Abstract: Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board.

Abstract: A method is provided for brazing a metal leadframe clip to an electrical resistance heating tip for an electrical resistance igniter, wherein the electrical resistance heating tip includes silicon carbide. The method includes forming a layer of SiO2/Al2O3 on a surface of the electrical resistance heating tip; applying a braze alloy paste between the layer of SiO2/Al2O3 and the metal leadframe clip; and heating the braze alloy, the metal leadframe clip and the electrical resistance heating tip to fuse the braze alloy.

Abstract: A method of assembling a metallic-graphite structure includes forming a wetted graphite subassembly by arranging one or more layers of graphite fiber material including a plurality of graphite fibers and applying a layer of metallization material to ends of the plurality of graphite fibers. At least one metallic substrate is secured to the wetted graphite subassembly via the layer of metallization material.

Abstract: In one embodiment, a process for joining carbide and non-carbide materials is disclosed, the process comprising providing an interface binder material, positioning the interface binder material between the carbide material and non-carbide material to provide an assembly and heating the assembly to join the carbide material and non-carbide material through the interface binder material, wherein the interface binder material comprises a powder metal or powder alloy or a sheet of metal or alloy.

Abstract: A first metal such as germanium is prepared for metal-to-metal bonding by depositing the first metal onto a roughened foundation layer so that asperities are present on the first metal layer substantially following the topology of the asperities on the surface of the foundation layer without having to process the surface of the first metal layer. Such asperities can break through barrier layer(s) on the surface of another metal (e.g., an oxide layer, an anti-stiction coating, and/or other barrier layer) during a bonding process so that direct metal-to-metal bonding can be accomplished without having to remove the barrier layer(s) and without having to process the surface of the first metal such as by photolithography or depositing and subsequently removing a material that partially interdiffuses with the first metal.

Abstract: The present invention provides a method of bonding ceramic and metal comprising the steps of bonding metal foils to a bonding surface of a ceramic matrix and a bonding surface of a metal matrix to be bonded and then heating so as to leave metal layers at the surfaces of the metal foils while forming diffusion layers with inclined linear expansion coefficients with materials of the metal foils diffused in them between the ceramic matrix and metal layer and between the metal matrix and metal layer, and making the respective metal layers which remain at the surfaces of the metal foils bond so as to bond the ceramic matrix and the metal matrix.

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: A method for forming sealed electrical feedthroughs through an encapsulation package, especially for an electronic, optical, or optoelectronic component, including forming a through opening in one of the package walls, and advantageously the bottom of said package; and soldering on this opening, a plate made of cofired ceramic having the electric connections transiting therethrough.

Abstract: A micromachined switch is provided including a base substrate, a bond pad on the base substrate, a cantilever arm connected to the bond pad, the cantilever arm having a conductive via from the bond pad, a first actuation electrode on the base substrate, and a second actuation electrode on the cantilever arm connected to the bond pad by way of the conductive via, positioned such that an actuation voltage applied between the first actuation electrode and the second actuation electrode will deform the cantilever arm, wherein the first actuation electrode is facing a side of the cantilever arm opposite the second actuation electrode.

Abstract: A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described.

Abstract: A method for making a cellular seal member for a turbine is disclosed. The method includes, in sequence, forming a diffusion aluminide coating on a surface of a cellular seal to form a coated cellular seal. The method also includes brazing the coated cellular seal to a seal substrate.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A feed through assembly is provided, which comprises a metal component passed through a ceramic insulator, and a multi-layered joint brazed to the ceramic insulator and the metal component to form the assembly. The multi-layered joint comprises a first portion of braze filler material placed around the metal component, and a hollow member of predetermined shape placed around the metal component and comprising a flange at a first end, wherein the flange rests on the first portion of braze filler material. Further, the multi-layered joint comprises a second portion of braze filler material placed around the hollow member and seated onto the flange, a ceramic member of predetermined shape placed around the hollow member which rests on the second portion of braze filler material, and a third portion of braze filler material placed around the metal component and seated onto a second end of the hollow member.

Abstract: A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink.

Abstract: A method of assembling a metallic-graphite structure includes forming a wetted graphite subassembly by arranging one or more layers of graphite fiber material including a plurality of graphite fibers and applying a layer of metallization material to ends of the plurality of graphite fibers. At least one metallic substrate is secured to the wetted graphite subassembly via the layer of metallization material.

Abstract: Methods for minimizing component shift during soldering are described. One such method includes forming a pedestal pad having a preselected shape on a substrate, forming at least one intervening layer on the substrate, the at least one intervening layer including a layer including a solidifying accelerant, and a layer including a solder, the solder layer having a preselected shape about the same as the preselected shape of the pedestal pad, positioning the component on the at least one intervening layer, and heating the solder to a predetermined process temperature, wherein the pedestal pad is configured to remain a solid during the heating the solder to the predetermined process temperature, and wherein the solidifying accelerant is configured to accelerate a solidification of the solder after the heating the solder to the predetermined process temperature.

Abstract: A method is provided for brazing a metal leadframe clip to an electrical resistance heating tip for an electrical resistance igniter, wherein the electrical resistance heating tip includes silicon carbide. The method includes forming a layer of SiO2/Al2O3 on a surface of the electrical resistance heating tip; applying a braze alloy paste between the layer of SiO2/Al2O3 and the metal leadframe clip; and heating the braze alloy, the metal leadframe clip and the electrical resistance heating tip to fuse the braze alloy.

Abstract: A process for joining a stainless steel part and a silicon carbide ceramic part comprising: providing a SUS part, a SiC ceramic part, a Mo foil and a Ni foil; depositing a nickel coating on a surface of the SiC ceramic part; placing the SiC ceramic part, the Mo foil, the Ni foil, and the SUS part into a mold, the Mo foil and the Ni foil located between the SiC ceramic part and the SUS part; placing the mold into a chamber of an hot press sintering device, heating the chamber and pressing the SUS part with the nickel coating, the SiC ceramic part, the Mo foil, and the Ni foil at least until the SUS part, the SiC ceramic part, the Mo foil and the Ni foil form a integral composite article.

Abstract: Disclosed herein is a manufacturing method for a ceramic heater. The manufacturing method includes the step of manufacturing a sintered ceramic substrate using a ceramic material and forming a conductive through hole in the ceramic substrate, the step of screen printing low temperature firing paste on the ceramic substrate, thus forming a heating wire, the step of screen printing Ag paste on the through hole, thus forming an electrode, the step of joining, using heat and pressure, a green sheet to a surface of the ceramic substrate on which the heating wire is formed, the step of firing the joined ceramic substrate and green sheet at low temperature, thus manufacturing a substrate body, and the step of brazing the lead wire to the electrode of the substrate body using filler metal while the lead wire is exposed to atmosphere.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A ceramic component having at least one electrical feedthrough, comprising: a ceramic body, through which a bore extends; and a metal conductor, which is arranged at least sectionally in the bore and which is secured in the bore by means of an active hard solder, or braze, whereby the bore is sealed. The active hard solder fills an annular gap between the metal conductor and the ceramic body, characterized in that the active hard solder has a radially variable, chemical composition.

Abstract: A metal/ceramic substrate made up of a multilayer, plate-shaped ceramic material and at least one metallization provided on a surface side of the ceramic material. The at least one metallization is bonded to the ceramic material by direct copper bonding or reactive brazing and the ceramic material is made of a base layer made of silicon nitride ceramic. The at least one metallization is formed from at least one intermediate layer of an oxidic ceramic applied to the at least one base layer.

Abstract: A friction stir welding tool and process for lap welding dissimilar materials are detailed. The invention includes a cutter scribe that penetrates and extrudes a first material of a lap weld stack to a preselected depth and further cuts a second material to provide a beneficial geometry defined by a plurality of mechanically interlocking features. The tool backfills the interlocking features generating a lap weld across the length of the interface between the dissimilar materials that enhances the shear strength of the lap weld.

Abstract: A durable, weld-on chrome carbide tooth is provided for roll crushers. The tooth includes a chrome carbide body that is vacuum brazed to a mild steel backing plate. An upper portion of the tooth is preferably cast from chrome carbide alloy having 25 percent high-chrome-molybdenum content and a Brinell Hardness Number of about 700. The mating surfaces of the chrome carbide body and the mild steel backing plate are surface ground, then brazed together in a heat-treating furnace that has been evacuated to a pressure of less than 1×10?3 Torr. The minor differences in thermal expansion coefficients of the chrome carbide body and the mild steel backing plate are absorbed in the brazed joint, thereby reducing the buildup of mechanical stresses at the boundary layer. The mild steel backing plate enables the tooth to be welded directly to the drum of a rotary crusher.

Abstract: A method of manufacturing an electronic component includes forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.

Abstract: A method of manufacturing high-heat-load equipment including a carbon material and a copper alloy material which are joined with each other includes; forming a titanium thin layer on a surface of the carbon material; positioning the carbon material so that the titanium thin layer is opposed to the copper alloy material while an interlayer is interposed between the carbon material and the copper alloy material; inserting a brazing material sheet into a space between the carbon material and the interlayer, as well as into a space between the interlayer and the copper alloy material, so as to prepare an assembly of the materials; and subjecting the assembly to a vacuum brazing process and further to an aging process.

Abstract: An improved electrical connector for use with a glazing is disclosed. The glazing preferably comprises a ply of glazing material having a first electrically conductive component mounted thereon, and a second electrically conductive component, joined to the first by a lead-free solder. The second component has a thickness t and comprises first and second connector feet linked by a bridge portion, the bridge portion being at a height h above each of the connector feet. T and/or h are chosen to minimise the occurrence of stress faults in the glass in the region of the solder. Preferably, the glazing is an automotive glazing.

Abstract: Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects.

Abstract: A method for processing a metal component comprising inserting a graphitic preform into an aperture of the metal component, brazing the metal component, and removing at least a portion of the graphitic preform from the aperture with a thermal process in an oxygen-containing atmosphere.

Abstract: A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.

Abstract: There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrate 10 to be cooled and solidified. Thus, a circuit forming metal plate 12 having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate 10, and a metal base plate 14 is bonded to the other side thereof.

Abstract: A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the interlayer material, but that is less than the melting point of the interlayer material, the ceramic part or the metal part is disclosed. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded assembly is optionally treated with acid to remove any residual free nickel and nickel salts to assure a biocompatible assembly for implantation in living tissue.

Abstract: The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a very thin essentially pure interlayer material of a compatible interlayer material placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the metal interlayer material, but that is less than the melting point of either the interlayer material, the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly for implantation in living tissue.

Abstract: A brazed product has a metal substrate, a ceramic or graphite substrate, and a brazing alloy containing one of a high nickel content and cobalt content joining the ceramic or graphite substrate to the metal substrate. A method of joining these materials include providing a metal layer coating of titanium or nickel on the surface of the ceramic or graphite substrate to be joined or using a high nickel content or high cobalt content and containing titanium. The brazing alloy contains a high nickel content 70-95% by weight, or a high cobalt content between 45-55% by weight. This brazing alloy can contain titanium in the range between 0.5-5% by weight.

Abstract: This disclosure describes a technique for fusing self-fluxing metallic coatings on non-cylindrical objects without the need to conduct the fuse operation in a vacuum furnace or some other type of protective environment. The technique consists of first applying the self-fluxing coating to the surface, then optionally applying a ceramic coating on top of the self-fluxing coating. The object is then submerged into a vessel containing a low-melting inert material. The aggregate is then heated, and as the glass becomes molten, it encases the object and protects it from oxidation. As heating continues, the fusing temperature is reached and the self-fluxing alloy becomes molten. The ceramic coating encases the self-fluxing alloy and acts as a mold. When fusing is complete, the aggregate is then slowly cooled to ambient temperature. The glass frit and the ceramic shell are then removed, and one is left with an object coated with a uniform thickness of a dense adherent fused coating on the surface of the object.

Abstract: A circuit assembly having a thin and large-area dielectric substrate and an improved grounding condition. To make the assembly, a circuit board comprises the substrate, and a circuit pattern and a metal layer that are formed on respective sides of the substrate. A bath of conductive bonding material (e.g., a low melting point solder) is made inside a tray-like metal chassis of the assembly. The circuit board is floated on the bath and excessive portion of the conductive material is absorbed. A branch circuit for branching a first path into at least two second paths is provided by mainly using impedance transformers but by using fewest possible stubs. Also, the elements are arranged in symmetry around the axis through the first path. This yields a wide operating frequency band. A waveguide-microstrip line transition that is easy to work and low in transition loss is provided by shaping the wider walls of the ridge waveguide so as to spread out toward the end.

Abstract: Reaction-brazing of tungsten or molybdenum metal bodies to carbonaceous supports enables an x-ray generating anode to be joined to a preferred lightweight substrate. Complementary surfaces are provided on a dense refractory metal body and a graphite or a carbon-carbon composite support. A particulate braze mixture comprising Hf or Zr carbide, Mo or W boride, Hf or Zr powder and Mo or W powder is coated onto the support surface, and hafnium or zirconium foil may be introduced between the braze mixture and the refractory metal body complementary surface. Reaction-brazing is carried out at or near the eutectic point of the components, which may be influenced to some extent by the presence of carbon and boride. Heating to about 1865° C.

Abstract: An article includes a substrate and an adhesion layer overlying the substrate. The adhesion layer includes a first phase including particles, and a second phase including braze alloy that bonds the particles to the substrate. The article further includes a ceramic layer overlying the adhesion layer. In one embodiment, the ceramic layer is a thermal barrier coating (TBC), formed of stabilized zirconia (ZrO2).

Abstract: The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a very thin essentially pure interlayer material of a compatible interlayer material placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed between the metal part and the metal interlayer material, but that is less than the melting point of either the interlayer material, the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a homogeneous and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly for implantation in living tissue.

Abstract: The invention relates to a method for attaching a first body which is of one of a metal matrix composite (MMC)-material or copper to a second body which is a ceramic member for acting as a heat sink, wherein the surface of the ceramic member which is placed against the MMC- or copper body is coated with a first metal by heating the two bodies to above the eutectic temperature of a system comprised of the matrix metal of the MMC-body or the copper of the copper body and the first metal applied to the surface of the ceramic member; and subsequently cooling the system to room temperature.

Abstract: A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.

Abstract: The present invention relates to a method for preparing the surface of a high purity alumina ceramic or sapphire specimen that enables direct brazing in a hydrogen atmosphere using an active braze alloy. The present invention also relates to a method for directly brazing a high purity alumina ceramic or sapphire specimen to a ceramic or metal member using this method of surface preparation, and to articles produced by this brazing method. The presence of silicon, in the form of a SiO2-containing surface layer, can more than double the tensile bond strength in alumina ceramic joints brazed in a hydrogen atmosphere using an active Au-16Ni-0.75 Mo-1.75V filler metal. A thin silicon coating applied by PVD processing can, after air firing, produce a semi-continuous coverage of the alumina surface with a SiO2 film. Room temperature tensile strength was found to be proportional to the fraction of air fired surface covered by silicon-containing films.

Abstract: To provide a way to use a ceramic alloy as a material for producing a cutter knife to be mounted on a thermoplastic resin pelletizer easily, with reduced costs, and also eliminating the possibility of breakage.

Abstract: A process is disclosed for producing a joined article between a ceramic member and another member, which process includes the steps of brazing the ceramic member with another member by using a brazing material composed of 50 to 99 wt % of copper, 0.5 to 20 wt % of aluminum, 0.5 to 5 wt % of at least one kind of active metal selected from the group consisting of titanium, zirconium, hafnium, vanadium and niobium, thereby obtaining a joined body including the ceramic member, another member and a layer of the brazing material, and heating the brazing material layer in an oxidative atmosphere.