem, Ltd.
    Inventor: Alex Khakhalev
  • Publication number: 20150098546
    Abstract: The invention pertains to a nuclear fuel assembly grid or a portion or a part of the grid, such as a grid strap and/or an integral flow mixer that is at least partially constructed of a composition containing one or more ternary compounds of the general formula I: Mn+1AXn??(I) wherein, M is a transition metal, A is an element selected from the group A elements in the Chemical Periodic Table, X is carbon or nitrogen, and n is an integer from 1 to 3.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 9, 2015
    Applicant: WESTINGHOUSE ELECTRIC COMPANY LLC
    Inventors: PENG XU, Edward J. Lahoda
  • Publication number: 20150075289
    Abstract: A method for production of a pressure sensor including a flat flexible membrane made of a ceramic material and a flat rigid support thereof made of a ceramic material is provided. Steps include: —establishing an electric circuit on the membrane; —establishing an electric contact with the outside on the support; —depositing an electrically conductive material on the support; —establishing an electrical and mechanical coupling between the membrane and the support. The electrical coupling between the membrane and the support are performed by deposition and sintering of at least one layer of an electrically conductive sinterable electrical connection material. The mechanical coupling between the membrane and the support are performed by deposition and sintering of at least one layer of sinterable mechanical connection material that is electrically insulating and/or isolated from the layer of sinterable electrical connection material.
    Type: Application
    Filed: March 20, 2013
    Publication date: March 19, 2015
    Inventors: Achille Cogliati, Roberto May, Pietro Regoliosi, Angelo Mario Adamo Albonico
  • Publication number: 20150077895
    Abstract: A member 10 for a semiconductor manufacturing apparatus includes an alumina electrostatic chuck 20, a cooling plate 30, and a cooling plate-chuck bonding layer 40. The cooling plate 30 includes first to third substrates 31 to 33, a first metal bonding layer 34 between the first and second substrates 31 and 32, a second metal bonding layer 35 between the second and third substrates 32 and 33, and a refrigerant path 36. The first to third substrates 31 to 33 are formed of a dense composite material containing Si, SiC, and Ti. The metal bonding layers 34 and 35 are formed by thermal compression bonding of the substrates 31 to 33 with an Al—Si—Mg or Al—Mg metal bonding material interposed between the first and second substrates 31 and 32 and between the second and third substrates 32 and 33.
    Type: Application
    Filed: October 16, 2014
    Publication date: March 19, 2015
    Inventors: Asumi JINDO, Katsuhiro INOUE, Yuji KATSUDA, Takashi KATAIGI, Shingo AMANO, Hiroya SUGIMOTO
  • Publication number: 20150056463
    Abstract: A method for manufacturing a cemented carbide body includes the steps of forming a first part of a first powder composition comprising a first carbide and a first binder phase, sintering the first part to full density in a first sintering operation, forming a second part of a second powder composition comprising a second carbide and a second binder phase, sintering the second part to full density in a second sintering operation, bringing a first surface of the first part and a second surface of the second part in contact, and joining the first and second surface in a heat treatment operation.
    Type: Application
    Filed: March 26, 2013
    Publication date: February 26, 2015
    Inventors: Bo Jansson, Per Jonsson, Tomas Persson
  • Publication number: 20150047234
    Abstract: The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge.
    Type: Application
    Filed: August 15, 2013
    Publication date: February 19, 2015
    Inventor: Kent Winter
  • Publication number: 20150020466
    Abstract: The Present invention relates to a method for manufacturing at least one portion of a seal ensuring gas-tightness between at least one first and one second glass panel in a glazing system, the method including the following steps: depositing a first adhesive layer on a first peripheral area of the first panel and a second adhesive layer on a second peripheral area of the second panel; welding a first metal seal element to the first adhesive layer; welding a second metal seal element or said first metal seal element to the second adhesive layer. According to the invention, the first and second adhesive layers are deposited using a high speed oxy-fuel flame-spraying method.
    Type: Application
    Filed: June 3, 2014
    Publication date: January 22, 2015
    Applicant: AGC Glass Europe
    Inventors: Olivier Bouesnard, Francois Closset
  • Patent number: 8932690
    Abstract: A method for the joining of a ceramic shaft and a ceramic plate into an assembly, such as a heater, adapted to be used in semiconductor processing. The joined pieces are adapted to withstand the environments within a process chamber during substrate processing, chamber cleaning processes, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The ceramic pieces may be aluminum nitride and the pieces may be brazed with aluminum. The joint material is adapted to withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The joint is adapted to provide a hermetic seal across the joint. The joined pieces are adapted to be separated at a later time should rework or replacement of one of the pieces be desired.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: January 13, 2015
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Alfred Grant Elliot, Dennis George Rex, Alexander Veytser, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster
  • Patent number: 8915142
    Abstract: A ceramic component having at least one electrical feedthrough, comprising: a ceramic body, through which a bore extends; and a metal conductor, which is arranged at least sectionally in the bore and which is secured in the bore by means of an active hard solder, or braze, whereby the bore is sealed. The active hard solder fills an annular gap between the metal conductor and the ceramic body, characterized in that the active hard solder has a radially variable, chemical composition.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: December 23, 2014
    Assignee: Endress + Hauser GmbH + Co. KG
    Inventor: Ulfert Drewes