Abstract: A CTE modified braze composition that can be utilized to manufacture a strong, gastight joint where at least one of the joining members comprises a ceramic (e.g., a ceramic or a cermet). The braze composition is formulated so as to reduce the thermal stress that results from the mismatch of thermal expansion coefficients between a ceramic joining member and the braze or other joining members. The braze composition comprises a braze alloy in powder, paste or bulk form mixed with one or more particulate or fibrous fillers that exhibit a low (i.e., no more than 6 ppm/K) or negative coefficient of thermal expansion. The braze composition can be used to join members, at least one of which comprises ceramic, and to a composite member produced by joining the two or more members.

Abstract: A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite material containing components of a ceramic material and an aluminum alloy. The method includes the step of inserting a joint material including an aluminum alloy layer between the ceramic base and the cooling member. The method includes the step of heating the joint material at a temperature in a range from TS ° C. to (TS-30) °C. (TS °C.: a solidus temperature of the aluminum alloy). The method includes the step of pressing substantially normally joint surfaces of the ceramic base and the cooling member, thereby joining the ceramic base and the cooling member via the joint material to obtain a joint layer including the aluminum alloy layer having a thickness in a range from 50 ?m to 200 ?m after joining.

Abstract: A novel method for bonding components has been disclosed. For bonding ceramic components the method involves placing at least three metal interlayers between the components. There is a central core metal layer and two other metal layers placed on either side of the core layer adjacent the ceramic components. The metal layers are heated to a temperature sufficient to transform at least part of the metal layers into a liquid. The temperature is maintained until the liquid begins to solidify and the first points of bonding between the components and the solidifying interlayer is established. This system can also be used to bond a ceramic component to a metal component. The metal component can be placed adjacent the central core metal layer without an intervening metal layer.

Abstract: Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, bringing the exposed individually conductive fibers into contact with each other at a junction point, and forming a molecular bond between the conductive fibers at the junction point. Also disclosed are systems for forming a junction between conductive fibers that are incorporated into a fabric.

Abstract: A down hole cutting tool includes a cutting element support structure. The cutting element support structure has at least one cavity formed therein. A cutting element is disposed in the cavity. Braze alloy is also disposed in the cavity between the cutting element and the cutting element support structure. The braze alloy comprises between about 0.5% and about 10% by weight of at least one selected from the group of gallium (Ga), indium (In), thallium (Tl). Methods for building a down hole tool using the braze alloy are also disclosed.

Abstract: Disclosed is a method of manufacturing a surface acoustic wave device comprising the steps of forming a drive electrode having a surface acoustic wave element function on a piezoelectric substrate wafer, providing a resist coat on an upper region of the drive electrode, covering the resist coat with a metal film, removing the resist coat lying within the metal film so that the metal film is formed in a dome form having a hollow portion covering the drive electrode, and providing a resin seal on the metal film.

Abstract: The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between laminated sheets has an end portion of a connector, e.g. a lead soldered to each of the bus bars during thermal processing of the sheets, e.g. during the lamination of the sheets during a windshield manufacturing process. In another nonlimiting embodiment, the connector is soldered to the electrically conductive arrangement during the annealing of glass blanks following the heating and shaping of the glass blanks. Soldering the leads during the annealing or laminating process eliminated possible thermal damage to the sheet by having the sheet heated during the soldering operation instead of only a small surface portion of the sheet at and eliminates the cost of a separated soldering operation.

Abstract: Tubular silicon members advantageously formed by extrusion from a silicon melt or by fixing together silicon staves in a barrel shape. A silicon-based wafer support tower is particularly useful for batch-mode thermal chemical vapor deposition and other high-temperature processes, especially reflow of silicate glass at above 1200° C. The surfaces of the silicon tower are bead blasted to introduce sub-surface damage, which produces pits and cracks in the surface, which anchor subsequently deposited layer of, for example, silicon nitride, thereby inhibiting peeling of the nitride film. Wafer support portions of the tower are preferably composed of virgin polysilicon. The invention can be applied to other silicon parts in a deposition or other substrate processing reactor, such as tubular sleeves and reactor walls. The tower parts are preferably pre-coated with silicon nitride or polysilicon prior to chemical vapor deposition of these materials, or with silicon nitride prior to reflow of silica.

Abstract: A circuit board including conductive layers bonded to both surfaces of an insulating ceramic substrate, with a brazing material disposed therebetween. The conductive layers comprise at least 99.98% by mass of aluminum, and display an average crystal grain diameter within a range from 0.5 mm to 5 mm and a standard deviation ? for that crystal grain diameter of no more than 2 mm. Each conductive layer comprises at least 20 ppm of Cu, Fe and Si. The surface area of the crystal with the maximum crystal grain diameter within the conductive layers accounts for no more than 15% of the surface area of the insulating ceramic substrate.

Abstract: An emitter for a miniature X-ray apparatus comprises an insulating shell, an anode, and a cathode. The insulating shell includes a conical brazing surface, brazed to a conical brazing surface on the anode. The braze consists of a pure titanium layer and a pure tin layer. During brazing, the pure metals react and bond to the insulating shell and create a titanium-tin alloy between the pure layers. Pure tin is sputtered from tin sputter target onto the exposed brazing surfaces of the cathode cap and the anode. The insulating shell is placed in a vacuum chamber of deposition applicator, which deposits an active metal onto the shell brazing surface. In a brazing oven, the anode is placed within insulating shell such that the anode conical brazing surface and the shell conical brazing surface are contacting and aligned with each other. During brazing, the cathode is brought into contact with the insulating shell. The sealed emitters are placed in a sputtering machine's vacuum chamber.

Abstract: A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum; either at least 0.01% or 0.01–10% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); either at least 0.5% or 0.5–10% by weight of an element or a mixture of elements selected from the group consisting of silver, copper, and indium; optionally either at least 0.01% or 0.01–1% by weight of gallium; and a remainder consisting of tin, lead, or of a mixture of tin and lead.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt or soften the joining material, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: A compound arrangement comprising a first component of metal being brazed to a second component of metal. The first component has an external cylindrical surface touching an cylindrical internal surface of the second component. The second component clasps the first component tightly, so that the second component exerts compressive stress on said external surface of the first component.

Abstract: Nonmetallic high-temperature material, such as graphite, CFC or SiC, or components produced from these materials, are joined using the two-stage process. First the structural components are canned and the canning foil is tightly pressed onto the surface contour of the structural components. Then the components are joined to a composite component by forming a material-to-material bond between the metal canning foils. This widens the hitherto highly restricted field of technical application for materials of this type.

Abstract: A brazed product has a metal substrate, a ceramic or graphite substrate, and a brazing alloy containing one of a high nickel content and cobalt content joining the ceramic or graphite substrate to the metal substrate. A method of joining these materials include providing a metal layer coating of titanium or nickel on the surface of the ceramic or graphite substrate to be joined or using a high nickel content or high cobalt content and containing titanium. The brazing alloy contains a high nickel content 70-95% by weight, or a high cobalt content between 45-55% by weight. This brazing alloy can contain titanium in the range between 0.5-5% by weight.

Abstract: A substrate (101) is coated with an aqueous solution of boehmite (AlO(OH)) which is an aluminum hydroxide to form a coating film (102), and the property of the coating film (102) is modified into &agr;-alumina, thereby joining the substrate (101) to a substrate (103).

Abstract: A method for producing a joined body comprising a supporting member made of a ceramic material for supporting a semiconductor wafer, a metal member and a joining layer for joining the supporting and metal members is provided. A first metal film is formed on a joining surface of the supporting member. A second metal film is formed on a joining surface of the metal member. A metal adhesive is placed between the first and second films to provide an assembly. The assembly is then heated at a temperature not higher than a melting point of the metal adhesive while the assembly is subjected to isostatic pressing, so that the supporting and metal members are joined by diffusion joining.

Abstract: The invention relates to a composite sheet material for brazing, the composite sheet material having a structure comprising an aluminium or aluminium alloy substrate on at least one side coupled to a layer comprising a polyolefin/acrylic acid copolymer as a carrier filled with brazing flux material, and optionally also with a metal powder, in an amount sufficient to achieve brazing. The invention further relates to a method of manufacturing composite sheet material for brazing, which method comprises the steps (a) mixing the polyolefin/acrylic acid copolymer with the brazing flux material and/or metal powder, and (b) applying to at least one surface of the metal substrate a mixture of said copolymer filled with the brazing flux material and/or metal powder, in an amount sufficient to achieve subsequent brazing.

Abstract: A method for producing a heat-conducting connection between two work pieces (1, 2) includes the steps of first producing a porous sintered layer (3), interposed between the two work pieces (1, 2) and sintered onto every work piece (1, 2) across a certain area, and subsequently compacting the porous sintered layer (3) sintered onto the two work pieces (1, 2) by pressing the two work pieces (1, 2) against each other.

Abstract: To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser chip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser chip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser chip. Therefor, when the mounting plate is overlaid to the laser chip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film.

Abstract: Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.

Abstract: A system for joining a pair of structural members having widely differing coefficients of thermal expansion is disclosed. A mechanically “thick” foil is made by dispersing a refractory metal powder, such as molybdenum, niobium, tantalum, or tungsten into a quantity of a liquid, high expansion metal such as copper, silver, or gold, casting an ingot of the mixture, and then cutting sections of the ingot about 1 mm thick to provide the foil member. These foil members are shaped, and assembled between surfaces of structural members for joining, together with a layer of a braze alloy on either side of the foil member capable of wetting both the surfaces of the structural members and the foil. The assembled body is then heated to melt the braze alloy and join the assembled structure. The foil member subsequently absorbs the mechanical strain generated by the differential contraction of the cooling members that results from the difference in the coefficients of thermal expansion of the members.

Abstract: A method of manufacturing heat-insulating structural and/or light elements composed of at least two wall elements of glass, a glass alloy or metal, wherein the wall elements are separated from each other by support elements and are provided on at least one of surfaces thereof facing each other with a layer reflecting heat radiation, and wherein the structural and/or light elements further are composed of a deformable sealing element for connecting the wall elements to obtain a hollow space between the wall elements which can be evacuated or supplied with gas.

Abstract: A single-tube Coriolis mass flow sensor includes a stainless steel sleeve having an unplated interior surface and a titanium member having a cylindrical end inserted into the stainless steel sleeve. The exterior surface of the titanium cylindrical end forms a joint with the unplated interior surface of the stainless steel sleeve. The titanium cylindrical end is brazed to the unplated interior surface of the stainless steel sleeve at the joint, and the stainless steel sleeve exerts compressive stress on the titanium cylindrical end at the joint.

Abstract: A method of producing fiber-reinforced metallic building components having a complicated three-dimensional geometric shape includes the following steps. First, metal-coated SiC fibers are applied to a metallic sectional piece having a simple geometric shape, and are then held thereon without restraint by a metallic counterpart piece. Then, the unit consisting of the sectional piece, fibers and counterpart piece undergoes plastic deformation in vacuo between mold halves by applying pressure at an elevated temperature, without bonding of the fibers to one another or to the building component metal. By further increasing the pressure and/or temperature, the molded unit is compressed further between the mold halves and is consolidated to a monolithic part by metallic bonding (diffusion welding), whereby the part, either alone or bonded to other parts, forms the building component, after cooling and removing it from the mold halves.

Abstract: A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20).

Abstract: A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 &mgr;m and preferably about 5 &mgr;m) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.

Abstract: A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a braze composition provide assemblies entirely of alumina or containing alumina and a metal or metal alloy. The braze composition is non-reactive with alumina or a reactive composition, whose reactivity with alumina is controlled, and it is formed of aluminium, of titanium, and of a matrix made up either of palladium, or of nickel, or of a nickel and palladium alloy.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: An ignition apparatus is provided for internal combustion engines to obtain higher reliability for the solder bonding parts. The ignition apparatus includes a molded case having an input-output terminal formed on the molded case, a semiconductor switching device, a control circuit board, and a heat sink. As such, the molded case provides a single body for containing the input-output terminal, the semiconductor switching device, the control circuit board and the heat sink. On the heat sink, one or more laminated structures are used, including the semiconductor switching devices with beryllia as an electric insulation plate.

Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

Abstract: The invention relates to a method for producing a heat-conducting connection between two work pieces (1, 2). which is characterized by first producing a porous sintered layer (3), interposed between the two work pieces (1, 2) and sintered onto every work piece (1, 2) across a certain area, and subsequently compacting the porous sintered layer (3) sintered onto the two work pieces (1, 2) by pressing the two work pieces (1, 2) against each other.

Abstract: Reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous supports enables an x-ray generating anode to be joined to a preferred lightweight substrate. Complementary surfaces are provided on a dense refractory metal body and a graphite or a carbon-carbon composite support. A particulate braze mixture comprising Hf or Zr carbide, Mo or W boride, Hf or Zr powder and Mo or W powder is coated onto the support surface, and hafnium or zirconium foil may be introduced between the braze mixture and the refractory metal body complementary surface. Reaction-brazing is carried out at or near the eutectic point of the components, which may be influenced to some extent by the presence of carbon and boride. Heating to about 1865° C.

Abstract: An article includes a substrate and an adhesion layer overlying the substrate. The adhesion layer includes a first phase including particles, and a second phase including braze alloy that bonds the particles to the substrate. The article further includes a ceramic layer overlying the adhesion layer. In one embodiment, the ceramic layer is a thermal barrier coating (TBC), formed of stabilized zirconia (ZrO2).

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: An apparatus and method for positioning and soldering together multiple stanined glass sections is disclosed.

Abstract: An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value.

Abstract: The active brazing solder for brazing ceramic parts of alumina, particularly of high-purity alumina, contains a maximum of 12 wt. % Ti, a maximum of 8 wt. % Be, and less than 16.5 wt. % Fe, the remainder being Zr and any impurities that may be present. The active brazing solder has the following behaviour/features: Brazing temperature: lower than 1,000° C.; the brazed joint is high-vacuum-tight over a long period of time; the coefficient of thermal expansion of the active brazing alloy is substantially identical to that of the alumina ceramic in the entire temperature range covered during the brazing process; the strength of the brazed joint between the two ceramic parts is so high that under tensile loading, fracture will result not at the joint, but in the adjacent ceramic; the pressure resistance of the active brazing solder is greater than 2 GPa; the active brazing solder is very good processable into powders having particle sizes on the order of 10 &mgr;m.

Abstract: Brazing or soldering of pieces of low wettable materials (1, 3), such as single crystal silicon, is accomplished by sandwiching the brazing material (5) between the pieces and sealing the edges of the brazing material with a tape (11) wrapped about the periphery of the brazing material, mechanically placing that tape in compression and maintaining that compression while heating (21) the sandwiched assembly to the brazing temperature of the brazing material. The tape possesses the characteristic of being non-wettable by the brazing material in the molten state and, hence, is impermeable to that melt. The tape may comprise a fibrous porous ceramic material.

Abstract: The invention relates to use of a solder composition exhibiting a desired combination of high creep resistance at typical operating temperatures and low stress in formed solder joints. The invention uses a solder containing 82 to 85 wt. % Au, 12 to 14 wt. % Sn, and 3 to 4 wt. % Ga (optionally with up to 2 wt. % additional elements). The small amount of added Ga induces a significant depression in the liquidus temperatures of both Au and Sn, and thus a depressed melting point (about 27° C. less than eutectic Au—Sn solder), and also provides an enhanced temperature-sensitivity of the solder's creep resistance.

Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.

Abstract: The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a solder braze alloy. The novel alloy is characterized in that it comprises 1-10% by weight of an element or a mixture of elements of subgroup IVa and/or Va of the Periodic Table of the Elements and 0.1-20 wt% of an element or a mixture of elements of the group of the rare earths and the remainder consists of zinc, lead, tin, bismuth or indium or a mixture predominantly of two or more of the elements zinc, lead, tin, bismuth and indium and optionally of the elements silver, copper, gallium, antimony, nickel, manganese, chromium, cobalt possibly of customary impurities.

Abstract: Surprisingly, silver-copper-palladium brazing alloys, which have hitherto been used only for the brazing of components of the same material, are also very well suited for brazing directly titanium to stainless steel if, the latter component clasps the titanium component tightly, so that the cold joint is under constant compressive stress. In a method for forming the titanium-steel compound the titanium component is provided with a cylindrical end which has a smaller outside diameter than an adjacent main portion whose external surface is a first surface to be brazed. The cylindrical steel component is a sleeve whose inside diameter is equal to the outside diameter of the main portion and whose internal surface is a second surface to be brazed. A silver-copper-palladium brazing alloy is placed around the end of the titanium component. The steel sleeve is slipped thereover.

Abstract: A method of semiconductor eutectic alloy metal (SEAM) technology for integration of heterogeneous materials and fabrication of compliant composite substrates takes advantage of eutectic properties of alloys. Sub1 and Sub2 are used to represent the two heterogeneous materials to be bonded or composed into a compliant composite substrate. For the purpose of fabricating compliant composite substrate, the first substrate material (Sub1) combines with the second substrate material (Sub2) to form a composite substrate that controls the stress in the epitaxial layers during cooling. The second substrate material (Sub2) controls the stress in the epitaxial layer grown thereon so that it is compressive during annealing. A joint metal (JM) with a melting point of Tm is chosen to offer variable joint stiffness at different temperatures. JM and Sub1 form a first eutectic alloy at a first eutectic temperature Teu1 while JM and Sub2 form a second eutectic alloy at a second eutectic temperature Teu2.

Abstract: This invention relates to a method of manufacturing joint body constructed of at lest one pair of substrates comprising a aluminum matrix composite which is made up of an aluminum or aluminum alloy matrix and a reinforcing ceramic, by using an infiltrating material made up of an aluminum alloy.

Abstract: A method of processing a ceramic body, such as a saw tip so that the ceramic body can be bonded to a substrate, such as a saw blade. The ceramic body is desirably a cermet, and it is first cleaned, preferably using sodium hydroxide. After this, the ceramic body is etched by an acid, after which a metallic coating is applied to the bonding surface either by electrolysis by an electroless process. Then the ceramic body is either brazed or welded to the substrate.

Abstract: The present invention is directed to a means for the surface preparation of a metal or metal alloy substrate. In the process of the present invention, a stream of a mixture of flux particles and metal particles is hurled at the substrate at velocities effective for flux adhesion to the surface. The velocities of the particle stream is adjusted so that the flux particles adhere to the surface and the metal particles bounce off the surface. At higher temperatures and velocities, the metal particles are co-deposited with the flux.

Abstract: There is disclosed a hybrid laminate comprising: a substrate layer containing a compact of first powder; and a functional material layer being in contact with the substrate layer and containing a compact of second powder; wherein the compact of the first powder comprises a glass material; the compact of the second powder comprises a ceramic material having at least one specific electric property selected from dielectricity, magnetism, resistivity and insulation; at least a part of the first powder is in a sintered state; and the second powder is in an unsintered state and is bonded together by diffusion or a flow of a part of the material of the substrate layer into the functional material layer.

Abstract: A wiring substrate with reduced thermal expansion stress. A wiring substrate, such as a laminated PWB, thin film circuit, lead frame, or chip carrier accepts an integrated circuit, such as a die, a flip chip, or ball grid array package. The wiring substrate has a thermal expansion stress reduction insert, void, or constructive void in a thermal expansion stress region proximate to the integrated circuit. The thermal expansion stress reduction insert or void may extend a selected distance from the edge or edges of the integrated circuit attachment area. The thermal expansion stress reduction insert or void improves the flexibility of the wiring substrate in the region that is joined to the integrated circuit, thus reducing thermal stress between components of the wiring substrate-integrated circuit assembly. In another embodiment, layers of a laminated wiring substrate are intentionally not bonded beneath the chip attach area, thus allowing greater flexibility of the upper layer of the laminate.

Abstract: The process of bonding a first workpiece to a second workpiece is disclosed comprising the steps of fabricating a sintered bonding pad formed from a matrix of randomly oriented metallic fibers. The bonding pad is interposed between the first and the second workpiece and the first and second workpieces are biased into engagement with the bonding pad. Heat is applied to the first workpiece to the second workpiece for transforming substantially all of the metallic fibers into a liquid for bonding the first workpiece to the second workpiece.