Abstract: A window installation includes a phase-change filler material sealing an outer edge of the window, and coupling the window to a frame around the window. The filler material in a solid state rigidly holds the window in place. When the filler material is in a liquid state it allows the window to float in its coupling to the frame. There may be supports within the rigid material that contact the window, but allow the window to expand or contract by sliding along the supports. The installation may be useful in situations where the window is subjected to thermal shocks, or other sorts of heating. The installation may be used for a sensor window, and may be part of a hypersonic vehicle.

Abstract: In an insulating circuit substrate, aluminum sheets formed of aluminum or an aluminum alloy are laminated and bonded to a surface of a ceramic substrate and, in the aluminum sheets, Cu is solid-solubilized at a bonding interface with the ceramic substrate and a ratio B/A between a Cu concentration A mass % at the bonding interface and a Cu concentration B mass % at a position of 100 ?m in a thickness direction from the bonding interface to the aluminum sheets side is 0.30 or more and 0.85 or less.

Abstract: Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.

Abstract: The disclosure relates to a heat exchange compound module and a manufacturing method for a heat exchange compound module. The heat exchange compound module comprises a metal-ceramic substrate and a heat exchange structure. The metal-ceramic substrate comprises an outer layer of a first metallic material. The heat exchange structure is made of a second metallic material and is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material.

Abstract: A drum-like core of a coil component includes a winding core portion, a flange portion, and a terminal electrode formed on a mounting surface of the flange portion. The mounting surface of the flange portion includes a flat region and a lower region. The terminal electrode has a flat surface, the flat surface being parallel with the length direction in an outer surface of the terminal electrode, covering the mounting surface of the flange portion, and being longer than the flat region in maximum measurement extending in parallel with the length direction.

Abstract: Systems, methods and apparatus related to a method for constructing a field emission device. The method includes providing a metal cathode substrate; shaping a carbon fiber fabric into a pattern, creating a patterned carbon fiber fabric; and brazing at least a portion of the patterned carbon fiber fabric to the metal cathode substrate.

Abstract: A coil component in which a terminal electrode includes a bottom surface electrode portion that is positioned along a bottom surface of a flange part, an end surface electrode portion that is positioned along an outer end surface of the flange part, and a plating film that covers the bottom surface electrode portion and the end surface electrode portion in a continuous manner. The bottom surface electrode portion contains Ag and Si. The end surface electrode portion is composed of a metal film.

Abstract: The present invention relates to an article comprising a ceramic substrate (310) comprising a source of zirconium oxide; a metallic substrate (320); and a braze joint disposed between the ceramic substrate and the metallic substrate. The braze joint comprises (i) a gold rich phase (330) interfacing against a surface of the ceramic substrate. The gold rich phase comprises a refractory metal selected from the group consisting of molybdenum, tungsten, niobium, tantalum and combinations thereof; and (ii) a second metallic phase (340) comprising a metal selected form the group consisting of nickel, iron, vanadium, cobalt, chromium, osmium, tantalum or combinations thereof.

Abstract: A method for brazing a first ceramic component and a second metal alloy component, to make a structural or external timepiece element, a zirconia-based ceramic is chosen for the first component and a titanium alloy for the second component, a first recess is made inside the first component, set back from a first surface in a junction area with a second surface of the second component, braze material is deposited on this first surface and inside each recess, the second surface is positioned in alignment with the first surface to form an assembly, this assembly is heated in a controlled atmosphere to above the melting temperature of the braze material, in order to form the braze in the junction area.

Abstract: The present disclosure discloses a hot-forging die with the conformal meshy structured cavity surface layer and a preparation method thereof. A large-scale hot-forging die includes a die substrate, and a sandwiched layer, a transition layer and a reinforcement layer are formed on the die substrate in sequence. The reinforcement layer and the transition layer are separated into a plurality of small units by the grooves. All the grooves are interconnected and communicated to form a meshy structure. The transition layer grooves are filled with ordinary soft material; the reinforcement layer grooves are filled with high temperature resistant soft material.

Abstract: Thermally-conductive ceramic and ceramic composite components suitable for high temperature applications, systems having such components, and methods of manufacturing such components. The thermally-conductive components are formed by a displacive compensation of porosity (DCP) process and are suitable for use at operating temperatures above 600° C. without a significant reduction in thermal and mechanical properties.

Abstract: Systems, methods and apparatus related to a method for constructing a field emission device. The method includes providing a metal cathode substrate; shaping a carbon fiber fabric into a pattern, creating a patterned carbon fiber fabric; and brazing at least a portion of the patterned carbon fiber fabric to the metal cathode substrate.

Abstract: An integrated circuit interconnects are described herein that are suitable for forming integrated circuit chip packages. In one example, an integrated circuit interconnect is embodied in a wafer that includes a substrate having a plurality of integrated circuit (IC) dice formed thereon. The plurality of IC dice include a first IC die having first solid state circuitry and a second IC die having second solid state circuitry. A first contact pad is disposed on the substrate and is coupled to the first solid state circuitry. A first solder ball is disposed on the first contact pad. The first solder ball has a substantially uniform oxide coating formed thereon.

Abstract: A lead pin includes a shaft portion, a head portion formed on one end of the shaft portion, and having a diameter greater than a diameter of the shaft portion, a tin-based first plated layer exposed at a surface of the head portion visible from the other end of the shaft portion, and a second plated layer exposed at an end surface of the shaft portion visible from the other end of the shaft portion. The second plated layer has a reflectivity with respect to visible light and a conductivity higher than a reflectivity with respect to the visible light and a conductivity of the first plated layer, respectively.

Abstract: The present invention provides a metal-ceramic base material and the like which allow a ceramic base material and a desired metal material to be easily joined. A metal-ceramic base material (30) to be joined to a metal material (40), includes: a ceramic base material (20); and a metal film (25) provided on the ceramic base material (20), the metal film (25) being formed by thermal spray of a mixed powder material containing aluminum, alumina, and nickel, at least part of the nickel being exposed on a surface of the metal film (25).

Abstract: A rotary electric machine includes a rotor, and a rotor shaft connected to the rotor so as to be integrally rotatable and provided with a coolant flow path through which a coolant flows. The rotor shaft includes a first rotor shaft and a second rotor shaft which is inserted into the first rotor shaft and is connected to the first rotor shaft so as to be integrally rotatable. The first rotor shaft includes an opposing surface opposed to a tip surface of the second rotor shaft, and a coolant supply path extending radially from a vicinity of the opposing surface. A gap is provided between the opposing surface of the first rotor shaft and the tip surface of the second rotor shaft. The gap constitutes a connection flow path connecting the coolant flow path and the coolant supply path.

Abstract: This glass bonding material (21) is made of a cladding material (1) in which at least a first layer (11) made of an Al-based alloy and configured to be bonded to glass and a second layer (12) made of an Fe—Ni based alloy having a thermal expansion coefficient from 30° C. to 400° C. of 11.5×10?6 (K?1) or less are bonded.

Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.

Abstract: A conduit seal assembly includes an outer conduit having a first end with a first opening and a second end, opposite the first end, with a second opening. A first seal is positioned in the first opening for resisting a first temperature, and a second seal is positioned in the second opening for resisting a second temperature less than the first temperature. The first and second seals define a cavity and provide an air-tight seal of the cavity, and the assembly includes a monitoring assembly configured to sense a characteristic in the cavity.

Abstract: Embodiments of the present invention disclose an ultrasonic atomization piece, a manufacturing method thereof, an ultrasonic atomizer and electronic cigarette. The ultrasonic atomization piece comprises a ceramic substrate, which is provided with an upper silver layer on the upper surface and with a lower silver layer on the lower surface. The ceramic substrate, the upper silver layer and the lower silver layer form piezoelectric ceramic, and glass glaze for protecting the upper silver layer is provided on the upper surface of the piezoelectric ceramic; and a tobacco tar adsorption layer is provided on the upper surface of the glass glaze to form a piezoelectric ceramic component, and the tobacco tar adsorption layer is used for adsorbing, guiding and transferring tobacco tar.

Abstract: An electronic component according to an embodiment of the present disclosure includes a formed article containing a cyclic siloxane resin or a branched siloxane resin serving as a first binder, and an outer electrode on at least part of a surface of the formed article, the outer electrode containing an early transition metal and/or an alloy thereof.

Abstract: A magnetic phase-transformation material with the formula Nia?mMnb?nCom+nTic is provided, wherein a+b+c=100, 20<a?90, 5?b<50, 5?c?30, 0?m?a, 0?n?b, 0<m+n<a+b, and wherein, any one or combination of a, b, c, m, n represent an atomic percentage content. The magnetic phase-transformation material has properties of high toughness, high deformation rate, ferromagnetism and magnetic field-driven martensitic phase transformation, which can be widely used in various fields including high-strength and high-toughness actuators, temperature and/or magnetic sensitive elements, magnetic refrigeration devices and equipments, magnetic heat pump devices, magnetic memories, micro-electromechanical devices and systems, and thermomagnetic power generators or transducers.

Abstract: In accordance with one embodiment of the present invention, an end-Hall ion source has an electron emitting cathode, an anode, a reflector, an internal pole piece, an external pole piece, a magnetically permeable path, and a magnetic-field generating means located in the permeable path between the two pole pieces. The anode and reflector are enclosed without contact by a thermally conductive cup that has internal passages through which a cooling fluid can flow. The closed end of the cup is located between the reflector and the internal pole piece and the opposite end of the cup is in direct contact with the external pole piece, and wherein the cup is made of a material having a low microhardness, such as copper or aluminum.

Abstract: Provided is an integrated fan-out package including a die, a first redistribution circuit structure, a second redistribution circuit structure, a plurality of solder joints, a plurality of conductive posts, and an insulating encapsulation. The first redistribution circuit structure and the second redistribution circuit structure are formed respectively over a back surface and an active surface of the die to sandwich the die. The solder joints are formed aside the die and connected to the first redistribution circuit structure. The conductive posts are formed on the solder joints and connected to the second redistribution circuit structure, and connected to the first redistribution circuit structure through the solder joints. A plurality of sidewalls of the die, a plurality of sidewalls of the conductive posts, and a plurality of sidewalls of the solder joints are encapsulated by the insulating encapsulation. A fabricating process of the integrated fan-out package is also provided.

Abstract: A method of manufacturing a grinding wheel, and a grinding wheel. After a first overcoat layer is formed on each of CBN abrasive grains, a second overcoat layer that is plastically deformed under a pressure lower than a pressure under which the first overcoat layer is deformed, is formed on the outer side of the first overcoat layer to manufacture coated abrasive grains. The coated abrasive grains are subjected to pressure-molding to be formed into a prescribed shape under a pressure that is equal to or higher than a pressure under which the second overcoat layer is plastically deformed. The second overcoat layers are deformed and flow to form a molded material having a structure in which the first overcoat layers contact each other, and the flowing second overcoat layers are moved into clearances between the coated abrasive grains.

Abstract: In a method for preparing a workpiece for subsequent laser welding, a recessed structure in the form of at least two grooved line elements is formed by a laser beam in a surface of the workplace, with the line elements having a common starting point from which the laser beam moves onwards to produce the line elements. Solidifying material melt of the workpiece is hereby accumulated in an area of the starting point to produce a nub-like elevation sized to extend out beyond the surface of the workpiece.

Abstract: Disclosed is an apparatus for coupling an SiC reflex mirror, configured to mount an SiC reflex mirror formed on a plurality of points and having a cylindrical portion on one surface thereof, to a mounting plate. The apparatus includes: an insertion portion having a vertical portion having a curved shape and attached to inside of the cylindrical portion, and a horizontal portion integrally formed with the vertical portion and formed to cross the vertical portion; an adhesive provided between the vertical portion and an inner circumferential surface of the cylindrical portion, and configured to attach the insertion portion to the cylindrical portion; a fixing portion having one end fixed to the horizontal portion, having another end fixed to the mounting plate, and configured to fix the SiC reflex mirror to the mounting plate; and a coupling member configured to fix the fixing portion to the insertion portion.

Abstract: A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.

Abstract: Partially formed earth-boring rotary drill bits comprise a first less than fully sintered particle-matrix component having at least one recess, and at least a second less than fully sintered particle-matrix component disposed at least partially within the at least one recess. Each less than fully sintered particle-matrix component comprises a green or brown structure including compacted hard particles, particles comprising a metal alloy matrix material, and an organic binder material. The at least a second less than fully sintered particle-matrix component is configured to shrink at a slower rate than the first less than fully sintered particle-matrix component due to removal of organic binder material from the less than fully sintered particle-matrix components in a sintering process to be used to sinterbond the first less than fully sintered particle-matrix component to the at least a second less than fully sintered particle-matrix component.

Abstract: A method for joining a ceramic component to a metallic component is described. At least one initial layer of an active metal is applied to one of the joining surfaces, by a cold spray technique. At least one second layer of a nickel-based braze composition is then applied over the initial layer by cold-spraying. The braze composition and components are then heated, so as to form an active braze joint between them. A method of sealing an open region of a sodium metal halide-based battery is also disclosed, using the brazing technique described herein to form braze joints that seal various components in the battery cells, such as metallic rings and ceramic collar structures.

Abstract: A hardfaced infiltrated matrix downhole tool and a method for hardfacing such items. The hardfaced infiltrated matrix downhole tool includes a body, an intermediate base coat coupled to at least a portion of the surface of the body, and a hardfacing material coupled to at least a portion of the intermediate base coat. The body is composed of at least a carbide material and an infiltrating binder material. The intermediate base coat bonds to the surface of the body and to the hardfacing material. The method includes obtaining an infiltrated matrix downhole tool, applying and bonding the intermediate base coat to at least a portion of the surface of the infiltrated matrix downhole tool, and applying and bonding the hardfacing material to at least a portion of the intermediate base coat.

Abstract: Techniques are described herein for a dip soldering process which provides a low-profile, low-cost solder bump formation process which may be implemented to promote package thickness scaling (e.g., reduce the overall package thickness). For example, the dip soldering process disclosed herein may enable ultra-thin wafer-level packages (WLP), ultra-thin wafer level quad-flat no-leads (WQFN) packages, or the like.

Abstract: A metal-ceramic joined body is provided in which the surface roughness of the metal is low, and the joined body is unlikely to break. Provided is a metal-ceramic joined body including a metal mainly composed of titanium and a ceramic, in which, regarding the X-ray diffraction peak intensity of a surface portion of the metal excluding a joining region to the ceramic, at least one of I110 and I012 is larger than I011, where I011 is the intensity of a peak attributable to a first plane of hexagonal ? titanium, I110 is the intensity of a peak attributable to a second plane of hexagonal ? titanium, and I012 is the intensity of a peak attributable to a third plane of hexagonal ? titanium.

Abstract: A method for producing a bonded body of ceramic and metal bodies includes stacking a ceramic body, metal body, gap layer capable of preventing oxidation and hindering heat conduction, first intermediate layer and second intermediate layer with the gap layer between the ceramic body and the metal body in the stacking direction. The first intermediate layer is between the ceramic body and gap layer, and the second intermediate layer is between the gap layer and metal body, linear expansion coefficients of the first and second intermediate layers being between those of the ceramic body and the metal body. Diffusion bonding is performed between the ceramic body and the first intermediate layer, and between the metal body and the second intermediate layer simultaneously. The gap layer is then removed from between the first and second intermediate layers. The first and second intermediate layers are then bonded to each other.

Abstract: An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.

Abstract: A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces.

Abstract: A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor.

Abstract: The invention refers to a method for fixing a heat resistant component on a surface of a heat exposed component, by brazing of at least a part of a surface of the heat resistant component limited by a peripheral boundary edge on the surface of the heat exposed component using a molten solder. A first alternative includes: metallizing the surface of the heat resistant component at least with the exception of an edge area comprising the peripheral boundary edge; and brazing said metallized surface to the surface of the heat exposed component, wherein at least the surface of the heat resistant component consists of a ceramic material which has a physico-chemical property concerning wettability such that the ceramic material is not wettable by the molten solder, and/or a metal or a metal alloy is used for metallizing which has a physico-chemical property concerning wettability such that the metallizing is wettable by the molten solder.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.

Abstract: A high-temperature-resistant composite body is formed by joining over an area of a first, nonmetallic section via a bonding solder layer to a second, metallic section composed of Mo, an Mo-based alloy, W or a W-based alloy. A first arrangement composed of the first section, a first Zr solder and an intermediate layer is firstly soldered together in a first soldering step. A second arrangement of the resulting partial composite body, a second solder adjoining the intermediate layer and the second section is subsequently soldered together in a second soldering step. The intermediate layer at least 90 atom % of at least one of the elements Ta, Nb, W. The second solder is formed by precisely one material selected from Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and it melts at a lower temperature than the first Zr solder in the second arrangement.

Abstract: The invention provides products of manufacture, e.g., biomaterials and implants, for cartilage maintenance and/or formation in-vivo, in-vitro, and ex-vivo, using nanotechnology, e.g., using nanotube, nanowire, nanopillar and/or nanodepots configured on surface structures of the products of manufacture.

Abstract: According to one embodiment, a ceramic circuit board includes a ceramic substrate, a copper circuit plate and a brazing material protrudent part. The copper circuit plate is bonded to at least one surface of the ceramic substrate through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 ?m2 or less in the brazing material protrudent part is one or less (including zero).

Abstract: A commutator (10) comprising a plurality of commutator bars (12) formed from a graphite structure (30) and a metal sheet (20) having soldered to the graphite structure (30) includes a brazing process followed by a soldering process. The brazing process includes applying a brazing material the graphite structure (30) and brazing at an elevated temperature to form a brazing layer (40). The soldering process includes applying a solder material to the brazing layer (40), placing the metal sheet (20) on the solder material, and soldering to form a solder layer (50) affixing the metal sheet (20) to the graphite structure (30). A plurality of grooves (70) are cut in the graphite structure (30) and the metal sheet (20) to form the commutator bars (12) arranged in an intermittent ring or circle.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.

Abstract: A cutting insert has only cutting edge portion thereof made of SiC whisker reinforced ceramics brazed to the shank with active solder. This provides improved cutting performance by increased toughness and high strength of the SiC whisker reinforced ceramics without limitation in shape while reducing manufacturing costs. The cutting insert includes a cutting edge portion made of SiC whisker reinforced ceramics, and a shank to which the cutting edge portion is mounted. The cutting edge portion is brazed to the shank using an active solder, and the whiskers are disorderedly arranged and agglomerated in the cutting edge portion.