Bonding Nonmetals With Metallic Filler Patents (Class 228/121)
  • Patent number: 11488880
    Abstract: Enclosure technology for electronic components is disclosed. An enclosure for an electronic component can comprise a base member and a cover member disposed on the base member such that the cover member and the base member form an enclosure for an electronic component. In one aspect, the base member can have at least one via extending therethrough. The at least one via can be configured to electrically couple an enclosed electronic component with another electronic component external to the enclosure. In another aspect, the cover member can include a protrusion, a receptacle, or both, and the base member can include a mating protrusion, receptacle, or both to facilitate proper alignment of the cover member and the base member. Electronic device packages and associated systems and methods are also disclosed.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: November 1, 2022
    Assignee: Intel Corporation
    Inventors: Vijay K. Nair, Digvijay A. Raorane
  • Patent number: 11482465
    Abstract: 3D semiconductor packages and methods of forming 3D semiconductor package are described herein. The 3D semiconductor packages are formed by mounting a die stack on an interposer, dispensing a thermal interface material (TIM) layer over the die stack and placing a heat spreading element over and attached to the die stack by the TIM layer. The TIM layer provides a reliable adhesion layer and an efficient thermally conductive path between the die stack and interposer to the heat spreading element. As such, delamination of the TIM layer from the heat spreading element is prevented, efficient heat transfer from the die stack to the heat spreading element is provided, and a thermal resistance along thermal paths through the TIM layer between the interposer and heat spreading element are reduced. Thus, the TIM layer reduces overall operating temperatures and increases overall reliability of the 3D semiconductor packages.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: October 25, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua Yu, Szu-Wei Lu, Ying-Ching Shih, Li-Chung Kuo
  • Patent number: 11069824
    Abstract: An optical sensor device has an optical semiconductor element fixed into a recessed portion of a base portion, and a pad portion of the optical semiconductor element is electrically connected to a lead portion of the base portion. On an upper surface of a protruding portion provided in an outer region of the base portion, a metallization layer having notch portions, a metal bonding layer, a metallization layer having notch portions, and a lid portion are provided. Through use of the metallization layers and the metal bonding layer, the lid portion can be hermetically bonded to the base portion.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: July 20, 2021
    Assignee: ABLIC INC.
    Inventor: Koji Tsukagoshi
  • Patent number: 11008913
    Abstract: A support for an electric heating type catalyst, comprising: a honeycomb structure having partition walls that define a plurality of cells, each cell extending from a first end face to a second end face to form a fluid path for a fluid; and a pair of metal electrode portions in which one metal electrode portion of the pair of metal electrode portions is disposed on a side opposite to the other metal electrode portion across a center axis of the honeycomb structure; wherein one or both of the pair of metal electrode portions comprise at least one protruding portion, the protruding portion projecting toward the honeycomb structure side to abut against the honeycomb structure.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: May 18, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Naoya Takase
  • Patent number: 10886251
    Abstract: A multilayer composite bonding material for transient liquid phase bonding a semiconductor device to a metal substrate includes thermal stress compensation layers sandwiched between a pair of bonding layers. The thermal stress compensation layers may include a core layer with a first stiffness sandwiched between a pair of outer layers with a second stiffness that is different than the first stiffness such that a graded stiffness extends across a thickness of the thermal stress compensation layers. The thermal stress compensation layers have a melting point above a sintering temperature and the bonding layers have a melting point below the sintering temperature. The graded stiffness across the thickness of the thermal stress compensation layers compensates for thermal contraction mismatch between the semiconductor device and the metal substrate during cooling from the sintering temperature to ambient temperature.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: January 5, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Shailesh N. Joshi
  • Patent number: 10787914
    Abstract: An airfoil includes a core having a first surface, a skin having a second surface disposed over at least a portion of the first surface of the core, and at least one of a transient liquid phase (TLP) bond and a partial transient liquid phase (PTLP) bond. The bond(s) are disposed between the first surface and the second surface, joining the skin to the core.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: September 29, 2020
    Assignee: United Technologies Corporation
    Inventors: Michael G. Abbott, Michael G. McCaffrey, Grant O. Cook, III
  • Patent number: 10716644
    Abstract: A dental instrument comprising a shaft and a working part adjoined thereto, with the working part having a coating in which abrasive bodies are embedded, is proposed, Firstly, the average proportion of the surface of the abrasive bodies which is covered by the coating can be at least 60%, preferably at least 65%, most preferably at least 70%. Secondly, the coating can, moreover, also consist of a nickel ahoy which additionally contains at least one element selected from the group consisting of titanium, vanadium, niobium, chromium, molybdenum, tungsten, manganese, iron and cobalt. In addition, a process for coating a working part, in particular for producing a dental instrument of this type, and also the use of such a dental instrument for cutting machining of solid bodies are proposed.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: July 21, 2020
    Assignee: COLTÈNE/WHALEDENT AG
    Inventors: Ralf Kollefrath, Ulrich Müller, Martin Schlüter
  • Patent number: 10720261
    Abstract: Disclosed herein is a composite comprising an elastomer with an embedded network of liquid metal inclusions. The composite retains similar flexibility to that of an elastomer but exhibits electrical and thermal properties that differ from the properties of a homogeneous elastomer. The composite has applications for wearable devices and other soft matter electronics, among others.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: July 21, 2020
    Assignee: CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Profit Corporation
    Inventors: Carmel Majidi, Andrew Fassler, Michael Bartlett, Navid Kazem, Matthew J. Powell-Palm, Jonathan A. Malen
  • Patent number: 10646964
    Abstract: Bonded surfaces are formed by adhering first nanorods and second nanorods to respective first and second surfaces. The first shell is formed on the first nanorods and the second shell is formed on the second nanorods, wherein at least one of the first nanorods and second nanorods, and the first shell and the second shell are formed of distinct metals. The surfaces are then exposed to at least one condition that causes the distinct metals to form an alloy, such as eutectic alloy having a melting point below the temperature at which the alloy is formed, thereby bonding the surfaces upon which solidification of the alloy.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: May 12, 2020
    Assignees: Northeastern University, University of North Florida Board of Trustees
    Inventors: Stephen Peter Stagon, Hanchen Huang, Paul Robert Elliott
  • Patent number: 10646941
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: May 12, 2020
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Patent number: 10607857
    Abstract: A method of joining a semiconductor die to a passive heat exchanger can include applying a bond enhancing agent to a semiconductor device; creating an assembly that includes a thermal interface disposed on the semiconductor device such that a first major surface of the thermal interface material is in touching relation with the bond enhancing agent on the semiconductor device, and a heat exchanger disposed in touching relation with a second major surface of the thermal interface material; and reflowing the assembly such that the thermal interface bonds the heat exchanger to the semiconductor device. Embodiments can use the ability of indium to bond to a non-metallic surface to form the thermal interface, which may be enhanced by a secondary coating on either or both joining surfaces.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: March 31, 2020
    Assignee: INDIUM CORPORATION
    Inventors: Ross B. Berntson, James E. Hisert, Robert N. Jarrett, Jordan P. Ross
  • Patent number: 10596782
    Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a resin film and a metal layer stacked on at least one of surfaces of the resin film. An average diffusion depth of a main metal of the metal layer in the resin film is 100 nm or less after a weather resistance test in which the substrate is held at 150° C. for seven days. The average diffusion depth is preferably 80 nm or less before the weather resistance test.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: March 24, 2020
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Kayo Hashizume, Yoshio Oka, Takashi Kasuga, Jinjoo Park, Hiroshi Ueda
  • Patent number: 10588220
    Abstract: A method of manufacturing includes bonding a paste material to an organic substrate by a polymer thick film (PTF) process to form a PTF trace, coating a sinterable material over the PTF trace, and sintering the sinterable material to the PTF trace.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: March 10, 2020
    Assignee: Molex, LLC
    Inventor: Patrick Weber
  • Patent number: 10585009
    Abstract: A pressure measurement cell is disclosed including a base body, substantially cylindrical at least in sections, a measuring membrane joined to the base body in a pressure-tight manner along a perimeter joint to form a measurement chamber between the base body and the measuring membrane, and a joining material that joins the perimeter joint between the base body and the measuring membrane. The base body and/or the measuring membrane have/has a stepped recess into which the joining material is at least partially disposed, the stepped recess structured to yield a minimum distance between the base body and the measuring membrane.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: March 10, 2020
    Assignee: Endress+Hauser SE+Co. KG
    Inventors: Ulfert Drewes, Nils Ponath, Andreas Rossberg, Elke Schmidt, Anh Tuan Tham
  • Patent number: 10497853
    Abstract: A device (100) includes a first chip (104) having a first circuit element (112), a first interconnect pad (116) in electrical contact (118) with the first circuit element, and a barrier layer (120) on the first interconnect pad, a superconducting bump bond (106) on the barrier layer, and a second chip (102) joined to the first chip by the superconducting bump bond, the second chip having a quantum circuit element (108), in which the superconducting bump bond provides an electrical connection between the first circuit element and the quantum circuit element.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: December 3, 2019
    Assignee: Google LLC
    Inventors: Joshua Yousouf Mutus, Erik Anthony Lucero
  • Patent number: 10487670
    Abstract: A blade for a gas turbine engine comprises a blade portion having a first end and a second end and an engagement portion including a first surface coupled to the second end of the blade portion and a second surface coupled to the second end of the blade portion, the first and second surfaces arranged to extend divergently away from one another. The engagement portion is adapted for coupling to a wheel included in a gas turbine engine wheel.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: November 26, 2019
    Assignees: Rolls-Royce Corporation, Rolls-Royce North American Technologies Inc.
    Inventors: David J. Thomas, Richard C. Uskert, Adam L. Chamberlain, Matthew Peter Basiletti
  • Patent number: 10468579
    Abstract: A device (100) includes a first chip (104) having a first circuit element (112), a first interconnect pad (116) in electrical contact (118) with the first circuit element, and a barrier layer (120) on the first interconnect pad, a superconducting bump bond (106) on the barrier layer, and a second chip (102) joined to the first chip by the superconducting bump bond, the second chip having a quantum circuit element (108), in which the superconducting bump bond provides an electrical connection between the first circuit element and the quantum circuit element.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: November 5, 2019
    Assignee: Google LLC
    Inventors: Joshua Yousouf Mutus, Erik Anthony Lucero
  • Patent number: 10384283
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with a silicon and an alloying element under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: August 20, 2019
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Brent Elliot, Alfred Grant Elliott
  • Patent number: 10375825
    Abstract: This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 ?m or less that is formed between the nitride layer and the copper plate.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu
  • Patent number: 10373928
    Abstract: A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive from the inter-contact region, and provide electrical communication between the respective sets of electrical contacts. The liquid curable adhesive is then cured to form a solid matrix which maintains a relative compression between the respective sets of electrical contacts. One embodiment of the module comprises a high-speed superconducting circuit which operates at cryogenic temperatures.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: August 6, 2019
    Assignee: Hypres, inc.
    Inventor: Vladimir V. Dotsenko
  • Patent number: 10364190
    Abstract: A method of producing a component of a composite of diamond and a binder, wherein a Hot Isostatic gas Pressure process (HIP) is used, includes the step of enclosing a de-bound green body having compacted diamond particles in an infiltrant. The method includes the further steps of enclosing the de-bound green body and the infiltrant in a Zr-capsule that has Zirconium as a main constituent and sealing the Zr-capsule, and applying a predetermined pressure-temperature cycle on the unit formed by the de-bound green body, infiltrant and capsule in which the infiltrant infiltrates the de-bound green body and the de-bound green body is further densified in the sense that the volume thereof is decreased.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: July 30, 2019
    Assignee: SANDVIK INTELLECTUAL PROPERTY AB
    Inventors: Susanne Norgren, Johan Sundstrom, Malin Martensson, Anna Ekmarker
  • Patent number: 10357840
    Abstract: The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: July 23, 2019
    Assignee: FEW Fahrzeugelektrik Werk GmbH & Co. KG
    Inventors: Roy Gleisberg, Björn Schneider, André Jenrich
  • Patent number: 10319426
    Abstract: A semiconductor structure includes an electrode, a ferroelectric material adjacent the electrode, the ferroelectric material comprising an oxide of at least one of hafnium and zirconium, the ferroelectric material doped with bismuth, and another electrode adjacent the ferroelectric material on an opposite side thereof from the first electrode. Related semiconductor structures, memory cells, semiconductor devices, electronic systems, and related methods are disclosed.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: June 11, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Albert Liao, Wayne I. Kinney, Yi Fang Lee, Manzar Siddik
  • Patent number: 10319664
    Abstract: A bonded body is provided in which an aluminum alloy member formed from an aluminum alloy, and a metal member formed from copper, nickel, or silver are bonded to each other. The aluminum alloy member is constituted by an aluminum alloy in which a concentration of Si is in a range of 1 mass % to 25 mass %. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A compound layer, which is formed through diffusion of Al of the aluminum alloy member and a metal element of the metal member, is provided at a bonding interface between the aluminum alloy member and the metal member. A Mg-concentrated layer, in which a concentration of Mg is to 3 mass % or greater, is formed at the inside of the compound layer, and the thickness of the Mg-concentrated layer is in a range of 1 ?m to 30 ?m.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: June 11, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo
  • Patent number: 10160066
    Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: December 25, 2018
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Xin Yang, Blair E. Carlson, Yongbing Li
  • Patent number: 10155301
    Abstract: Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) comprising a polycrystalline diamond (“PCD”) table including at least a portion having aluminum carbide disposed interstitially between bonded-together diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a PCD table bonded to the substrate. The PCD table includes a plurality of bonded-together diamond grains defining a plurality of interstitial regions. The PCD table further includes aluminum carbide disposed in at least a portion of the plurality of interstitial regions.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: December 18, 2018
    Assignee: US SYNTHETIC CORPORATION
    Inventors: Paul Douglas Jones, Kenneth E. Bertagnolli, Debkumar Mukhopadhyay, David P. Miess
  • Patent number: 10153183
    Abstract: A method for the joining of ceramic pieces into an assembly adapted to be used in semiconductor processing. The joined pieces are adapted to withstand the environments within a process chamber during substrate processing, chamber cleaning processes, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The ceramic pieces may be aluminum nitride and the pieces may be brazed with aluminum. The joint material is adapted to withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The joint is adapted to provide a hermetic seal across the joint. The joined pieces are adapted to be separated at a later time should rework or replacement of one of the pieces be desired.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: December 11, 2018
    Assignee: Component Re-Engineering Company, Inc.
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Patent number: 10071543
    Abstract: A precipitation-hardened partial transient liquid phase bond and method of making same is provided. The bond is created at a bonding temperature and then, based on the phase diagrams corresponding to the materials in the interlayer between the bonded materials, the bond is held at a lower heat-treatment temperature to achieve a precipitation-hardened structure.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: September 11, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventor: Grant O. Cook, III
  • Patent number: 10014273
    Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: July 3, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas E. Lombardi, Donald Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran
  • Patent number: 10000422
    Abstract: The present invention provides a ceramic to ceramic joint and methods for making such a joint. Generally, the joint includes a first ceramic part and a second ceramic part, wherein the first and second ceramic parts each include a ceramic-carbide or a ceramic-nitride material. In some cases, an aluminum-initiated joint region joins the first and second ceramic parts. This joint region typically includes chemical species from the first and second ceramic parts that have diffused into the joint region. Additionally, the first and second ceramic parts each typically include a joint diffusion zone that is disposed adjacent to the joint region and which includes aluminum species from the joint region that have diffused into the joint diffusion zone. Other implementations are also described.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: June 19, 2018
    Assignee: CoorsTek, Inc.
    Inventors: Joseph R Fellows, Merrill Wilson
  • Patent number: 9969654
    Abstract: A means for attaching a metallic component to a non-metallic component using a compliant material having thermal properties intermediate those of the metallic component to a non-metallic component is provided. The method can accommodate CTE mismatches and wear-type problems common to many assemblies of dissimilar materials. In particular, the method provides a sufficient wear surface to accommodate relative motion and provide a durable wear surface that does not excessively wear/gall/mico-weld itself together and provides the necessary damping and motion for proper operation in aeronautical applications.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: May 15, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Benjamin T. Fisk, Grant O. Cook, III
  • Patent number: 9968012
    Abstract: A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: May 8, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo, Yoshirou Kuromitsu
  • Patent number: 9947560
    Abstract: An integrated circuit (IC) package, assembly tool and method for assembling an IC package are described herein. In a first example, an IC package is provided that includes a package substrate, at least a first integrated circuit (IC) die and a cover. The first integrated circuit (IC) die is mechanically and electrically coupled to the package substrate via solder connections. The cover is bonded to the package substrate. The cover encloses the first IC die and is laterally offset from a peripheral edge of the package substrate.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: April 17, 2018
    Assignee: XILINX, INC.
    Inventors: Mohsen H. Mardi, David Tan, Gamal Refai-Ahmed
  • Patent number: 9931717
    Abstract: An assembly comprising: two ceramic bodies, which are joined by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced, in each case, from the ceramic bodies by at least 1 ?m, and an average composition CK with a liquidus temperature Tl(CK), wherein the composition CK has a coefficient of thermal expansion ?(CK), wherein ?(CK)=m·?(K), wherein m?1.5, especially m?1.3 and preferably m?1.2, wherein ?(K) is the average coefficient of thermal expansion of the ceramic material of the ceramic bodies, wherein the joint has boundary layers, which border on the ceramic body, wherein at least one of the boundary layers, which lies outside of the core volume, has an average composition CB with a liquidus temperature Tl(CB), which lies not less than 50 K, preferably not less than 100 K, and especially preferably not less than 200 K, under the liquidus temperature Tl(CK) of the average composition CK of the core volume.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: April 3, 2018
    Assignee: ENDRESS + HAUSER GMBH + CO. KG
    Inventors: Andreas Rossberg, Elke Schmidt, Markus Rettenmayr, Peter Siegmund
  • Patent number: 9831211
    Abstract: Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15° C. and less than or equal to about 110° C. or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: November 28, 2017
    Assignees: Samsung Electronics Co., Ltd., Yonsei University Wonju Industry-Academic Cooperation Foundation
    Inventors: Kunmo Chu, Wonsuk Chang, Chanmoon Chung
  • Patent number: 9764387
    Abstract: A polycrystalline diamond (PCD) with diamond grains includes a first zone of the diamond grains and a second zone of the diamond grains. The first zone forms a working surface and a first catalyzing material is disposed within voids of the diamond grains in the first zone. A second catalyzing material is bonded to the diamond grains disposed in the second zone. The first catalyzing material in the first zone is connected to the diamond grains disposed in the first zone less intimately than the second catalyzing material is bonded to the diamond grains in the second zone.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: September 19, 2017
    Inventor: Rusty Petree
  • Patent number: 9769963
    Abstract: A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or an aluminum alloy, and the other one of them is composed of copper or a copper alloy, the metal layer (13) and the heat sink (31) are bonded together by solid phase diffusion bonding, an intermetallic compound layer formed of copper and aluminum is formed in a bonding interface between the metal layer (13) and the heat sink (31), and an oxide is dispersed in an interface between the intermetallic compound layer and either one of the metal layer (13) composed of copper or a copper alloy and heat sink (31) composed of copper or a copper alloy in a layered form along the interface.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: September 19, 2017
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo, Yoshirou Kuromitsu
  • Patent number: 9698078
    Abstract: A semiconductor module of the present invention includes: a semiconductor element having a first main surface and a second main surface facing the first main surface, the semiconductor element including a front surface electrode and a back surface electrode on the first main surface and the second main surface, respectively; a metal plate electrically connected to the back surface electrode of the semiconductor element through a sintered bonding material including metal nanoparticles; and a plate-shaped conductor electrically connected to the front surface electrode of the semiconductor element through the sintered bonding material including the metal nanoparticles. The metal plate and the conductor include grooves communicating between a bonding region bonded to the semiconductor element and the outside of the bonding region.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: July 4, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yasunari Hino
  • Patent number: 9662729
    Abstract: A laser guided nano-brazing method for a reinforced aluminum composite material having high volume fraction silicon carbide particles, comprising 4 steps: nanocrystallizing the surface of the reinforced aluminum composite material having high volume fraction silicon carbide particles, preparing solder material, assembling pieces to be soldered, and dual-beam laser brazing. The use of nano-technology for the brazing of reinforced aluminum composite material having high volume fraction silicon carbide particles, and the use of dual-beam laser technology for brazing temperature field control enhance the humidity during the brazing process of said material and filling ability of the solder material, and satisfy the strict requirements of electronic packaging.
    Type: Grant
    Filed: April 27, 2013
    Date of Patent: May 30, 2017
    Assignee: Henan Jingtai Aerospace High-Novel Materials Technology Co., Ltd.
    Inventors: Jitai Niu, Dongfeng Cheng, Zeng Gao, Peng Wang, Qiang Li, Baoqing Zhang, Erzhen Mu, Sijie Chen, Hengze Xian, Gang Zeng, Xitao Wang
  • Patent number: 9610451
    Abstract: One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes providing the housing with a flange forming a recess about an opening through the housing, the opening disposed within the recess. A feedthrough is positioned within the recess so as to form a gap between the flange and an insulator of the feedthrough. A braze preform is then positioned within the recess about the insulator, the braze preform comprising a biocompatible braze material having a melting point less than a ?-transus temperature of the titanium of the housing. The preform is melted at a temperature less than the ?-transus temperature of the titanium of the housing such that the melted braze material fills at least the gap, and then cooled to form a braze joint which bonds the insulator to the housing and hermetically seals the opening.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: April 4, 2017
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jacob Markham, Ulrich Hausch
  • Patent number: 9598321
    Abstract: A method and apparatus for providing molten metal infiltration into a component is provided.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: March 21, 2017
    Assignee: Rolls-Royce Corporation
    Inventor: Andrew J. Lazur
  • Patent number: 9556074
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: January 31, 2017
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Patent number: 9374893
    Abstract: A production method for a metallized substrate to produce a metallized substrate which comprises: a sintered nitride ceramic substrate; a titanium nitride layer formed on the sintered substrate; and a metal layer containing copper, silver and titanium formed on the titanium nitride layer. The method comprises: a step of layering a first paste layer containing copper powder and titanium hydride powder on the sintered nitride ceramic substrate, to produce a first layered body; a step of layering a second paste layer containing silver-copper alloy powder on the first paste layer of the first layered body, to produce a second layered body; and a step of firing the second layered body, to thereby form the titanium nitride layer and the metal layer on the sintered nitride ceramic substrate.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: June 21, 2016
    Assignee: TOKUYAMA CORPORATION
    Inventor: Naoto Takahashi
  • Patent number: 9370795
    Abstract: A method for applying a wear protection layer to a continuous flow machine component which has a base material comprising titanium is provided. The method includes the following steps: mixing a solder which comprises an alloy comprising titanium and particles which are distributed in the alloy and have a reaction agent; applying the solder to predetermined points of the continuous flow machine component; introducing a heat volume into the solder and the continuous flow machine component so that the alloy becomes liquid and the reaction agent changes through diffusion processes with the solder and undergoes a chemical reaction with the alloy, forming a hard aggregate; and cooling the solder so that the alloy becomes solid.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: June 21, 2016
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jochen Barnikel, Susanne Gollerthan, Harald Krappitz, Ingo Reinkensmeier
  • Patent number: 9358765
    Abstract: A method for coating of a first substrate with a first diffusion bond layer by deposition of a first material which forms the first diffusion bond layer on a first surface of the first substrate such that the first diffusion bond layer forms a grain surface with an average grain diameter H parallel to the first surface smaller than 1 ?m. The invention further relates to a method for bonding of a first substrate which has been coated as described above to a second substrate which has a second diffusion bond layer, the method of the bonding comprising the following steps: bring a first diffusion bond layer of a first substrate into contact with a second diffusion bond layer of a second substrate, pressing the substrates together to form a permanent metal diffusion bond between the first and second substrates.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: June 7, 2016
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Markus Wimplinger, Bernhard Rebhan
  • Patent number: 9355984
    Abstract: An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and connecting the metal layers such that a single metal layer is formed.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: May 31, 2016
    Assignee: Infineon Technologies AG
    Inventors: Irmgard Escher-Poeppel, Eduard Knauer, Thomas Kunstmann, Peter Scherl, Raimund Foerg
  • Patent number: 9333578
    Abstract: Methods of providing a fiber reinforced braze include providing a substrate, disposing at least a first fiber reinforcement layer on the substrate, wherein the at least first fiber reinforcement layer comprises a fiber material, disposing at least a first braze layer on the at least first fiber reinforcement layer, wherein a melt temperature of the braze layer is lower than a melt temperature of the fiber material, and heating the at least first fiber reinforcement layer and the at least first braze layer to bond the fiber reinforced braze to the substrate.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: May 10, 2016
    Assignee: General Electric Company
    Inventors: Yan Cui, Srikanth Chandrudu Kottilingam, Jason Robert Parolini, Dechao Lin
  • Patent number: 9293683
    Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: March 22, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazunobu Irie, Futoshi Ohtsuka, Takeshi Kita, Motoi Hatanaka
  • Patent number: 9293764
    Abstract: A negative electrode active material for an electric device includes an alloy containing Si in a range from greater than or equal to 17% by mass to less than 90% by mass, Ti in a range from 10% by mass to 83% by mass exclusive, Ge in a range from 0% by mass to 73% by mass exclusive, and inevitable impurities as a residue. The negative electrode active material can be obtained with a multi DC magnetron sputtering apparatus by use of, for example, Si, Ti and Ge as targets. An electric device employing the negative electrode active material can achieve long cycle life, and ensure a high capacity and improved cycle durability.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: March 22, 2016
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Manabu Watanabe, Masao Yoshida
  • Patent number: 9263375
    Abstract: A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: February 16, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Lakshminarayan Viswanathan, Lakshmi N. Ramanathan, Audel A. Sanchez, Fernando A. Santos